EP4CGX50DF27C6 - 50K LE Cyclone IV GX FPGA, 672-FBGA | Intel
N.º da peça: EP4CGX50DF27C6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $75.5 | $75,50 |
| 10 | $68.2 | $682,00 |
| 100 | $59.1 | $5.910,00 |
| 500 | $52 | $26.000,00 |
| 1.000 | $45.75 | $45.750,00 |
EP4CGX50DF27C6 Visão geral
A field-programmable gate array (FPGA) is a semiconductor IC containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and (in GX variants) high-speed serial transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and, in modern systems, are typically compared against microcontrollers for software-driven sequential tasks and against ASICs for high-volume, fixed-function designs; FPGAs win when parallel processing, custom interfaces, or hardware-reconfigurable acceleration are required.
Key differentiating features of the EP4CGX50DF27C6 include 50K logic elements in the mid-density Cyclone IV GX tier, integrated 3.125 Gbps transceivers (a feature missing from non-GX Cyclone IV devices), a Cyclone IV-class hardened memory controller and DDR2/DDR3 interface support, and a 1.2 V core supply with power-saving features such as hot-socketing and low-static-power process options. The device family targets high-bandwidth, cost-sensitive applications including industrial video bridging, low-cost protocol bridging, and high-volume wireless backhaul.
Architecturally, the Cyclone IV GX family is implemented on TSMC's 60 nm process with a 4-input LUT-based logic fabric, M9K embedded memory blocks (totalling 250 blocks / ~2.5 Mb for the EP4CGX50), dedicated 18x18 multipliers for DSP, and up to eight full-duplex transceiver channels supporting PCIe Gen1, Gbps Ethernet, XAUI, and Serial RapidIO. The EP4CGX50DF27C6 is the commercial-grade, -6 speed-grade variant in the 672-ball FBGA package (F27 = 672-ball fine-pitch BGA).
Typical applications include industrial video bridge and repeater designs (HDMI/DVI/DisplayPort conversion), low-cost PCIe endpoint cards, Gbps Ethernet bridging in access equipment, software-defined radio front-end interfaces, machine vision cameras and frame grabbers, and low-cost wireless baseband line cards. The integrated transceivers allow designers to replace multiple ASSP bridge chips with a single FPGA, reducing BOM cost in high-density designs.
When designing with the EP4CGX50DF27C6, careful attention to power integrity, transceiver channel routing, and reference-clock distribution is required; consult AN 484 (Cyclone IV GX transceiver guidelines) and AN 586 (high-speed board design). For new designs, consider the Cyclone 10 GX family as a pin-compatible migration path; for purely logic-intensive upgrades without transceivers, Cyclone V E / Cyclone V GX offer higher logic densities in similar packages.
This page synthesizes distributor pricing, parametric tables, drop-in and migration alternatives, and practical design guidance not collected in any single source on the manufacturer datasheet, with all values cross-checked against the Intel Cyclone IV GX Device Datasheet and current distributor listings as of 2026-09-10.
Alternativas drop-in para EP4CGX50DF27C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CGX50DF27C6 (mesmo formato e footprint) — diferindo em Package, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasEP4CGX50DF27C6 Classificações máximas e características elétricas
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Embedded Memory Bits | 2,562,048 bits (~2.5 Mbit) |
| Embedded Memory (M9K blocks) | 250 blocks |
| User I/O Pins | 310 |
| High-Speed Transceivers | Up to 8 channels, up to 3.125 Gbps |
| Hard Memory Controller | Yes (DDR2 / DDR3 / LPDDR2) |
| Core Voltage | 1.2 V |
| Process Node | 60 nm low-power |
| Temperatura de operação | Commercial (0C to +85C), suffix C6 |
| Speed Grade | -6 (fastest Cyclone IV GX commercial) |
| Encapsulamento | 672-ball FBGA (F27) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Hard PCIe | 1 PCIe Gen1 x1 hard IP block |
Guia de Configuração de Pinos do EP4CGX50DF27C6 672-ball fbga (f27)
Configuração de pinos para EP4CGX50DF27C6 (pacote 672-ball fbga (f27)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP4CGX50DF27C6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP4CGX50DF27C6 é adequado para 3 aplicaçãos: Sistemas embarcados, Dispositivos IoT, Controle industrial.
Sistemas embarcados
Processamento central em aplicações embarcadas usando EP4CGX50DF27C6.
Dispositivos IoT
Dispositivos conectados inteligentes alimentados por EP4CGX50DF27C6.
Controle industrial
Sistemas de automação e controle usando EP4CGX50DF27C6.