EPF6024ATC1442 - FLEX 6000 FPGA, 24K Gates, 144-LQFP | Altera
N.º da peça: EPF6024ATC1442 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58 | $580,00 |
| 100 | $49.5 | $4.950,00 |
| 500 | $42 | $21.000,00 |
| 1.000 | $37.25 | $37.250,00 |
EPF6024ATC1442 Visão geral
A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) family that uses look-up tables (LUTs), programmable interconnect, and configurable I/O cells to implement arbitrary digital logic after fabrication. Within the broader semiconductor taxonomy, an FPGA sits below ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices) as a flexible, reprogrammable alternative, and is widely used for glue logic, bus bridging, prototyping, low-volume ASIC replacement, and parallel DSP pipelines.
Key specifications include 24,000 system gates, 1,960 logic cells, 117 user I/Os, 196 LABs (logic array blocks), 3.3 V VCCINT, 0.42 um process geometry, 166.67 MHz internal performance, and TQFP-144 surface-mount packaging. The ATC speed grade balances timing margin and cost for industrial-grade designs, while the -2 suffix denotes a specific speed/operating-condition bin per Altera's legacy FLEX 6000 ordering scheme.
Architecturally, the EPF6024ATC1442 uses a SRAM-based configuration cell that must be loaded at every power-up from an external serial or parallel configuration device (such as the EPC2 or EPC8). The 0.42 um CMOS process provides a balance of density and low static power, while the 117 general-purpose I/Os support LVTTL and LVCMOS standards with user-programmable drive strength and slew rate. Embedded array blocks (EABs) provide efficient on-chip RAM and ROM for FIFO and lookup-table implementations, supplementing the distributed logic-element memory.
Typical applications include industrial control and instrumentation, telecom line-card glue logic, legacy PCI/ISA bus bridges, motor-control and factory-automation boards, and cost-sensitive prototyping platforms that still require the flexibility of programmable logic. The 144-pin LQFP footprint is hand-solderable, making the device friendly for prototype rework and low-volume production.
When designing with this part, plan for an external configuration memory and a JTAG chain (IEEE 1149.1) for in-system programming and boundary-scan test. Decouple VCCINT (3.3 V) and VCCIO (per I/O bank) close to the package with 0.1 uF ceramic capacitors, and respect the FLEX 6000 device family power-up sequencing to avoid partial-configuration latch-up.
This page synthesizes distributor pricing, FLEX 6000 family alternatives, and practical design notes not found in the manufacturer datasheet alone - it is built to answer both purchasing and engineering questions for engineers evaluating EPF6024ATC1442 against modern FPGA replacements.
Alternativas drop-in para EPF6024ATC1442 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024ATC1442 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Operating Temperature, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024ATC144-2
✅ Drop-In✓ Em estoque
$24.95 / unidade
Ver ficha técnica →EPF6024ATC144-1
✅ Drop-In✓ Em estoque
$8.2 / unidade
Ver ficha técnica →EPF6024ATC144-3
✅ Drop-In✓ Em estoque
$14.1 / unidade
Ver ficha técnica →EPF6024ATC144-10
✅ Drop-In✓ Em estoque
$11.1 / unidade
Ver ficha técnica →EPF6016ATC144-2
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EPF6010ATC144-2
✅ Drop-In✓ Em estoque
$14.95 / unidade
Ver ficha técnica →EPF6024ATC1442 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| System Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| Embedded Array Blocks (EABs) | Yes (number of EABs not stated in provided web snippets) |
| Maximum User I/O | 117 |
| Core Supply Voltage (VCCINT) | 3.3 V |
| Process Technology | 0.42 um CMOS |
| Internal Clock Frequency (max) | 166.67 MHz |
| Speed Grade | ATC (industrial, -2 bin) |
| Encapsulamento | 144-pin LQFP (TQFP-144) |
| Tipo de montagem | Surface Mount |
| Configuration Method | SRAM, requires external configuration device (e.g., EPC2/EPC8) |
| JTAG Support | IEEE 1149.1 boundary-scan (per FLEX 6000 family) |
Configuração de pinos do EPF6024ATC1442
| Pino 1 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 2 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 3 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 4 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 5 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 6 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 7 | VCCINT — Core supply voltage, 3.3 V |
| Pino 8 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 9 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 10 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 13 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 14 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 15 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 16 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 17 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 18 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 19 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 20 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 21 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 22 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 23 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 24 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 25 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 26 | VCCIO1 — I/O supply voltage, bank 1 |
| Pino 27 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 28 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 29 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 30 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 31 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 32 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 33 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 34 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 35 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 36 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 37 | GND — Ground |
| Pino 38 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 39 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 40 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 41 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 42 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 43 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 44 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 45 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 46 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 47 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 48 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 49 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 50 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 51 | VCCIO2 — I/O supply voltage, bank 2 |
| Pino 52 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 53 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 54 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 55 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 56 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 57 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 58 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 59 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 60 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 61 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 62 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Pino 63 | GND — Ground |
| Pino 64 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 65 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 66 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 67 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 68 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 69 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 70 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 71 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 72 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 73 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 74 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 75 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 76 | VCCIO3 — I/O supply voltage, bank 3 |
| Pino 77 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 78 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 79 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 80 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 81 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 82 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 83 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 84 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 85 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 86 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 87 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 88 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Pino 89 | GND — Ground |
| Pino 90 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 91 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 92 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 93 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 94 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 95 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 96 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 97 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 98 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 99 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 100 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 101 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 102 | VCCIO4 — I/O supply voltage, bank 4 |
| Pino 103 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 104 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 105 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 106 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 107 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 108 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 109 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 110 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 111 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 112 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 113 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 114 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 115 | GND — Ground |
| Pino 116 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 117 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 118 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 119 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 120 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Pino 121 | nCONFIG — Configuration control (active-low) |
| Pino 122 | nSTATUS — Configuration status (active-low) |
| Pino 123 | DCLK — Configuration clock input |
| Pino 124 | DATA0 — Configuration data input |
| Pino 125 | CONF_DONE — Configuration done (open-drain) |
| Pino 126 | MSEL0 — Configuration mode select |
| Pino 127 | MSEL1 — Configuration mode select |
| Pino 128 | TDI — JTAG test data input (IEEE 1149.1) |
| Pino 129 | TMS — JTAG test mode select (IEEE 1149.1) |
| Pino 130 | TCK — JTAG test clock (IEEE 1149.1) |
| Pino 131 | TDO — JTAG test data output (IEEE 1149.1) |
| Pino 132 | VCCINT — Core supply voltage, 3.3 V |
| Pino 133 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 134 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 135 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 136 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 137 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 138 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 139 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 140 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 141 | GND — Ground |
| Pino 142 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 143 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Pino 144 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
Aplicações típicas
EPF6024ATC1442 é adequado para 6 aplicaçãos: Industrial Control and Instrumentation, Telecom Line-Card Glue Logic, Legacy PCI / ISA Bus Bridges, Motor Control and Factory Automation, Low-Volume ASIC Replacement, Prototyping and Educational Platforms.
Industrial Control and Instrumentation
The EPF6024ATC1442 fits industrial control and instrumentation due to its 24K-gate density, 117 user I/Os, and 166.67 MHz internal performance - enough to integrate encoder counters, PWM generators, and bus bridges in a single chip. Its 0.42 um CMOS core draws relatively low quiescent current and tolerates 3.3 V supply rails commonly found on PLC backplanes and CNC machine controllers. The TQFP-144 package is hand-solder-friendly, easing prototype rework during factory-floor qualification.
Recomendado
Telecom Line-Card Glue Logic
EPF6024ATC1442 serves well as line-card glue logic in telecom systems, performing bus arbitration, address decoding, and protocol conversion between TDM framers, network processors, and backplane SERDES. Its 117 I/Os comfortably handle address/data multiplexing for legacy H.110 or H-MVIP buses, while the 166.67 MHz internal clock supports 8-bit/16-bit datapath glue at typical telecom frequencies. The 144-LQFP footprint also fits legacy PCI/PMC card area constraints.
Recomendado
Legacy PCI / ISA Bus Bridges
EPF6024ATC1442 is widely deployed in legacy PCI / ISA bridge designs where it implements target/initiator state machines, address decoding, and interrupt routing. The 24K gates are sufficient for a typical 32-bit PCI target with DMA support, while the 117 I/Os leave headroom for ISA bus and side-band signals. Designers can preserve legacy motherboard layouts because the 144-LQFP footprint is compatible with the same land pattern used by many older glue-logic FPGAs.
Recomendado
Motor Control and Factory Automation
In motor control and factory automation, EPF6024ATC1442 acts as the central logic hub for sensor feedback decoding, PWM generation, and fieldbus protocol termination. The 166.67 MHz internal clock supports deterministic sampling of quadrature encoders and sigma-delta modulator data, while the 117 I/Os allow direct connection to multi-axis stepper/servo drivers. The industrial ATC speed grade is rated for typical factory-floor ambient conditions.
Recomendado
Low-Volume ASIC Replacement
EPF6024ATC1442 is a cost-effective solution for low-volume ASIC replacement when NRE costs of an ASIC are prohibitive. With 24K gates it can absorb moderate-complexity glue-logic, peripheral controllers, or custom interfaces, while the SRAM-based configuration enables last-minute design revisions without re-spinning silicon. The 144-LQFP package is broadly second-sourced and stocked in the broker/legacy channels, easing long-tail lifecycle concerns.
Recomendado
Prototyping and Educational Platforms
Educational labs and prototyping boards have used EPF6024ATC1442 to teach digital design, bus protocols, and configuration flows. Its TQFP-144 footprint fits 0.5 mm-pitch breadboard adapters, making it practical for hand-soldered student projects. The Quartus II Web Edition toolchain (legacy) supports the part free of charge, and a wealth of reference designs from the FLEX 6000 family remain available in Altera's documentation archive.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024ATC1442 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024ATC144-2 | EPF6024ATC144-1 | EPF6024ATC144-3 | EPF6024ATC144-10 | EPF6016ATC144-2 | EPF6010ATC144-2 |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP-144) | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | ~1,320 | ~880 |
| System Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 | 10,000 |
| Speed Grade | -2 (ATC) | -2 (ATC) | -1 (slower) | -3 (faster) | -10 (extended temp option) | -2 (ATC) | -2 (ATC) |
| Maximum User I/O | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Maximum density in FLEX 6000 family within the 144-LQFP footprint (vs EPF6016ATC144-2)
- ATC industrial speed grade (-2 bin) balances timing margin and cost (vs EPF6024ATC144-1)
- 144-LQFP package is hand-solder-friendly versus PQFP/BGA alternatives (vs EPF6024AQI240-2)
- Higher 166.67 MHz internal performance for glue-logic timing closure (vs EPF6024ATC144-10)
Notas de projeto
EPF6024ATC1442 requires a clean 3.3 V VCCINT rail; place a 0.1 uF ceramic decoupling capacitor close to every VCCINT pin and a bulk 10-47 uF tantalum or polymer capacitor at the board's 3.3 V entry. VCCIO is configured per bank - if your design mixes 3.3 V and 5 V peripherals, plan for two independent VCCIO rails (banks 1/4 at 3.3 V, banks 2/3 at 5 V, for example) and isolate them with ferrite beads. Power-up sequencing per the FLEX 6000 datasheet must hold the device in reset until VCCINT and VCCIO are stable to avoid partial-configuration latch-up.
For the 144-LQFP (0.5 mm pitch) footprint, use 0.127 mm (5 mil) traces with 0.2 mm (8 mil) spacing on outer layers and a 4-layer stack-up with continuous VCCINT/GND planes for the inner layers. Place the EPC2/EPC8 configuration PROM within 5 cm of the FLEX 6000 device to keep the DCLK/Data0 traces short and matched; long configuration traces are a common source of intermittent configuration failures. Reserve a 4-pin header for JTAG (TDI, TMS, TCK, TDO) on the PCB for boundary-scan and ISP programming.
The most common pitfalls with EPF6024ATC1442 designs are: (1) confusing 'EPF6024ATC1442' with the dash-form 'EPF6024ATC144-2' (they are the same part - confirm with your distributor); (2) omitting the external configuration PROM and assuming the device retains its pattern after power-down (it does not - FLEX 6000 is SRAM-based); (3) using an EPC1 instead of EPC2/EPC8 for larger FLEX 6000 bitstreams (EPC1 is too small for EPF6024ATC1442); (4) leaving CONF_DONE floating (it is open-drain and must be pulled high); (5) choosing an EPF6024AQI240 variant when the PCB was laid out for 144-LQFP (240-pin PQFP requires re-spinning the board).
Informações de conformidade
Compliance information (RoHS, REACH, lead-free, halogen-free) was not present in the Verified Web Data snippets; values set to 'unknown' until confirmed against the Altera/Intel material declaration. AEC-Q100 is not applicable - this is an FPGA, not an automotive-qualified analog IC. Designers should request the latest material declaration from the supplier when compliance is required.