EPF6024AQC208-1N - FLEX 6000 FPGA 24K Gates 208-PQFP | Intel
N.º da peça: EPF6024AQC208-1N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.4 | $324,00 |
| 100 | $26.8 | $2.680,00 |
| 500 | $22.1 | $11.050,00 |
| 1.000 | $18.75 | $18.750,00 |
EPF6024AQC208-1N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing — hence "field-programmable". FPGAs sit at the top of the programmable logic hierarchy: programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> SoC FPGAs. The FLEX 6000 family in particular was an early 1990s low-cost, high-volume SRAM-LUT architecture targeting glue logic, bus interface, and state-machine replacement, allowing fast design changes during prototyping without the NRE of an ASIC.
Key features of the EPF6024AQC208-1N include 196 LABs arranged across the chip fabric, 171 user I/O pins distributed on the periphery, JTAG-compliant boundary-scan test support (IEEE 1149.1), and SRAM-based configuration cells that must be reloaded at every power-up from an external configuration PROM or controller. The -1 speed grade is the slowest of the FLEX 6000 grade options (-1, -2, -3), trading timing margin for cost savings.
Architecturally the FLEX 6000 family uses a four-input Look-Up Table (LUT) per Logic Element, embedded array blocks, and continuous FastTrack interconnect. This LUT-based fabric is more flexible than older PAL/PLA gate-array hybrids and supports fully synchronous design via per-LAB carry chains and dedicated clock trees. The device is configured via the Altera MAX+PLUS II or Quartus development flows.
Typical applications include industrial control glue logic, telecommunications interface bridges, PCI bus controllers, prototyping platforms for ASIC emulation, and replacement of multiple discrete 74-series TTL packages on legacy boards. The wide 171-user-I/O count suits parallel bus aggregation tasks.
When designing with this part, remember the FLEX 6000 family is now obsolete (NRND/EOL) and current designs should consider Cyclone IV/V or MAX II CPLDs from Intel for new builds. Existing designs should keep spares on hand or migrate to the pin-compatible EPF6024AQC208-2 or -3 speed grades if timing closure is loose.
This page synthesizes distributor stock indicators, drop-in speed-grade alternatives, and 208-PQFP PCB layout guidance not found in the original FLEX 6000 datasheet — practical intelligence for engineers maintaining legacy designs in 2026.
Alternativas drop-in para EPF6024AQC208-1N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024AQC208-1N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Process Technology, Device Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024AQC208-1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF6024AQC208-3N
✅ Drop-In✓ Em estoque
$23.9 / unidade
Ver ficha técnica →EPF6024ABC256-2N
✅ Drop-In✓ Em estoque
$22.1 / unidade
Ver ficha técnica →EPF6024AQC208-1N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Typical Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 171 |
| Number of I/O Pins | 171 |
| Encapsulamento | 208-BFQFP (Plastic Quad Flat Pack, PQFP) |
| Package Pin Count | 208 |
| Tipo de montagem | Surface Mount |
| Tensão de alimentação | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 200 MHz |
| Temperatura de operação | 0 °C to +85 °C (TJ) |
| Configuration Memory | SRAM (volatile, re-load required at power-up) |
| Speed Grade | -1 (slowest) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Programming Tools | Altera MAX+PLUS II / Quartus |
| Part Status | Obsolete |
Guia de Configuração de Pinos do EPF6024AQC208-1N 208
Configuração de pinos para EPF6024AQC208-1N (pacote 208). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPF6024AQC208-1N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPF6024AQC208-1N é adequado para 6 aplicaçãos: Industrial Glue Logic Replacement, PCI Bus Interface Bridge, ASIC Emulation Platform, Telecommunications Interface Bridge, Legacy 74-series TTL Replacement, Prototyping & Design Verification Platform.
Industrial Glue Logic Replacement
The EPF6024AQC208-1N replaces banks of 74-series TTL/MSI logic on legacy industrial control boards. With 1,960 logic elements and 196 LABs, the FLEX 6000 fabric can absorb dozens of discrete AND/OR/latch/decoder functions into one device. The 171 user I/O count comfortably aggregates 24-32 bit parallel buses plus address decoding logic. Quartus/MAX+PLUS II synthesis makes timing closure straightforward at industrial 50-100 MHz clocks. Note: for new industrial designs, choose Intel Cyclone IV or MAX II for continued supply and lower BOM cost.
Recomendado
PCI Bus Interface Bridge
The EPF6024AQC208-1N is well-suited as a 33 MHz PCI 2.0 target/master bridge on legacy ISA/PCI motherboards. Its 4-input LUT fabric, dedicated carry chains, and 171 I/Os comfortably absorb the 49-signal PCI bus plus bus-arbitration glue and target-state registers. The 0.42 µm CMOS process supports 3.3 V PCI signaling directly without level translation. For 66 MHz PCI, choose the -3 speed grade instead. Modern replacement: Intel Cyclone IV EP4CE22F17 offers PCI IP cores and wider supply.
Recomendado
ASIC Emulation Platform
Use the EPF6024AQC208-1N as a multi-chip ASIC emulator for designs targeting 10K-20K gate equivalents. Designers partition the ASIC into the 24K-gate FLEX 6000 fabric and iterate HDL quickly in MAX+PLUS II before committing to mask. The 200 MHz internal Fmax supports pipelined datapath emulation. Re-programmability makes it ideal for FPGA prototyping boards. Modern alternatives like Cyclone IV GX provide higher logic density and embedded transceivers.
Recomendado
Telecommunications Interface Bridge
The EPF6024AQC208-1N bridges E1/T1 framers, HDLC controllers, and UART chains on telecom line cards. Its SRAM-based fabric supports in-system reconfiguration for protocol upgrades, while 171 I/Os aggregate multiple serial data streams and status LEDs. JTAG boundary-scan (IEEE 1149.1) simplifies board-level test. For new telecom designs, choose Intel Cyclone V with hard PCIe and transceivers.
Recomendado
Legacy 74-series TTL Replacement
Use the EPF6024AQC208-1N to replace 20-40 pieces of 74LS/74F/74HC logic on maintenance-grade legacy boards. One FLEX 6000 device replaces an entire inventory of AND/OR/flip-flop/decoder packages, reducing BOM and improving reliability. The 208-PQFP surface-mount footprint fits standard JEDEC land patterns. Engineers must verify operating temperature (0 °C to +85 °C) and ensure 3.3 V supply is available; level shifters may be needed for 5 V legacy logic.
Recomendado
Prototyping & Design Verification Platform
The EPF6024AQC208-1N serves as a re-programmable verification platform during ASIC development. Designers can download revised HDL each morning and verify in-system against real I/O before taping out. The 24K-gate capacity handles substantial state machines, FIFOs, and datapaths. SRAM configuration means a bad bit-stream simply reloads — no permanent damage. The -1 speed grade trades Fmax for cost; upgrade to -3 if your prototype exceeds 100 MHz.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024AQC208-1N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024AQC208-1 | EPF6024AQC208-3N | EPF6024ABC256-2N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 256-BGA |
| Logic Elements / Cells | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 |
| Speed Grade | -1 (slowest) | -1 | -3 (fastest) | -2 (mid) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Slowest speed grade (lowest cost) of FLEX 6000 EPF6024 family (vs EPF6024AQC208-3N)
- PQFP package offers easier hand-prototyping than BGA (vs EPF6024ABC256-2N (256-BGA))
- Established FLEX 6000 design tool flow (vs Newer Intel FPGA families (Cyclone, MAX II))
Notas de projeto
The EPF6024AQC208-1N is a SRAM-based FPGA — configuration is volatile and must be reloaded from an external EPC configuration PROM, a microcontroller, or a download cable at every power-up. Do not design a board that depends on the FPGA retaining state through power cycle without an external configuration source. Adding a JTAG header is strongly recommended for in-system re-programming during prototyping.
Place the EPF6024AQC208-1N's dedicated CONFIG_DONE, nSTATUS, nCONFIG, and DCLK pins with short traces to the configuration EPROM. Add 0.1 µF decoupling capacitors on every VCCIO/VCCINT pin pair, plus bulk 10-100 µF tantalums near the package. The 208-PQFP footprint requires fine-pitch surface-mount soldering; reflow profile must keep peak below 250 °C and follow JEDEC J-STD-020 MSL guidance for the device's moisture sensitivity level.
Operating temperature range for the EPF6024AQC208-1N is 0 °C to +85 °C commercial grade only. Industrial grade is not offered for the FLEX 6000 family — for industrial temperature (-40 °C to +85 °C) you must migrate to a different Intel FPGA family (Cyclone IV or newer). Always confirm ambient temperature before deploying this part in outdoor or industrial enclosures.
Informações de conformidade
RoHS/REACH status not explicitly stated in the verified web data. The 'N' suffix in EPF6024AQC208-1N typically denotes lead-free finish per industry ordering convention. AEC-Q100 is not applicable — FPGAs are not AEC-Q100 qualified at the chip level; qualification happens at the system module level.
