10AS032H4F35E3LG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz, 1152-FBGA | Intel
N.º da peça: 10AS032H4F35E3LG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1571.83 | $1.571,83 |
| 10 | $1490.5 | $14.905,00 |
| 100 | $1395 | $139.500,00 |
| 500 | $1290 | $645.000,00 |
| 1.000 | $1195 | $1.195.000,00 |
10AS032H4F35E3LG Visão geral
An SoC FPGA is a class of system-on-chip that fuses a general-purpose application processor subsystem with FPGA fabric on the same silicon die, connected via a high-bandwidth on-chip interconnect. This architecture enables deterministic real-time processing in the FPGA fabric while the ARM subsystem handles operating systems, networking stacks, and user applications. The Arria 10 SX series specifically targets applications requiring DSP-intensive acceleration, high-speed serial connectivity, and embedded software execution in industrial, broadcast, and defense markets.
Key features of the 10AS032H4F35E3LG include 320K logic elements, integrated dual ARM Cortex-A9 cores with CoreSight debug, on-chip memory, dedicated DSP blocks for high-throughput signal processing, and 28.05 Gbps-capable transceivers supporting protocols such as PCIe Gen3 and 10GbE. The F35 package designation refers to the 35x35 mm flip-chip BGA with 1152 balls, providing extensive I/O and supply connectivity for high-bandwidth designs.
The device uses TSMC's 20nm process technology and is built on Intel's Adaptive Logic Module (ALM) architecture, providing improved logic packing efficiency versus prior generations. The hard processor system includes NEON media processing engine, single-precision/half-precision floating-point unit, L1/L2 caches, and a rich peripheral set including EMAC, USB, NAND flash controller, and DDR3/DDR4 memory interfaces supporting ECC.
Typical applications include industrial motor control with high-speed feedback loops, broadcast video processing and encoding, military radar and electronic warfare systems, medical imaging equipment, and 5G wireless baseband processing. The combination of software programmability and hardware parallelism makes the device particularly well-suited for system designs where deterministic latency, protocol bridging, and compute density must coexist in a single chip.
Design considerations include BGA PCB layout requiring microvia or via-in-pad technology, multi-rail power sequencing for the FPGA core and HPS domains, and thermal management via heat spreaders or heatsinks given the flip-chip package's thermal envelope. Engineers should reference the Arria 10 device family datasheet and the SoC development kit collateral for power estimation, pin-out, and reference design resources.
This page synthesizes real-time distributor pricing, pin-compatible drop-in alternatives within the Arria 10 family, comparison tables, and practical design notes that extend beyond the manufacturer datasheet, providing engineers with a complete decision-making resource for SoC FPGA selection.
Alternativas drop-in para 10AS032H4F35E3LG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS032H4F35E3LG (mesmo formato e footprint) — diferindo em Package, DSP Blocks, Transceivers, Logic Elements, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS032H4F35I3SG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1080 / unidade
Ver ficha técnica →10AS032H4F35E3SG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3750 / unidade
Ver ficha técnica →10AS032H4F35I2SG
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10AS032H4F34E3LG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2240 / unidade
Ver ficha técnica →10AS032H3F35E2LG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3650 / unidade
Ver ficha técnica →10AS032H3F35I2SG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2120 / unidade
Ver ficha técnica →10AS032H4F35E3LG Classificações máximas e características elétricas
| Series | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock Speed (Max) | 1.5 GHz |
| Operating Voltage (Core) | 0.87 V (typical per datasheet minimum) |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) |
| Package Size | 35 x 35 mm |
| Process Technology | 20 nm TSMC |
| Transceiver Speed | Up to 28.05 Gbps |
| Memory Interface | DDR3 / DDR4 with ECC support |
| DSP Blocks | Variable-precision DSP blocks |
| Embedded Memory | MLAB + M20K blocks |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do 10AS032H4F35E3LG 35 x 35 mm
Configuração de pinos para 10AS032H4F35E3LG (pacote 35 x 35 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS032H4F35E3LG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS032H4F35E3LG é adequado para 7 aplicaçãos: Industrial Motor Control and Drive Systems, Broadcast Video Processing and Encoding, Military Radar and Electronic Warfare, Medical Imaging Equipment, 5G Wireless Baseband Processing, Test and Measurement Instrumentation, Smart Factory and IIoT Gateways.
Industrial Motor Control and Drive Systems
The 10AS032H4F35E3LG's combination of 320K logic elements and dual ARM Cortex-A9 cores at 1.5 GHz makes it ideal for industrial motor control applications requiring deterministic feedback loops and high-speed PWM generation. The FPGA fabric handles real-time current and voltage loop control with sub-microsecond latency, while the HPS runs Linux-based supervisory control, HMI, and Ethernet protocols such as EtherCAT or PROFINET. Per Arria 10 SX datasheets, the DSP blocks support field-oriented control (FOC) algorithms for permanent magnet synchronous motors, and the 28.05 Gbps transceivers enable multi-axis drive networking. Engineers commonly pair the SoC with external ADCs for current sensing and gate drivers for power stage control.
Recomendado
Broadcast Video Processing and Encoding
The 10AS032H4F35E3LG is well-suited for broadcast video infrastructure, including SD/HD/4K video processing, format conversion, and real-time encoding. The 320K logic elements handle parallel pixel processing pipelines for multi-stream video, while the variable-precision DSP blocks accelerate H.264/HEVC codec operations. The dual ARM Cortex-A9 HPS runs embedded Linux with FFmpeg, GStreamer, or vendor SDKs for stream management and metadata processing. Per the Arria 10 SX family datasheet, transceivers support SDI standards up to 12G-SDI, and the DDR4 memory interface provides bandwidth for uncompressed video frame buffers. The F35 35x35 mm package is commonly used in broadcast encoder blades and contribution decoders.
Recomendado
Military Radar and Electronic Warfare
Defense systems including radar signal processing and electronic countermeasures benefit from the 10AS032H4F35E3LG's high logic density, transceiver bandwidth, and ARM HPS for sensor fusion. The FPGA fabric performs beamforming, pulse compression, and digital down-conversion across multiple receive channels, while the HPS handles track management, classification algorithms, and Ethernet connectivity to higher-level command systems. Per Arria 10 SX datasheets, transceivers support JESD204B/C interfaces to high-speed ADCs and DACs common in radar front ends. The device's ability to process data in real time with deterministic latency is critical for electronic warfare applications where reaction time determines mission success.
Recomendado
Medical Imaging Equipment
Medical imaging modalities including ultrasound, CT, and MRI scanners leverage the 10AS032H4F35E3LG for real-time beamforming, image reconstruction, and high-throughput signal processing. The FPGA fabric accelerates back-end image reconstruction algorithms, while the ARM Cortex-A9 HPS runs embedded Linux for user interface, DICOM networking, and patient database integration. Per the Arria 10 SX family datasheet, the device supports JESD204B interfaces to high-channel-count ADCs typical of ultrasound probes. DDR4 with ECC provides reliable buffering of raw image data, and the F35 package's thermal envelope suits fan-cooled cart-based ultrasound systems.
Recomendado
5G Wireless Baseband Processing
5G baseband processing and small-cell infrastructure benefit from the 10AS032H4F35E3LG's parallel processing capability and high-speed transceivers. The FPGA fabric handles PHY-layer operations including channel coding, modulation, and FFT/IFFT for OFDM waveforms, while the ARM HPS runs the 5G stack, MAC scheduler, and management plane. Per the Arria 10 SX family datasheet, transceivers up to 28.05 Gbps support CPRI and eCPRI fronthaul interfaces to radio units. The 320K logic element count enables full PHY-layer implementation of LTE and 5G NR sub-6 GHz waveforms on a single device.
Recomendado
Test and Measurement Instrumentation
High-end test and measurement instruments such as oscilloscopes, protocol analyzers, and arbitrary waveform generators leverage the 10AS032H4F35E3LG's processing density and HPS integration. The FPGA fabric performs real-time DSP on sampled waveforms, while the HPS runs the user interface, display rendering, and connectivity layers. Per the Arria 10 SX family datasheet, transceivers support high-speed serial standards for compliance testing interfaces including PCIe Gen3 and USB 3.1. The DDR4 memory subsystem provides deep capture buffering essential for protocol analyzers, and the ARM Cortex-A9 cores enable Linux-based test automation frameworks.
Recomendado
Smart Factory and IIoT Gateways
Industrial IoT gateways built around the 10AS032H4F35E3LG combine deterministic protocol handling in the FPGA fabric with edge analytics on the ARM Cortex-A9 HPS. The device supports multiple industrial protocols simultaneously - EtherCAT, PROFINET, Modbus, OPC-UA - via FPGA-implemented MAC layers, while the HPS runs containerized analytics workloads under Linux. Per the Arria 10 SX datasheet, the EMAC and USB peripherals enable direct connectivity to industrial networks without external bridge chips. The 320K logic elements provide headroom for future protocol expansion without device replacement, protecting long-lifecycle industrial deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS032H4F35E3LG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS032H4F35I3SG | 10AS032H4F35E3SG | 10AS032H4F35I2SG | 10AS032H4F34E3LG | 10AS032H3F35E2LG | 10AS032H3F35I2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA 35x35 mm (F35) | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 34x34 mm (F34) - smaller | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 35x35 mm (F35) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Processor | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz |
| Temperature Grade | Commercial Extended (E3) | Industrial (I3) | Commercial Extended (E3) | Industrial (I2) | Commercial Extended (E3) | Commercial Extended (E2) | Industrial (I2) |
| Speed Grade | -3 | -3 | -3 | -2 | -3 | -2 | -2 |
| Transceiver Speed | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps |
| Lead-Free / RoHS | SnPb (L) / Yes | Lead-free (G) / Yes | Lead-free (G) / Yes | Lead-free (G) / Yes | SnPb (L) / Yes | SnPb (L) / Yes | Lead-free (G) / Yes |
Principais diferenciais
- Hard ARM Cortex-A9 HPS integrated with 320K logic elements on the same die (vs Non-SoC Arria 10 10AX115N3F40)
- 28.05 Gbps transceiver capability (vs Xilinx Zynq-7045 Z-7045)
- F35 35x35 mm FCBGA package with 1152 balls (vs 10AS032H4F34E3LG (F34 34x34 mm))
Notas de projeto
The 1152-ball F35 FCBGA at 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for reliable BGA breakout routing. Per Arria 10 SX design guidelines, use a stack-up with HDI (High Density Interconnect) layers and ensure proper thermal via arrays beneath the package center for heat dissipation. Lead-free solder reflow profiles must follow JEDEC J-STD-020 for moisture sensitivity level handling, as 1152-ball BGA devices are highly susceptible to warpage during thermal cycling.
The 10AS032H4F35E3LG requires multiple power rails including 0.87V core, 1.8V auxiliary, and various transceiver and HPS supplies. Per the Arria 10 SX family datasheet, power sequencing must follow the prescribed order to prevent latch-up and device damage. Use the Intel Early Power Estimator (EPE) and PowerPlay Power Analyzer with realistic utilization vectors to obtain design-specific power budgets; typical designs range from 15W to 40W with peak cases exceeding 60W. Decoupling capacitor selection per the reference design schematic is mandatory for power integrity.
The F35 35x35 mm FCBGA package has a junction-to-ambient thermal resistance that requires active cooling in most operating conditions. Per Arria 10 SX thermal documentation, heat spreaders or heatsinks with thermal interface material are mandatory for designs dissipating more than 20W. Estimated: at typical 30W dissipation and 1.0 C/W theta_JA with adequate heatsinking, junction-to-ambient rise is approximately 30C. Always perform thermal simulation with the actual board stack-up and enclosure constraints before committing to a cooling solution.
Common pitfalls in 10AS032H4F35E3LG designs include: (1) failing to configure unused transceiver channels per reference design recommendations, which can cause spurious emissions; (2) ignoring HPS boot mode pin settings, which can leave the device in a non-functional state; (3) underestimating configuration memory size for FPGA bitstreams with HPS firmware images, leading to boot failures; and (4) neglecting DDR4 write leveling and read calibration during board bring-up, causing intermittent memory errors. Reference the Arria 10 SX EMIF Toolkit and the Arria 10 SoC Development Kit user guide for validated bring-up procedures.
Transceiver channels up to 28.05 Gbps require careful PCB routing with controlled impedance (typically 100 ohm differential), length matching within 0.127 mm tolerance for lanes within a group, and continuous reference planes on adjacent layers. Per Intel transceiver layout guidelines, AC coupling capacitors must be placed within 250 mils of the receiver pins. Channel simulation with the Quartus Prime IBIS-AMI models is mandatory for 25 Gbps and higher signaling to validate signal integrity margin before fabrication.
Informações de conformidade
10AS032H4F35E3LG uses SnPb solder per L suffix per Altera OPN convention; choose G-suffix variants for lead-free compliance. RoHS compliance per Altera product page. Not AEC-Q100 qualified - this device is intended for industrial, commercial, and defense applications, not automotive.
