EPF6024AQC208-1N - FLEX 6000 FPGA 24K Gates 208-PQFP | Intel
부품 번호: EPF6024AQC208-1N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.4 | $324.00 |
| 100 | $26.8 | $2,680.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.75 | $18,750.00 |
EPF6024AQC208-1N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing — hence "field-programmable". FPGAs sit at the top of the programmable logic hierarchy: programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> SoC FPGAs. The FLEX 6000 family in particular was an early 1990s low-cost, high-volume SRAM-LUT architecture targeting glue logic, bus interface, and state-machine replacement, allowing fast design changes during prototyping without the NRE of an ASIC.
Key features of the EPF6024AQC208-1N include 196 LABs arranged across the chip fabric, 171 user I/O pins distributed on the periphery, JTAG-compliant boundary-scan test support (IEEE 1149.1), and SRAM-based configuration cells that must be reloaded at every power-up from an external configuration PROM or controller. The -1 speed grade is the slowest of the FLEX 6000 grade options (-1, -2, -3), trading timing margin for cost savings.
Architecturally the FLEX 6000 family uses a four-input Look-Up Table (LUT) per Logic Element, embedded array blocks, and continuous FastTrack interconnect. This LUT-based fabric is more flexible than older PAL/PLA gate-array hybrids and supports fully synchronous design via per-LAB carry chains and dedicated clock trees. The device is configured via the Altera MAX+PLUS II or Quartus development flows.
Typical applications include industrial control glue logic, telecommunications interface bridges, PCI bus controllers, prototyping platforms for ASIC emulation, and replacement of multiple discrete 74-series TTL packages on legacy boards. The wide 171-user-I/O count suits parallel bus aggregation tasks.
When designing with this part, remember the FLEX 6000 family is now obsolete (NRND/EOL) and current designs should consider Cyclone IV/V or MAX II CPLDs from Intel for new builds. Existing designs should keep spares on hand or migrate to the pin-compatible EPF6024AQC208-2 or -3 speed grades if timing closure is loose.
This page synthesizes distributor stock indicators, drop-in speed-grade alternatives, and 208-PQFP PCB layout guidance not found in the original FLEX 6000 datasheet — practical intelligence for engineers maintaining legacy designs in 2026.
드롭인 대체품: EPF6024AQC208-1N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6024AQC208-1N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Process Technology, Device Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6024AQC208-1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPF6024AQC208-3N
✅ 드롭인✓ 재고 있음
$23.9 / 개
데이터시트 보기 →EPF6024ABC256-2N
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →EPF6024AQC208-1N 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Typical Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 171 |
| Number of I/O Pins | 171 |
| 패키지 | 208-BFQFP (Plastic Quad Flat Pack, PQFP) |
| Package Pin Count | 208 |
| 실장 유형 | Surface Mount |
| 공급 전압 | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 200 MHz |
| 동작 온도 | 0 °C to +85 °C (TJ) |
| Configuration Memory | SRAM (volatile, re-load required at power-up) |
| Speed Grade | -1 (slowest) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Programming Tools | Altera MAX+PLUS II / Quartus |
| Part Status | Obsolete |
EPF6024AQC208-1N 208 핀 구성 가이드
EPF6024AQC208-1N(208 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF6024AQC208-1N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF6024AQC208-1N 적합 용도: 6 애플리케이션s: Industrial Glue Logic Replacement, PCI Bus Interface Bridge, ASIC Emulation Platform, Telecommunications Interface Bridge, Legacy 74-series TTL Replacement, Prototyping & Design Verification Platform.
Industrial Glue Logic Replacement
The EPF6024AQC208-1N replaces banks of 74-series TTL/MSI logic on legacy industrial control boards. With 1,960 logic elements and 196 LABs, the FLEX 6000 fabric can absorb dozens of discrete AND/OR/latch/decoder functions into one device. The 171 user I/O count comfortably aggregates 24-32 bit parallel buses plus address decoding logic. Quartus/MAX+PLUS II synthesis makes timing closure straightforward at industrial 50-100 MHz clocks. Note: for new industrial designs, choose Intel Cyclone IV or MAX II for continued supply and lower BOM cost.
추천
PCI Bus Interface Bridge
The EPF6024AQC208-1N is well-suited as a 33 MHz PCI 2.0 target/master bridge on legacy ISA/PCI motherboards. Its 4-input LUT fabric, dedicated carry chains, and 171 I/Os comfortably absorb the 49-signal PCI bus plus bus-arbitration glue and target-state registers. The 0.42 µm CMOS process supports 3.3 V PCI signaling directly without level translation. For 66 MHz PCI, choose the -3 speed grade instead. Modern replacement: Intel Cyclone IV EP4CE22F17 offers PCI IP cores and wider supply.
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ASIC Emulation Platform
Use the EPF6024AQC208-1N as a multi-chip ASIC emulator for designs targeting 10K-20K gate equivalents. Designers partition the ASIC into the 24K-gate FLEX 6000 fabric and iterate HDL quickly in MAX+PLUS II before committing to mask. The 200 MHz internal Fmax supports pipelined datapath emulation. Re-programmability makes it ideal for FPGA prototyping boards. Modern alternatives like Cyclone IV GX provide higher logic density and embedded transceivers.
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Telecommunications Interface Bridge
The EPF6024AQC208-1N bridges E1/T1 framers, HDLC controllers, and UART chains on telecom line cards. Its SRAM-based fabric supports in-system reconfiguration for protocol upgrades, while 171 I/Os aggregate multiple serial data streams and status LEDs. JTAG boundary-scan (IEEE 1149.1) simplifies board-level test. For new telecom designs, choose Intel Cyclone V with hard PCIe and transceivers.
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Legacy 74-series TTL Replacement
Use the EPF6024AQC208-1N to replace 20-40 pieces of 74LS/74F/74HC logic on maintenance-grade legacy boards. One FLEX 6000 device replaces an entire inventory of AND/OR/flip-flop/decoder packages, reducing BOM and improving reliability. The 208-PQFP surface-mount footprint fits standard JEDEC land patterns. Engineers must verify operating temperature (0 °C to +85 °C) and ensure 3.3 V supply is available; level shifters may be needed for 5 V legacy logic.
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Prototyping & Design Verification Platform
The EPF6024AQC208-1N serves as a re-programmable verification platform during ASIC development. Designers can download revised HDL each morning and verify in-system against real I/O before taping out. The 24K-gate capacity handles substantial state machines, FIFOs, and datapaths. SRAM configuration means a bad bit-stream simply reloads — no permanent damage. The -1 speed grade trades Fmax for cost; upgrade to -3 if your prototype exceeds 100 MHz.
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추천 제품 요약
엔지니어링 참조 데이터: EPF6024AQC208-1N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6024AQC208-1 | EPF6024AQC208-3N | EPF6024ABC256-2N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 256-BGA |
| Logic Elements / Cells | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 |
| Speed Grade | -1 (slowest) | -1 | -3 (fastest) | -2 (mid) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Slowest speed grade (lowest cost) of FLEX 6000 EPF6024 family (vs EPF6024AQC208-3N)
- PQFP package offers easier hand-prototyping than BGA (vs EPF6024ABC256-2N (256-BGA))
- Established FLEX 6000 design tool flow (vs Newer Intel FPGA families (Cyclone, MAX II))
설계 노트
The EPF6024AQC208-1N is a SRAM-based FPGA — configuration is volatile and must be reloaded from an external EPC configuration PROM, a microcontroller, or a download cable at every power-up. Do not design a board that depends on the FPGA retaining state through power cycle without an external configuration source. Adding a JTAG header is strongly recommended for in-system re-programming during prototyping.
Place the EPF6024AQC208-1N's dedicated CONFIG_DONE, nSTATUS, nCONFIG, and DCLK pins with short traces to the configuration EPROM. Add 0.1 µF decoupling capacitors on every VCCIO/VCCINT pin pair, plus bulk 10-100 µF tantalums near the package. The 208-PQFP footprint requires fine-pitch surface-mount soldering; reflow profile must keep peak below 250 °C and follow JEDEC J-STD-020 MSL guidance for the device's moisture sensitivity level.
Operating temperature range for the EPF6024AQC208-1N is 0 °C to +85 °C commercial grade only. Industrial grade is not offered for the FLEX 6000 family — for industrial temperature (-40 °C to +85 °C) you must migrate to a different Intel FPGA family (Cyclone IV or newer). Always confirm ambient temperature before deploying this part in outdoor or industrial enclosures.
규정 준수 정보
RoHS/REACH status not explicitly stated in the verified web data. The 'N' suffix in EPF6024AQC208-1N typically denotes lead-free finish per industry ordering convention. AEC-Q100 is not applicable — FPGAs are not AEC-Q100 qualified at the chip level; qualification happens at the system module level.
