Altera

EPF6016QC208-3 - FLEX 6000 FPGA 16K Gates 1320 Cells | Altera

N.º da peça: EPF6016QC208-3 ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

5.0 V Vdss 208-pin PQFP (QFP-208) Package -3 (slowest commercial) Speed

A partir de $19.91 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$31.62	$31,62
10	$28.46	$284,60
100	$25.3	$2.530,00
500	$22.13	$11.065,00
1.000	$19.91	$19.910,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EPF6016QC208-3 Visão geral

The Altera (Intel) EPF6016QC208-3 is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs) fabricated on a 5.0V CMOS process, offering 16,000 typical gates and 1,320 logic elements across 132 Logic Array Blocks (LABs). The -3 speed grade denotes the slowest commercial speed bin of the family, prioritizing timing-closure margin over absolute fMAX, and the device is housed in a 208-pin Power Quad Flat Pack (PQFP / QFP-208) package with 171 usable user I/Os. It operates from a single 5.0V supply (VCCINT = 5.0V, VCCIO = 3.3V or 5.0V tolerant) and is targeted at glue-logic, bus-interface, and cost-sensitive ASIC-replacement designs in industrial, telecom, and embedded-control applications.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all of which can be re-programmed in the field to implement arbitrary digital logic. The FLEX 6000 family sits in the hierarchy: programmable logic device (PLD) -> CPLD/FPGA -> SRAM-based FPGA -> low-density FPGA (16K gate class). Each LE in the EPF6016 contains a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains that accelerate arithmetic and wide fan-in functions across LABs, providing deterministic, predictable timing for synchronous state machines and datapaths.

Key features of the EPF6016QC208-3 include 1,320 logic elements in 132 LABs, 171 user I/Os, an embedded array block structure, JTAG (IEEE 1149.1) boundary-scan support, and SRAM-based configuration loaded from a serial PROM or through the Altera ByteBlaster / MasterBlaster / BitBlaster download cables. The device supports in-system programmability (ISP) and can be reconfigured in-circuit without removing it from the PCB, enabling field upgrades and rapid prototyping. The Q-3 speed grade is appropriate for designs where fMAX targets are below 100 MHz and where routing headroom, rather than raw speed, is the primary concern.

The EPF6016QC208-3 is typically deployed in telecom line-card glue logic, industrial control and instrumentation backplanes, PCI / ISA bus bridges, asynchronous-transfer-mode (ATM) glue, and embedded microcontroller co-processors. The 208-pin PQFP footprint has a generous 0.5 mm lead pitch that simplifies hand-prototyping and rework compared to fine-pitch BGA packages, while still exposing 171 user I/Os for medium-density parallel buses and peripheral multiplexing. Designers transitioning from older discrete TTL or 74-series glue logic often select this part as a single-chip replacement for 10-30 SSI/MSI packages.

When designing with the EPF6016QC208-3, ensure that VCCINT decoupling uses 0.1 uF ceramic capacitors placed within 5 mm of every supply pin and that the JTAG TMS/TCK lines are pulled up to VCCIO through 10 kohm resistors. The configuration EEPROM (such as EPC1 or EPC2) should be wired to support FLEX 6000 passive-serial configuration mode. Because the -3 speed grade has the slowest tPD of the family, validate critical paths with the Quartus II (or legacy MAX+PLUS II) timing analyzer before committing to the layout.

This page synthesizes distributor pricing from Heisener, Octopart, DigiKey and Mouser, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not found in the manufacturer datasheet.

Alternativas drop-in para EPF6016QC208-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF6016QC208-3 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Configuration Memory, Speed Grade.

EPF6016AQC208-3

Intel

Operating Temperature: 0 C to +85 C (Commercial)

Process Technology: 0.35 um CMOS, 5 V tolerant

Configuration Memory: Volatile SRAM (external configuration device required)

Comparar com EPF6016QC208-3 →

EPF6016AQC208-3N

Intel

Operating Temperature: 0 °C to 85 °C (Commercial)

Package: 208-PQFP (28x28 mm)

Process Technology: 0.42 µm CMOS

Comparar com EPF6016QC208-3 →

EPF6016AQC208-3S

Intel

Configuration Memory: SRAM (volatile, requires external PROM)

Speed Grade: -3 (highest speed in family)

Comparar com EPF6016QC208-3 →

EPF6016QC208

Altera

Operating Temperature: 0C to 70C (commercial)

Package: PQFP-208 (Plastic Quad Flat Pack)

Process Technology: 0.42 um CMOS (SRAM-based)

Comparar com EPF6016QC208-3 →

EPF6016QC208-2

Intel

Operating Temperature: 0 °C to +85 °C (TJ)

Package: 208-BFQFP / 208-PQFP (28x28 mm)

Process Technology: 0.42 µm CMOS SRAM

Comparar com EPF6016QC208-3 →

EPF6016QC208-2N

Intel

Operating Temperature: 0°C to +85°C (Commercial)

Package: 208-Pin PQFP (Plastic Quad Flat Pack), 28 x 28 mm

Process Technology: CMOS, SRAM-based configuration

Comparar com EPF6016QC208-3 →

EPF6016QC208-3N

Altera

Operating Temperature: 0 °C to +85 °C (commercial)

Package: 208-pin PQFP (Power Quad Flat Pack)

Process Technology: 0.42 µm CMOS, SRAM-based

Comparar com EPF6016QC208-3 →

EPF6016QI208-3

Intel

Operating Temperature: 0 °C to 85 °C (commercial)

Configuration Memory: SRAM (volatile, requires configuration device)

Comparar com EPF6016QC208-3 →

✅ Drop-In

Intel

📦 PQFP-208

FLEX 6000 · Field-Programmable Gate Array (FPGA) · 16,000 · 1,320 · 132 · 171 · 208-PQFP (Plastic Quad Flat Pack) · FQFP, 28x28 mm, 0.5 mm pitch

✓ Em estoque

$27.9 / unidade

Ver ficha técnica →

EPF6016QC208-3 Classificações máximas e características elétricas

Family	FLEX 6000
Typical Gates	16,000
Logic Elements	1,320
Logic Array Blocks (LABs)	132
User I/Os	171
Process Technology	5.0 V SRAM CMOS
Supply Voltage VCCINT	5.0 V
Supply Voltage VCCIO	3.3 V / 5.0 V tolerant
Encapsulamento	208-pin PQFP (QFP-208)
Speed Grade	-3 (slowest commercial)
Configuration Method	SRAM, passive-serial via EPC1/EPC2
JTAG Support	IEEE 1149.1 boundary-scan
In-System Programmability	Yes
Operating Temperature (commercial)	0 C to 85 C

Configuração de pinos do EPF6016QC208-3

Pino 1	I/O — User I/O bank (pin 1 of 208)
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Pino 53	GND — Ground
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Pino 105	GND — Ground
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Pino 157	GND — Ground
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Aplicações típicas

EPF6016QC208-3 é adequado para 6 aplicaçãos: Telecom Line-Card Glue Logic, Industrial Control Backplanes, PCI / ISA Bus Bridge, Embedded Microcontroller Co-Processor, Legacy ASIC Replacement, Test and Measurement Instrumentation.

🌐

Telecom Line-Card Glue Logic

The EPF6016QC208-3 is well suited to telecom line-card glue logic where it consolidates 10-30 discrete 74-series SSI/MSI packages into a single reprogrammable device. With 1,320 logic elements across 132 LABs and 171 user I/Os, it absorbs bus bridges, framer interfaces, and clock-domain crossings that surround legacy TDM ASICs, while the 5.0V VCCINT and 3.3V/5.0V-tolerant VCCIO simplify interfacing to vintage line-card backplanes. The -3 speed grade delivers deterministic timing at sub-100 MHz fMAX with ample routing slack, and in-system programmability via JTAG (IEEE 1149.1) allows field firmware revisions without removing the line card from service.

Recomendado

🏭

Industrial Control Backplanes

The EPF6016QC208-3 has long been deployed in industrial control backplanes for PLCs, motor drives, and process instrumentation, where its 208-pin PQFP package with 0.5 mm lead pitch is hand-solderable and field-reworkable by technicians. The 5.0V core tolerance interfaces directly to legacy 74HC/74LS logic on the backplane, while the 171 available I/Os drive multi-drop RS-485, CAN, and parallel fieldbus transceivers without external bus-switches. Combined with 1,320 LEs of state-machine capacity and SRAM-based in-system reconfigurability, it lets OEM backplane vendors ship a single hardware platform that supports multiple customer-specific protocols through firmware differentiation.

Recomendado

EPC1LC20 · Intel EPF10K30EQC208-3 · Intel

🖥️

PCI / ISA Bus Bridge

For PCI (33 MHz, 32-bit) and ISA bus bridge designs the EPF6016QC208-3 supplies enough logic and I/O to implement address decoding, byte-enable logic, wait-state generation, and interrupt steering without external MSI glue. The 171 user I/Os comfortably fan out to 32-bit address/data buses plus control and arbitration signals, and the -3 speed grade provides timing margin for 33 MHz PCI signaling when paired with external transceivers. SRAM-based configuration lets a single PCB ship as PCI or ISA depending on the loaded bitstream, simplifying inventory across product variants.

Recomendado

EPC2LC20 · Altera EPF6016AQC208-3 · Intel

🔧

Embedded Microcontroller Co-Processor

The EPF6016QC208-3 serves as a co-processor to 8-bit and 16-bit microcontrollers (8051, 68HC11, H8) by offloading custom peripheral logic, DSP pre-processing, or parallel I/O expansion. Its 1,320 LEs implement state machines for stepping-motor control, encoder quadrature decoding, or LCD segment driving without burdening the host MCU's cycle budget. The PQFP-208 footprint mates with hand-rework-friendly 2-layer PCBs, and the 5.0V core matches the supply rail of legacy microcontrollers, removing level-shifters from the bus between host and FPGA.

Recomendado

EPC1LC20 · Intel EPF10K20RC208-4 · Intel

✈️

Legacy ASIC Replacement

The EPF6016QC208-3 is a frequent ASIC-replacement target for low-volume industrial and military programs whose original masked-ASIC supplier has exited the market. With approximately 16,000 equivalent ASIC gates and 1,320 logic elements, it accommodates designs that previously committed to 5.0V masked ASICs and now require last-time-buy alternatives. The SRAM bitstream is held in an external EPC1/EPC2 PROM, allowing the design to be re-spun in software rather than at the wafer fab, and the same 208-pin PQFP footprint matches legacy ASIC land patterns so PCBs do not require rework.

Recomendado

EPC2LC20 · Altera EPF6016QC208-2N · Intel

🔬

Test and Measurement Instrumentation

Bench-top test and measurement instruments use the EPF6016QC208-3 as a flexible pattern generator, protocol decoder, or custom-timing engine where off-the-shelf microcontrollers lack deterministic timing. The 132 LABs hold wide counters, parallel-serial converters, and trigger-state machines, while the 171 user I/Os simultaneously drive front-panel BNC connectors, parallel LCDs, and GPIB/HPIB interfaces. In-system programmability allows the instrument firmware to be updated through JTAG without opening the chassis, and the -3 speed grade provides robust timing margin for slow-precision measurements up to roughly 50 MHz.

Recomendado

EPC2LC20 · Altera EPF6016QC208-2 · Intel

Resumo dos produtos recomendados

EPC2LC20 Altera Usado em: Telecom Line-Card Glue Logic, PCI / ISA Bus Bridge, Legacy ASIC Replacement, Test and Measurement Instrumentation EPF6010ATC100-3 Intel Usado em: Telecom Line-Card Glue Logic EPC1LC20 Intel Usado em: Industrial Control Backplanes, Embedded Microcontroller Co-Processor EPF10K30EQC208-3 Intel Usado em: Industrial Control Backplanes EPF6016AQC208-3 Intel Usado em: PCI / ISA Bus Bridge EPF10K20RC208-4 Intel Usado em: Embedded Microcontroller Co-Processor EPF6016QC208-2N Intel Usado em: Legacy ASIC Replacement EPF6016QC208-2 Intel Usado em: Test and Measurement Instrumentation

What is the EPF6016QC208-3?

The EPF6016QC208-3 is an Altera (now Intel) FLEX 6000 family SRAM-based FPGA with 16,000 typical gates and 1,320 logic elements in 132 LABs, housed in a 208-pin PQFP package. According to Altera FLEX 6000 datasheet material referenced on Octopart, it targets cost-sensitive ASIC-replacement and glue-logic applications at 5.0V supply with 171 user I/Os available on the -3 speed grade.

How many logic elements does the EPF6016QC208-3 have?

The EPF6016QC208-3 contains 1,320 logic elements organized into 132 Logic Array Blocks (LABs). Each LE integrates a 4-input LUT, a programmable register, and carry/cascade chain logic, and the entire fabric maps to roughly 16,000 typical ASIC gates for capacity planning purposes.

Is the EPF6016QC208-3 still in production?

No, the EPF6016QC208-3 is obsolete. The FLEX 6000 family has been discontinued by Altera/Intel and the part is now sourced only through the secondary market and franchised excess distributors such as Heisener, Avnet, and Rochester Electronics. For new designs, Altera recommends migrating to MAX II CPLD or Cyclone FPGA families.

Where can I buy the EPF6016QC208-3 today?

Heisener lists the EPF6016QC208-3 at USD 31.62 unit price with in stock as of 2026-09-11. Lead time is "Can Ship Immediately" with estimated delivery Feb 3 - Feb 8 if expedited. Other sources include Octopart's distributor aggregator and authorized resellers stocking legacy Altera inventory.

What is the lead time and stock status for EPF6016QC208-3?

Heisener reports in stock with immediate shipment capability as of 2026-09-11. Because the part is obsolete, lead time from Altera-direct is N/A; remaining inventory is at independent distributors and brokers, so pricing is volatile and order quantities above 1,000 units should be confirmed by RFQ.

What is the price of the EPF6016QC208-3?

The EPF6016QC208-3 is listed at USD 31.62 per unit (qty 1) on Heisener, USD 28.46 at qty 10, USD 25.30 at qty 100, USD 22.13 at qty 500, and USD 19.91 at qty 1000 as of 2026-09-11. Pricing reflects obsolete/legacy status and may fluctuate significantly with distributor inventory movements.

Where do I download the EPF6016QC208-3 datasheet PDF?

The official Altera FLEX 6000 datasheet is hosted at Intel's Altera documentation archive (altera.com / intel.com content portal) and mirrored on Octopart at https://octopart.com/datasheet/altera/EPF6016QC208-3. FindIC and Datasheets.com also host PDF copies; Altera's MAX+PLUS II and Quartus II legacy installers include the same datasheet in /doc directory.

EPF6016QC208-3 vs EPF6016QC208-2 - which should I choose?

Both parts share the FLEX 6000 die, 1,320 LEs, 132 LABs and 208-pin PQFP package, differing only in speed grade. The -2 is the faster bin (shorter tPD, higher fMAX), while -3 is the slowest commercial grade with the largest timing margin. Choose -2 for designs with tight fMAX targets, and -3 for prototyping or cost-driven layouts where speed headroom matters more than throughput.

What is a drop-in replacement for the EPF6016QC208-3?

Drop-in same-package replacements in the FLEX 6000 family include EPF6016QC208-2N and EPF6016QC208-2 (208-pin PQFP, identical footprint, different speed grade). The -2N variant adds -40C to +85C industrial temperature range and is functionally identical at room temperature, making it a clean substitution when timing margins allow the slower -3 grade.

Is there a non-Altera (cross-brand) equivalent for the EPF6016QC208-3?

There is no pin-compatible cross-brand replacement for the EPF6016QC208-3 in the same 208-pin PQFP package. Xilinx XC4000-series parts with similar 16K-gate capacity used different pinouts and BGA packages, so they require PCB rework. For new designs the recommended cross-brand path is to migrate to a modern low-density FPGA such as Lattice iCE40 or Microchip PolarFire in a fresh PCB layout.

What is the operating voltage of EPF6016QC208-3?

The EPF6016QC208-3 requires a 5.0V VCCINT supply for the core logic, with VCCIO supporting 3.3V or 5.0V I/O banks for mixed-voltage interfacing. The device does NOT support 1.8V or 1.2V core rails; for low-voltage operation, migrate to a Cyclone III/IV/V FPGA on 1.2V VCCINT.

How do I configure the EPF6016QC208-3?

The EPF6016QC208-3 uses SRAM configuration loaded through the passive-serial (PS) mode from an external EPC1, EPC2, or EPC16 configuration PROM, or directly from a download cable such as Altera ByteBlaster / MasterBlaster / BitBlaster. JTAG (IEEE 1149.1) is also supported for boundary-scan testing and in-system programming. Configuration time is determined by the bitstream size (approximately 60-80 Kbits for a fully utilized EPF6016).

What software supports the EPF6016QC208-3?

The EPF6016QC208-3 is supported by MAX+PLUS II (legacy Altera toolchain) and Quartus II versions up through Quartus II 13.0 sp1. Quartus Prime does not support FLEX 6000 devices; engineers maintaining FLEX 6000 designs must remain on MAX+PLUS II or an archived Quartus II version for synthesis, place-and-route, and timing analysis.

What package does the EPF6016QC208-3 use?

The EPF6016QC208-3 is housed in a 208-pin Plastic Quad Flat Pack (PQFP / QFP-208) with 0.5 mm lead pitch and a body size of approximately 28 mm x 28 mm with a 3.4 mm profile. The Q-suffix in the part number designates PQFP, and the C denotes commercial temperature grade. 171 of the 208 pins are bonded out as user I/Os; remaining pins are supply, ground, JTAG, and configuration.

What are typical applications for the EPF6016QC208-3?

The EPF6016QC208-3 is used in telecom line-card glue logic, industrial control and instrumentation backplanes, PCI and ISA bus bridges, embedded microcontroller co-processors, and asynchronous-transfer-mode (ATM) glue. Its 5.0V tolerance and 208-pin PQFP ease of prototyping make it common in legacy industrial systems, military refresh programs, and ASIC-replacement designs that originally targeted the late 1990s.

Dados de referência de engenharia para EPF6016QC208-3 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPF6016QC208-3 when your design is timing-marginal rather than speed-critical, and you want the lowest unit cost in the FLEX 6000 208-pin PQFP family. It is the right pick for glue-logic replacement, legacy ASIC drop-in, and 5.0V-tolerant industrial backplanes where fMAX below 100 MHz is acceptable. Choose EPF6016QC208-2 if you need higher fMAX in the same footprint, or EPF6016QC208-2N if you also need industrial -40 C to +85 C operation. Migrate to a Cyclone IV/V or MAX 10 CPLD for new designs, since the FLEX 6000 family is obsolete. The 208-pin PQFP package remains the best choice for hand-prototyping and field-rework scenarios where BGA is impractical.

Comparação com alternativas

Parâmetro	Este produto	EPF6016QC208-2	EPF6016QC208-2N	EPF6016AQC208-3	EPF6016AQC208-3N
Brand	Altera	Altera	Altera	Altera	Altera
Package	PQFP-208	PQFP-208 - same	PQFP-208 - same	PQFP-208 - same	PQFP-208 - same
Logic Elements	1,320	1,320 (same die)	1,320 (same die)	1,320 (same die)	1,320 (same die)
LABs	132	132	132	132	132
User I/Os	171	171	171	171	171
Speed Grade	-3 (slowest)	-2 (faster fMAX)	-2 + industrial temp	-3 (same speed, A-grade die)	-3 (same speed, A-grade + industrial)
Operating Temperature	0 C to +85 C (commercial)	0 C to +85 C	-40 C to +85 C (industrial)	0 C to +85 C	-40 C to +85 C (industrial)
Supply Voltage VCCINT	5.0 V	5.0 V	5.0 V	5.0 V	5.0 V
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

Principais diferenciais

Lowest cost FLEX 6000 speed grade in PQFP-208 (vs EPF6016QC208-2)
Industrial temperature variant available in same footprint (vs EPF6016QC208-2N)
Same die across PQFP and BGA package options (vs EPF6016BC256-3)

Notas de projeto

Estimated: at VCCINT = 5.0 V and typical 100 MHz operation with 70% utilization, the EPF6016QC208-3 core current is approximately 100-150 mA. Place 0.1 uF X7R ceramic decoupling within 5 mm of every VCCINT pin and add a single bulk 47-100 uF tantalum or aluminum-polymer capacitor on each VCCINT island. VCCIO banks should be decoupled similarly and never left floating - unused banks should be tied to the same rail as the active bank to prevent I/O latch-up.

PQFP-208 has 0.5 mm lead pitch - keep-out clearance of 0.3 mm above the package body is required for socketed or hand-reworked designs. Route all I/O signals on inner layers with vias placed inside the package land pattern to avoid signal-fanout congestion. Provide a continuous ground plane on layer 2 directly beneath the device, and stitch the perimeter of the PQFP land pattern with a ground-signal-ground trace pattern to control simultaneous-switching noise (SSN) on the 171 I/O banks.

Do not confuse speed grades - the -3 grade has the slowest tPD of the FLEX 6000 family; designing assuming -1 fMAX values will fail timing closure. The configuration PROM (EPC1/EPC2) must match the bit-width of the FLEX 6000 bitstream - using an EPC8 intended for ACEX devices will not configure the EPF6016. Finally, the JTAG chain order (TMS/TCK/TDO/TDI) must be verified before ISP programming or boundary-scan test vectors will return expected results.

The 208-pin PQFP has long internal bond wires that introduce approximately 4-6 nH of series inductance per pin, which combined with 5-10 pF of pin capacitance creates LC resonances around 600 MHz. For signal-integrity above 50 MHz, add 33 ohm series resistors on clock outputs and source-terminate high-speed buses. The PQFP-208 body is approximately 28 mm x 28 mm with 3.4 mm height - allow 4 mm of vertical clearance above the package for socketed test clips and inspection.

Informações de conformidade

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Sem chumbo

Unknown

Sem halogênios

Unknown

Minerais de conflito

Unknown

RoHS/REACH status not present in verified web data; EPF6016QC208-3 pre-dates RoHS Phase 2 transition (the FLEX 6000 family launched in 1998). AEC-Q100 not applicable - this is a commercial-grade FPGA. For RoHS-compliant variants of the FLEX 6000 die, consult Altera/Intel product-change notifications.

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Manufacturer Datasheet, Distributor, Octopart, Distributor, Distributor, Distributor, Octopart

Buscas relacionadas

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Componentes & termos relacionados

Altera Intel EPF6016QC208-3 EPF6016QC208-2 EPF6016QC208-2N EPF6016AQC208-3 FLEX 6000 FPGA Field Programmable Gate Array Logic Array Block LAB Logic Element LE Look-Up Table LUT PQFP-208 Plastic Quad Flat Pack 5.0V CMOS JTAG IEEE 1149.1 EPC1 EPC2 configuration PROM SRAM-based FPGA in-system programmability MAX+PLUS II Quartus II Telecom line card industrial backplane PCI bus bridge