EPF6024AQC208-1N - FLEX 6000 FPGA 24K Gates 208-PQFP | Intel
Référence : EPF6024AQC208-1N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.4 | $324,00 |
| 100 | $26.8 | $2 680,00 |
| 500 | $22.1 | $11 050,00 |
| 1 000 | $18.75 | $18 750,00 |
EPF6024AQC208-1N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing — hence "field-programmable". FPGAs sit at the top of the programmable logic hierarchy: programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> SoC FPGAs. The FLEX 6000 family in particular was an early 1990s low-cost, high-volume SRAM-LUT architecture targeting glue logic, bus interface, and state-machine replacement, allowing fast design changes during prototyping without the NRE of an ASIC.
Key features of the EPF6024AQC208-1N include 196 LABs arranged across the chip fabric, 171 user I/O pins distributed on the periphery, JTAG-compliant boundary-scan test support (IEEE 1149.1), and SRAM-based configuration cells that must be reloaded at every power-up from an external configuration PROM or controller. The -1 speed grade is the slowest of the FLEX 6000 grade options (-1, -2, -3), trading timing margin for cost savings.
Architecturally the FLEX 6000 family uses a four-input Look-Up Table (LUT) per Logic Element, embedded array blocks, and continuous FastTrack interconnect. This LUT-based fabric is more flexible than older PAL/PLA gate-array hybrids and supports fully synchronous design via per-LAB carry chains and dedicated clock trees. The device is configured via the Altera MAX+PLUS II or Quartus development flows.
Typical applications include industrial control glue logic, telecommunications interface bridges, PCI bus controllers, prototyping platforms for ASIC emulation, and replacement of multiple discrete 74-series TTL packages on legacy boards. The wide 171-user-I/O count suits parallel bus aggregation tasks.
When designing with this part, remember the FLEX 6000 family is now obsolete (NRND/EOL) and current designs should consider Cyclone IV/V or MAX II CPLDs from Intel for new builds. Existing designs should keep spares on hand or migrate to the pin-compatible EPF6024AQC208-2 or -3 speed grades if timing closure is loose.
This page synthesizes distributor stock indicators, drop-in speed-grade alternatives, and 208-PQFP PCB layout guidance not found in the original FLEX 6000 datasheet — practical intelligence for engineers maintaining legacy designs in 2026.
Alternatives de remplacement direct pour EPF6024AQC208-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024AQC208-1N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Process Technology, Device Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024AQC208-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.4 / unité
Voir la fiche technique →EPF6024AQC208-3N
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →EPF6024ABC256-2N
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EPF6024AQC208-1N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Typical Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 171 |
| Number of I/O Pins | 171 |
| Boîtier | 208-BFQFP (Plastic Quad Flat Pack, PQFP) |
| Package Pin Count | 208 |
| Type de montage | Surface Mount |
| Tension d'alimentation | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 200 MHz |
| Température de fonctionnement | 0 °C to +85 °C (TJ) |
| Configuration Memory | SRAM (volatile, re-load required at power-up) |
| Speed Grade | -1 (slowest) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Programming Tools | Altera MAX+PLUS II / Quartus |
| Part Status | Obsolete |
Guide de configuration des broches du EPF6024AQC208-1N 208
Configuration des broches du EPF6024AQC208-1N (boîtier 208). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF6024AQC208-1N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF6024AQC208-1N convient pour 6 applications: Industrial Glue Logic Replacement, PCI Bus Interface Bridge, ASIC Emulation Platform, Telecommunications Interface Bridge, Legacy 74-series TTL Replacement, Prototyping & Design Verification Platform.
Industrial Glue Logic Replacement
The EPF6024AQC208-1N replaces banks of 74-series TTL/MSI logic on legacy industrial control boards. With 1,960 logic elements and 196 LABs, the FLEX 6000 fabric can absorb dozens of discrete AND/OR/latch/decoder functions into one device. The 171 user I/O count comfortably aggregates 24-32 bit parallel buses plus address decoding logic. Quartus/MAX+PLUS II synthesis makes timing closure straightforward at industrial 50-100 MHz clocks. Note: for new industrial designs, choose Intel Cyclone IV or MAX II for continued supply and lower BOM cost.
Recommandé
PCI Bus Interface Bridge
The EPF6024AQC208-1N is well-suited as a 33 MHz PCI 2.0 target/master bridge on legacy ISA/PCI motherboards. Its 4-input LUT fabric, dedicated carry chains, and 171 I/Os comfortably absorb the 49-signal PCI bus plus bus-arbitration glue and target-state registers. The 0.42 µm CMOS process supports 3.3 V PCI signaling directly without level translation. For 66 MHz PCI, choose the -3 speed grade instead. Modern replacement: Intel Cyclone IV EP4CE22F17 offers PCI IP cores and wider supply.
Recommandé
ASIC Emulation Platform
Use the EPF6024AQC208-1N as a multi-chip ASIC emulator for designs targeting 10K-20K gate equivalents. Designers partition the ASIC into the 24K-gate FLEX 6000 fabric and iterate HDL quickly in MAX+PLUS II before committing to mask. The 200 MHz internal Fmax supports pipelined datapath emulation. Re-programmability makes it ideal for FPGA prototyping boards. Modern alternatives like Cyclone IV GX provide higher logic density and embedded transceivers.
Recommandé
Telecommunications Interface Bridge
The EPF6024AQC208-1N bridges E1/T1 framers, HDLC controllers, and UART chains on telecom line cards. Its SRAM-based fabric supports in-system reconfiguration for protocol upgrades, while 171 I/Os aggregate multiple serial data streams and status LEDs. JTAG boundary-scan (IEEE 1149.1) simplifies board-level test. For new telecom designs, choose Intel Cyclone V with hard PCIe and transceivers.
Recommandé
Legacy 74-series TTL Replacement
Use the EPF6024AQC208-1N to replace 20-40 pieces of 74LS/74F/74HC logic on maintenance-grade legacy boards. One FLEX 6000 device replaces an entire inventory of AND/OR/flip-flop/decoder packages, reducing BOM and improving reliability. The 208-PQFP surface-mount footprint fits standard JEDEC land patterns. Engineers must verify operating temperature (0 °C to +85 °C) and ensure 3.3 V supply is available; level shifters may be needed for 5 V legacy logic.
Recommandé
Prototyping & Design Verification Platform
The EPF6024AQC208-1N serves as a re-programmable verification platform during ASIC development. Designers can download revised HDL each morning and verify in-system against real I/O before taping out. The 24K-gate capacity handles substantial state machines, FIFOs, and datapaths. SRAM configuration means a bad bit-stream simply reloads — no permanent damage. The -1 speed grade trades Fmax for cost; upgrade to -3 if your prototype exceeds 100 MHz.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024AQC208-1N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024AQC208-1 | EPF6024AQC208-3N | EPF6024ABC256-2N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 256-BGA |
| Logic Elements / Cells | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 |
| Speed Grade | -1 (slowest) | -1 | -3 (fastest) | -2 (mid) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Slowest speed grade (lowest cost) of FLEX 6000 EPF6024 family (vs EPF6024AQC208-3N)
- PQFP package offers easier hand-prototyping than BGA (vs EPF6024ABC256-2N (256-BGA))
- Established FLEX 6000 design tool flow (vs Newer Intel FPGA families (Cyclone, MAX II))
Notes de conception
The EPF6024AQC208-1N is a SRAM-based FPGA — configuration is volatile and must be reloaded from an external EPC configuration PROM, a microcontroller, or a download cable at every power-up. Do not design a board that depends on the FPGA retaining state through power cycle without an external configuration source. Adding a JTAG header is strongly recommended for in-system re-programming during prototyping.
Place the EPF6024AQC208-1N's dedicated CONFIG_DONE, nSTATUS, nCONFIG, and DCLK pins with short traces to the configuration EPROM. Add 0.1 µF decoupling capacitors on every VCCIO/VCCINT pin pair, plus bulk 10-100 µF tantalums near the package. The 208-PQFP footprint requires fine-pitch surface-mount soldering; reflow profile must keep peak below 250 °C and follow JEDEC J-STD-020 MSL guidance for the device's moisture sensitivity level.
Operating temperature range for the EPF6024AQC208-1N is 0 °C to +85 °C commercial grade only. Industrial grade is not offered for the FLEX 6000 family — for industrial temperature (-40 °C to +85 °C) you must migrate to a different Intel FPGA family (Cyclone IV or newer). Always confirm ambient temperature before deploying this part in outdoor or industrial enclosures.
Informations de conformité
RoHS/REACH status not explicitly stated in the verified web data. The 'N' suffix in EPF6024AQC208-1N typically denotes lead-free finish per industry ordering convention. AEC-Q100 is not applicable — FPGAs are not AEC-Q100 qualified at the chip level; qualification happens at the system module level.
