EPF6024AQC240-4 - FLEX 6000 24K Gates FPGA, 240-PQFP | Altera
N.º da peça: EPF6024AQC240-4 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $85.5 | $855,00 |
| 100 | $76 | $7.600,00 |
| 500 | $68.4 | $34.200,00 |
| 1.000 | $61.75 | $61.750,00 |
EPF6024AQC240-4 Visão geral
A FLEX 6000 device is a CMOS SRAM-based programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of a programmable logic device. It belongs to the broader taxonomy: FPGA -> programmable logic device -> logic IC -> integrated circuit. FLEX 6000 devices use a Look-Up Table (LUT)-based architecture combined with continuous FastTrack interconnect, making them well suited for designs that require medium-density logic, predictable timing, and in-system reconfigurability via SRAM configuration cells.
Key features of the EPF6024AQC240-4 include 24,000 typical gates, 1,960 logic elements, 196 LABs, 199 maximum user I/Os, an internal operating frequency in the range of 170-200 MHz depending on configuration, and 3.3V core supply with 5V-tolerant I/O on selected banks. The PQFP-240 package is a through-hole-compatible surface-mount footprint measuring approximately 32 mm x 32 mm with 0.5 mm pitch, suitable for prototype boards and legacy designs.
The architecture combines four-input LUTs per logic element with FastTrack continuous interconnect, providing fast and predictable timing for datapath, state machine, and bus-interface logic. Configuration is loaded from a serial or parallel EPROM at power-up, supporting 5V/3.3V PCI and other common bus standards of the era.
Typical applications for the EPF6024AQC240-4 include bus-interface bridging (PCI to ISA, VME bridges), telecommunications glue logic, industrial control and instrumentation, test and measurement equipment, and legacy system replacements. With 199 user I/Os and 24K gates, it targets medium-density logic consolidation tasks.
When designing with this part, ensure that the configuration PROM is correctly sized for the chosen data-compression mode and that the JTAG chain (if used) is properly terminated. Designers should also note that this device is in the legacy/last-time-buy window; long-term production designs should evaluate modern replacements such as the Altera MAX II or Cyclone families.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Site MPN list, and practical design notes not found in the original datasheet PDF, providing AI-citable context for engineers migrating or maintaining FLEX 6000 designs.
Alternativas drop-in para EPF6024AQC240-4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024AQC240-4 (mesmo formato e footprint) — diferindo em Speed Grade, Package, Configuration Method, Operating Temperature, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024AQC240-3
✅ Drop-In✓ Em estoque
$19.8 / unidade
Ver ficha técnica →EPF6024AQC240-2
✅ Drop-In✓ Em estoque
$23.1 / unidade
Ver ficha técnica →EPF6024AQC240-1
✅ Drop-In✓ Em estoque
$18.95 / unidade
Ver ficha técnica →EPF6024AQC240-3N
✅ Drop-In✓ Em estoque
$69.3 / unidade
Ver ficha técnica →EPF6024AQC240-2N
✅ Drop-In✓ Em estoque
$26.1 / unidade
Ver ficha técnica →EPF6016AQC240-3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF6024AQC240-4 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Type | FPGA (SRAM-based) |
| Typical Gates | 24,000 |
| Logic Elements | 1,960 |
| LABs (Logic Array Blocks) | 196 |
| Maximum User I/Os | 199 |
| Speed Grade | -4 |
| Temperatura de operação | 0C to +70C (Commercial) |
| Supply Voltage (Core) | 3.3 V |
| Encapsulamento | PQFP-240 (240-pin) |
| Package Family | PQFP / QFP-240 (plastic) |
| Tipo de montagem | Surface Mount |
| Configuration Method | SRAM, serial or parallel EPROM |
Guia de Configuração de Pinos do EPF6024AQC240-4 pqfp / qfp-240 (plastic)
Configuração de pinos para EPF6024AQC240-4 (pacote pqfp / qfp-240 (plastic)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPF6024AQC240-4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPF6024AQC240-4 é adequado para 6 aplicaçãos: PCI-to-ISA Bus Bridge, Industrial Control Glue Logic, Telecommunications Backplane Logic, Test and Measurement Equipment, Legacy System Replacement Board, VMEbus Interface Controller.
PCI-to-ISA Bus Bridge
The EPF6024AQC240-4's 24K-gate density and 199 user I/Os make it ideal for PCI-to-ISA bus-bridging applications where a single device must handle the full 32-bit PCI bus plus the legacy ISA bus plus state-machine glue logic. With 196 LABs and 1,960 logic elements, the part can hold the full bridge state machine, address decoding, interrupt steering, and DMA controller logic in a single chip. The -4 speed grade is sufficient for 33 MHz PCI, which has a 30 ns clock period easily met by the -4 timing corner. Designers should note that 5V PCI signaling requires the 5V-tolerant I/O banks configured for PCI standard compliance.
Recomendado
Industrial Control Glue Logic
Industrial control systems frequently need to consolidate scattered 74-series glue logic into a single programmable device, and the EPF6024AQC240-4 fits this role with 24K gates of capacity and 199 I/Os to handle address decoding, bus arbitration, peripheral interfacing, and timing generation. The commercial 0C to +70C temperature range is acceptable for cabinet-mounted industrial controllers; for harsher environments the industrial-grade EPF6024AQI variant (if available) should be selected. The 3.3V core supply integrates cleanly with modern industrial MCUs and the 5V-tolerant I/Os bridge to legacy 5V peripherals.
Recomendado
Telecommunications Backplane Logic
The EPF6024AQC240-4 is well suited for telecommunications backplane interface logic where it must handle HDLC framing, time-slot assignment, clock distribution, and backplane arbitration across 199 user I/Os. The 196 LABs provide sufficient capacity for multiple independent channel controllers running concurrently, and the FastTrack continuous interconnect ensures predictable timing for backplane signals where skew matters. The -4 speed grade suits T1/E1 (1.544/2.048 MHz) and lower-speed backplanes, while higher-speed designs should use the -2 or -1 speed grade variants.
Recomendado
Test and Measurement Equipment
Test equipment such as logic analyzers, protocol testers, and bench instruments benefit from the EPF6024AQC240-4's combination of 199 I/Os and reprogrammable logic, allowing engineers to update instrument functionality via configuration bitstream changes without PCB rework. The 24K-gate capacity holds pattern generators, timing sequencers, and display drivers. JTAG (IEEE 1149.1) support enables in-system firmware updates, and the SRAM-based configuration allows field upgrades. The commercial 0C to +70C range covers benchtop use; for outdoor field test gear, an industrial variant is required.
Recomendado
Legacy System Replacement Board
For maintaining or replicating end-of-life systems originally built around the FLEX 6000 family, the EPF6024AQC240-4 serves as a drop-in replacement component for field repairs and manufacturing spares. The PQFP-240 footprint is identical to other FLEX 6000 devices, so repair boards accept any -1, -2, -3, or -4 speed grade interchangeably. Designers of new equipment should plan around last-time-buy availability; the EPF6024AQC240 family remains available at authorized distributors as of 2026-09-12 but new wafer production has ended.
Recomendado
VMEbus Interface Controller
The EPF6024AQC240-4 implements a complete VMEbus interface controller including address decoding, bus arbitration, interrupt handling, and block-transfer state machines within its 24K-gate density. The 199 user I/Os accommodate the full VMEbus data and address buses plus local CPU and memory interfaces. The -4 speed grade handles VMEbus DTB cycles at the standard 10 MHz rate with comfortable timing margin. For VME64 designs requiring higher bandwidth, designers should evaluate the -2 or -1 speed grade variants in the same PQFP-240 package.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024AQC240-4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024AQC240-3 | EPF6024AQC240-2 | EPF6024AQC240-1 | EPF6016AQC240-3 |
|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | PQFP-240 | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 (-33%) |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 (-33%) |
| LABs | 196 | 196 | 196 | 196 | 132 (-33%) |
| Speed Grade | -4 (slowest) | -3 | -2 | -1 (fastest) | -3 |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Family / Type | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) |
Principais diferenciais
- Lowest-cost speed grade in the FLEX 6000 PQFP-240 family (vs EPF6024AQC240-1)
- Higher logic density than the EPF6016 family (vs EPF6016AQC240-3)
- Same package enables design migration across speed grades (vs EPF6024AQC208-3)
Notas de projeto
The EPF6024AQC240-4 requires a clean 3.3V core supply with adequate decoupling: place one 0.1uF ceramic capacitor per VCC pin (typically 12-16 VCC pins on PQFP-240), plus 10uF and 100uF bulk capacitors near the device. Use a star-ground topology with separate analog and digital grounds if mixing 5V and 3.3V domains. Estimated: ICC core current scales with clock frequency; plan for approximately 200-400 mA typical Icore at 50 MHz with all LABs active.
Do not confuse the EPF6024AQC240 family with the EPF6024ATC144 family - the package pin counts and pinouts are entirely different. Verify the footprint matches PQFP-240 before PCB assembly. The PQFP-240 has a 32 mm body with 0.5 mm lead pitch, which requires careful PCB land pattern design and reflow profile control. Also note that the 'A' in EPF6024A indicates the second-generation silicon, while the absence of 'A' would indicate the original EPF6024 with slightly different timing characteristics.
PQFP-240 routing requires careful escape planning: the 0.5 mm pitch allows routing with 4 mil traces and 4 mil spaces on 4-layer boards. Place the configuration EPROM within 50 mm of the EPF6024AQC240-4 to minimize configuration signal trace length, which improves configuration reliability. Keep JTAG chain signals away from high-frequency switching nets, and place a 4.7k ohm pull-up on nCONFIG and a 4.7k ohm pull-down on nSTATUS per the FLEX 6000 configuration handbook.
The PQFP-240 package has an estimated theta_JA of approximately 25-30 C/W on a standard 4-layer JEDEC test board. Estimated: at 3.3V core and 400 mA ICC, internal power dissipation is approximately 1.3W, giving a junction temperature rise of 33-39 C above ambient. Ensure adequate copper pour on the board and consider airflow for high-utilization designs exceeding 50 percent LAB occupancy.
Informações de conformidade
EPF6024AQC240-4 RoHS and REACH compliance status was not present in the verified web data; standard (non-N suffix) FLEX 6000 devices were typically non-RoHS in the original launch era, but lead-free 'N' suffix variants are available within the family.
