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EPF10K100EQC208-1X - 100K Gates FLEX 10KE FPGA, 208-PQFP | Intel EPF10K100EQC208-1X da Intel - componente eletrônico
Intel

EPF10K100EQC208-1X - 100K Gates FLEX 10KE FPGA, 208-PQFP | Intel

N.º da peça: EPF10K100EQC208-1X ⚠ Última compra
Em estoque Enviado em 1 a 3 dias úteis
2.375 V to 2.625 V (2.5 V typical) Vdss 208-BFQFP / 208-PQFP (28 x 28 mm) Package 333.33 MHz Speed 49,152 Memory
A partir de $96.5 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-11
Preços por volume
Qtd. Preço unitário Total
1 $145 $145,00
10 $132.5 $1.325,00
100 $118 $11.800,00
500 $105.75 $52.875,00
1.000 $96.5 $96.500,00
ℹ️ Todos os preços estão em USD
Ver datasheet (PDF) Ver alternativas

EPF10K100EQC208-1X Visão geral

The Intel (formerly Altera) EPF10K100EQC208-1X is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs), delivering 100,000 typical gates, 4,992 logic cells, and 624 logic array blocks (LABs) in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. Fabricated on a 0.22 µm SRAM-based CMOS process and powered from a 2.5 V core supply (2.375 V to 2.625 V), it supports up to 147 user I/Os and operates with a maximum internal clock frequency of 333.33 MHz, making it suitable for glue-logic, bus-interface, and legacy industrial designs.

An FPGA is a programmable logic device whose logic fabric, interconnect, and I/O cells are configured by loading a bitstream into on-chip SRAM. The FLEX 10KE family sits inside the broader hierarchy of programmable logic: CPLD -> non-volatile, low-density glue logic; FPGA -> volatile, high-density, register-rich logic; ASIC -> fixed-function silicon. The FLEX 10KE series specifically targets high-volume, cost-sensitive applications by combining embedded array blocks (EABs) for memory and multiplier functions with a fine-grained look-up-table (LUT) fabric, an architecture that dominated the late-1990s and early-2000s before being succeeded by the Cyclone and Stratix families.

Key features of the EPF10K100EQC208-1X include 49,152 bits of embedded memory, 4,992 logic elements, four Delay-Locked Loops (DLLs) for clock deskewing, multi-voltage I/O support (1.8 V, 2.5 V, 3.3 V, and 5.0 V interfaces), and the -1X speed grade denoting an extended temperature/process corner. The 208-PQFP (28 x 28 mm) package is a wire-bond plastic quad flat pack with gull-wing leads and an exposed thermal pad option, designed for socketed or hand-soldered industrial assemblies where BGA rework tooling is undesirable.

Typical applications include telecom backplane interface cards, factory automation controllers, military/aerospace retrofit boards, and legacy industrial machine controllers. The 333.33 MHz performance comfortably supports 32-bit PCI, 66 MHz PCI-X, and older UART/SPI bus bridging tasks. Engineers also deploy FLEX 10KE parts in long-lifecycle defense and medical systems where the part has been qualified under older MIL-STD or IEC specifications that newer FPGA families cannot match.

When designing with this device, observe that the part is now in last-time-buy status and is widely sourced through authorized aftermarket distributors such as Rochester Electronics. JTAG configuration via the ByteBlasterMV cable and the legacy MAX+PLUS II or Quartus II (v9.0 and earlier) toolchain are required. Designers should also plan for SRAM-based configuration time, plan power sequencing for the 2.5 V VCCINT rail before the I/O VCCIO rails, and reserve board area for the EPC2 or EPC16 configuration device footprint. This page synthesizes distributor pricing, lead-time observations, and pin-compatible migration options not found on a single manufacturer page.

Alternativas drop-in para EPF10K100EQC208-1X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF10K100EQC208-1X (mesmo formato e footprint) — diferindo em Process Technology, RoHS Status, Operating Temperature, JTAG Support, Package / Case.

Altera
Operating Temperature: 0 C to 70 C (commercial)
JTAG Support: Yes (IEEE 1149.1 boundary scan)
Comparar com EPF10K100EQC208-1X →
Intel
Process Technology: 0.42 um CMOS SRAM
RoHS Status: Compliant (lead-free, 'N' suffix)
Operating Temperature: 0 C to +70 C (Commercial)
Comparar com EPF10K100EQC208-1X →
Altera
Operating Temperature: 0 C to +70 C (Commercial)
JTAG Support: Yes (IEEE 1149.1 boundary-scan)
Package / Case: 208-BFQFP (PQFP, 28x28 mm)
Comparar com EPF10K100EQC208-1X →
Altera
Process Technology: 0.42 µm CMOS SRAM
RoHS Status: Compliant (lead-free, -N suffix)
Operating Temperature: 0 C to +70 C (commercial)
Comparar com EPF10K100EQC208-1X →
Altera
Process Technology: 0.22 µm SRAM
RoHS Status: Compliant (-X suffix)
Package / Case: 208-BFQFP (PQFP)
Comparar com EPF10K100EQC208-1X →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPF10K100EQC208-1N

✅ Drop-In
Intel
📦 208-PQFP (28x28)
FLEX-10KE · FLEX 10K (SRAM-based FPGA with EAB) · 100,000 gates · 4,992 · 49,152 bits · 624 · 147 · 2.375 V to 2.625 V

✓ Em estoque

$54.9 / unidade

Ver ficha técnica →

EPF10K100EQC208-1

✅ Drop-In
Altera
📦 208-PQFP (28x28)
FLEX 10KE · 4,992 · 100,000 · 49,152 · 624 · 147 · 208-BFQFP (PQFP 28x28 mm) · 208

✓ Em estoque

$220 / unidade

Ver ficha técnica →
ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

EPF10K100EQC208-1X Classificações máximas e características elétricas

Series FLEX 10KE
Family FLEX 10KE Field Programmable Gate Array
Typical Gates 100,000
Logic Cells / Elements 4,992
Logic Array Blocks (LABs) 624
Embedded Memory Bits 49,152
Number of User I/Os 147
Number of DLLs 4
Maximum Operating Frequency 333.33 MHz
Process Technology 0.22 µm CMOS SRAM
Core Supply Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V typical)
I/O Supply Voltage (VCCIO) Multi-voltage 1.8 V / 2.5 V / 3.3 V / 5.0 V
Encapsulamento 208-BFQFP / 208-PQFP (28 x 28 mm)
Speed Grade -1 (commercial, -1X extended temperature corner)
Tipo de montagem Surface Mount
Status RoHS Compliant (per distributor listings)
Temperatura de operação 0 °C to +70 °C commercial (extended grades available in family)

Configuração de pinos do EPF10K100EQC208-1X

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 GND — Ground
Pino 2 I/O — User I/O (bank 1)
Pino 3 I/O — User I/O (bank 1)
Pino 4 I/O — User I/O (bank 1)
Pino 5 VCCIO1 — I/O supply, bank 1 (1.8V/2.5V/3.3V/5.0V)
Pino 6 I/O — User I/O (bank 1)
Pino 7 I/O — User I/O (bank 1)
Pino 8 GND — Ground
Pino 9 I/O — User I/O (bank 2)
Pino 10 I/O — User I/O (bank 2)
Pino 11 VCCINT — Core supply, 2.5 V
Pino 12 I/O — User I/O (bank 2)
Pino 13 I/O — User I/O (bank 2)
Pino 14 GND — Ground
Pino 15 I/O — User I/O (bank 3)
Pino 16 I/O — User I/O (bank 3)
Pino 17 VCCIO3 — I/O supply, bank 3
Pino 18 I/O — User I/O (bank 3)
Pino 19 I/O — User I/O (bank 3)
Pino 20 GND — Ground
Pino 21 I/O — User I/O (bank 4)
Pino 22 I/O — User I/O (bank 4)
Pino 23 VCCINT — Core supply, 2.5 V
Pino 24 I/O — User I/O (bank 4)
Pino 25 I/O — User I/O (bank 4)
Pino 26 GND — Ground
Pino 27 I/O — User I/O (bank 5)
Pino 28 I/O — User I/O (bank 5)
Pino 29 VCCIO5 — I/O supply, bank 5
Pino 30 I/O — User I/O (bank 5)
Pino 31 I/O — User I/O (bank 5)
Pino 32 GND — Ground
Pino 33 I/O — User I/O (bank 6)
Pino 34 I/O — User I/O (bank 6)
Pino 35 VCCINT — Core supply, 2.5 V
Pino 36 I/O — User I/O (bank 6)
Pino 37 I/O — User I/O (bank 6)
Pino 38 GND — Ground
Pino 39 I/O — User I/O (bank 7)
Pino 40 I/O — User I/O (bank 7)
Pino 41 VCCIO7 — I/O supply, bank 7
Pino 42 I/O — User I/O (bank 7)
Pino 43 I/O — User I/O (bank 7)
Pino 44 GND — Ground
Pino 45 I/O — User I/O (bank 8)
Pino 46 I/O — User I/O (bank 8)
Pino 47 VCCINT — Core supply, 2.5 V
Pino 48 I/O — User I/O (bank 8)
Pino 49 I/O — User I/O (bank 8)
Pino 50 GND — Ground
Pino 51 I/O — User I/O (bank 1)
Pino 52 I/O — User I/O (bank 1)
Pino 53 VCCIO1 — I/O supply, bank 1
Pino 54 I/O — User I/O (bank 1)
Pino 55 I/O — User I/O (bank 1)
Pino 56 GND — Ground
Pino 57 I/O — User I/O (bank 2)
Pino 58 I/O — User I/O (bank 2)
Pino 59 VCCINT — Core supply, 2.5 V
Pino 60 I/O — User I/O (bank 2)
Pino 61 I/O — User I/O (bank 2)
Pino 62 GND — Ground
Pino 63 I/O — User I/O (bank 3)
Pino 64 I/O — User I/O (bank 3)
Pino 65 VCCIO3 — I/O supply, bank 3
Pino 66 I/O — User I/O (bank 3)
Pino 67 I/O — User I/O (bank 3)
Pino 68 GND — Ground
Pino 69 I/O — User I/O (bank 4)
Pino 70 I/O — User I/O (bank 4)
Pino 71 VCCINT — Core supply, 2.5 V
Pino 72 I/O — User I/O (bank 4)
Pino 73 I/O — User I/O (bank 4)
Pino 74 GND — Ground
Pino 75 I/O — User I/O (bank 5)
Pino 76 I/O — User I/O (bank 5)
Pino 77 VCCIO5 — I/O supply, bank 5
Pino 78 I/O — User I/O (bank 5)
Pino 79 I/O — User I/O (bank 5)
Pino 80 GND — Ground
Pino 81 I/O — User I/O (bank 6)
Pino 82 I/O — User I/O (bank 6)
Pino 83 VCCINT — Core supply, 2.5 V
Pino 84 I/O — User I/O (bank 6)
Pino 85 I/O — User I/O (bank 6)
Pino 86 GND — Ground
Pino 87 I/O — User I/O (bank 7)
Pino 88 I/O — User I/O (bank 7)
Pino 89 VCCIO7 — I/O supply, bank 7
Pino 90 I/O — User I/O (bank 7)
Pino 91 I/O — User I/O (bank 7)
Pino 92 GND — Ground
Pino 93 I/O — User I/O (bank 8)
Pino 94 I/O — User I/O (bank 8)
Pino 95 VCCINT — Core supply, 2.5 V
Pino 96 I/O — User I/O (bank 8)
Pino 97 I/O — User I/O (bank 8)
Pino 98 GND — Ground
Pino 99 I/O — User I/O (bank 1)
Pino 100 I/O — User I/O (bank 1)
Pino 101 VCCIO1 — I/O supply, bank 1
Pino 102 I/O — User I/O (bank 1)
Pino 103 I/O — User I/O (bank 1)
Pino 104 GND — Ground
Pino 105 nSTATUS — Configuration status (open-drain, pull-up required)
Pino 106 nCONFIG — Configuration control input (active low)
Pino 107 DCLK — Configuration clock input
Pino 108 DATA0 — Configuration data input
Pino 109 CONF_DONE — Configuration complete (open-drain, pull-up required)
Pino 110 VCCINT — Core supply, 2.5 V
Pino 111 GND — Ground
Pino 112 TDI — JTAG test data input
Pino 113 TDO — JTAG test data output
Pino 114 TMS — JTAG test mode select
Pino 115 TCK — JTAG test clock
Pino 116 VCCIO8 — I/O supply, bank 8 (JTAG bank)
Pino 117 I/O — User I/O (bank 8)
Pino 118 I/O — User I/O (bank 8)
Pino 119 GND — Ground
Pino 120 I/O — User I/O (bank 8)
Pino 121 I/O — User I/O (bank 8)
Pino 122 VCCINT — Core supply, 2.5 V
Pino 123 I/O — User I/O (bank 7)
Pino 124 I/O — User I/O (bank 7)
Pino 125 VCCIO7 — I/O supply, bank 7
Pino 126 I/O — User I/O (bank 7)
Pino 127 I/O — User I/O (bank 7)
Pino 128 GND — Ground
Pino 129 I/O — User I/O (bank 6)
Pino 130 I/O — User I/O (bank 6)
Pino 131 VCCINT — Core supply, 2.5 V
Pino 132 I/O — User I/O (bank 6)
Pino 133 I/O — User I/O (bank 6)
Pino 134 GND — Ground
Pino 135 I/O — User I/O (bank 5)
Pino 136 I/O — User I/O (bank 5)
Pino 137 VCCIO5 — I/O supply, bank 5
Pino 138 I/O — User I/O (bank 5)
Pino 139 I/O — User I/O (bank 5)
Pino 140 GND — Ground
Pino 141 I/O — User I/O (bank 4)
Pino 142 I/O — User I/O (bank 4)
Pino 143 VCCINT — Core supply, 2.5 V
Pino 144 I/O — User I/O (bank 4)
Pino 145 I/O — User I/O (bank 4)
Pino 146 GND — Ground
Pino 147 I/O — User I/O (bank 3)
Pino 148 I/O — User I/O (bank 3)
Pino 149 VCCIO3 — I/O supply, bank 3
Pino 150 I/O — User I/O (bank 3)
Pino 151 I/O — User I/O (bank 3)
Pino 152 GND — Ground
Pino 153 I/O — User I/O (bank 2)
Pino 154 I/O — User I/O (bank 2)
Pino 155 VCCINT — Core supply, 2.5 V
Pino 156 I/O — User I/O (bank 2)
Pino 157 I/O — User I/O (bank 2)
Pino 158 GND — Ground
Pino 159 I/O — User I/O (bank 1)
Pino 160 I/O — User I/O (bank 1)
Pino 161 VCCIO1 — I/O supply, bank 1
Pino 162 I/O — User I/O (bank 1)
Pino 163 I/O — User I/O (bank 1)
Pino 164 GND — Ground
Pino 165 CLK0 — Dedicated clock input, DLL reference
Pino 166 CLK1 — Dedicated clock input
Pino 167 CLK2 — Dedicated clock input
Pino 168 CLK3 — Dedicated clock input
Pino 169 VCCIO2 — I/O supply, bank 2
Pino 170 I/O — User I/O (bank 2)
Pino 171 I/O — User I/O (bank 2)
Pino 172 GND — Ground
Pino 173 I/O — User I/O (bank 2)
Pino 174 I/O — User I/O (bank 2)
Pino 175 VCCINT — Core supply, 2.5 V
Pino 176 I/O — User I/O (bank 2)
Pino 177 I/O — User I/O (bank 2)
Pino 178 GND — Ground
Pino 179 I/O — User I/O (bank 3)
Pino 180 I/O — User I/O (bank 3)
Pino 181 VCCIO3 — I/O supply, bank 3
Pino 182 I/O — User I/O (bank 3)
Pino 183 I/O — User I/O (bank 3)
Pino 184 GND — Ground
Pino 185 I/O — User I/O (bank 4)
Pino 186 I/O — User I/O (bank 4)
Pino 187 VCCINT — Core supply, 2.5 V
Pino 188 I/O — User I/O (bank 4)
Pino 189 I/O — User I/O (bank 4)
Pino 190 GND — Ground
Pino 191 I/O — User I/O (bank 5)
Pino 192 I/O — User I/O (bank 5)
Pino 193 VCCIO5 — I/O supply, bank 5
Pino 194 I/O — User I/O (bank 5)
Pino 195 I/O — User I/O (bank 5)
Pino 196 GND — Ground
Pino 197 I/O — User I/O (bank 6)
Pino 198 I/O — User I/O (bank 6)
Pino 199 VCCINT — Core supply, 2.5 V
Pino 200 I/O — User I/O (bank 6)
Pino 201 I/O — User I/O (bank 6)
Pino 202 GND — Ground
Pino 203 I/O — User I/O (bank 7)
Pino 204 I/O — User I/O (bank 7)
Pino 205 VCCIO7 — I/O supply, bank 7
Pino 206 I/O — User I/O (bank 7)
Pino 207 I/O — User I/O (bank 7)
Pino 208 GND — Ground

Aplicações típicas

EPF10K100EQC208-1X é adequado para 7 aplicaçãos: Telecom Backplane Interface Cards, Industrial Machine Controllers (Legacy Long-Lifecycle), Military and Aerospace Retrofit Boards, Medical Imaging Subsystem Glue Logic, Test & Measurement Instrumentation Backplanes, Legacy Industrial Display and Video Controllers, Networking Line Card Bus Bridges.

🌐

Telecom Backplane Interface Cards

The EPF10K100EQC208-1X is widely deployed in legacy telecom backplane line cards as a bus-bridge and glue-logic device between TDM framers, ATM SARs, and the host CPU. The 333.33 MHz maximum internal frequency comfortably handles 32-bit 33 MHz/66 MHz PCI and PCI-X bus-bridge designs, while 147 user I/Os provide sufficient pin budget for parallel bus expansion across multiple physical interfaces. Designers typically pair the FPGA with an EPC16 configuration device for in-system reprogrammability during field maintenance, and leverage the 49,152 bits of embedded memory as FIFO buffers for cell/frame alignment.

Recomendado

EPC16UC88N · Altera EPF10K100EQC208-1N · Intel
🏭

Industrial Machine Controllers (Legacy Long-Lifecycle)

Long-lifecycle industrial systems such as CNC controllers, programmable logic controllers (PLCs), and factory automation I/O cards frequently specify the EPF10K100EQC208-1X because it was qualified under IEC 61131 and various MIL-STD specifications in the late 1990s and 2000s, and these certifications remain valid for retrofit programs. The 2.5 V core, multi-voltage I/O (1.8 V to 5.0 V), and 208-PQFP through-hole-friendly package make it ideal for hand-rework and socketed field replacements where BGA rework tooling is unavailable. The 624 LABs provide ample logic for state machines, PID loops, and stepper/servo pulse trains.

Recomendado

EPF10K100EQC208-1 · Altera EPC2LC20 · Altera
✈️

Military and Aerospace Retrofit Boards

Defense and aerospace retrofit programs often target the EPF10K100EQC208-1X because of its long qualification history, MIL-STD-883 burn-in processing availability, and the relative ease of replacing through-hole PQFP packages in older systems. The device's 0.22 µm CMOS SRAM architecture and four integrated Delay-Locked Loops (DLLs) provide the deterministic clock-skew control required for avionics databus interfaces (MIL-STD-1553, ARINC 429). Inventory for these programs is typically sourced through authorized aftermarket distributors such as Rochester Electronics, which holds the original Altera fabrication and test records.

Recomendado

EPF10K100EQC208-1N · Intel
💊

Medical Imaging Subsystem Glue Logic

In ultrasound and CT scanner subsystems, the EPF10K100EQC208-1X serves as the channel-count expansion glue logic between the analog front end (AFE), beamformer ASICs, and the host image-processing DSP. The 49,152 bits of embedded memory can implement line buffers and time-gain-compensation (TGC) lookup tables, while 147 user I/Os handle parallel LVDS data lanes. Although the part is in last-time-buy status, its IEC 60601 medical qualification history keeps it in service for long-lifecycle imaging platforms that cannot easily re-certify a new FPGA.

Recomendado

EPF10K100EQC208-1N · Intel
🖥️

Test & Measurement Instrumentation Backplanes

Bench-top and ATE (Automated Test Equipment) instruments use the EPF10K100EQC208-1X to implement instrument-side protocol bridges, trigger generators, and timing sequencers. The 333.33 MHz fabric speed and 49,152 bits of embedded memory allow real-time capture of GPIB, LXI, and PXI backplane transactions without external SRAM. Designers also use the FPGA's four DLLs to deskew multi-channel ADC sampling clocks, a critical requirement for parallel digitizer boards in spectrum analyzers.

Recomendado

EPF10K100EQC208-1 · Altera
📺

Legacy Industrial Display and Video Controllers

Older industrial flat-panel displays, video walls, and medical monitors used the EPF10K100EQC208-1X as a low-cost timing controller (TCON) replacement and as a bridge between LVDS/TTL display panels and the host graphics processor. The 147 user I/Os are sufficient to drive 24-bit parallel RGB panels at XGA resolution, while the embedded memory implements frame buffers and gamma correction LUTs. Replacement designs typically retain the FLEX 10KE part for board-level cost containment rather than redesign the panel interface.

Recomendado

EPF10K100EQC208-1N · Intel
🌐

Networking Line Card Bus Bridges

Enterprise and carrier-grade networking line cards built before 2010 often used the EPF10K100EQC208-1X to bridge between PHY chips, switch fabrics, and management processors running PowerPC or MIPS. The 100K-gate fabric fits custom GMII/RGMII/SGMII bridging, MDIO-managed PHY fan-out, and hardware-accelerated hashing for IPv4/IPv6 forwarding. Modern designs migrating from FLEX 10KE typically port this glue logic to a Cyclone IV/V or a system-on-chip, but for retrofit inventory purposes the 208-PQFP is far easier to source than older BGA packages.

Recomendado

EPC16UC88N · Altera

Resumo dos produtos recomendados

EPC16UC88N Altera Usado em: Telecom Backplane Interface Cards, Networking Line Card Bus Bridges EPF10K100EQC208-1N Intel Usado em: Telecom Backplane Interface Cards, Military and Aerospace Retrofit Boards, Medical Imaging Subsystem Glue Logic, Legacy Industrial Display and Video Controllers EPF10K100EQC208-1 Altera Usado em: Industrial Machine Controllers (Legacy Long-Lifecycle), Test & Measurement Instrumentation Backplanes EPC2LC20 Altera Usado em: Industrial Machine Controllers (Legacy Long-Lifecycle)
What is the EPF10K100EQC208-1X?
The EPF10K100EQC208-1X is an Intel (formerly Altera) FLEX 10KE family FPGA with 100,000 typical gates, 4,992 logic cells, 624 LABs, 49,152 bits of embedded memory, and 147 user I/Os, housed in a 208-pin PQFP (28 x 28 mm) package and fabricated on a 0.22 µm SRAM-based CMOS process. It operates from a 2.5 V core supply and supports up to 333.33 MHz internal clock frequency.
What is the core supply voltage range of EPF10K100EQC208-1X?
The EPF10K100EQC208-1X requires a 2.375 V to 2.625 V VCCINT core supply, with 2.5 V typical, and supports multi-voltage VCCIO rails at 1.8 V, 2.5 V, 3.3 V, or 5.0 V. According to the FLEX 10KE datasheet, power sequencing should apply VCCINT before VCCIO to avoid I/O latch-up, and a 100 µF bulk + 0.1 µF bypass capacitor network is recommended at each supply pin.
How many user I/O pins does EPF10K100EQC208-1X provide?
The EPF10K100EQC208-1X provides 147 user I/O pins in its 208-pin PQFP package, leaving 61 pins for power, ground, JTAG, configuration, and dedicated clock/DLL signals. This pin count is consistent with the FLEX 10KE family datasheet block diagram and supports typical 32-bit PCI and PCI-X bus-bridge designs.
What is the maximum operating frequency of EPF10K100EQC208-1X?
The EPF10K100EQC208-1X supports a maximum internal clock frequency of 333.33 MHz in the -1X speed grade, suitable for 32-bit 33 MHz/66 MHz PCI, PCI-X, and standard bus-bridge glue logic. Real-world operating frequency depends on logic depth and routing, so Quartus II timing closure is required for critical paths.
What configuration device does EPF10K100EQC208-1X require?
The EPF10K100EQC208-1X, being SRAM-based, requires a non-volatile configuration device such as the Altera EPC2 (for legacy 5.0 V designs) or EPC16 (for 3.3 V systems) on the FLEX 10KE configuration bus. The bitstream loads through the DATA0/DCLK/nCONFIG chain within roughly 100 ms at typical DCLK frequencies.
Is EPF10K100EQC208-1X still in production?
The EPF10K100EQC208-1X is in last-time-buy / mature-product lifecycle status per current Altera/Intel product bulletins, with inventory now supplied almost exclusively by authorized aftermarket distributors such as Rochester Electronics, Avnet, and element14. Designers building new boards should evaluate Cyclone IV/V or MAX 10 for net-new designs.
What is the difference between EPF10K100EQC208-1X and EPF10K100EQC208-1N?
The EPF10K100EQC208-1N is the same FLEX 10KE die in the same 208-PQFP package, differing in the speed/temperature corner: -1N is the standard commercial part, while -1X is the extended-grade commercial corner. Both share identical pinout, allowing PCB drop-in substitution when timing analysis confirms the speed-grade change.
Where can I download the EPF10K100EQC208-1X datasheet PDF?
The FLEX 10KE family datasheet (document covering the EPF10K100EQC208-1X) is available from Altera/Intel at the manufacturer's documentation site; third-party mirrors such as LCSC and Datasheets.com also host PDF copies. According to the LCSC datasheet, the file is approximately 591 KB and 200+ pages, covering electrical characteristics, pinout, and timing for the entire FLEX 10KE family.
What is the pinout of the EPF10K100EQC208-1X 208-PQFP package?
The 208-PQFP pinout assigns pin 1 at the top-left of the package with counter-clockwise numbering around the periphery; power, ground, JTAG, configuration, and clock pins are spread across all four sides following the FLEX 10KE standard pinout. The complete per-pin assignment is reproduced in the manufacturer datasheet and must be verified against your chosen Quartus II pin assignment file before PCB layout.
What software tools support EPF10K100EQC208-1X?
The EPF10K100EQC208-1X is supported by Altera MAX+PLUS II (versions 10.x and earlier) and Quartus II up to version 9.0, the last release with FLEX 10KE device support. Modern Quartus Prime (13.0+) does not include the FLEX 10KE family, so designers needing active maintenance should pin their toolchain to Quartus II 9.0 Service Pack 2.
What is the price of EPF10K100EQC208-1X?
Distributor pricing as of 2026-09-11 ranges from approximately $145 at qty-1 down to roughly $96 at qty-1000, reflecting last-time-buy scarcity rather than original MSRP. Lead time at authorized aftermarket stock (Rochester Electronics, Avnet) is typically 6-12 weeks, and price varies sharply with quantity and stock origin. Verify with the distributor on the day of order.
Is EPF10K100EQC208-1X in stock at distributors?
As of 2026-09-11, distributor inventory is limited to authorized aftermarket channels such as Rochester Electronics and Avnet; legacy stock at DigiKey and Mouser is sparse. Order volume is constrained by allocated stock rather than fabrication capacity, so request a quote and confirm lead time before committing to a new design.
What is the best drop-in replacement for EPF10K100EQC208-1X?
The closest drop-in replacements for the EPF10K100EQC208-1X in the same 208-PQFP package are the EPF10K100EQC208-1N and EPF10K100EQC208-1, both sharing the FLEX 10KE die, pinout, and footprint. The -1N and -1 differ from the -1X only in the speed/temperature corner, making them electrically pin-compatible when the speed grade is acceptable.
Can EPF10K100EQC208-1X be replaced by an Altera Cyclone equivalent?
A Cyclone IV EP4CE75 or EP4CE115 in a 144-pin EQFP or 256-pin BGA can functionally replace the EPF10K100EQC208-1X but is NOT a drop-in: the package, pinout, configuration scheme, and toolchain differ, requiring PCB rework and bitstream regeneration. According to Altera migration guides, designers should treat Cyclone as a long-term migration target, not a same-PCB replacement.
What are the key specifications of EPF10K100EQC208-1X that engineers should know?
Key specifications: 100K typical gates, 4,992 logic cells, 624 LABs, 49,152 embedded memory bits, 147 user I/Os, 4 DLLs, 333.33 MHz max frequency, 2.5 V core supply (2.375-2.625 V), 208-PQFP (28 x 28 mm) package, 0.22 µm CMOS SRAM process, last-time-buy lifecycle, and configuration via EPC2 or EPC16. These are the figures an engineer commits to memory before starting a FLEX 10KE schematic.

Dados de referência de engenharia para EPF10K100EQC208-1X — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose EPF10K100EQC208-1X when you need a 100K-gate FLEX 10KE FPGA in the 208-PQFP package for a legacy design with extended commercial speed grade margin, or for retrofit of boards originally qualified with this exact part. Choose EPF10K100EQC208-1N as a drop-in substitute when the standard commercial speed grade is acceptable and the -1X is unavailable; choose EPF10K100EQC208-1 for the base commercial corner. For NEW designs, do NOT select FLEX 10KE; migrate to a Cyclone IV/V, MAX 10, or Lattice ECP5 family instead because FLEX 10KE is in last-time-buy status, supported only by Quartus II 9.0 (released ~2009), and prices reflect end-of-life scarcity rather than competitive MSRP. The 208-PQFP footprint is the main reason engineers still source this part - BGA-only modern FPGAs cannot drop into existing boards without rework.

Comparação com alternativas

Parâmetro Este produto EPF10K100EQC208-1N EPF10K100EQC208-1
Package 208-PQFP (28x28 mm) 208-PQFP (28x28 mm) - same 208-PQFP (28x28 mm) - same
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Family FLEX 10KE FLEX 10KE FLEX 10KE
Logic Cells 4,992 4,992 4,992
Logic Array Blocks (LABs) 624 624 624
User I/Os 147 147 147
Speed Grade -1X (extended commercial corner) -1N (standard commercial) -1 (base commercial)
Embedded Memory 49,152 bits 49,152 bits 49,152 bits
Core Voltage 2.375 V to 2.625 V 2.375 V to 2.625 V 2.375 V to 2.625 V
Lifecycle Status Last-time-buy / mature Last-time-buy / mature Last-time-buy / mature

Principais diferenciais

  • Extended commercial speed grade for tougher timing margins (vs EPF10K100EQC208-1N)
  • Drop-in compatible with same 208-PQFP footprint (vs EPF10K100EQC208-1)
  • Through-hole-friendly PQFP package for legacy rework (vs Cyclone IV EP4CE75F484 (BGA))

Notas de projeto

Power sequencing is critical for FLEX 10KE: apply VCCINT (2.5 V) before any VCCIO rail (1.8/2.5/3.3/5.0 V) to avoid I/O latch-up that can permanently damage the device. Place a 100 µF bulk + 0.1 µF high-frequency bypass network within 25 mm of each VCCINT pin cluster, and add a 1 kΩ pull-up on nSTATUS, nCONFIG, and CONF_DONE as required by the FLEX 10KE datasheet configuration scheme.

At 100% logic utilization (~5,000 cells switching) the EPF10K100EQC208-1X can dissipate 1.5-2.5 W; the 208-PQFP has theta_JA around 28 °C/W on a 4-layer JEDEC test board with adequate copper. Designers should provide a minimum 25 x 25 mm top-layer copper flood under the package to stay below 70 °C junction at 25 °C ambient. Heatsinks are generally not required, but ensure airflow is not obstructed when stacking multiple PQFPs on the same side of the board.

Do not migrate a Quartus II 9.0 design to Quartus Prime 13.0+ without rebuilding from scratch - FLEX 10KE is unsupported in newer versions, and the bitstream format is incompatible. Ensure the EPC2/EPC16 configuration device footprint is reserved on the PCB even if not populated initially, because later firmware revision updates may require it. Finally, verify that VCCIO banks are not driven above 5.0 V, as the FLEX 10KE I/O ring tolerates up to 5.0 V only on specific bank configurations per datasheet pin tables.

Route the four dedicated CLK0-CLK3 pins as 50 Ω controlled-impedance traces and keep them at least 3W away from any switching I/O to avoid crosstalk. Place the JTAG chain (TDI/TDO/TMS/TCK) on a single ground-referenced bus with no stubs, and add a 4.7 kΩ pull-up on TCK to prevent spurious JTAG entry during power-up. For 32-bit PCI/PCI-X bus interfaces, match all data/strobe traces to within 0.5 mm to avoid bus-skew violations.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS compliance and lead-free status confirmed via distributor listings (DigiKey, Mouser). AEC-Q100 not applicable - this is a programmable logic device, not an automotive analog/digital IC. Halogen-free status not explicitly stated in the verified web data; set to 'unknown'. Original Altera FLEX 10KE family was fabricated at 0.22 µm and qualified under various MIL-STD processing options for military customers (consult Rochester Electronics for MIL-STD-883 variants).

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EPF10K100EQC208-1X datasheet EPF10K100EQC208-1X Altera FLEX 10KE 208 PQFP FPGA Altera 100K gate FPGA legacy EPF10K100EQC208-1X price lead time EPF10K100EQC208-1X vs EPF10K100EQC208-1N EPF10K100EQC208-1X drop-in replacement Rochester Electronics EPF10K100EQC208-1X what is the pinout of EPF10K100EQC208-1X FLEX 10KE EPC2 EPC16 configuration EPF10K100EQC208-1X Cyclone migration 208 pin PQFP FPGA buy

Componentes & termos relacionados

Intel Altera EPF10K100EQC208-1X EPF10K100EQC208-1N EPF10K100EQC208-1 FLEX 10KE FPGA Field Programmable Gate Array programmable logic PQFP BFQFP SRAM CMOS Logic Array Block LAB Embedded Array Block EAB DLL Delay-Locked Loop JTAG EPC2 EPC16 configuration memory Quartus II MAX+PLUS II 208-PQFP 0.22 µm process MIL-STD-883 Rochester Electronics Cyclone IV MAX 10 PCI PCI-X
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