EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
N.º da peça: EPF10K30EQC208-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.75 | $2.175,00 |
| 250 | $19.4 | $4.850,00 |
| 500 | $17.85 | $8.925,00 |
EPF10K30EQC208-2 Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design.
Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required.
Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM.
Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces.
When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support).
This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
Alternativas drop-in para EPF10K30EQC208-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30EQC208-2 (mesmo formato e footprint) — diferindo em Package, Process Technology, Family, Operating Temperature, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30EQC208-1
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →EPF10K30EQC208-1N
✅ Drop-In✓ Em estoque
$28.4 / unidade
Ver ficha técnica →EPF10K30EQC208-1X
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EPF10K30EQC208-2N
✅ Drop-In✓ Em estoque
$19.75 / unidade
Ver ficha técnica →EPF10K30AQC208-2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K30AQC208-1N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF10K30EQC208-2 Classificações máximas e características elétricas
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) |
| Embedded Memory (bits) | 24,576 |
| Maximum User I/O | 147 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -2 |
| Temperatura de operação | Commercial (0 °C to +70 °C) |
| Encapsulamento | 208-pin PQFP (Plastic Quad Flat Pack) |
| Package Dimensions | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | 200 MHz |
| Tipo de montagem | Surface Mount (gull-wing leads) |
| Programmability | SRAM-based, JTAG/ISP |
| Status RoHS | Non-compliant (legacy PQFP package) |
Configuração de pinos do EPF10K30EQC208-2
| Pino 1 | GND — Ground (per datasheet) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | VCCINT — Core supply voltage (2.5 V) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | GND — Ground (per datasheet) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | TDI — JTAG test data input |
| Pino 16 | TMS — JTAG test mode select |
| Pino 17 | TCK — JTAG test clock |
| Pino 18 | nSTATUS — Configuration status (open-drain) |
| Pino 19 | nCONFIG — Configuration control input (active-low) |
| Pino 20 | DCLK — Configuration clock |
| Pino 21 | DATA0 — Configuration data input |
| Pino 22 | nCE — Chip enable (active-low) |
| Pino 23 | MSEL0 — Configuration mode select 0 |
| Pino 24 | MSEL1 — Configuration mode select 1 |
| Pino 25 | VCCIO — I/O supply voltage |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | GND — Ground (per datasheet) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | VCCINT — Core supply voltage (2.5 V) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | I/O — User I/O pin (bank 2) |
| Pino 40 | I/O — User I/O pin (bank 2) |
| Pino 41 | I/O — User I/O pin (bank 2) |
| Pino 42 | GND — Ground (per datasheet) |
| Pino 43 | I/O — User I/O pin (bank 2) |
| Pino 44 | I/O — User I/O pin (bank 2) |
| Pino 45 | I/O — User I/O pin (bank 2) |
| Pino 46 | I/O — User I/O pin (bank 2) |
| Pino 47 | I/O — User I/O pin (bank 2) |
| Pino 48 | I/O — User I/O pin (bank 2) |
| Pino 49 | VCCIO — I/O supply voltage |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | GND — Ground (per datasheet) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 3) |
| Pino 59 | VCCINT — Core supply voltage (2.5 V) |
| Pino 60 | I/O — User I/O pin (bank 3) |
| Pino 61 | I/O — User I/O pin (bank 3) |
| Pino 62 | I/O — User I/O pin (bank 3) |
| Pino 63 | I/O — User I/O pin (bank 3) |
| Pino 64 | I/O — User I/O pin (bank 3) |
| Pino 65 | GND — Ground (per datasheet) |
| Pino 66 | I/O — User I/O pin (bank 3) |
| Pino 67 | I/O — User I/O pin (bank 3) |
| Pino 68 | I/O — User I/O pin (bank 3) |
| Pino 69 | I/O — User I/O pin (bank 3) |
| Pino 70 | I/O — User I/O pin (bank 3) |
| Pino 71 | I/O — User I/O pin (bank 3) |
| Pino 72 | VCCIO — I/O supply voltage |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | GND — Ground (per datasheet) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | VCCINT — Core supply voltage (2.5 V) |
| Pino 82 | I/O — User I/O pin (bank 4) |
| Pino 83 | I/O — User I/O pin (bank 4) |
| Pino 84 | I/O — User I/O pin (bank 4) |
| Pino 85 | I/O — User I/O pin (bank 4) |
| Pino 86 | I/O — User I/O pin (bank 4) |
| Pino 87 | GND — Ground (per datasheet) |
| Pino 88 | I/O — User I/O pin (bank 4) |
| Pino 89 | I/O — User I/O pin (bank 4) |
| Pino 90 | I/O — User I/O pin (bank 4) |
| Pino 91 | I/O — User I/O pin (bank 4) |
| Pino 92 | I/O — User I/O pin (bank 4) |
| Pino 93 | I/O — User I/O pin (bank 4) |
| Pino 94 | I/O — User I/O pin (bank 4) |
| Pino 95 | VCCIO — I/O supply voltage |
| Pino 96 | I/O — User I/O pin (bank 5) |
| Pino 97 | GND — Ground (per datasheet) |
| Pino 98 | I/O — User I/O pin (bank 5) |
| Pino 99 | I/O — User I/O pin (bank 5) |
| Pino 100 | I/O — User I/O pin (bank 5) |
| Pino 101 | I/O — User I/O pin (bank 5) |
| Pino 102 | I/O — User I/O pin (bank 5) |
| Pino 103 | VCCINT — Core supply voltage (2.5 V) |
| Pino 104 | I/O — User I/O pin (bank 5) |
| Pino 105 | I/O — User I/O pin (bank 5) |
| Pino 106 | I/O — User I/O pin (bank 5) |
| Pino 107 | I/O — User I/O pin (bank 5) |
| Pino 108 | I/O — User I/O pin (bank 5) |
| Pino 109 | GND — Ground (per datasheet) |
| Pino 110 | I/O — User I/O pin (bank 5) |
| Pino 111 | I/O — User I/O pin (bank 5) |
| Pino 112 | I/O — User I/O pin (bank 5) |
| Pino 113 | I/O — User I/O pin (bank 5) |
| Pino 114 | I/O — User I/O pin (bank 5) |
| Pino 115 | I/O — User I/O pin (bank 5) |
| Pino 116 | VCCIO — I/O supply voltage |
| Pino 117 | I/O — User I/O pin (bank 6) |
| Pino 118 | I/O — User I/O pin (bank 6) |
| Pino 119 | GND — Ground (per datasheet) |
| Pino 120 | I/O — User I/O pin (bank 6) |
| Pino 121 | I/O — User I/O pin (bank 6) |
| Pino 122 | I/O — User I/O pin (bank 6) |
| Pino 123 | I/O — User I/O pin (bank 6) |
| Pino 124 | I/O — User I/O pin (bank 6) |
| Pino 125 | VCCINT — Core supply voltage (2.5 V) |
| Pino 126 | I/O — User I/O pin (bank 6) |
| Pino 127 | I/O — User I/O pin (bank 6) |
| Pino 128 | I/O — User I/O pin (bank 6) |
| Pino 129 | I/O — User I/O pin (bank 6) |
| Pino 130 | I/O — User I/O pin (bank 6) |
| Pino 131 | GND — Ground (per datasheet) |
| Pino 132 | I/O — User I/O pin (bank 6) |
| Pino 133 | I/O — User I/O pin (bank 6) |
| Pino 134 | I/O — User I/O pin (bank 6) |
| Pino 135 | I/O — User I/O pin (bank 6) |
| Pino 136 | I/O — User I/O pin (bank 6) |
| Pino 137 | I/O — User I/O pin (bank 6) |
| Pino 138 | I/O — User I/O pin (bank 6) |
| Pino 139 | VCCIO — I/O supply voltage |
| Pino 140 | I/O — User I/O pin (bank 7) |
| Pino 141 | GND — Ground (per datasheet) |
| Pino 142 | I/O — User I/O pin (bank 7) |
| Pino 143 | I/O — User I/O pin (bank 7) |
| Pino 144 | I/O — User I/O pin (bank 7) |
| Pino 145 | I/O — User I/O pin (bank 7) |
| Pino 146 | I/O — User I/O pin (bank 7) |
| Pino 147 | VCCINT — Core supply voltage (2.5 V) |
| Pino 148 | I/O — User I/O pin (bank 7) |
| Pino 149 | I/O — User I/O pin (bank 7) |
| Pino 150 | I/O — User I/O pin (bank 7) |
| Pino 151 | I/O — User I/O pin (bank 7) |
| Pino 152 | I/O — User I/O pin (bank 7) |
| Pino 153 | GND — Ground (per datasheet) |
| Pino 154 | I/O — User I/O pin (bank 7) |
| Pino 155 | I/O — User I/O pin (bank 7) |
| Pino 156 | I/O — User I/O pin (bank 7) |
| Pino 157 | I/O — User I/O pin (bank 7) |
| Pino 158 | I/O — User I/O pin (bank 7) |
| Pino 159 | I/O — User I/O pin (bank 7) |
| Pino 160 | I/O — User I/O pin (bank 7) |
| Pino 161 | VCCIO — I/O supply voltage |
| Pino 162 | I/O — User I/O pin (bank 8) |
| Pino 163 | I/O — User I/O pin (bank 8) |
| Pino 164 | GND — Ground (per datasheet) |
| Pino 165 | I/O — User I/O pin (bank 8) |
| Pino 166 | I/O — User I/O pin (bank 8) |
| Pino 167 | I/O — User I/O pin (bank 8) |
| Pino 168 | I/O — User I/O pin (bank 8) |
| Pino 169 | I/O — User I/O pin (bank 8) |
| Pino 170 | VCCINT — Core supply voltage (2.5 V) |
| Pino 171 | I/O — User I/O pin (bank 8) |
| Pino 172 | I/O — User I/O pin (bank 8) |
| Pino 173 | I/O — User I/O pin (bank 8) |
| Pino 174 | I/O — User I/O pin (bank 8) |
| Pino 175 | I/O — User I/O pin (bank 8) |
| Pino 176 | GND — Ground (per datasheet) |
| Pino 177 | I/O — User I/O pin (bank 8) |
| Pino 178 | I/O — User I/O pin (bank 8) |
| Pino 179 | I/O — User I/O pin (bank 8) |
| Pino 180 | I/O — User I/O pin (bank 8) |
| Pino 181 | I/O — User I/O pin (bank 8) |
| Pino 182 | I/O — User I/O pin (bank 8) |
| Pino 183 | I/O — User I/O pin (bank 8) |
| Pino 184 | I/O — User I/O pin (bank 8) |
| Pino 185 | VCCIO — I/O supply voltage |
| Pino 186 | I/O — User I/O pin (bank 8) |
| Pino 187 | GND — Ground (per datasheet) |
| Pino 188 | I/O — User I/O pin (bank 8) |
| Pino 189 | I/O — User I/O pin (bank 8) |
| Pino 190 | I/O — User I/O pin (bank 8) |
| Pino 191 | I/O — User I/O pin (bank 8) |
| Pino 192 | I/O — User I/O pin (bank 8) |
| Pino 193 | VCCINT — Core supply voltage (2.5 V) |
| Pino 194 | I/O — User I/O pin (bank 8) |
| Pino 195 | I/O — User I/O pin (bank 8) |
| Pino 196 | I/O — User I/O pin (bank 8) |
| Pino 197 | I/O — User I/O pin (bank 8) |
| Pino 198 | I/O — User I/O pin (bank 8) |
| Pino 199 | GND — Ground (per datasheet) |
| Pino 200 | I/O — User I/O pin (bank 8) |
| Pino 201 | I/O — User I/O pin (bank 8) |
| Pino 202 | I/O — User I/O pin (bank 8) |
| Pino 203 | I/O — User I/O pin (bank 8) |
| Pino 204 | I/O — User I/O pin (bank 8) |
| Pino 205 | I/O — User I/O pin (bank 8) |
| Pino 206 | I/O — User I/O pin (bank 8) |
| Pino 207 | TDO — JTAG test data output |
| Pino 208 | DEV_CLRn — Device clear (active-low, optional) |
Aplicações típicas
EPF10K30EQC208-2 é adequado para 6 aplicaçãos: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge, Telecom Line-Card Interface Logic, ASIC Replacement Prototyping, Test & Measurement Front-End Controller, Avionics Legacy Retrofit.
Industrial Glue Logic Replacement
The EPF10K30EQC208-2 is well-suited to industrial glue-logic replacement because its 1,728 logic elements and 147 user I/O pins deliver enough capacity to consolidate multiple discrete PAL/GAL devices into a single reprogrammable part. In retrofit projects where a legacy control board must add a sensor interface or modify bus timing, the SRAM-based architecture lets the engineer iterate without respinning the PCB. The 2.5 V core supply and PQFP-208 footprint integrate directly into existing 5 V-tolerant I/O designs with proper level shifting. Compared to a fixed-function ASIC, the FLEX 10KE reduces NRE cost and lead time for low-volume industrial automation panels.
Recomendado
Legacy Peripheral Bus Bridge
With 147 user I/O pins and 216 LABs, the EPF10K30EQC208-2 can implement a complete ISA-to-PCI or parallel-port-to-LPC bridge on a single chip. The FLEX 10KE family supports up to 200 MHz internal operation, sufficient for legacy peripheral bus clocks in the 25–66 MHz range, while the embedded array blocks provide synchronous buffering for DMA transfers. The PQFP-208 footprint fits legacy through-hole board designs that cannot be reworked to fine-pitch BGAs. Per the FLEX 10KE datasheet, the 24 Kbits of embedded RAM are sufficient for small FIFO buffers between mismatched bus widths.
Recomendado
Telecom Line-Card Interface Logic
The EPF10K30EQC208-2 is commonly deployed in telecom line cards for T1/E1 framing, HDLC controllers, and time-slot interchangers where deterministic logic and moderate memory depth are required. The FLEX 10KE EABs implement synchronous FIFOs and elastic stores for backplane traffic shaping, while the 147 I/O pins handle parallel bus interfaces to network processors. The commercial temperature grade (0 °C to +70 °C) suits climate-controlled central-office environments. Designers leverage the SRAM-based programmability to update line-card firmware across hardware revisions without PCB changes.
Recomendado
ASIC Replacement Prototyping
The EPF10K30EQC208-2 serves as a prototyping vehicle for ASIC designs in the 10K–30K-gate density range, allowing functional verification before committing to mask costs. The FLEX 10KE pinout, JTAG chain, and Quartus II 13.0 toolchain support streamline RTL design entry, simulation, and timing closure. Engineers can validate bus protocols, state machines, and DSP datapaths against real I/O before tapeout. Compared to a fixed-function ASIC, this FPGA reduces time-to-market by 3–6 months for low-volume designs where ASIC NRE is not amortized.
Recomendado
Test & Measurement Front-End Controller
In test and measurement equipment, the EPF10K30EQC208-2 sequences relays, generates trigger pulses, and counts events on parallel buses thanks to its 200 MHz internal performance and 147 programmable I/O. The FLEX 10KE EABs hold calibration tables and waveform descriptors, while the LABs implement state machines for sweep generators. The PQFP-208 footprint is large enough to host hand-routed prototypes during bench characterization. The SRAM-based architecture lets firmware engineers adjust test sequences without respinning the controller PCB.
Recomendado
Avionics Legacy Retrofit
Although commercial-grade, the EPF10K30EQC208-2 is also used in retrofitting legacy avionics subsystems where existing harness and connector designs dictate PQFP-208 retention. The 30,000-gate capacity is sufficient for ARINC 429 bus controllers, discrete I/O expansion, and MIL-STD-1553 monitoring interfaces in flight-line test sets. Engineers appreciate the JTAG/ISP capability for in-circuit firmware updates during depot-level maintenance. The obsolete lifecycle means designers typically pair it with a long-term inventory contract from authorized distributors.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30EQC208-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30EQC208-1 | EPF10K30EQC208-1N | EPF10K30EQC208-2N | EPF10K30AQC208-2 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (30.6×30.6 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KA | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (bits) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | Distributed RAM only (no EAB) | Distributed RAM only (no EAB) |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -2 (faster) | -1 (slower) | -1 (slower) | -2 (faster) | -2 | -1 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Pb-free (RoHS) | Pb-free (RoHS) | Non-RoHS (SnPb) | Pb-free (RoHS) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Only FLEX 10KE family option at -2 speed grade in the 208-PQFP footprint (vs EPF10K30EQC208-1)
- Includes EAB-based synchronous embedded memory (vs EPF10K30AQC208-2 (FLEX 10KA family))
- Compatible with Quartus II 13.0 (last FLEX 10KE-supported release) (vs Newer Cyclone II/III families)
Notas de projeto
Estimated: at 200 MHz toggle activity across 50% of LEs (approximately 864 LEs active) with 3.3 V VCCIO, the EPF10K30EQC208-2 can draw up to 0.5 A from VCCINT (2.5 V) and 0.3 A from VCCIO, giving roughly 2.25 W total dissipation. For new designs use a 1 A / 5 V-tolerant LDO regulator on VCCINT and bulk decoupling of at least 100 µF plus 0.1 µF ceramic per VCCINT/VCCIO pin pair. The 208-PQFP package has no thermal pad; airflow across the package or a small clip-on heatsink is recommended for sustained high-activity operation above 70 °C ambient.
Route all VCCINT (2.5 V) and VCCIO (3.3 V or 5 V tolerant) power pins to planes rather than traces; the 208-PQFP lead inductance of the gull-wing leads (about 1 nH each) creates significant switching noise if power is delivered through traces. Place 0.1 µF X7R ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a 10 µF tantalum bulk capacitor per voltage rail. JTAG signals (TCK, TMS, TDI, TDO) should be series-terminated with 33 Ω resistors and length-matched to within 50 mil to avoid boundary-scan failures at higher TCK frequencies.
Do not assume any FLEX 10KE variant is RoHS compliant - the trailing '-N' suffix is required for Pb-free terminal finish. Mixing Pb-free -2N parts with SnPb -2 parts on the same board violates the higher-temperature reflow profile required by Pb-free finishes. Also note that the configuration device must match the FPGA density: EPC2LC20 supports FLEX 10KE up to 30K gates; larger densities require EPC4 or EPC8. Finally, the MSEL pins select configuration mode (AS, AP, PS, JTAG) and must be pulled to VCCINT or GND with 4.7 kΩ resistors - leaving them floating causes configuration failures.
Informações de conformidade
Original EPF10K30EQC208-2 is SnPb terminal finish (non-RoHS); RoHS-compliant variants use the trailing '-N' suffix (EPF10K30EQC208-2N). Not AEC-Q100 qualified. Halogen-free status not stated in available datasheet excerpts. REACH compliance assumed per Intel product environmental program; conflict-minerals declaration available from Intel.