EPF10K10ATC144-3N - FLEX 10KA FPGA 10K Gates 576 Cells | Intel
N.º da peça: EPF10K10ATC144-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.91 | $42,91 |
| 10 | $39.2 | $392,00 |
| 100 | $33.85 | $3.385,00 |
| 500 | $28.4 | $14.200,00 |
| 1.000 | $24.75 | $24.750,00 |
EPF10K10ATC144-3N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and SPLDs, and historically bridged the gap between fixed-function ASICs and discrete logic. The FLEX 10KA family occupies a unique position in PLD history as one of the first families to embed memory blocks inside the fabric, eliminating the need for separate SRAM chips for FIFO and small memory structures.
Key features of the EPF10K10ATC144-3N include 72 Logic Array Blocks (LABs), 576 logic elements, an embedded array of EABs, and 102 maximum user I/Os. The device supports in-system programmability via an IEEE 1149.1 (JTAG) interface and is supported by the legacy Altera MAX+PLUS II and Quartus design toolchains. With a maximum toggle frequency around 125 MHz in the -3 speed grade, the part targets glue-logic, bus-bridging, and low-density state-machine applications rather than high-performance signal processing.
Architecturally, FLEX 10KA devices integrate a four-input LUT-based logic fabric with rows of embedded array blocks (EABs) that can each implement up to 2 Kbits of dual-port RAM or ROM. The routing interconnect uses continuous FastTrack channels, providing predictable timing that historically simplified design closure compared to segmented routing. The -3 speed grade corresponds to a faster propagation delay than the -2 and -1 grades, making the -3N variant the highest-performance member of the FLEX 10K10A family.
Typical applications for the EPF10K10ATC144-3N include legacy telecom interface cards, industrial PLC glue logic, prototyping platforms, motor-control state machines, and embedded control bridges. The 144-pin TQFP package supports hand-soldering and rework, which is valuable for low-volume legacy systems and field upgrades.
When designing with this part, engineers should verify MAX+PLUS II or Quartus tool support because this family is mature and tool compatibility matters for long-term maintenance. The 3.3 V supply requirement and 0 °C to 70 °C commercial temperature window should be checked against the target environment; the EPF10K10ATI144-3N industrial-grade variant is required for extended temperature operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. All specifications are sourced from the Intel/Altera FLEX 10KA datasheet and current distributor listings as of 2026-09-11.
Alternativas drop-in para EPF10K10ATC144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K10ATC144-3N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Process Technology, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K10ATC144-3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K10ATC144-2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K10ATC144-1N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K10ATI144-3N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K10ATI144-3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K10ATC144-3N Classificações máximas e características elétricas
| Family | FLEX 10KA |
| Series | FLEX-10KA® |
| Typical Gates | 10,000 gates |
| Logic Cells / Elements | 576 cells |
| Number of LABs | 72 |
| Maximum User I/Os | 102 |
| Process Technology | 0.3 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Maximum Toggle Frequency | 125 MHz |
| Propagation Delay | 0.6 ns (per digchip listing) |
| Temperatura de operação | 0 °C to 70 °C (commercial) |
| Encapsulamento | 144-pin TQFP (LQFP, 144-LQFP) |
| Tipo de montagem | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG / ByteBlaster |
| Embedded Memory | Embedded Array Blocks (EABs), up to 2 Kbit each |
| Status RoHS | Non-Compliant (lead-bearing N suffix variant) |
| Lead-Free Status | Contains lead (per FindIC) |
Configuração de pinos do EPF10K10ATC144-3N
| Pino 1 | I/O — User I/O pin (varies by bank; see datasheet pin table) |
| Pino 2 | I/O — User I/O pin |
| Pino 3 | I/O — User I/O pin |
| Pino 4 | I/O — User I/O pin |
| Pino 5 | VCCINT — Core supply voltage (3.3 V) |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O pin |
| Pino 8 | I/O — User I/O pin |
| Pino 9 | I/O — User I/O pin |
| Pino 10 | I/O — User I/O pin |
| Pino 11 | I/O — User I/O pin |
| Pino 12 | I/O — User I/O pin |
| Pino 13 | I/O — User I/O pin |
| Pino 14 | TDI — JTAG Test Data In |
| Pino 15 | TMS — JTAG Test Mode Select |
| Pino 16 | TCK — JTAG Test Clock |
| Pino 17 | nSTATUS — Configuration status (open-drain) |
| Pino 18 | nCONFIG — Configuration control (active-low) |
| Pino 19 | CONF_DONE — Configuration done (open-drain) |
| Pino 20 | DCLK — Configuration clock input |
| Pino 21 | DATA0 — Configuration data input |
| Pino 22 | nCE — Chip enable (active-low) |
| Pino 23 | I/O — User I/O pin |
| Pino 24 | I/O — User I/O pin |
| Pino 25 | I/O — User I/O pin |
| Pino 26 | I/O — User I/O pin |
| Pino 27 | I/O — User I/O pin |
| Pino 28 | I/O — User I/O pin |
| Pino 29 | I/O — User I/O pin |
| Pino 30 | VCCIO — I/O supply voltage |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O pin |
| Pino 33 | I/O — User I/O pin |
| Pino 34 | I/O — User I/O pin |
| Pino 35 | I/O — User I/O pin |
| Pino 36 | I/O — User I/O pin |
| Pino 37 | I/O — User I/O pin |
| Pino 38 | I/O — User I/O pin |
| Pino 39 | I/O — User I/O pin |
| Pino 40 | I/O — User I/O pin |
| Pino 41 | I/O — User I/O pin |
| Pino 42 | I/O — User I/O pin |
| Pino 43 | I/O — User I/O pin |
| Pino 44 | GND — Ground |
| Pino 45 | I/O — User I/O pin |
| Pino 46 | I/O — User I/O pin |
| Pino 47 | I/O — User I/O pin |
| Pino 48 | I/O — User I/O pin |
| Pino 49 | I/O — User I/O pin |
| Pino 50 | I/O — User I/O pin |
| Pino 51 | I/O — User I/O pin |
| Pino 52 | I/O — User I/O pin |
| Pino 53 | I/O — User I/O pin |
| Pino 54 | I/O — User I/O pin |
| Pino 55 | VCCINT — Core supply voltage (3.3 V) |
| Pino 56 | GND — Ground |
| Pino 57 | I/O — User I/O pin |
| Pino 58 | I/O — User I/O pin |
| Pino 59 | I/O — User I/O pin |
| Pino 60 | I/O — User I/O pin |
| Pino 61 | I/O — User I/O pin |
| Pino 62 | I/O — User I/O pin |
| Pino 63 | I/O — User I/O pin |
| Pino 64 | I/O — User I/O pin |
| Pino 65 | I/O — User I/O pin |
| Pino 66 | I/O — User I/O pin |
| Pino 67 | I/O — User I/O pin |
| Pino 68 | I/O — User I/O pin |
| Pino 69 | VCCIO — I/O supply voltage |
| Pino 70 | I/O — User I/O pin |
| Pino 71 | I/O — User I/O pin |
| Pino 72 | I/O — User I/O pin |
| Pino 73 | I/O — User I/O pin |
| Pino 74 | GND — Ground |
| Pino 75 | I/O — User I/O pin |
| Pino 76 | I/O — User I/O pin |
| Pino 77 | I/O — User I/O pin |
| Pino 78 | I/O — User I/O pin |
| Pino 79 | I/O — User I/O pin |
| Pino 80 | I/O — User I/O pin |
| Pino 81 | I/O — User I/O pin |
| Pino 82 | I/O — User I/O pin |
| Pino 83 | I/O — User I/O pin |
| Pino 84 | I/O — User I/O pin |
| Pino 85 | I/O — User I/O pin |
| Pino 86 | VCCINT — Core supply voltage (3.3 V) |
| Pino 87 | I/O — User I/O pin |
| Pino 88 | I/O — User I/O pin |
| Pino 89 | I/O — User I/O pin |
| Pino 90 | GND — Ground |
| Pino 91 | I/O — User I/O pin |
| Pino 92 | I/O — User I/O pin |
| Pino 93 | I/O — User I/O pin |
| Pino 94 | I/O — User I/O pin |
| Pino 95 | I/O — User I/O pin |
| Pino 96 | I/O — User I/O pin |
| Pino 97 | I/O — User I/O pin |
| Pino 98 | I/O — User I/O pin |
| Pino 99 | I/O — User I/O pin |
| Pino 100 | I/O — User I/O pin |
| Pino 101 | I/O — User I/O pin |
| Pino 102 | I/O — User I/O pin |
| Pino 103 | GND — Ground |
| Pino 104 | I/O — User I/O pin |
| Pino 105 | I/O — User I/O pin |
| Pino 106 | I/O — User I/O pin |
| Pino 107 | I/O — User I/O pin |
| Pino 108 | I/O — User I/O pin |
| Pino 109 | VCCIO — I/O supply voltage |
| Pino 110 | I/O — User I/O pin |
| Pino 111 | I/O — User I/O pin |
| Pino 112 | I/O — User I/O pin |
| Pino 113 | I/O — User I/O pin |
| Pino 114 | I/O — User I/O pin |
| Pino 115 | I/O — User I/O pin |
| Pino 116 | I/O — User I/O pin |
| Pino 117 | I/O — User I/O pin |
| Pino 118 | I/O — User I/O pin |
| Pino 119 | I/O — User I/O pin |
| Pino 120 | GND — Ground |
| Pino 121 | I/O — User I/O pin |
| Pino 122 | I/O — User I/O pin |
| Pino 123 | I/O — User I/O pin |
| Pino 124 | I/O — User I/O pin |
| Pino 125 | I/O — User I/O pin |
| Pino 126 | I/O — User I/O pin |
| Pino 127 | I/O — User I/O pin |
| Pino 128 | I/O — User I/O pin |
| Pino 129 | I/O — User I/O pin |
| Pino 130 | I/O — User I/O pin |
| Pino 131 | I/O — User I/O pin |
| Pino 132 | VCCINT — Core supply voltage (3.3 V) |
| Pino 133 | GND — Ground |
| Pino 134 | I/O — User I/O pin |
| Pino 135 | I/O — User I/O pin |
| Pino 136 | I/O — User I/O pin |
| Pino 137 | I/O — User I/O pin |
| Pino 138 | I/O — User I/O pin |
| Pino 139 | TDO — JTAG Test Data Out |
| Pino 140 | I/O — User I/O pin |
| Pino 141 | I/O — User I/O pin |
| Pino 142 | I/O — User I/O pin |
| Pino 143 | I/O — User I/O pin |
| Pino 144 | I/O — User I/O pin |
Aplicações típicas
EPF10K10ATC144-3N é adequado para 6 aplicaçãos: Legacy Telecom Interface Cards, Industrial PLC Glue Logic, Motor Control State Machines, Embedded Control Bridges, Prototyping and Education Platforms, Legacy Bus Interface Cards.
Legacy Telecom Interface Cards
The EPF10K10ATC144-3N is well-suited to legacy telecom interface cards where 10,000 gates, 102 user I/Os, and a 125 MHz toggle frequency are sufficient for protocol bridging, framing, and clock-recovery glue logic. With 3.3 V core supply and 0.6 ns propagation delay, the device handles E1/T1 framer interconnects and HDLC-style state machines. Its embedded array blocks (EABs) can implement small FIFOs and lookup tables, eliminating external SRAM. The 144-pin TQFP supports hand rework that legacy telecom field-service technicians rely on. Compiled with MAX+PLUS II, the design files remain portable to Quartus for ongoing maintenance.
Recomendado
Industrial PLC Glue Logic
For industrial PLC backplanes and field-bus bridges, the EPF10K10ATC144-3N delivers the gate density needed to consolidate discrete 74-series logic, custom state machines, and bus-arbitration circuits onto a single programmable device. Its 576 logic elements arranged in 72 LABs are well-matched to ladder-logic migration and IEC 61131-style sequencer designs. The 102 user I/Os accommodate multiple field-bus interfaces (Profibus, Modbus) plus local GPIO. Embedded array blocks can host lookup tables for PID coefficients and small CAM tables. Note that the commercial 0 °C to 70 °C temperature grade requires the industrial EPF10K10ATI144-3N for cabinet-mounted applications.
Recomendado
Motor Control State Machines
The EPF10K10ATC144-3N's 125 MHz performance and embedded memory make it a strong fit for brushless DC and stepper motor control state machines that demand deterministic timing and small lookup tables. The 72 LABs can encode commutation tables, ramp generators, and PWM modulator logic; EABs host sine-drive and space-vector modulation coefficients. With 102 user I/Os, the FPGA can directly interface Hall sensors, quadrature encoders, and FET gate drivers without external bus expanders. The -3 speed grade's 0.6 ns propagation delay supports high-resolution PWM at low duty cycle. Hardware engineers migrating to MAX 10 should evaluate 10M02SCE144I7G with similar gate count.
Recomendado
Embedded Control Bridges
The EPF10K10ATC144-3N serves as an embedded control bridge between mismatched processors, memory, and peripheral buses. With 10K gates and 102 user I/Os, it can host I2C/SPI to parallel-bus bridges, UART multiplexers, and address-decoding glue logic. The 576 logic cells support full 8/16-bit datapath implementations and small FIFO buffers using EAB blocks. JTAG programming (IEEE 1149.1) allows in-system reprogramming during development and field updates, critical for control-bridge designs that must adapt to multiple product variants. The 144-pin TQFP footprint simplifies PCB layout for bridges placed between BGA processors and through-hole legacy peripherals.
Recomendado
Prototyping and Education Platforms
Universities and engineering labs rely on the EPF10K10ATC144-3N as a teaching vehicle for programmable-logic courses and digital-design prototyping. Its manageable 10K-gate density lets students implement complete RISC-like CPUs, UART controllers, and VGA generators within a single semester. The MAX+PLUS II and Quartus toolchains are mature and well-documented, with abundant example projects and reference designs freely available. The 144-pin TQFP package on 0.5 mm pitch is large enough for educational soldering but small enough to fit on a student project board. EAB blocks teach the concept of distributed on-chip memory, a foundational concept for modern FPGA education.
Recomendado
Legacy Bus Interface Cards
The EPF10K10ATC144-3N is a proven solution for legacy VMEbus, ISA, and PCI-style interface cards where existing designs must remain operational without requalification. Its 102 user I/Os comfortably drive 32-bit address/data buses plus control signals, and the embedded EABs implement bus-master FIFOs and address-mapping registers. The -3 speed grade's 125 MHz toggle frequency supports PCI 33 MHz bus timing with adequate margin. Industrial and defense customers value the long-term stability of the FLEX 10KA silicon, which has been in production since the late 1990s. Migration paths to MAX II or MAX 10 require PCB rework but preserve the design's Verilog/VHDL source.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K10ATC144-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K10ATC144-3 | EPF10K10ATC144-2 | EPF10K10ATC144-1N | EPF10K10ATI144-3N | EPF10K10ATI144-3 |
|---|---|---|---|---|---|---|
| Package | 144-pin TQFP (LQFP) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | -3 (fastest) | -3 (same as target) | -2 (slower, ~100 MHz) | -1 (slowest grade) | -3 (same speed grade) | -3 (same speed grade) |
| Operating Temperature | 0 °C to 70 °C (commercial) | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) |
| Logic Cells | 576 | 576 | 576 | 576 | 576 | 576 |
| Number of LABs | 72 | 72 | 72 | 72 | 72 | 72 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Status | Non-Compliant (lead-bearing) | Non-Compliant (lead-bearing) | Non-Compliant (lead-bearing) | Non-Compliant (lead-bearing) | Non-Compliant (lead-bearing) | Non-Compliant (lead-bearing) |
Principais diferenciais
- Highest speed grade in FLEX 10K10A TQFP-144 family (vs EPF10K10ATC144-2)
- Commercial temperature, lead-bearing package available for legacy customers (vs EPF10K10ATI144-3N)
- Lower pin count than 208-pin PQFP alternative but same die (vs EPF10K10AQC208-3N)
Notas de projeto
The EPF10K10ATC144-3N requires a stable 3.3 V VCCINT supply with bulk decoupling of at least 100 µF tantalum plus 0.1 µF ceramic per VCCINT pin pair. Because this part is obsolete and may have variable I/O bank (VCCIO) tolerance, measure VCCIO before connecting to 5 V peripherals; FLEX 10KA I/O is not 5 V-tolerant in most bank configurations, so external level shifters are required for 5 V bus interfaces. Power-on ramp should follow the FLEX 10KA datasheet sequencing to avoid inadvertent configuration mode entry.
The EPF10K10ATC144-3N is lead-bearing and non-RoHS-compliant, which causes regulatory issues for new products entering the EU market. Engineers should verify the device family revision: only the -3N suffix means 3.3 V commercial lead-free variant; older -3 (without N) are lead-bearing. JTAG chain ordering with other 1149.1 devices on the board must keep TDI/TDO paths short because the EPF10K10ATC144-3N does not include a JTAG bypass register chain isolation - use BSDL files to validate the chain during bring-up.
The 144-pin TQFP at 0.5 mm pitch requires careful PCB land pattern design with solder mask-defined (SMD) pads to prevent tombstoning during reflow. Place decoupling capacitors as close as possible to each VCCINT/VCCIO pin pair, and route GND on an internal ground plane directly under the device for thermal dissipation and signal return paths. Configuration-related pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) need pull-up resistors per datasheet; leave room on the PCB for the ByteBlaster JTAG header for in-system reprogramming during development.
Estimated: at typical 3.3 V supply and 100 MHz operation with all 576 logic cells active (worst-case utilization), the EPF10K10ATC144-3N consumes approximately 250-400 mW. With the 144-pin TQFP thermal resistance around 35 °C/W on a JEDEC 2s2p test board, junction temperature rise is approximately 9-14 °C above ambient. Commercial 0-70 °C range is rarely challenged in normal operation, but designers should still provide modest copper pour thermal relief on VCCINT and GND pads to keep Tj below the 85 °C recommended long-term limit.
Informações de conformidade
Per FindIC compare data, the EPF10K10ATC144-3N is flagged 'Non-Compliant' for RoHS and 'Contains Lead' for lead-free status. The N suffix historically indicated lead-bearing variant. REACH, halogen-free, and conflict-minerals status not explicitly stated in available data; flagged as unknown.
