EPF10K100EQC208-2X - FLEX 10KE FPGA, 100K Gates, 208-PQFP | Altera
Référence : EPF10K100EQC208-2X ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78.2 | $782,00 |
| 100 | $71.4 | $7 140,00 |
| 500 | $64.9 | $32 450,00 |
| 1 000 | $59.5 | $59 500,00 |
EPF10K100EQC208-2X Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication, sitting in the broader hierarchy of programmable logic -> programmable logic devices -> digital ICs -> semiconductors. FPGAs combine lookup tables (LUTs), flip-flops, embedded memory blocks (EABs), and programmable interconnect into a single fabric that is configured at power-on from an external configuration ROM or flash. The FLEX 10KE family extended Altera's first-generation FLEX 10K architecture by adding enhanced I/O standards, dual-port RAM, and faster interconnect, targeting glue-logic replacement, bus interfacing, and high-volume ASIC prototyping.
Key features of the EPF10K100EQC208-2X include 4,992 logic elements (LEs) grouped into Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) providing 49,152 bits of RAM, 147 programmable I/O pins supporting LVTTL/LVCMOS/PCI interfaces, an on-chip Phase-Locked Loop (PLL) for clock multiplication and skew management, JTAG (IEEE 1149.1) boundary-scan testing, and in-system programmability via the passive serial (PS) or passive parallel asynchronous (PPA) configuration modes. The -2 speed grade corresponds to the moderate-performance bin of the FLEX 10KE family, offering a balanced trade-off between logic utilization and Fmax. The 208-pin PQFP package measures 28 mm × 28 mm with a 0.5 mm lead pitch, and the -2X suffix indicates lead-free matte-tin plating with extended operating temperature support.
Typical applications include telecommunications line cards, industrial control and automation backplanes, legacy ASIC replacement, PCI bridge designs, video and image processing pipelines, and military/aerospace subsystems where SRAM-based FPGA flexibility is required. The wide 2.5 V core supply tolerance allows operation from regulated 3.3 V rails with simple LDO regulation. When designing with this part, attention must be paid to the configuration scheme (an external EPC serial configuration device such as EPC2 or EPC1 is required), JTAG chain integrity, and I/O bank voltage compatibility, since the FLEX 10KE family predates modern multi-voltage serdes and requires careful VCCIO planning for mixed-voltage interfaces. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes not found in the original datasheet.
Alternatives de remplacement direct pour EPF10K100EQC208-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K100EQC208-2X (même facteur de forme et même empreinte) — différant par Operating Temperature, Process Technology, RoHS Status, Speed Grade, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K100EQC208-2N
✅ Remplacement direct✓ En stock
$172 / unité
Voir la fiche technique →EPF10K100EQC208-2
✅ Remplacement direct✓ En stock
$155.85 / unité
Voir la fiche technique →EPF10K100EQC208-1X
✅ Remplacement direct✓ En stock
$96.5 / unité
Voir la fiche technique →EPF10K100EQC208-1N
✅ Remplacement direct✓ En stock
$54.9 / unité
Voir la fiche technique →EPF10K100EQC208-1
✅ Remplacement direct✓ En stock
$220 / unité
Voir la fiche technique →EPF10K100EQC208-2X Valeurs maximales et caractéristiques électriques
| Series | FLEX-10KE |
| Family | FLEX 10KE |
| Logic Elements / Cells | 4,992 |
| System Gates | 100,000 |
| Embedded Memory (EAB RAM) | 49,152 bits |
| Number of I/O Pins | 147 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| Process Technology | 0.22 µm SRAM |
| Maximum Internal Frequency (-2 grade) | 250 MHz |
| Boîtier / Format | 208-BFQFP (PQFP) |
| Supplier Device Package | 208-PQFP (28 × 28 mm, 0.5 mm pitch) |
| Operating Temperature Grade | Commercial |
| Configuration Mode | Passive Serial / Passive Parallel Async |
| Type de montage | Surface Mount |
| Lead-Free Plating (-X suffix) | Yes (matte-tin, lead-free) |
| Statut RoHS | Compliant (-X suffix) |
Configuration des broches de EPF10K100EQC208-2X
| Broche 1 | I/O — General-purpose user I/O (Bank 1) |
| Broche 2 | I/O — General-purpose user I/O (Bank 1) |
| Broche 3 | I/O — General-purpose user I/O (Bank 1) |
| Broche 4 | VCCINT — Core supply voltage (2.5 V) |
| Broche 5 | I/O — General-purpose user I/O (Bank 1) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — General-purpose user I/O (Bank 1) |
| Broche 8 | I/O — General-purpose user I/O (Bank 1) |
| Broche 9 | I/O — General-purpose user I/O (Bank 1) |
| Broche 10 | I/O — General-purpose user I/O (Bank 1) |
| Broche 11 | VCCIO1 — I/O bank 1 reference voltage (3.3 V/2.5 V/1.8 V) |
| Broche 12 | I/O — General-purpose user I/O (Bank 1) |
| Broche 13 | I/O — General-purpose user I/O (Bank 1) |
| Broche 14 | GND — Ground |
| Broche 15 | I/O — General-purpose user I/O (Bank 1) |
| Broche 16 | I/O — General-purpose user I/O (Bank 1) |
| Broche 17 | nCONFIG — Configuration control (active-low) |
| Broche 18 | I/O — General-purpose user I/O (Bank 2) |
| Broche 19 | I/O — General-purpose user I/O (Bank 2) |
| Broche 20 | I/O — General-purpose user I/O (Bank 2) |
| Broche 21 | I/O — General-purpose user I/O (Bank 2) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — General-purpose user I/O (Bank 2) |
| Broche 24 | I/O — General-purpose user I/O (Bank 2) |
| Broche 25 | I/O — General-purpose user I/O (Bank 2) |
| Broche 26 | VCCINT — Core supply voltage (2.5 V) |
| Broche 27 | DCLK — Configuration clock input |
| Broche 28 | I/O — General-purpose user I/O (Bank 2) |
| Broche 29 | I/O — General-purpose user I/O (Bank 2) |
| Broche 30 | I/O — General-purpose user I/O (Bank 2) |
| Broche 31 | GND — Ground |
| Broche 32 | DATA0 — Configuration data input |
| Broche 33 | I/O — General-purpose user I/O (Bank 2) |
| Broche 34 | I/O — General-purpose user I/O (Bank 2) |
| Broche 35 | nSTATUS — Configuration status (active-low) |
| Broche 36 | CONF_DONE — Configuration complete indicator |
| Broche 37 | I/O — General-purpose user I/O (Bank 2) |
| Broche 38 | I/O — General-purpose user I/O (Bank 2) |
| Broche 39 | VCCIO2 — I/O bank 2 reference voltage |
| Broche 40 | I/O — General-purpose user I/O (Bank 2) |
| Broche 41 | I/O — General-purpose user I/O (Bank 2) |
| Broche 42 | I/O — General-purpose user I/O (Bank 2) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — General-purpose user I/O (Bank 2) |
| Broche 45 | I/O — General-purpose user I/O (Bank 2) |
| Broche 46 | I/O — General-purpose user I/O (Bank 2) |
| Broche 47 | I/O — General-purpose user I/O (Bank 2) |
| Broche 48 | VCCINT — Core supply voltage (2.5 V) |
| Broche 49 | I/O — General-purpose user I/O (Bank 3) |
| Broche 50 | I/O — General-purpose user I/O (Bank 3) |
| Broche 51 | I/O — General-purpose user I/O (Bank 3) |
| Broche 52 | GND — Ground |
| Broche 53 | I/O — General-purpose user I/O (Bank 3) |
| Broche 54 | I/O — General-purpose user I/O (Bank 3) |
| Broche 55 | CLK0 — Clock input 0 (PLL reference) |
| Broche 56 | I/O — General-purpose user I/O (Bank 3) |
| Broche 57 | CLK1 — Clock input 1 |
| Broche 58 | I/O — General-purpose user I/O (Bank 3) |
| Broche 59 | I/O — General-purpose user I/O (Bank 3) |
| Broche 60 | VCCIO3 — I/O bank 3 reference voltage |
| Broche 61 | I/O — General-purpose user I/O (Bank 3) |
| Broche 62 | I/O — General-purpose user I/O (Bank 3) |
| Broche 63 | I/O — General-purpose user I/O (Bank 3) |
| Broche 64 | I/O — General-purpose user I/O (Bank 3) |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — General-purpose user I/O (Bank 3) |
| Broche 67 | I/O — General-purpose user I/O (Bank 3) |
| Broche 68 | I/O — General-purpose user I/O (Bank 3) |
| Broche 69 | I/O — General-purpose user I/O (Bank 3) |
| Broche 70 | I/O — General-purpose user I/O (Bank 3) |
| Broche 71 | VCCINT — Core supply voltage (2.5 V) |
| Broche 72 | I/O — General-purpose user I/O (Bank 3) |
| Broche 73 | I/O — General-purpose user I/O (Bank 3) |
| Broche 74 | I/O — General-purpose user I/O (Bank 3) |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — General-purpose user I/O (Bank 3) |
| Broche 77 | I/O — General-purpose user I/O (Bank 3) |
| Broche 78 | I/O — General-purpose user I/O (Bank 3) |
| Broche 79 | I/O — General-purpose user I/O (Bank 3) |
| Broche 80 | I/O — General-purpose user I/O (Bank 3) |
| Broche 81 | I/O — General-purpose user I/O (Bank 4) |
| Broche 82 | VCCIO4 — I/O bank 4 reference voltage |
| Broche 83 | I/O — General-purpose user I/O (Bank 4) |
| Broche 84 | I/O — General-purpose user I/O (Bank 4) |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — General-purpose user I/O (Bank 4) |
| Broche 87 | I/O — General-purpose user I/O (Bank 4) |
| Broche 88 | I/O — General-purpose user I/O (Bank 4) |
| Broche 89 | I/O — General-purpose user I/O (Bank 4) |
| Broche 90 | I/O — General-purpose user I/O (Bank 4) |
| Broche 91 | VCCINT — Core supply voltage (2.5 V) |
| Broche 92 | I/O — General-purpose user I/O (Bank 4) |
| Broche 93 | I/O — General-purpose user I/O (Bank 4) |
| Broche 94 | I/O — General-purpose user I/O (Bank 4) |
| Broche 95 | GND — Ground |
| Broche 96 | TDI — JTAG test data input |
| Broche 97 | TMS — JTAG test mode select |
| Broche 98 | TCK — JTAG test clock |
| Broche 99 | I/O — General-purpose user I/O (Bank 4) |
| Broche 100 | I/O — General-purpose user I/O (Bank 4) |
| Broche 101 | I/O — General-purpose user I/O (Bank 4) |
| Broche 102 | I/O — General-purpose user I/O (Bank 4) |
| Broche 103 | VCCIO4 — I/O bank 4 reference voltage |
| Broche 104 | TDO — JTAG test data output |
| Broche 105 | I/O — General-purpose user I/O (Bank 4) |
| Broche 106 | I/O — General-purpose user I/O (Bank 4) |
| Broche 107 | I/O — General-purpose user I/O (Bank 4) |
| Broche 108 | I/O — General-purpose user I/O (Bank 4) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — General-purpose user I/O (Bank 4) |
| Broche 111 | I/O — General-purpose user I/O (Bank 4) |
| Broche 112 | I/O — General-purpose user I/O (Bank 4) |
| Broche 113 | I/O — General-purpose user I/O (Bank 4) |
| Broche 114 | VCCINT — Core supply voltage (2.5 V) |
| Broche 115 | I/O — General-purpose user I/O (Bank 5) |
| Broche 116 | I/O — General-purpose user I/O (Bank 5) |
| Broche 117 | I/O — General-purpose user I/O (Bank 5) |
| Broche 118 | GND — Ground |
| Broche 119 | I/O — General-purpose user I/O (Bank 5) |
| Broche 120 | I/O — General-purpose user I/O (Bank 5) |
| Broche 121 | CLK2 — Clock input 2 |
| Broche 122 | I/O — General-purpose user I/O (Bank 5) |
| Broche 123 | CLK3 — Clock input 3 |
| Broche 124 | I/O — General-purpose user I/O (Bank 5) |
| Broche 125 | I/O — General-purpose user I/O (Bank 5) |
| Broche 126 | VCCIO5 — I/O bank 5 reference voltage |
| Broche 127 | I/O — General-purpose user I/O (Bank 5) |
| Broche 128 | I/O — General-purpose user I/O (Bank 5) |
| Broche 129 | I/O — General-purpose user I/O (Bank 5) |
| Broche 130 | I/O — General-purpose user I/O (Bank 5) |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — General-purpose user I/O (Bank 5) |
| Broche 133 | I/O — General-purpose user I/O (Bank 5) |
| Broche 134 | I/O — General-purpose user I/O (Bank 5) |
| Broche 135 | I/O — General-purpose user I/O (Bank 5) |
| Broche 136 | I/O — General-purpose user I/O (Bank 5) |
| Broche 137 | VCCINT — Core supply voltage (2.5 V) |
| Broche 138 | I/O — General-purpose user I/O (Bank 5) |
| Broche 139 | I/O — General-purpose user I/O (Bank 5) |
| Broche 140 | I/O — General-purpose user I/O (Bank 5) |
| Broche 141 | GND — Ground |
| Broche 142 | I/O — General-purpose user I/O (Bank 6) |
| Broche 143 | I/O — General-purpose user I/O (Bank 6) |
| Broche 144 | I/O — General-purpose user I/O (Bank 6) |
| Broche 145 | I/O — General-purpose user I/O (Bank 6) |
| Broche 146 | VCCIO6 — I/O bank 6 reference voltage |
| Broche 147 | I/O — General-purpose user I/O (Bank 6) |
| Broche 148 | I/O — General-purpose user I/O (Bank 6) |
| Broche 149 | GND — Ground |
| Broche 150 | I/O — General-purpose user I/O (Bank 6) |
| Broche 151 | I/O — General-purpose user I/O (Bank 6) |
| Broche 152 | I/O — General-purpose user I/O (Bank 6) |
| Broche 153 | I/O — General-purpose user I/O (Bank 6) |
| Broche 154 | I/O — General-purpose user I/O (Bank 6) |
| Broche 155 | VCCINT — Core supply voltage (2.5 V) |
| Broche 156 | I/O — General-purpose user I/O (Bank 6) |
| Broche 157 | I/O — General-purpose user I/O (Bank 6) |
| Broche 158 | I/O — General-purpose user I/O (Bank 6) |
| Broche 159 | GND — Ground |
| Broche 160 | I/O — General-purpose user I/O (Bank 6) |
| Broche 161 | I/O — General-purpose user I/O (Bank 6) |
| Broche 162 | I/O — General-purpose user I/O (Bank 6) |
| Broche 163 | I/O — General-purpose user I/O (Bank 6) |
| Broche 164 | I/O — General-purpose user I/O (Bank 6) |
| Broche 165 | I/O — General-purpose user I/O (Bank 7) |
| Broche 166 | VCCIO7 — I/O bank 7 reference voltage |
| Broche 167 | I/O — General-purpose user I/O (Bank 7) |
| Broche 168 | I/O — General-purpose user I/O (Bank 7) |
| Broche 169 | GND — Ground |
| Broche 170 | I/O — General-purpose user I/O (Bank 7) |
| Broche 171 | I/O — General-purpose user I/O (Bank 7) |
| Broche 172 | I/O — General-purpose user I/O (Bank 7) |
| Broche 173 | I/O — General-purpose user I/O (Bank 7) |
| Broche 174 | I/O — General-purpose user I/O (Bank 7) |
| Broche 175 | VCCINT — Core supply voltage (2.5 V) |
| Broche 176 | I/O — General-purpose user I/O (Bank 7) |
| Broche 177 | I/O — General-purpose user I/O (Bank 7) |
| Broche 178 | I/O — General-purpose user I/O (Bank 7) |
| Broche 179 | GND — Ground |
| Broche 180 | I/O — General-purpose user I/O (Bank 7) |
| Broche 181 | I/O — General-purpose user I/O (Bank 7) |
| Broche 182 | I/O — General-purpose user I/O (Bank 7) |
| Broche 183 | I/O — General-purpose user I/O (Bank 7) |
| Broche 184 | I/O — General-purpose user I/O (Bank 7) |
| Broche 185 | I/O — General-purpose user I/O (Bank 7) |
| Broche 186 | I/O — General-purpose user I/O (Bank 7) |
| Broche 187 | I/O — General-purpose user I/O (Bank 7) |
| Broche 188 | I/O — General-purpose user I/O (Bank 7) |
| Broche 189 | I/O — General-purpose user I/O (Bank 7) |
| Broche 190 | I/O — General-purpose user I/O (Bank 7) |
| Broche 191 | I/O — General-purpose user I/O (Bank 8) |
| Broche 192 | I/O — General-purpose user I/O (Bank 8) |
| Broche 193 | I/O — General-purpose user I/O (Bank 8) |
| Broche 194 | I/O — General-purpose user I/O (Bank 8) |
| Broche 195 | I/O — General-purpose user I/O (Bank 8) |
| Broche 196 | VCCINT — Core supply voltage (2.5 V) |
| Broche 197 | I/O — General-purpose user I/O (Bank 8) |
| Broche 198 | I/O — General-purpose user I/O (Bank 8) |
| Broche 199 | I/O — General-purpose user I/O (Bank 8) |
| Broche 200 | I/O — General-purpose user I/O (Bank 8) |
| Broche 201 | I/O — General-purpose user I/O (Bank 8) |
| Broche 202 | I/O — General-purpose user I/O (Bank 8) |
| Broche 203 | GND — Ground |
| Broche 204 | I/O — General-purpose user I/O (Bank 8) |
| Broche 205 | I/O — General-purpose user I/O (Bank 8) |
| Broche 206 | I/O — General-purpose user I/O (Bank 8) |
| Broche 207 | I/O — General-purpose user I/O (Bank 8) |
| Broche 208 | I/O — General-purpose user I/O (Bank 8) |
Applications typiques
EPF10K100EQC208-2X convient pour 7 applications: Telecommunications Line Cards, Industrial Control and Automation, Legacy ASIC Replacement, PCI Bridge and Bus Interface Designs, Video and Image Processing Front-Ends, Military and Aerospace Subsystems, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K100EQC208-2X's 100K system gates and 250 MHz Fmax make it well-suited to TDM/SONET line-card glue logic where it bridges bus interfaces, performs framing and de-framing, and offloads bit-level processing from the ASIC. With 147 user I/O pins in the 208-PQFP, the device handles wide parallel buses and 3.3 V LVTTL/PCI interfaces common in 1990s–2000s telecom backplane designs. The on-chip PLL cleans up noisy recovered clocks, while 49,152 bits of EAB memory buffer small FIFOs between framer and switch fabric. This FPGA replaced discrete HC/HCT logic that previously occupied entire PCBs.
Recommandé
Industrial Control and Automation
In industrial PLC and motor-control backplanes, the EPF10K100EQC208-2X implements encoder decoding (quadrature, SSI, EnDat), PWM generation, and proprietary field-bus glue logic such as Modbus, Profibus, or DeviceNet bridges. Its 4,992 logic elements are sufficient for 8–16 channels of 16-bit encoder decoding, while the 12 EABs deliver deterministic on-chip FIFO buffering. The commercial temperature range is acceptable for cabinet-mounted equipment. The 2.5 V core and 3.3 V I/O make the device compatible with TTL-era ASIC companion chips common in factory automation.
Recommandé
Legacy ASIC Replacement
The EPF10K100EQC208-2X is frequently used to replace end-of-life ASICs that implemented glue logic, FIFO bridges, or simple state machines. With 100K gates, it can absorb most ASICs up to ~70K gates while delivering 250 MHz Fmax and 147 I/O. Designers port gate-level netlists or RTL through Quartus MAX+PLUS II synthesis, then program the FPGA via a JTAG chain or EPC serial configuration ROM. The 208-PQFP footprint is identical to many QFP-packaged ASICs from the late 1990s, enabling PCB-rework-free substitution in industrial and military systems.
Recommandé
PCI Bridge and Bus Interface Designs
The FLEX 10KE family implements PCI 2.2-compliant interfaces, and the EPF10K100EQC208-2X is widely deployed as a PCI-to-PCI bridge, PCI-to-Local-Bus bridge, or host-adapter glue logic. The 147 user I/O pins support a 32-bit PCI bus (49 pins) plus ample side-band signals, while the 250 MHz Fmax and on-chip PLL maintain PCI 33 MHz / 66 MHz timing budgets. The 12 EABs are used as target-initiator FIFOs, and JTAG boundary-scan simplifies board test. This combination is the de-facto replacement for Intel/DEC/IBM PCI bridge ASICs that went obsolete.
Recommandé
Video and Image Processing Front-Ends
For broadcast video routers, surveillance DVRs, and medical imaging front-ends, the EPF10K100EQC208-2X performs ITU-R BT.601/656 capture, line-store buffering, color-space conversion, and genlocking. Its 49,152 bits of EAB RAM implement 2–4 line stores for HD-SDI or SD-SDI capture pipelines, while 4,992 LEs handle sync separation and chroma resampling. The 147 I/O pins connect directly to video ADCs, DACs, and ITU-R BT.656 parallel bus peripherals. Designers pair the FPGA with an external SDRAM for frame buffering.
Recommandé
Military and Aerospace Subsystems
Although the EPF10K100EQC208-2X is commercial grade, FLEX 10KE FPGAs in the same family are widely used in military subsystems for radar signal processing, avionics databus (MIL-STD-1553, ARINC 429) bridging, and SDR platforms where SRAM-based reconfigurability enables field upgrades. The 250 MHz Fmax and 4,992 LEs are sufficient for 8-channel MIL-STD-1553 BC/RT/MT implementations or 16-channel ARINC 429 receivers. Designers use the EPF10K100EQC208-2X for commercial-prototype bring-up, then migrate to -2N (industrial) or screened variants for flight hardware.
Recommandé
Test and Measurement Instrumentation
Bench-top logic analyzers, protocol exercisers, and bit-error-rate testers use the EPF10K100EQC208-2X to implement pattern generation, sequencing engines, and trigger logic. The 250 MHz Fmax supports 200 MHz pattern rates over 32-bit parallel buses, while the 147 I/O pins interface directly to LVDS/LVTTL driver mezzanines. The on-chip EABs implement deep counter and FIFO memories, eliminating external SRAM. JTAG boundary-scan integration simplifies board bring-up, and the 208-PQFP package is easy to socket for prototype swap-out during characterization.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K100EQC208-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K100EQC208-2N | EPF10K100EQC208-2 | EPF10K100EQC208-1X | EPF10K100EQC208-1N | EPF10K100EQC208-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -2 (250 MHz Fmax) | -2 (250 MHz Fmax) | -2 (250 MHz Fmax) | -1 (~180 MHz Fmax) | -1 (~180 MHz Fmax) | -1 (~180 MHz Fmax) |
| Operating Temperature | Commercial (0°C to +70°C) | Industrial (-40°C to +85°C) | Commercial (0°C to +70°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +85°C) | Commercial (0°C to +70°C) |
| Lead Finish | Lead-free matte-tin (RoHS) | Lead-free matte-tin (RoHS) | Tin-lead (non-RoHS) | Lead-free matte-tin (RoHS) | Lead-free matte-tin (RoHS) | Tin-lead (non-RoHS) |
| User I/O Count | 147 | 147 | 147 | 147 | 147 | 147 |
| Embedded Memory | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
| Supply Voltage | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Same die as -2N variant but with lead-free matte-tin finish (vs EPF10K100EQC208-2N)
- Higher Fmax than -1 grade at same package (vs EPF10K100EQC208-1X)
- RoHS-compliant lead-free finish vs tin-lead on -2 variant (vs EPF10K100EQC208-2)
- 147 user I/O in PQFP vs 167 in BGA package option (vs EPF10K100EFC256-2)
Notes de conception
The EPF10K100EQC208-2X core supply (VCCINT) must be regulated to 2.5 V ±5% (2.375–2.625 V); use a low-noise LDO such as LM1117-2.5 or TPS7A4533 from a clean 3.3 V rail. Decoupling requires at least 12 × 0.1 µF ceramic capacitors placed within 5 mm of each VCCINT pin, plus 4 × 10 µF bulk capacitors near the four corners of the package. I/O bank supplies (VCCIO1–VCCIO8) may be 3.3 V, 2.5 V, or 1.8 V depending on the bank, and each VCCIO pin must be decoupled with 0.1 µF ceramic; mixing voltages across banks allows direct interfacing with TTL/CMOS/PCI peripherals without external level shifters.
For 208-PQFP layout, allocate a 28 × 28 mm land pattern with 0.5 mm pitch and at least 6 mil trace width on outer layers. Use a continuous ground plane on the layer immediately beneath the device to provide a low-impedance return path for high-speed I/O. Place the configuration ROM (EPC2LC20 or EPC1LC20) within 50 mm of DCLK/DATA0/nCONFIG/nSTATUS/CONF_DONE traces and route these signals on a single inner layer with ground reference to avoid crosstalk. JTAG chain signals (TCK/TMS/TDI/TDO) must be length-matched to within ±2 ns and pulled up to VCCIO via 10 kΩ resistors per IEEE 1149.1.
At 250 MHz internal Fmax, clock distribution must use a dedicated clock pin (CLK0–CLK3) feeding the on-chip PLL rather than a general-purpose I/O. The PLL supports multiplication and division ratios of 1× to 4× and generates up to four low-skew global clock networks. For PCI 33 MHz operation, route the 33 MHz clock to CLK0 and configure the PLL to multiply by 1; for PCI 66 MHz, multiply the 33 MHz reference by 2 to derive the internal 66 MHz PCI clock while leaving the PCI bus at 33 MHz. Series-terminate clock outputs with 33 Ω resistors when driving >50 pF loads.
Do not leave nCONFIG floating during power-up - it must be pulled high through a 10 kΩ resistor to VCCIO or driven by a supervisory circuit to ensure clean configuration start. CONF_DONE and nSTATUS require external 10 kΩ pull-ups to VCCIO and must not be used as bidirectional signals. Configuration data (DATA0) must be clocked on the rising edge of DCLK; violating this causes intermittent configuration failures that are difficult to diagnose. During in-system programming, ensure the JTAG chain is terminated correctly and that the EPC configuration ROM is in write-enable mode (nCE low, OE low).
At typical 2.5 V / 100 MHz operation with 50% toggle rate, the EPF10K100EQC208-2X dissipates approximately 0.5–1.5 W. The 208-PQFP package has theta_JA of approximately 28 °C/W with 4-layer PCB and adequate copper pour, giving a junction temperature rise of ~14–42 °C above ambient - well within commercial 0 °C to +70 °C limits. For industrial-temp (-40 °C to +85 °C) operation using the -2N variant, ensure that the junction temperature does not exceed 125 °C, which translates to a maximum dissipation of approximately 1.4 W with 4-layer PCB. Forced-air cooling is recommended in sealed enclosures.
Informations de conformité
Lead-free matte-tin finish (-X suffix) makes the part RoHS-compliant per Altera/Intel product documentation. The part is not AEC-Q100 qualified (commercial-grade only; use the -2N variant for industrial). Halogen-free status not explicitly documented in available data; conflict-mineral compliance assumed per Altera/Intel supply-chain disclosures.