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Altera

EPF10K100EQC208-2X - FLEX 10KE FPGA, 100K Gates, 208-PQFP | Altera

N.º da peça: EPF10K100EQC208-2X ⚠ Última compra
Em estoque Enviado em 1 a 3 dias úteis
2.375 V to 2.625 V (2.5 V nominal) Vdss 208-BFQFP (PQFP) Package 250 MHz Speed 49,152 bits Memory
A partir de $59.5 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-11
Preços por volume
Qtd. Preço unitário Total
1 $85 $85,00
10 $78.2 $782,00
100 $71.4 $7.140,00
500 $64.9 $32.450,00
1.000 $59.5 $59.500,00
ℹ️ Todos os preços estão em USD

EPF10K100EQC208-2X Visão geral

The Altera (Intel) EPF10K100EQC208-2X is a member of the FLEX 10KE family of Field Programmable Gate Array (FPGA) ICs, delivering 100,000 system gates with 4,992 logic elements/cells and 49,152 bits of embedded memory in a 208-pin Plastic Quad Flat Pack (PQFP / 208-BFQFP) package. Built on a 0.22 µm SRAM-based process, the device operates from a 2.375 V to 2.625 V core supply (2.5 V nominal), supports 147 user I/O pins, and is offered in the commercial -2 speed grade with a guaranteed internal operating frequency of up to 250 MHz.

An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication, sitting in the broader hierarchy of programmable logic -> programmable logic devices -> digital ICs -> semiconductors. FPGAs combine lookup tables (LUTs), flip-flops, embedded memory blocks (EABs), and programmable interconnect into a single fabric that is configured at power-on from an external configuration ROM or flash. The FLEX 10KE family extended Altera's first-generation FLEX 10K architecture by adding enhanced I/O standards, dual-port RAM, and faster interconnect, targeting glue-logic replacement, bus interfacing, and high-volume ASIC prototyping.

Key features of the EPF10K100EQC208-2X include 4,992 logic elements (LEs) grouped into Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) providing 49,152 bits of RAM, 147 programmable I/O pins supporting LVTTL/LVCMOS/PCI interfaces, an on-chip Phase-Locked Loop (PLL) for clock multiplication and skew management, JTAG (IEEE 1149.1) boundary-scan testing, and in-system programmability via the passive serial (PS) or passive parallel asynchronous (PPA) configuration modes. The -2 speed grade corresponds to the moderate-performance bin of the FLEX 10KE family, offering a balanced trade-off between logic utilization and Fmax. The 208-pin PQFP package measures 28 mm × 28 mm with a 0.5 mm lead pitch, and the -2X suffix indicates lead-free matte-tin plating with extended operating temperature support.

Typical applications include telecommunications line cards, industrial control and automation backplanes, legacy ASIC replacement, PCI bridge designs, video and image processing pipelines, and military/aerospace subsystems where SRAM-based FPGA flexibility is required. The wide 2.5 V core supply tolerance allows operation from regulated 3.3 V rails with simple LDO regulation. When designing with this part, attention must be paid to the configuration scheme (an external EPC serial configuration device such as EPC2 or EPC1 is required), JTAG chain integrity, and I/O bank voltage compatibility, since the FLEX 10KE family predates modern multi-voltage serdes and requires careful VCCIO planning for mixed-voltage interfaces. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes not found in the original datasheet.

Alternativas drop-in para EPF10K100EQC208-2X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF10K100EQC208-2X (mesmo formato e footprint) — diferindo em Operating Temperature, Process Technology, RoHS Status, Speed Grade, Total RAM Bits.

Altera
Operating Temperature: 0 C to 70 C (commercial)
Total RAM Bits: 49,152
Comparar com EPF10K100EQC208-2X →
Intel
Operating Temperature: 0 C to +70 C (Commercial)
Process Technology: 0.42 um CMOS SRAM
RoHS Status: Compliant (lead-free, 'N' suffix)
Comparar com EPF10K100EQC208-2X →
Intel
Operating Temperature: 0 °C to +70 °C commercial (extended grades available in family)
Process Technology: 0.22 µm CMOS SRAM
RoHS Status: Compliant (per distributor listings)
Comparar com EPF10K100EQC208-2X →
Altera
Operating Temperature: 0 C to +70 C (Commercial)
Speed Grade: -2
Total RAM Bits: 49,152 bits
Comparar com EPF10K100EQC208-2X →
Altera
Operating Temperature: 0 C to +70 C (commercial)
Process Technology: 0.42 µm CMOS SRAM
RoHS Status: Compliant (lead-free, -N suffix)
Comparar com EPF10K100EQC208-2X →
Altera
Operating Temperature: 0 °C to 70 °C (Commercial)
Process Technology: 0.22 µm CMOS
RoHS Status: unknown
Comparar com EPF10K100EQC208-2X →
Intel
Operating Temperature: 0 °C to +70 °C (industrial -40 °C to +85 °C per -I suffix)
Process Technology: 0.22 µm CMOS
Total RAM Bits: 24,576
Comparar com EPF10K100EQC208-2X →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPF10K100EQC208-2N

✅ Drop-In
Altera
📦 208-BFQFP (PQFP)
FLEX-10KE · Altera (Intel) · 4992 · 49152 · 624 · 147 · 100000 (typical) · 2.375 V to 2.625 V

✓ Em estoque

$172 / unidade

Ver ficha técnica →

EPF10K100EQC208-2

✅ Drop-In
Altera
📦 208-BFQFP (PQFP)
FLEX 10KE · FPGA (Field Programmable Gate Array) · 100,000 gates · 4,992 · 49,152 bits · 624 · 12 x 2,048 bits · 147

✓ Em estoque

$155.85 / unidade

Ver ficha técnica →

EPF10K100EQC208-1X

✅ Drop-In
Intel
📦 208-BFQFP (PQFP)
FLEX 10KE · FLEX 10KE Field Programmable Gate Array · 100,000 · 4,992 · 624 · 49,152 · 147 · 4

✓ Em estoque

$96.5 / unidade

Ver ficha técnica →

EPF10K100EQC208-1N

✅ Drop-In
Intel
📦 208-BFQFP (PQFP)
FLEX-10KE · FLEX 10K (SRAM-based FPGA with EAB) · 100,000 gates · 4,992 · 49,152 bits · 624 · 147 · 2.375 V to 2.625 V

✓ Em estoque

$54.9 / unidade

Ver ficha técnica →

EPF10K100EQC208-1

✅ Drop-In
Altera
📦 208-BFQFP (PQFP)
FLEX 10KE · 4,992 · 100,000 · 49,152 · 624 · 147 · 208-BFQFP (PQFP 28x28 mm) · 208

✓ Em estoque

$220 / unidade

Ver ficha técnica →
ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

EPF10K100EQC208-2X Classificações máximas e características elétricas

Series FLEX-10KE
Family FLEX 10KE
Logic Elements / Cells 4,992
System Gates 100,000
Embedded Memory (EAB RAM) 49,152 bits
Number of I/O Pins 147
Number of Embedded Array Blocks (EABs) 12
Supply Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V nominal)
Process Technology 0.22 µm SRAM
Maximum Internal Frequency (-2 grade) 250 MHz
Encapsulamento / Caixa 208-BFQFP (PQFP)
Supplier Device Package 208-PQFP (28 × 28 mm, 0.5 mm pitch)
Operating Temperature Grade Commercial
Configuration Mode Passive Serial / Passive Parallel Async
Tipo de montagem Surface Mount
Lead-Free Plating (-X suffix) Yes (matte-tin, lead-free)
Status RoHS Compliant (-X suffix)

Configuração de pinos do EPF10K100EQC208-2X

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 I/O — General-purpose user I/O (Bank 1)
Pino 2 I/O — General-purpose user I/O (Bank 1)
Pino 3 I/O — General-purpose user I/O (Bank 1)
Pino 4 VCCINT — Core supply voltage (2.5 V)
Pino 5 I/O — General-purpose user I/O (Bank 1)
Pino 6 GND — Ground
Pino 7 I/O — General-purpose user I/O (Bank 1)
Pino 8 I/O — General-purpose user I/O (Bank 1)
Pino 9 I/O — General-purpose user I/O (Bank 1)
Pino 10 I/O — General-purpose user I/O (Bank 1)
Pino 11 VCCIO1 — I/O bank 1 reference voltage (3.3 V/2.5 V/1.8 V)
Pino 12 I/O — General-purpose user I/O (Bank 1)
Pino 13 I/O — General-purpose user I/O (Bank 1)
Pino 14 GND — Ground
Pino 15 I/O — General-purpose user I/O (Bank 1)
Pino 16 I/O — General-purpose user I/O (Bank 1)
Pino 17 nCONFIG — Configuration control (active-low)
Pino 18 I/O — General-purpose user I/O (Bank 2)
Pino 19 I/O — General-purpose user I/O (Bank 2)
Pino 20 I/O — General-purpose user I/O (Bank 2)
Pino 21 I/O — General-purpose user I/O (Bank 2)
Pino 22 GND — Ground
Pino 23 I/O — General-purpose user I/O (Bank 2)
Pino 24 I/O — General-purpose user I/O (Bank 2)
Pino 25 I/O — General-purpose user I/O (Bank 2)
Pino 26 VCCINT — Core supply voltage (2.5 V)
Pino 27 DCLK — Configuration clock input
Pino 28 I/O — General-purpose user I/O (Bank 2)
Pino 29 I/O — General-purpose user I/O (Bank 2)
Pino 30 I/O — General-purpose user I/O (Bank 2)
Pino 31 GND — Ground
Pino 32 DATA0 — Configuration data input
Pino 33 I/O — General-purpose user I/O (Bank 2)
Pino 34 I/O — General-purpose user I/O (Bank 2)
Pino 35 nSTATUS — Configuration status (active-low)
Pino 36 CONF_DONE — Configuration complete indicator
Pino 37 I/O — General-purpose user I/O (Bank 2)
Pino 38 I/O — General-purpose user I/O (Bank 2)
Pino 39 VCCIO2 — I/O bank 2 reference voltage
Pino 40 I/O — General-purpose user I/O (Bank 2)
Pino 41 I/O — General-purpose user I/O (Bank 2)
Pino 42 I/O — General-purpose user I/O (Bank 2)
Pino 43 GND — Ground
Pino 44 I/O — General-purpose user I/O (Bank 2)
Pino 45 I/O — General-purpose user I/O (Bank 2)
Pino 46 I/O — General-purpose user I/O (Bank 2)
Pino 47 I/O — General-purpose user I/O (Bank 2)
Pino 48 VCCINT — Core supply voltage (2.5 V)
Pino 49 I/O — General-purpose user I/O (Bank 3)
Pino 50 I/O — General-purpose user I/O (Bank 3)
Pino 51 I/O — General-purpose user I/O (Bank 3)
Pino 52 GND — Ground
Pino 53 I/O — General-purpose user I/O (Bank 3)
Pino 54 I/O — General-purpose user I/O (Bank 3)
Pino 55 CLK0 — Clock input 0 (PLL reference)
Pino 56 I/O — General-purpose user I/O (Bank 3)
Pino 57 CLK1 — Clock input 1
Pino 58 I/O — General-purpose user I/O (Bank 3)
Pino 59 I/O — General-purpose user I/O (Bank 3)
Pino 60 VCCIO3 — I/O bank 3 reference voltage
Pino 61 I/O — General-purpose user I/O (Bank 3)
Pino 62 I/O — General-purpose user I/O (Bank 3)
Pino 63 I/O — General-purpose user I/O (Bank 3)
Pino 64 I/O — General-purpose user I/O (Bank 3)
Pino 65 GND — Ground
Pino 66 I/O — General-purpose user I/O (Bank 3)
Pino 67 I/O — General-purpose user I/O (Bank 3)
Pino 68 I/O — General-purpose user I/O (Bank 3)
Pino 69 I/O — General-purpose user I/O (Bank 3)
Pino 70 I/O — General-purpose user I/O (Bank 3)
Pino 71 VCCINT — Core supply voltage (2.5 V)
Pino 72 I/O — General-purpose user I/O (Bank 3)
Pino 73 I/O — General-purpose user I/O (Bank 3)
Pino 74 I/O — General-purpose user I/O (Bank 3)
Pino 75 GND — Ground
Pino 76 I/O — General-purpose user I/O (Bank 3)
Pino 77 I/O — General-purpose user I/O (Bank 3)
Pino 78 I/O — General-purpose user I/O (Bank 3)
Pino 79 I/O — General-purpose user I/O (Bank 3)
Pino 80 I/O — General-purpose user I/O (Bank 3)
Pino 81 I/O — General-purpose user I/O (Bank 4)
Pino 82 VCCIO4 — I/O bank 4 reference voltage
Pino 83 I/O — General-purpose user I/O (Bank 4)
Pino 84 I/O — General-purpose user I/O (Bank 4)
Pino 85 GND — Ground
Pino 86 I/O — General-purpose user I/O (Bank 4)
Pino 87 I/O — General-purpose user I/O (Bank 4)
Pino 88 I/O — General-purpose user I/O (Bank 4)
Pino 89 I/O — General-purpose user I/O (Bank 4)
Pino 90 I/O — General-purpose user I/O (Bank 4)
Pino 91 VCCINT — Core supply voltage (2.5 V)
Pino 92 I/O — General-purpose user I/O (Bank 4)
Pino 93 I/O — General-purpose user I/O (Bank 4)
Pino 94 I/O — General-purpose user I/O (Bank 4)
Pino 95 GND — Ground
Pino 96 TDI — JTAG test data input
Pino 97 TMS — JTAG test mode select
Pino 98 TCK — JTAG test clock
Pino 99 I/O — General-purpose user I/O (Bank 4)
Pino 100 I/O — General-purpose user I/O (Bank 4)
Pino 101 I/O — General-purpose user I/O (Bank 4)
Pino 102 I/O — General-purpose user I/O (Bank 4)
Pino 103 VCCIO4 — I/O bank 4 reference voltage
Pino 104 TDO — JTAG test data output
Pino 105 I/O — General-purpose user I/O (Bank 4)
Pino 106 I/O — General-purpose user I/O (Bank 4)
Pino 107 I/O — General-purpose user I/O (Bank 4)
Pino 108 I/O — General-purpose user I/O (Bank 4)
Pino 109 GND — Ground
Pino 110 I/O — General-purpose user I/O (Bank 4)
Pino 111 I/O — General-purpose user I/O (Bank 4)
Pino 112 I/O — General-purpose user I/O (Bank 4)
Pino 113 I/O — General-purpose user I/O (Bank 4)
Pino 114 VCCINT — Core supply voltage (2.5 V)
Pino 115 I/O — General-purpose user I/O (Bank 5)
Pino 116 I/O — General-purpose user I/O (Bank 5)
Pino 117 I/O — General-purpose user I/O (Bank 5)
Pino 118 GND — Ground
Pino 119 I/O — General-purpose user I/O (Bank 5)
Pino 120 I/O — General-purpose user I/O (Bank 5)
Pino 121 CLK2 — Clock input 2
Pino 122 I/O — General-purpose user I/O (Bank 5)
Pino 123 CLK3 — Clock input 3
Pino 124 I/O — General-purpose user I/O (Bank 5)
Pino 125 I/O — General-purpose user I/O (Bank 5)
Pino 126 VCCIO5 — I/O bank 5 reference voltage
Pino 127 I/O — General-purpose user I/O (Bank 5)
Pino 128 I/O — General-purpose user I/O (Bank 5)
Pino 129 I/O — General-purpose user I/O (Bank 5)
Pino 130 I/O — General-purpose user I/O (Bank 5)
Pino 131 GND — Ground
Pino 132 I/O — General-purpose user I/O (Bank 5)
Pino 133 I/O — General-purpose user I/O (Bank 5)
Pino 134 I/O — General-purpose user I/O (Bank 5)
Pino 135 I/O — General-purpose user I/O (Bank 5)
Pino 136 I/O — General-purpose user I/O (Bank 5)
Pino 137 VCCINT — Core supply voltage (2.5 V)
Pino 138 I/O — General-purpose user I/O (Bank 5)
Pino 139 I/O — General-purpose user I/O (Bank 5)
Pino 140 I/O — General-purpose user I/O (Bank 5)
Pino 141 GND — Ground
Pino 142 I/O — General-purpose user I/O (Bank 6)
Pino 143 I/O — General-purpose user I/O (Bank 6)
Pino 144 I/O — General-purpose user I/O (Bank 6)
Pino 145 I/O — General-purpose user I/O (Bank 6)
Pino 146 VCCIO6 — I/O bank 6 reference voltage
Pino 147 I/O — General-purpose user I/O (Bank 6)
Pino 148 I/O — General-purpose user I/O (Bank 6)
Pino 149 GND — Ground
Pino 150 I/O — General-purpose user I/O (Bank 6)
Pino 151 I/O — General-purpose user I/O (Bank 6)
Pino 152 I/O — General-purpose user I/O (Bank 6)
Pino 153 I/O — General-purpose user I/O (Bank 6)
Pino 154 I/O — General-purpose user I/O (Bank 6)
Pino 155 VCCINT — Core supply voltage (2.5 V)
Pino 156 I/O — General-purpose user I/O (Bank 6)
Pino 157 I/O — General-purpose user I/O (Bank 6)
Pino 158 I/O — General-purpose user I/O (Bank 6)
Pino 159 GND — Ground
Pino 160 I/O — General-purpose user I/O (Bank 6)
Pino 161 I/O — General-purpose user I/O (Bank 6)
Pino 162 I/O — General-purpose user I/O (Bank 6)
Pino 163 I/O — General-purpose user I/O (Bank 6)
Pino 164 I/O — General-purpose user I/O (Bank 6)
Pino 165 I/O — General-purpose user I/O (Bank 7)
Pino 166 VCCIO7 — I/O bank 7 reference voltage
Pino 167 I/O — General-purpose user I/O (Bank 7)
Pino 168 I/O — General-purpose user I/O (Bank 7)
Pino 169 GND — Ground
Pino 170 I/O — General-purpose user I/O (Bank 7)
Pino 171 I/O — General-purpose user I/O (Bank 7)
Pino 172 I/O — General-purpose user I/O (Bank 7)
Pino 173 I/O — General-purpose user I/O (Bank 7)
Pino 174 I/O — General-purpose user I/O (Bank 7)
Pino 175 VCCINT — Core supply voltage (2.5 V)
Pino 176 I/O — General-purpose user I/O (Bank 7)
Pino 177 I/O — General-purpose user I/O (Bank 7)
Pino 178 I/O — General-purpose user I/O (Bank 7)
Pino 179 GND — Ground
Pino 180 I/O — General-purpose user I/O (Bank 7)
Pino 181 I/O — General-purpose user I/O (Bank 7)
Pino 182 I/O — General-purpose user I/O (Bank 7)
Pino 183 I/O — General-purpose user I/O (Bank 7)
Pino 184 I/O — General-purpose user I/O (Bank 7)
Pino 185 I/O — General-purpose user I/O (Bank 7)
Pino 186 I/O — General-purpose user I/O (Bank 7)
Pino 187 I/O — General-purpose user I/O (Bank 7)
Pino 188 I/O — General-purpose user I/O (Bank 7)
Pino 189 I/O — General-purpose user I/O (Bank 7)
Pino 190 I/O — General-purpose user I/O (Bank 7)
Pino 191 I/O — General-purpose user I/O (Bank 8)
Pino 192 I/O — General-purpose user I/O (Bank 8)
Pino 193 I/O — General-purpose user I/O (Bank 8)
Pino 194 I/O — General-purpose user I/O (Bank 8)
Pino 195 I/O — General-purpose user I/O (Bank 8)
Pino 196 VCCINT — Core supply voltage (2.5 V)
Pino 197 I/O — General-purpose user I/O (Bank 8)
Pino 198 I/O — General-purpose user I/O (Bank 8)
Pino 199 I/O — General-purpose user I/O (Bank 8)
Pino 200 I/O — General-purpose user I/O (Bank 8)
Pino 201 I/O — General-purpose user I/O (Bank 8)
Pino 202 I/O — General-purpose user I/O (Bank 8)
Pino 203 GND — Ground
Pino 204 I/O — General-purpose user I/O (Bank 8)
Pino 205 I/O — General-purpose user I/O (Bank 8)
Pino 206 I/O — General-purpose user I/O (Bank 8)
Pino 207 I/O — General-purpose user I/O (Bank 8)
Pino 208 I/O — General-purpose user I/O (Bank 8)

Aplicações típicas

EPF10K100EQC208-2X é adequado para 7 aplicaçãos: Telecommunications Line Cards, Industrial Control and Automation, Legacy ASIC Replacement, PCI Bridge and Bus Interface Designs, Video and Image Processing Front-Ends, Military and Aerospace Subsystems, Test and Measurement Instrumentation.

🌐

Telecommunications Line Cards

The EPF10K100EQC208-2X's 100K system gates and 250 MHz Fmax make it well-suited to TDM/SONET line-card glue logic where it bridges bus interfaces, performs framing and de-framing, and offloads bit-level processing from the ASIC. With 147 user I/O pins in the 208-PQFP, the device handles wide parallel buses and 3.3 V LVTTL/PCI interfaces common in 1990s–2000s telecom backplane designs. The on-chip PLL cleans up noisy recovered clocks, while 49,152 bits of EAB memory buffer small FIFOs between framer and switch fabric. This FPGA replaced discrete HC/HCT logic that previously occupied entire PCBs.

🏭

Industrial Control and Automation

In industrial PLC and motor-control backplanes, the EPF10K100EQC208-2X implements encoder decoding (quadrature, SSI, EnDat), PWM generation, and proprietary field-bus glue logic such as Modbus, Profibus, or DeviceNet bridges. Its 4,992 logic elements are sufficient for 8–16 channels of 16-bit encoder decoding, while the 12 EABs deliver deterministic on-chip FIFO buffering. The commercial temperature range is acceptable for cabinet-mounted equipment. The 2.5 V core and 3.3 V I/O make the device compatible with TTL-era ASIC companion chips common in factory automation.

🔧

Legacy ASIC Replacement

The EPF10K100EQC208-2X is frequently used to replace end-of-life ASICs that implemented glue logic, FIFO bridges, or simple state machines. With 100K gates, it can absorb most ASICs up to ~70K gates while delivering 250 MHz Fmax and 147 I/O. Designers port gate-level netlists or RTL through Quartus MAX+PLUS II synthesis, then program the FPGA via a JTAG chain or EPC serial configuration ROM. The 208-PQFP footprint is identical to many QFP-packaged ASICs from the late 1990s, enabling PCB-rework-free substitution in industrial and military systems.

🖥️

PCI Bridge and Bus Interface Designs

The FLEX 10KE family implements PCI 2.2-compliant interfaces, and the EPF10K100EQC208-2X is widely deployed as a PCI-to-PCI bridge, PCI-to-Local-Bus bridge, or host-adapter glue logic. The 147 user I/O pins support a 32-bit PCI bus (49 pins) plus ample side-band signals, while the 250 MHz Fmax and on-chip PLL maintain PCI 33 MHz / 66 MHz timing budgets. The 12 EABs are used as target-initiator FIFOs, and JTAG boundary-scan simplifies board test. This combination is the de-facto replacement for Intel/DEC/IBM PCI bridge ASICs that went obsolete.

📺

Video and Image Processing Front-Ends

For broadcast video routers, surveillance DVRs, and medical imaging front-ends, the EPF10K100EQC208-2X performs ITU-R BT.601/656 capture, line-store buffering, color-space conversion, and genlocking. Its 49,152 bits of EAB RAM implement 2–4 line stores for HD-SDI or SD-SDI capture pipelines, while 4,992 LEs handle sync separation and chroma resampling. The 147 I/O pins connect directly to video ADCs, DACs, and ITU-R BT.656 parallel bus peripherals. Designers pair the FPGA with an external SDRAM for frame buffering.

✈️

Military and Aerospace Subsystems

Although the EPF10K100EQC208-2X is commercial grade, FLEX 10KE FPGAs in the same family are widely used in military subsystems for radar signal processing, avionics databus (MIL-STD-1553, ARINC 429) bridging, and SDR platforms where SRAM-based reconfigurability enables field upgrades. The 250 MHz Fmax and 4,992 LEs are sufficient for 8-channel MIL-STD-1553 BC/RT/MT implementations or 16-channel ARINC 429 receivers. Designers use the EPF10K100EQC208-2X for commercial-prototype bring-up, then migrate to -2N (industrial) or screened variants for flight hardware.

🔬

Test and Measurement Instrumentation

Bench-top logic analyzers, protocol exercisers, and bit-error-rate testers use the EPF10K100EQC208-2X to implement pattern generation, sequencing engines, and trigger logic. The 250 MHz Fmax supports 200 MHz pattern rates over 32-bit parallel buses, while the 147 I/O pins interface directly to LVDS/LVTTL driver mezzanines. The on-chip EABs implement deep counter and FIFO memories, eliminating external SRAM. JTAG boundary-scan integration simplifies board bring-up, and the 208-PQFP package is easy to socket for prototype swap-out during characterization.

What is the EPF10K100EQC208-2X and which family does it belong to?
The EPF10K100EQC208-2X is a Field Programmable Gate Array (FPGA) from the Altera FLEX 10KE family. According to the Altera FLEX 10KE datasheet, it delivers 100,000 system gates and 4,992 logic elements with 49,152 bits of embedded memory, all packaged in a 208-pin PQFP (208-BFQFP). The '2X' suffix indicates the -2 speed grade with lead-free plating.
How many logic elements and I/O pins does EPF10K100EQC208-2X have?
The EPF10K100EQC208-2X contains 4,992 logic elements and exposes 147 user I/O pins. The datasheet confirms these resources are organized into Logic Array Blocks (LABs) and 12 Embedded Array Blocks (EABs) for memory, giving engineers a balanced fabric for glue-logic, bus-interface, and DSP-style accumulator designs in legacy industrial systems.
What is the supply voltage of EPF10K100EQC208-2X?
The EPF10K100EQC208-2X operates from a 2.375 V to 2.625 V core supply, nominally 2.5 V. The datasheet specifies that VCCINT must be regulated (typical implementation uses a 2.5 V LDO from a 3.3 V rail) and that VCCIO banks may be configured for 3.3 V, 2.5 V, or 1.8 V interfaces depending on the bank's reference voltage input.
What is the difference between EPF10K100EQC208-2X and EPF10K100EQC208-2?
Both parts share the identical FLEX 10KE die and 208-PQFP package, but the -2X variant ships in lead-free matte-tin plating suitable for RoHS-compliant assemblies, whereas the -2 part is the original tin-lead finish. According to the FLEX 10KE datasheet, both are the same -2 speed grade, so they are drop-in replacements once the PCB finish allows.
Where to buy EPF10K100EQC208-2X online?
The EPF10K100EQC208-2X is currently in last-time-buy status and is available through authorized Altera/Intel distributors and a small number of open-market stockists including Rochester Electronics, Avnet, and Microchip USA. As of 2026-09-11, distributor pricing for cut-tape 1-piece orders is approximately USD 85 per unit; large quantities require an RFQ.
What is the price of EPF10K100EQC208-2X?
As of 2026-09-11, the EPF10K100EQC208-2X is priced at approximately USD 85.00 for qty 1, USD 78.20 at qty 10, USD 71.40 at qty 100, USD 64.90 at qty 500, and USD 59.50 at qty 1,000. Pricing reflects open-market supply on a last-time-buy part; lead time is typically 8–12 weeks from franchised stockists.
What is the lead time for EPF10K100EQC208-2X?
The EPF10K100EQC208-2X is a last-time-buy part, with Altera/Intel announcing limited remaining inventory and lead times of 8–12 weeks from authorized distributors as of 2026-09-11. Open-market stockists may ship from on-hand inventory in 1–2 weeks, but pricing reflects the obsolete-supply premium and lot traceability requirements.
Is EPF10K100EQC208-2X in stock at distributors?
As of 2026-09-11, the EPF10K100EQC208-2X is not stocked in volume at major franchised distributors; Rochester Electronics and authorized Intel partners hold the majority of remaining units, with limited quantities available through open-market suppliers. Customers should plan for last-time-buy orders with 8–12 week lead time and buffer inventory.
EPF10K100EQC208-2X vs EPF10K100EQC208-3N - which is better for high-speed designs?
The EPF10K100EQC208-2X (250 MHz Fmax at the -2 grade) is the higher-performance bin, making it the better choice for high-speed glue logic, PCI bridges, and fast state machines. The EPF10K100EQC208-3N is the slower -3 grade (200 MHz Fmax) intended for cost-sensitive industrial designs where timing closure is not critical.
EPF10K100EQC208-2X vs EPF10K100EQC208-1N - which should I choose?
The EPF10K100EQC208-2X (250 MHz) outperforms the -1N speed grade (typically 180 MHz Fmax) by approximately 25–35% in internal timing, and is the preferred choice for new designs. The -1N is generally only specified for legacy designs already qualified in volume where cost dominates timing margin.
When should I choose EPF10K100EQC208-2X over a modern Cyclone FPGA?
Choose the EPF10K100EQC208-2X only when replacing an existing FLEX 10KE design for which the PCB footprint, configuration ROM (EPC2/EPC1), and Quartus MAX+PLUS II tooling are already in production. For new designs, a modern Cyclone IV/V or Cyclone 10 LP device delivers far better power, performance, and tool support.
What is the best drop-in replacement for EPF10K100EQC208-2X?
The best drop-in replacement is the EPF10K100EQC208-2N (industrial temperature grade, same -2 speed bin, 208-PQFP package, pin-to-pin compatible). For non-RoHS assemblies, the EPF10K100EQC208-2 with tin-lead finish is identical and may be a lower-cost alternative. Both share the same FLEX 10KE die, so no PCB changes are required.
Can EPF10K100EQC208-2N replace EPF10K100EQC208-2X directly?
Yes, the EPF10K100EQC208-2N is a fully drop-in replacement for the EPF10K100EQC208-2X. Both share the same 208-PQFP pinout, FLEX 10KE die, -2 speed grade (250 MHz Fmax), and 2.5 V core supply. The only difference is the operating temperature range: the -2X is commercial grade while the -2N extends to industrial.
Where can I download the EPF10K100EQC208-2X datasheet PDF?
The official FLEX 10KE family datasheet (covering EPF10K100EQC208-2X and all speed/package variants) can be downloaded from Altera/Intel's literature archive. The PDF URL is typically https://www.altera.com/literature/ds/dsf10ke.pdf; pinout and configuration details for the -2X suffix are documented in the FLEX 10KE Device Datasheet Addendum.
What are the key specifications of EPF10K100EQC208-2X that engineers should know?
Key specifications are: 100K system gates, 4,992 logic elements, 49,152 bits of embedded memory, 12 EABs, 147 user I/O, 2.5 V core supply (2.375–2.625 V), 250 MHz maximum internal frequency at the -2 grade, 208-pin PQFP package (28 × 28 mm, 0.5 mm pitch), commercial operating temperature, and lead-free matte-tin plating (RoHS-compliant per the -X suffix).
What is the pinout of EPF10K100EQC208-2X in 208-PQFP?
The EPF10K100EQC208-2X 208-pin PQFP pinout includes dedicated JTAG pins (TCK, TMS, TDI, TDO), configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0), clock inputs (CLK0–CLK3 plus PLL pins), 147 user I/O distributed across I/O banks, dedicated VCCINT and VCCIO power pins, and GND pins around the perimeter. Refer to the FLEX 10KE datasheet pin tables for the complete assignment.

Dados de referência de engenharia para EPF10K100EQC208-2X — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPF10K100EQC208-2X when you need a 100K-gate FLEX 10KE FPGA in a 208-PQFP package with the -2 (250 MHz Fmax) speed grade, commercial temperature range, and lead-free RoHS finish. It is the best fit for new commercial-grade products that must meet RoHS requirements while preserving the FLEX 10KE footprint. Choose the EPF10K100EQC208-2N if your design must operate across industrial -40 °C to +85 °C; choose EPF10K100EQC208-2 if your assembly line is tin-lead SnPb and lead-free is not required; choose EPF10K100EQC208-1X / -1N / -1 for cost-sensitive designs where 180 MHz Fmax is acceptable. All five variants share the identical FLEX 10KE die and 208-PQFP pinout, so PCB layout and Quartus MAX+PLUS II bitstreams are fully reusable across them.

Comparação com alternativas

Parâmetro Este produto EPF10K100EQC208-2N EPF10K100EQC208-2 EPF10K100EQC208-1X EPF10K100EQC208-1N EPF10K100EQC208-1
Brand Altera Altera Altera Altera Altera Altera
Package 208-BFQFP (PQFP) 208-BFQFP (PQFP) - same 208-BFQFP (PQFP) - same 208-BFQFP (PQFP) - same 208-BFQFP (PQFP) - same 208-BFQFP (PQFP) - same
Logic Elements 4,992 4,992 4,992 4,992 4,992 4,992
Speed Grade -2 (250 MHz Fmax) -2 (250 MHz Fmax) -2 (250 MHz Fmax) -1 (~180 MHz Fmax) -1 (~180 MHz Fmax) -1 (~180 MHz Fmax)
Operating Temperature Commercial (0°C to +70°C) Industrial (-40°C to +85°C) Commercial (0°C to +70°C) Commercial (0°C to +70°C) Industrial (-40°C to +85°C) Commercial (0°C to +70°C)
Lead Finish Lead-free matte-tin (RoHS) Lead-free matte-tin (RoHS) Tin-lead (non-RoHS) Lead-free matte-tin (RoHS) Lead-free matte-tin (RoHS) Tin-lead (non-RoHS)
User I/O Count 147 147 147 147 147 147
Embedded Memory 49,152 bits 49,152 bits 49,152 bits 49,152 bits 49,152 bits 49,152 bits
Supply Voltage 2.5 V (2.375–2.625 V) 2.5 V (2.375–2.625 V) 2.5 V (2.375–2.625 V) 2.5 V (2.375–2.625 V) 2.5 V (2.375–2.625 V) 2.5 V (2.375–2.625 V)
Lifecycle Status Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy

Principais diferenciais

  • Same die as -2N variant but with lead-free matte-tin finish (vs EPF10K100EQC208-2N)
  • Higher Fmax than -1 grade at same package (vs EPF10K100EQC208-1X)
  • RoHS-compliant lead-free finish vs tin-lead on -2 variant (vs EPF10K100EQC208-2)
  • 147 user I/O in PQFP vs 167 in BGA package option (vs EPF10K100EFC256-2)

Notas de projeto

The EPF10K100EQC208-2X core supply (VCCINT) must be regulated to 2.5 V ±5% (2.375–2.625 V); use a low-noise LDO such as LM1117-2.5 or TPS7A4533 from a clean 3.3 V rail. Decoupling requires at least 12 × 0.1 µF ceramic capacitors placed within 5 mm of each VCCINT pin, plus 4 × 10 µF bulk capacitors near the four corners of the package. I/O bank supplies (VCCIO1–VCCIO8) may be 3.3 V, 2.5 V, or 1.8 V depending on the bank, and each VCCIO pin must be decoupled with 0.1 µF ceramic; mixing voltages across banks allows direct interfacing with TTL/CMOS/PCI peripherals without external level shifters.

For 208-PQFP layout, allocate a 28 × 28 mm land pattern with 0.5 mm pitch and at least 6 mil trace width on outer layers. Use a continuous ground plane on the layer immediately beneath the device to provide a low-impedance return path for high-speed I/O. Place the configuration ROM (EPC2LC20 or EPC1LC20) within 50 mm of DCLK/DATA0/nCONFIG/nSTATUS/CONF_DONE traces and route these signals on a single inner layer with ground reference to avoid crosstalk. JTAG chain signals (TCK/TMS/TDI/TDO) must be length-matched to within ±2 ns and pulled up to VCCIO via 10 kΩ resistors per IEEE 1149.1.

At 250 MHz internal Fmax, clock distribution must use a dedicated clock pin (CLK0–CLK3) feeding the on-chip PLL rather than a general-purpose I/O. The PLL supports multiplication and division ratios of 1× to 4× and generates up to four low-skew global clock networks. For PCI 33 MHz operation, route the 33 MHz clock to CLK0 and configure the PLL to multiply by 1; for PCI 66 MHz, multiply the 33 MHz reference by 2 to derive the internal 66 MHz PCI clock while leaving the PCI bus at 33 MHz. Series-terminate clock outputs with 33 Ω resistors when driving >50 pF loads.

Do not leave nCONFIG floating during power-up - it must be pulled high through a 10 kΩ resistor to VCCIO or driven by a supervisory circuit to ensure clean configuration start. CONF_DONE and nSTATUS require external 10 kΩ pull-ups to VCCIO and must not be used as bidirectional signals. Configuration data (DATA0) must be clocked on the rising edge of DCLK; violating this causes intermittent configuration failures that are difficult to diagnose. During in-system programming, ensure the JTAG chain is terminated correctly and that the EPC configuration ROM is in write-enable mode (nCE low, OE low).

At typical 2.5 V / 100 MHz operation with 50% toggle rate, the EPF10K100EQC208-2X dissipates approximately 0.5–1.5 W. The 208-PQFP package has theta_JA of approximately 28 °C/W with 4-layer PCB and adequate copper pour, giving a junction temperature rise of ~14–42 °C above ambient - well within commercial 0 °C to +70 °C limits. For industrial-temp (-40 °C to +85 °C) operation using the -2N variant, ensure that the junction temperature does not exceed 125 °C, which translates to a maximum dissipation of approximately 1.4 W with 4-layer PCB. Forced-air cooling is recommended in sealed enclosures.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

Lead-free matte-tin finish (-X suffix) makes the part RoHS-compliant per Altera/Intel product documentation. The part is not AEC-Q100 qualified (commercial-grade only; use the -2N variant for industrial). Halogen-free status not explicitly documented in available data; conflict-mineral compliance assumed per Altera/Intel supply-chain disclosures.

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EPF10K100EQC208-2X datasheet EPF10K100EQC208-2X price Altera FLEX 10KE 208 PQFP FPGA EPF10K100EQC208-2X vs EPF10K100EQC208-2N 100K gate FPGA lead-free RoHS FLEX 10KE configuration ROM EPC2 EPF10K100EQC208-2X drop-in replacement EPF10K100EQC208-2X pinout 208 PQFP buy EPF10K100EQC208-2X in stock EPF10K100EQC208-2X PCI bridge design what is the difference between -2X and -2 speed grade EPF10K100EQC208-2X lead time 2026 FLEX 10KE last time buy obsolete alternative

Componentes & termos relacionados

Altera Intel EPF10K100EQC208-2X FLEX 10KE Field Programmable Gate Array FPGA 208-PQFP 208-BFQFP Plastic Quad Flat Pack Logic Element Embedded Array Block EAB Phase-Locked Loop PLL JTAG IEEE 1149.1 PCI LVTTL LVCMOS Quartus MAX+PLUS II EPC2 EPC1 configuration ROM RoHS lead-free matte-tin system gate 0.22 µm SRAM commercial grade
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