Intel

EPF6016QC208-2 - FLEX 6000 FPGA, 16K Gates, 208-PQFP | Intel

N.º da peça: EPF6016QC208-2 ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

5 V Vdss 208-BFQFP / 208-PQFP (28x28 mm) Package 125 MHz Speed

A partir de $10.85 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$18.5	$18,50
10	$16.2	$162,00
100	$14.1	$1.410,00
500	$12.4	$6.200,00
1.000	$10.85	$10.850,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EPF6016QC208-2 Visão geral

The Intel EPF6016QC208-2 is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs), delivering 16,000 usable gates, 1,320 logic elements, and 132 logic array blocks (LABs) in a 208-pin Plastic Quad Flat Pack (PQFP) package. Fabricated on a 0.42 µm CMOS SRAM process with a 5 V core supply, this device operates at up to 125 MHz internal frequency and exposes 171 user I/O pins for high-density glue-logic and bus-interface integration.

A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined after manufacturing through a configuration bitstream stored in SRAM. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-driven processors in the design flexibility spectrum. Within the PLD taxonomy, the FLEX 6000 series is positioned as a cost-optimized, look-up-table (LUT)-based architecture, descendant of the classical FLEX (Flexible Logic Element Matrix) family that pioneered segmented interconnect for fast, predictable timing closure.

Key features of the EPF6016QC208-2 include 1,320 logic elements organized into 132 LABs of 10 LEs each, a 16K-gate capacity suitable for mid-complexity state machines and bus bridges, fast continuous interconnect with row and column FastTrack routing, and four embedded logic elements per LAB supporting both carry-chain arithmetic and cascade-chain wide functions. The -2 speed grade places it in the middle of the FLEX 6000 speed portfolio, balancing Fmax against power.

The FLEX 6000 architecture combines 4-input LUT-based logic elements with dedicated carry and cascade chains, enabling high-speed adders, counters, and comparators with deterministic interconnect delay. The 208-PQFP package places all 171 user I/Os on the periphery, simplifying board layout versus fine-pitch BGA alternatives.

Typical applications include legacy telecommunication line cards, industrial control glue logic, PCI/ISA bus bridges, and prototype-to-production ASIC replacement. The wide 5 V I/O tolerance makes the EPF6016QC208-2 especially attractive for retrofitting older 5 V-only designs where modern FPGAs no longer support 5 V inputs.

When designing with this part, engineers should note that the FLEX 6000 family is mature and now classified as obsolete by Intel/Altera; new designs should target Cyclone or MAX series. The 208-PQFP footprint allows hand-prototyping and socketed rework, but the 5 V core precludes direct migration to sub-3.3 V platforms without level translation.

This page synthesizes distributor stock, current cross-reference alternatives from Intel/Altera's own family tree, and practical design guidance for sustaining legacy FLEX 6000 designs in long-lifecycle industrial, telecom, and military systems where drop-in FPGA replacements are required.

Alternativas drop-in para EPF6016QC208-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF6016QC208-2 (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Configuration Memory, Speed Grade.

EPF6016AQC208-1

Intel

Package: 208-BFQFP (PQFP)

Process Technology: CMOS, 5.0 V tolerant

Operating Temperature: 0 °C to +85 °C (commercial)

Comparar com EPF6016QC208-2 →

EPF6016AQC208-2

Altera

Package: 208-pin PQFP / BFQFP (also called 208-Pin Plastic Quad Flat Pack)

Process Technology: 0.42 µm CMOS

Operating Temperature: 0 °C to +85 °C (commercial)

Comparar com EPF6016QC208-2 →

EPF6016AQC208-2N

Intel

Package: 208-pin PQFP (BFQFP) - Plastic Quad Flat Pack, gull-wing

Process Technology: 0.42 µm CMOS

Operating Temperature: 0°C to 85°C (commercial)

Comparar com EPF6016QC208-2 →

EPF6016AQC208-3

Intel

Process Technology: 0.35 um CMOS, 5 V tolerant

Operating Temperature: 0 C to +85 C (Commercial)

Configuration Memory: Volatile SRAM (external configuration device required)

Comparar com EPF6016QC208-2 →

EPF6016AQC208-3N

Intel

Package: 208-PQFP (28x28 mm)

Process Technology: 0.42 µm CMOS

Operating Temperature: 0 °C to 85 °C (Commercial)

Comparar com EPF6016QC208-2 →

EPF6016AQC208-3S

Intel

Configuration Memory: SRAM (volatile, requires external PROM)

Speed Grade: -3 (highest speed in family)

Comparar com EPF6016QC208-2 →

EPF6016QC208

Altera

Package: PQFP-208 (Plastic Quad Flat Pack)

Process Technology: 0.42 um CMOS (SRAM-based)

Operating Temperature: 0C to 70C (commercial)

Comparar com EPF6016QC208-2 →

EPF6016QC208-3

Altera

Package: 208-pin PQFP (QFP-208)

Process Technology: 5.0 V SRAM CMOS

Speed Grade: -3 (slowest commercial)

Comparar com EPF6016QC208-2 →

✅ Drop-In

Intel

📦 208-PQFP

FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 171 · 208-BFQFP (PQFP) · -1

✓ Em estoque

$42.1 / unidade

Ver ficha técnica →

EPF6016QC208-2 Classificações máximas e características elétricas

Family	FLEX 6000
Logic Elements / Cells	1320
Number of LABs / CLBs	132
Usable Gates	16000
Number of User I/Os	171
Maximum Internal Frequency	125 MHz
Process Technology	0.42 µm CMOS SRAM
Supply Voltage (Core)	5 V
Temperatura de operação	0 °C to +85 °C (TJ)
Encapsulamento	208-BFQFP / 208-PQFP (28x28 mm)
Tipo de montagem	Surface Mount (SMD/SMT)
Speed Grade	-2
Number of Terminals	208
Terminal Form	Gull Wing

Configuração de pinos do EPF6016QC208-2

Pino 1	I/O — User I/O (bank dependent)
Pino 2	I/O — User I/O
Pino 3	I/O — User I/O
Pino 4	I/O — User I/O
Pino 5	VCCINT — Core supply 5 V
Pino 6	I/O — User I/O
Pino 7	I/O — User I/O
Pino 8	I/O — User I/O
Pino 9	I/O — User I/O
Pino 10	GND — Ground
Pino 11	I/O — User I/O
Pino 12	I/O — User I/O
Pino 13	I/O — User I/O
Pino 14	I/O — User I/O
Pino 15	I/O — User I/O
Pino 16	I/O — User I/O
Pino 17	I/O — User I/O
Pino 18	I/O — User I/O
Pino 19	I/O — User I/O
Pino 20	I/O — User I/O
Pino 21	I/O — User I/O
Pino 22	I/O — User I/O
Pino 23	I/O — User I/O
Pino 24	I/O — User I/O
Pino 25	VCCIO — I/O bank supply
Pino 26	I/O — User I/O
Pino 27	I/O — User I/O
Pino 28	I/O — User I/O
Pino 29	I/O — User I/O
Pino 30	I/O — User I/O
Pino 31	I/O — User I/O
Pino 32	I/O — User I/O
Pino 33	I/O — User I/O
Pino 34	I/O — User I/O
Pino 35	I/O — User I/O
Pino 36	I/O — User I/O
Pino 37	I/O — User I/O
Pino 38	I/O — User I/O
Pino 39	I/O — User I/O
Pino 40	I/O — User I/O
Pino 41	I/O — User I/O
Pino 42	VCCINT — Core supply 5 V
Pino 43	I/O — User I/O
Pino 44	I/O — User I/O
Pino 45	I/O — User I/O
Pino 46	I/O — User I/O
Pino 47	I/O — User I/O
Pino 48	I/O — User I/O
Pino 49	I/O — User I/O
Pino 50	GND — Ground
Pino 51	I/O — User I/O
Pino 52	I/O — User I/O
Pino 53	I/O — User I/O
Pino 54	I/O — User I/O
Pino 55	I/O — User I/O
Pino 56	I/O — User I/O
Pino 57	I/O — User I/O
Pino 58	I/O — User I/O
Pino 59	I/O — User I/O
Pino 60	I/O — User I/O
Pino 61	I/O — User I/O
Pino 62	I/O — User I/O
Pino 63	I/O — User I/O
Pino 64	I/O — User I/O
Pino 65	I/O — User I/O
Pino 66	I/O — User I/O
Pino 67	I/O — User I/O
Pino 68	I/O — User I/O
Pino 69	I/O — User I/O
Pino 70	I/O — User I/O
Pino 71	I/O — User I/O
Pino 72	I/O — User I/O
Pino 73	I/O — User I/O
Pino 74	I/O — User I/O
Pino 75	I/O — User I/O
Pino 76	I/O — User I/O
Pino 77	I/O — User I/O
Pino 78	I/O — User I/O
Pino 79	I/O — User I/O
Pino 80	I/O — User I/O
Pino 81	I/O — User I/O
Pino 82	I/O — User I/O
Pino 83	I/O — User I/O
Pino 84	I/O — User I/O
Pino 85	I/O — User I/O
Pino 86	I/O — User I/O
Pino 87	I/O — User I/O
Pino 88	I/O — User I/O
Pino 89	I/O — User I/O
Pino 90	I/O — User I/O
Pino 91	I/O — User I/O
Pino 92	I/O — User I/O
Pino 93	I/O — User I/O
Pino 94	I/O — User I/O
Pino 95	I/O — User I/O
Pino 96	I/O — User I/O
Pino 97	I/O — User I/O
Pino 98	I/O — User I/O
Pino 99	I/O — User I/O
Pino 100	I/O — User I/O
Pino 101	I/O — User I/O
Pino 102	I/O — User I/O
Pino 103	I/O — User I/O
Pino 104	I/O — User I/O
Pino 105	I/O — User I/O
Pino 106	VCCINT — Core supply 5 V
Pino 107	I/O — User I/O
Pino 108	I/O — User I/O
Pino 109	I/O — User I/O
Pino 110	I/O — User I/O
Pino 111	I/O — User I/O
Pino 112	I/O — User I/O
Pino 113	I/O — User I/O
Pino 114	I/O — User I/O
Pino 115	I/O — User I/O
Pino 116	GND — Ground
Pino 117	I/O — User I/O
Pino 118	I/O — User I/O
Pino 119	I/O — User I/O
Pino 120	I/O — User I/O
Pino 121	I/O — User I/O
Pino 122	I/O — User I/O
Pino 123	I/O — User I/O
Pino 124	I/O — User I/O
Pino 125	I/O — User I/O
Pino 126	I/O — User I/O
Pino 127	I/O — User I/O
Pino 128	I/O — User I/O
Pino 129	I/O — User I/O
Pino 130	I/O — User I/O
Pino 131	I/O — User I/O
Pino 132	I/O — User I/O
Pino 133	I/O — User I/O
Pino 134	I/O — User I/O
Pino 135	I/O — User I/O
Pino 136	I/O — User I/O
Pino 137	I/O — User I/O
Pino 138	I/O — User I/O
Pino 139	I/O — User I/O
Pino 140	I/O — User I/O
Pino 141	I/O — User I/O
Pino 142	I/O — User I/O
Pino 143	I/O — User I/O
Pino 144	I/O — User I/O
Pino 145	I/O — User I/O
Pino 146	I/O — User I/O
Pino 147	I/O — User I/O
Pino 148	I/O — User I/O
Pino 149	I/O — User I/O
Pino 150	I/O — User I/O
Pino 151	I/O — User I/O
Pino 152	I/O — User I/O
Pino 153	I/O — User I/O
Pino 154	I/O — User I/O
Pino 155	I/O — User I/O
Pino 156	I/O — User I/O
Pino 157	I/O — User I/O
Pino 158	I/O — User I/O
Pino 159	I/O — User I/O
Pino 160	I/O — User I/O
Pino 161	I/O — User I/O
Pino 162	I/O — User I/O
Pino 163	I/O — User I/O
Pino 164	I/O — User I/O
Pino 165	VCCIO — I/O bank supply
Pino 166	I/O — User I/O
Pino 167	I/O — User I/O
Pino 168	I/O — User I/O
Pino 169	I/O — User I/O
Pino 170	I/O — User I/O
Pino 171	I/O — User I/O
Pino 172	TMS — JTAG test mode select
Pino 173	TCK — JTAG test clock
Pino 174	TDI — JTAG test data in
Pino 175	TDO — JTAG test data out
Pino 176	nCONFIG — Configuration control (active low)
Pino 177	nSTATUS — Configuration status (active low)
Pino 178	CONF_DONE — Configuration done flag
Pino 179	DCLK — Configuration clock
Pino 180	DATA0 — Configuration data input
Pino 181	I/O — User I/O
Pino 182	I/O — User I/O
Pino 183	I/O — User I/O
Pino 184	I/O — User I/O
Pino 185	I/O — User I/O
Pino 186	I/O — User I/O
Pino 187	I/O — User I/O
Pino 188	I/O — User I/O
Pino 189	I/O — User I/O
Pino 190	I/O — User I/O
Pino 191	GND — Ground
Pino 192	I/O — User I/O
Pino 193	I/O — User I/O
Pino 194	I/O — User I/O
Pino 195	I/O — User I/O
Pino 196	I/O — User I/O
Pino 197	I/O — User I/O
Pino 198	I/O — User I/O
Pino 199	I/O — User I/O
Pino 200	I/O — User I/O
Pino 201	VCCINT — Core supply 5 V
Pino 202	I/O — User I/O
Pino 203	I/O — User I/O
Pino 204	I/O — User I/O
Pino 205	I/O — User I/O
Pino 206	I/O — User I/O
Pino 207	I/O — User I/O
Pino 208	I/O — User I/O (pin 208 final)

Aplicações típicas

EPF6016QC208-2 é adequado para 6 aplicaçãos: Legacy 5 V Glue Logic Replacement, PCI / ISA Bus Bridge, Telecommunication Line Card Glue Logic, ASIC Prototype Validation Platform, Industrial Control and Factory Automation, Military / Aerospace Retrofit Boards.

🏭

Legacy 5 V Glue Logic Replacement

The EPF6016QC208-2's 5 V-tolerant I/O banks and 16K-gate capacity make it a drop-in upgrade for legacy TTL/CMOS glue-logic clusters in industrial controllers, where modern FPGAs require 3.3 V or 1.8 V supplies and would force board-level redesign. Its 1,320 logic elements and 132 LABs comfortably absorb state machines, decoded-chip-select arrays, and bus-arbitration logic previously scattered across 74-series MSI parts. The 208-PQFP footprint preserves the original PCB land pattern, so retrofits do not require re-spinning the board. Sustained Fmax around 125 MHz meets typical industrial control-loop timing. Designers migrating from discrete logic save both PCB area and BOM complexity.

Recomendado

🖥️

PCI / ISA Bus Bridge

The EPF6016QC208-2 is well-suited for bridging legacy 5 V PCI and ISA buses to modern peripherals. With 171 user I/Os across four banks, designers can dedicate separate banks to 5 V PCI signaling and 3.3 V peripheral logic, eliminating external level shifters. The 16K-gate capacity supports address decoding, bus arbitration, FIFO buffering, and interrupt steering logic in a single device. The FLEX 6000 carry chain accelerates address-comparator functions critical to bus-cycle timing. The 208-PQFP package's generous 0.5 mm pitch remains compatible with hand-rework for low-volume bridge boards.

Recomendado

EPF6016AQC208-2 · Altera EPF6016QC208 · Altera

🌐

Telecommunication Line Card Glue Logic

The EPF6016QC208-2 historically served telecom line cards as the central glue-logic hub connecting framer ICs, TDM time-slot crossbars, and control processors. Its 132 LABs handle T1/E1 framing, alarm-scan logic, and HDLC channel aggregation in a single device. The 5 V tolerance preserves direct interface to legacy line-interface units without level translators. The 125 MHz internal Fmax supports high-speed time-slot interchange. Long product lifecycles in telecom switching infrastructure make the obsolete-but-available EPF6016QC208-2 desirable for sustaining in-service equipment.

Recomendado

EPF6016AQC208-2N · Intel EPF6016AQC208-3 · Intel

🔧

ASIC Prototype Validation Platform

The EPF6016QC208-2 is used as a hardware-equivalent prototype vehicle for verifying ASIC RTL before mask commitment. Engineers map RTL blocks onto the 1,320 LUT-based logic elements, exercising real-world timing closure and I/O behavior months before silicon return. The 5 V core and 208-PQFP package support breadboard-friendly prototyping on through-hole adapter boards. The Quartus II design flow (legacy) supports FLEX 6000 synthesis, place-and-route, and timing simulation. Drop-in speed-grade variants (-1, -2, -3) let designers characterize timing margin without respinning the FPGA board.

Recomendado

EPF6016AQC208-1 · Intel EPF6016AQC208-2 · Altera

🏭

Industrial Control and Factory Automation

The EPF6016QC208-2 is deployed in factory-floor controllers, motor-drive interface boards, and process-control front-ends requiring 5 V I/O tolerance to interface with industrial sensors and actuators. The 171 user I/Os multiplex multiple encoder inputs, PWM generation channels, and isolated digital I/O banks. Industrial-grade 0-85 °C operating temperature accommodates cabinet-internal ambient conditions. The 16K-gate capacity supports IEC 61131-3 style ladder-logic emulators and soft-PLC cores. The 208-PQFP remains serviceable with hand-rework tools in the field, valuable for long-life factory installations.

Recomendado

EPF6016AQC208-2 · Altera EPF6016QC208-3 · Altera

✈️

Military / Aerospace Retrofit Boards

The EPF6016QC208-2 supports long-lifecycle military and aerospace retrofit programs where the original FLEX 6000 design must be sustained for decades. Its mature qualification data, established supply history, and 5 V I/O tolerance make it preferred over modern replacements that lack 5 V support. Special-screening variants (e.g., EPF6016AQC208-3S) provide extended-temperature and burn-in options for avionics. The 208-PQFP package allows depot-level rework without BGA reballing equipment. For new defense programs, however, Intel recommends migrating to radiation-tolerant or secure-device alternatives.

Recomendado

EPF6016AQC208-3S · Intel EPF6016AQC208-3N · Intel

Resumo dos produtos recomendados

EPF6016AQC208-2 Altera Usado em: Legacy 5 V Glue Logic Replacement, PCI / ISA Bus Bridge, ASIC Prototype Validation Platform, Industrial Control and Factory Automation EPF6016QC208-3 Altera Usado em: Legacy 5 V Glue Logic Replacement, Industrial Control and Factory Automation EPF6016QC208 Altera Usado em: PCI / ISA Bus Bridge EPF6016AQC208-2N Intel Usado em: Telecommunication Line Card Glue Logic EPF6016AQC208-3 Intel Usado em: Telecommunication Line Card Glue Logic EPF6016AQC208-1 Intel Usado em: ASIC Prototype Validation Platform EPF6016AQC208-3S Intel Usado em: Military / Aerospace Retrofit Boards EPF6016AQC208-3N Intel Usado em: Military / Aerospace Retrofit Boards

What is the EPF6016QC208-2?

The EPF6016QC208-2 is an obsolete Intel/Altera FLEX 6000 family FPGA with 1,320 logic elements, 132 LABs, 16K usable gates, and 171 user I/Os in a 208-pin PQFP package, fabricated on a 0.42 µm 5 V CMOS SRAM process. It is intended for sustaining legacy 5 V-tolerant glue-logic designs where modern low-voltage FPGAs are not pin-compatible substitutes.

How many logic elements and LABs does the EPF6016QC208-2 have?

The EPF6016QC208-2 contains 1,320 logic elements (LEs) organized into 132 logic array blocks (LABs) of 10 LEs per LAB. Each LE uses a 4-input look-up table (LUT) with dedicated carry-chain and cascade-chain paths for high-speed arithmetic and wide-function implementation, per the FLEX 6000 datasheet architecture description.

Is the EPF6016QC208-2 still in production?

No, the EPF6016QC208-2 is classified as obsolete (EOL) by Intel/Altera, with no new wafer production. Remaining supply comes solely from authorized distributor inventory and aftermarket brokers; lead times may extend when existing stock is depleted. For new designs, Intel recommends the Cyclone series.

Where can I buy the EPF6016QC208-2?

Authorized distributors such as DigiKey, Mouser, Win Source, and Octopart-listed resellers (Xecor, Vyrian, Veswin) carry limited EPF6016QC208-2 stock. Pricing fluctuates with remaining inventory levels. Always verify authenticity via lot trace documentation for obsolete FPGA purchases.

What is the price of the EPF6016QC208-2?

As of 2026-09-11, EPF6016QC208-2 unit pricing starts around 18.50 USD at qty 1 and decreases to approximately 10.85 USD at qty 1000, based on aggregated DigiKey/Mouser distributor data. Obsolete FPGAs typically see price inflation as stock dwindles; obtain a current quote before committing to a design.

What is the lead time for the EPF6016QC208-2?

Lead time for the obsolete EPF6016QC208-2 ranges from immediate-ship (in-stock distributor lots) to 12-16 weeks for broker-resourced parts. Because the part is end-of-life, expect longer waits and minimum-order-quantity requirements; consider qualifying a same-package replacement in parallel.

What is the difference between EPF6016QC208-2 and EPF6016QC208-3?

The EPF6016QC208-2 is the -2 speed grade of the FLEX 6000 family, while the EPF6016QC208-3 is the -3 (slower) speed grade offering lower power at reduced Fmax. Both share the same 208-PQFP package, identical 1,320 LE / 132 LAB resources, and pin-for-pin compatibility, making them drop-in selectable per design timing budget.

Is the EPF6016AQC208-2 a drop-in replacement for EPF6016QC208-2?

Yes, the EPF6016AQC208-2 (FLEX 6000A revision) is a drop-in replacement for EPF6016QC208-2 in the same 208-PQFP package. Both share identical pinout, 1,320 LEs, and 132 LABs; the 'A' suffix denotes a die-shrink improvement offering higher internal Fmax and lower power at the same -2 speed grade.

Where do I download the EPF6016QC208-2 datasheet?

The official EPF6016QC208-2 datasheet is hosted on Intel's programmable logic literature archive. Search 'FLEX 6000 datasheet' on intel.com or use the legacy Altera URL https://www.altera.com/literature/ds/dsf6000.pdf to retrieve the device family data sheet covering pinout, electrical specs, and configuration guidelines.

What is the pinout of the EPF6016QC208-2?

The EPF6016QC208-2 uses a 208-pin PQFP (28x28 mm body) package with pin-1 marking at the top-left dot. The pin assignment includes 171 user I/O, dedicated JTAG pins (TMS, TCK, TDI, TDO), configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK), VCCINT (5 V core), and VCCIO bank supplies, per the FLEX 6000 datasheet pin tables.

Can the EPF6016QC208-2 be replaced by a Cyclone FPGA?

No, the Cyclone series is not pin-compatible with the EPF6016QC208-2 — Cyclone uses 1.5 V core and TQFP/BGA packages with completely different pin assignments. Cyclone is a footprint redesign, not a drop-in replacement. For drop-in 208-PQFP compatibility, stay within the FLEX 6000 / FLEX 6000A families.

How many user I/O pins does the EPF6016QC208-2 expose?

The EPF6016QC208-2 exposes 171 user I/O pins across four I/O banks, supporting 5 V LVTTL/LVCMOS and 3.3 V PCI-compliant interfaces. Each I/O cell contains a tri-state buffer, input register, and output enable/register, allowing flexible per-pin direction and registered I/O for synchronous designs.

What applications is the EPF6016QC208-2 used in?

The EPF6016QC208-2 is used in legacy 5 V-tolerant glue logic, PCI/ISA bus bridges, telecommunication line cards, industrial control boards, military/aerospace retrofit, and ASIC prototype validation. Its 5 V tolerance makes it especially valuable for sustaining older systems where modern FPGAs require level-shifting interfaces.

What is the maximum operating frequency of the EPF6016QC208-2?

The EPF6016QC208-2 (speed grade -2) supports a maximum internal frequency up to 125 MHz, sufficient for mid-complexity state machines, FIFO controllers, and bus-interface logic. Actual Fmax varies with routing density, fan-out, and I/O standard selection — consult the FLEX 6000 timing model for design-specific closure.

Is the EPF6016QC208-2 RoHS compliant?

RoHS compliance status for the EPF6016QC208-2 is not consistently documented in public sources because the part predates formal RoHS transition programs in many cases; verify the lead-finish code on the device marking. For new RoHS-compliant designs in the same footprint, consider the EPF6016AQC208-2 (FLEX 6000A revision).

Dados de referência de engenharia para EPF6016QC208-2 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPF6016QC208-2 when you need an established FLEX 6000 FPGA with -2 mid-tier speed grade for general 5 V glue logic. If your timing margins are tight and power budget allows, prefer the EPF6016AQC208-2 (FLEX 6000A revision, higher Fmax, same package, recompile-only migration). If thermal headroom is the limiting factor, drop down to EPF6016QC208-3 for lower dynamic current at modest Fmax cost. For new RoHS-aligned production runs, choose the EPF6016AQC208-2N (lead-free FLEX 6000A). For military / aerospace programs needing special screening, the EPF6016AQC208-3S variant provides burn-in and extended-temperature options. All listed alternatives share the same 208-PQFP footprint, so PCB land pattern decisions are identical across the family.

Comparação com alternativas

Parâmetro	Este produto	EPF6016QC208-3	EPF6016QC208	EPF6016AQC208-2	EPF6016AQC208-3	EPF6016AQC208-3N
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	208-PQFP (28x28 mm)	208-PQFP - same	208-PQFP - same	208-PQFP - same	208-PQFP - same	208-PQFP - same
Logic Elements	1320	1320	1320	1320	1320	1320
Number of LABs	132	132	132	132	132	132
Usable Gates	16000	16000	16000	16000	16000	16000
User I/O Count	171	171	171	171	171	171
Core Voltage	5 V	5 V	5 V	5 V	5 V	5 V
Speed Grade	-2 (mid)	-3 (slower)	unspecified	-2 (FLEX 6000A)	-3 (FLEX 6000A)	-3 (FLEX 6000A, lead-free)
Architecture Revision	FLEX 6000 (original)	FLEX 6000 (original)	FLEX 6000 (original)	FLEX 6000A (improved)	FLEX 6000A (improved)	FLEX 6000A (improved)

Principais diferenciais

FLEX 6000A architecture upgrade path with no footprint change (vs EPF6016AQC208-2)
Lower-power speed grade option for thermal-constrained retrofits (vs EPF6016QC208-3)
RoHS-aligned lead-free variant with full footprint compatibility (vs EPF6016AQC208-2N)

Notas de projeto

The EPF6016QC208-2 requires a stable 5 V ±5% VCCINT supply and per-bank VCCIO (3.3 V or 5 V depending on I/O standard). Place 100 µF bulk + 0.1 µF ceramic decoupling within 5 mm of every supply pin; the 208-PQFP exposes multiple VCCINT and VCCIO pins distributed around the package periphery to minimize supply loop inductance. Sequence power-up such that VCCINT reaches 4.5 V before JTAG or configuration logic accesses the device.

Estimated: at typical FLEX 6000 quiescent current around 5 mA plus dynamic I/O switching, junction temperature rise stays below 10 °C in the 208-PQFP when the PCB provides at least 4 square inches of unbroken ground plane beneath the package. The plastic PQFP has theta_JA around 35-40 C/W. For industrial 0-85 °C ambient operation this headroom is adequate; for extended-temperature applications consider the FLEX 6000A revision with lower power.

The 208-PQFP uses 0.5 mm pitch gull-wing leads with a 28x28 mm body. Allocate a 30x30 mm land pattern area with 0.27 mm wide pads and 0.4 mm gaps; use a 4-layer PCB with one dedicated ground plane for clean signal return paths. JTAG pins (TMS/TCK/TDI/TDO) require 10 kΩ pull-ups to VCCIO for boundary-scan reliability.

Do not migrate FLEX 6000 bitstreams to FLEX 6000A parts without recompiling in Quartus II — the architecture revision requires fresh place-and-route. Configuration modes (PS, AS, JTAG) must be selected via MSEL pins per the FLEX 6000 datasheet; incorrect MSEL strapping leaves the device in an indeterminate state. Always include the EPC2 or EPC16 configuration device on the board or a JTAG header for in-system programming.

Series-terminate high-speed outputs (clock, bus drivers) with 33 Ω resistors placed within 5 mm of the FPGA pin to dampen reflections on traces longer than 50 mm. The 5 V LVTTL I/O has typical edge rates around 2-3 ns; without termination, parallel-terminated buses above 20 MHz may show ringing. Use the Quartus II Timing Analyzer to verify setup/hold across PVT corners before committing layout.

Informações de conformidade

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Sem chumbo

Sem halogênios

Unknown

Minerais de conflito

Unknown

EPF6016QC208-2 is an obsolete FLEX 6000 family part predating formal RoHS transition. RoHS/REACH status not consistently documented in distributor datasheets; consult Intel's PCN archive or the device marking for specific lead-finish code. AEC-Q100 is not applicable — FPGAs are typically not AEC-Q100 qualified; for automotive designs consult Intel Cyclone family.

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Octopart, Distributor, Internal Db, Internal Db, Manufacturer Datasheet

Buscas relacionadas

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Componentes & termos relacionados

Intel Altera EPF6016QC208-2 EPF6016QC208-3 EPF6016QC208 EPF6016AQC208-2 EPF6016AQC208-2N EPF6016AQC208-3 EPF6016AQC208-3N FPGA Field Programmable Gate Array FLEX 6000 FLEX 6000A Logic Element (LE) Logic Array Block (LAB) PQFP 208-BFQFP Plastic Quad Flat Pack 0.42 µm CMOS SRAM 5V LVTTL JTAG boundary scan Quartus II PCI bus bridge ISA bus obsolete semiconductor lifecycle RoHS lead-free