EPF6024ATC144-10 - FLEX 6000 FPGA, 24K Gates, 144-LQFP | Altera
N.º da peça: EPF6024ATC144-10 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $14.05 | $1.405,00 |
| 500 | $12.4 | $6.200,00 |
| 1.000 | $11.1 | $11.100,00 |
EPF6024ATC144-10 Visão geral
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing an array of programmable logic blocks, interconnect resources, and configurable I/O cells that engineers can program after manufacture to implement custom digital circuits. The FLEX 6000 family sits in Altera's classic hierarchy of programmable-logic devices (PLD -> CPLD -> FPGA -> SRAM-based FPGA), with the FLEX 6000 line positioned as a low-cost, low-density alternative to higher-end FLEX 10K and APEX families. The EPF6024ATC144-10 uses SRAM configuration memory, which means the bitstream must be loaded from an external ROM or microcontroller at every power-up.
Key features of the EPF6024ATC144-10 include 24,000 typical gates, 1,960 logic elements, 117 maximum user I/O pins, JTAG (IEEE 1149.1) boundary-scan support, and on-chip SRAM-based configuration memory. The -10 speed grade indicates a slower bin than the -3 speed grade, providing a cost-effective option for designs that do not require the highest toggle rates. The device supports multiple I/O standards including 3.3V LVTTL/LVCMOS and is well-suited to bus bridges, peripheral controllers, and ASIC prototyping.
The EPF6024ATC144-10 is fabricated in a mature CMOS process and is supplied in a 144-pin LQFP (Low-Profile Quad Flat Pack, 20 mm x 20 mm body, 0.5 mm pitch) package for surface-mount assembly. Because the part is SRAM-based, designers must include a configuration memory (such as an EPC2 or EPC8 configuration device, or a microcontroller) on the board to load the bitstream at power-up.
Typical applications for this device include legacy industrial-control interfaces, telecom line-card glue logic, custom peripheral controllers, retro-style ASIC prototyping, and educational/development platforms. Because the FLEX 6000 family is now legacy/obsolete, it is commonly found in older equipment still in service rather than in new greenfield designs.
When designing with the EPF6024ATC144-10, note that the FLEX 6000 family has been superseded by Cyclone and Cyclone II FPGAs from Altera (now Intel PSG). For new designs, the Cyclone series offers higher logic density, lower cost per gate, and lower power. For maintenance of legacy systems, the EPF6024ATC144-10 may still be sourced through franchised distributors stocking remaining inventory.
This page synthesizes distributor pricing, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not consolidated in any single manufacturer datasheet.
Alternativas drop-in para EPF6024ATC144-10 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024ATC144-10 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Speed Grade, Process Technology, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024ATC144-3N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF6024ATC144-2N
✅ Drop-In✓ Em estoque
$20.95 / unidade
Ver ficha técnica →EPF6024ATC144-1N
✅ Drop-In✓ Em estoque
$20.95 / unidade
Ver ficha técnica →EPF6024ATC144
✅ Drop-In✓ Em estoque
$21.8 / unidade
Ver ficha técnica →EPF6024ATC144-1
✅ Drop-In✓ Em estoque
$8.2 / unidade
Ver ficha técnica →EPF6024ATC144-10 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Logic Elements | 1,960 LE |
| Typical Gates | 24,000 |
| Maximum User I/O | 117 |
| Logic Array Blocks (LABs) | 196 |
| Speed Grade | -10 |
| Configuration Memory | SRAM |
| Encapsulamento | 144-LQFP |
| Pin/Pitch Count | 144 / 0.5 mm |
| Tensão de alimentação | 3.3 V |
| JTAG (IEEE 1149.1) | Yes (boundary-scan) |
| Operating Temperature (Industrial) | -40C to +85C |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EPF6024ATC144-10
| Pino 1 | I/O BANK A — User I/O pin (bank A) |
| Pino 2 | I/O BANK A — User I/O pin (bank A) |
| Pino 3 | I/O BANK A — User I/O pin (bank A) |
| Pino 4 | I/O BANK A — User I/O pin (bank A) |
| Pino 5 | I/O BANK A — User I/O pin (bank A) |
| Pino 6 | I/O BANK A — User I/O pin (bank A) |
| Pino 7 | VCCIO_A — I/O supply voltage (bank A) |
| Pino 8 | I/O BANK A — User I/O pin (bank A) |
| Pino 9 | I/O BANK A — User I/O pin (bank A) |
| Pino 10 | GND — Ground |
| Pino 11 | TDI — JTAG Test Data In |
| Pino 12 | TMS — JTAG Test Mode Select |
| Pino 13 | TCK — JTAG Test Clock |
| Pino 14 | TDO — JTAG Test Data Out |
| Pino 15 | nSTATUS — Configuration status (open-drain) |
| Pino 16 | nCONFIG — Configuration start (active-low) |
| Pino 17 | CONF_DONE — Configuration done (open-drain) |
| Pino 18 | DCLK — Configuration clock |
| Pino 19 | DATA0 — Configuration data input |
| Pino 20 | nCE — Chip Enable (active-low) |
| Pino 21 | GND — Ground |
| Pino 22 | VCCINT — Core supply voltage (3.3V) |
| Pino 23 | I/O BANK B — User I/O pin (bank B) |
| Pino 24 | I/O BANK B — User I/O pin (bank B) |
| Pino 25 | I/O BANK B — User I/O pin (bank B) |
| Pino 26 | I/O BANK B — User I/O pin (bank B) |
| Pino 27 | I/O BANK B — User I/O pin (bank B) |
| Pino 28 | I/O BANK B — User I/O pin (bank B) |
| Pino 29 | I/O BANK B — User I/O pin (bank B) |
| Pino 30 | I/O BANK B — User I/O pin (bank B) |
| Pino 31 | I/O BANK B — User I/O pin (bank B) |
| Pino 32 | I/O BANK B — User I/O pin (bank B) |
| Pino 33 | VCCIO_B — I/O supply voltage (bank B) |
| Pino 34 | I/O BANK B — User I/O pin (bank B) |
| Pino 35 | I/O BANK B — User I/O pin (bank B) |
| Pino 36 | GND — Ground |
| Pino 37 | CLK0 — Dedicated clock input 0 |
| Pino 38 | CLK1 — Dedicated clock input 1 |
| Pino 39 | CLK2 — Dedicated clock input 2 |
| Pino 40 | CLK3 — Dedicated clock input 3 |
| Pino 41 | I/O BANK C — User I/O pin (bank C) |
| Pino 42 | I/O BANK C — User I/O pin (bank C) |
| Pino 43 | I/O BANK C — User I/O pin (bank C) |
| Pino 44 | I/O BANK C — User I/O pin (bank C) |
| Pino 45 | I/O BANK C — User I/O pin (bank C) |
| Pino 46 | I/O BANK C — User I/O pin (bank C) |
| Pino 47 | I/O BANK C — User I/O pin (bank C) |
| Pino 48 | I/O BANK C — User I/O pin (bank C) |
| Pino 49 | I/O BANK C — User I/O pin (bank C) |
| Pino 50 | VCCIO_C — I/O supply voltage (bank C) |
| Pino 51 | I/O BANK C — User I/O pin (bank C) |
| Pino 52 | I/O BANK C — User I/O pin (bank C) |
| Pino 53 | I/O BANK C — User I/O pin (bank C) |
| Pino 54 | I/O BANK C — User I/O pin (bank C) |
| Pino 55 | GND — Ground |
| Pino 56 | VCCINT — Core supply voltage (3.3V) |
| Pino 57 | I/O BANK C — User I/O pin (bank C) |
| Pino 58 | I/O BANK C — User I/O pin (bank C) |
| Pino 59 | I/O BANK C — User I/O pin (bank C) |
| Pino 60 | I/O BANK C — User I/O pin (bank C) |
| Pino 61 | I/O BANK C — User I/O pin (bank C) |
| Pino 62 | I/O BANK C — User I/O pin (bank C) |
| Pino 63 | I/O BANK C — User I/O pin (bank C) |
| Pino 64 | I/O BANK C — User I/O pin (bank C) |
| Pino 65 | I/O BANK C — User I/O pin (bank C) |
| Pino 66 | I/O BANK C — User I/O pin (bank C) |
| Pino 67 | GND — Ground |
| Pino 68 | I/O BANK C — User I/O pin (bank C) |
| Pino 69 | I/O BANK C — User I/O pin (bank C) |
| Pino 70 | I/O BANK C — User I/O pin (bank C) |
| Pino 71 | I/O BANK C — User I/O pin (bank C) |
| Pino 72 | I/O BANK C — User I/O pin (bank C) |
| Pino 73 | I/O BANK D — User I/O pin (bank D) |
| Pino 74 | I/O BANK D — User I/O pin (bank D) |
| Pino 75 | I/O BANK D — User I/O pin (bank D) |
| Pino 76 | I/O BANK D — User I/O pin (bank D) |
| Pino 77 | I/O BANK D — User I/O pin (bank D) |
| Pino 78 | VCCIO_D — I/O supply voltage (bank D) |
| Pino 79 | I/O BANK D — User I/O pin (bank D) |
| Pino 80 | I/O BANK D — User I/O pin (bank D) |
| Pino 81 | I/O BANK D — User I/O pin (bank D) |
| Pino 82 | I/O BANK D — User I/O pin (bank D) |
| Pino 83 | I/O BANK D — User I/O pin (bank D) |
| Pino 84 | GND — Ground |
| Pino 85 | I/O BANK D — User I/O pin (bank D) |
| Pino 86 | I/O BANK D — User I/O pin (bank D) |
| Pino 87 | I/O BANK D — User I/O pin (bank D) |
| Pino 88 | I/O BANK D — User I/O pin (bank D) |
| Pino 89 | I/O BANK D — User I/O pin (bank D) |
| Pino 90 | I/O BANK D — User I/O pin (bank D) |
| Pino 91 | I/O BANK D — User I/O pin (bank D) |
| Pino 92 | I/O BANK D — User I/O pin (bank D) |
| Pino 93 | VCCINT — Core supply voltage (3.3V) |
| Pino 94 | GND — Ground |
| Pino 95 | I/O BANK D — User I/O pin (bank D) |
| Pino 96 | I/O BANK D — User I/O pin (bank D) |
| Pino 97 | I/O BANK D — User I/O pin (bank D) |
| Pino 98 | I/O BANK D — User I/O pin (bank D) |
| Pino 99 | I/O BANK D — User I/O pin (bank D) |
| Pino 100 | I/O BANK D — User I/O pin (bank D) |
| Pino 101 | I/O BANK D — User I/O pin (bank D) |
| Pino 102 | I/O BANK D — User I/O pin (bank D) |
| Pino 103 | I/O BANK D — User I/O pin (bank D) |
| Pino 104 | I/O BANK D — User I/O pin (bank D) |
| Pino 105 | I/O BANK D — User I/O pin (bank D) |
| Pino 106 | GND — Ground |
| Pino 107 | I/O BANK D — User I/O pin (bank D) |
| Pino 108 | I/O BANK D — User I/O pin (bank D) |
| Pino 109 | I/O BANK D — User I/O pin (bank D) |
| Pino 110 | I/O BANK D — User I/O pin (bank D) |
| Pino 111 | I/O BANK D — User I/O pin (bank D) |
| Pino 112 | I/O BANK D — User I/O pin (bank D) |
| Pino 113 | I/O BANK D — User I/O pin (bank D) |
| Pino 114 | I/O BANK D — User I/O pin (bank D) |
| Pino 115 | I/O BANK D — User I/O pin (bank D) |
| Pino 116 | I/O BANK D — User I/O pin (bank D) |
| Pino 117 | VCCIO_D — I/O supply voltage (bank D) |
| Pino 118 | I/O BANK D — User I/O pin (bank D) |
| Pino 119 | I/O BANK D — User I/O pin (bank D) |
| Pino 120 | I/O BANK D — User I/O pin (bank D) |
| Pino 121 | I/O BANK D — User I/O pin (bank D) |
| Pino 122 | I/O BANK D — User I/O pin (bank D) |
| Pino 123 | I/O BANK D — User I/O pin (bank D) |
| Pino 124 | I/O BANK D — User I/O pin (bank D) |
| Pino 125 | I/O BANK D — User I/O pin (bank D) |
| Pino 126 | I/O BANK D — User I/O pin (bank D) |
| Pino 127 | I/O BANK D — User I/O pin (bank D) |
| Pino 128 | I/O BANK D — User I/O pin (bank D) |
| Pino 129 | I/O BANK D — User I/O pin (bank D) |
| Pino 130 | I/O BANK D — User I/O pin (bank D) |
| Pino 131 | I/O BANK D — User I/O pin (bank D) |
| Pino 132 | I/O BANK D — User I/O pin (bank D) |
| Pino 133 | I/O BANK D — User I/O pin (bank D) |
| Pino 134 | I/O BANK D — User I/O pin (bank D) |
| Pino 135 | I/O BANK D — User I/O pin (bank D) |
| Pino 136 | I/O BANK D — User I/O pin (bank D) |
| Pino 137 | I/O BANK D — User I/O pin (bank D) |
| Pino 138 | I/O BANK D — User I/O pin (bank D) |
| Pino 139 | I/O BANK D — User I/O pin (bank D) |
| Pino 140 | I/O BANK D — User I/O pin (bank D) |
| Pino 141 | I/O BANK D — User I/O pin (bank D) |
| Pino 142 | I/O BANK D — User I/O pin (bank D) |
| Pino 143 | I/O BANK D — User I/O pin (bank D) |
| Pino 144 | GND — Ground |
Aplicações típicas
EPF6024ATC144-10 é adequado para 6 aplicaçãos: Legacy Industrial Glue Logic, Telecom Line-Card Interface Logic, Retro ASIC Prototyping Platform, Custom Peripheral Controller, Test & Measurement Front-End Logic, Legacy Avionics Bus Interface (Maintenance).
Legacy Industrial Glue Logic
The EPF6024ATC144-10 fits legacy industrial glue-logic designs where a low-density SRAM FPGA is acceptable and where board redesign is not feasible. Its 1,960 logic elements, 117 user I/O pins, and 3.3V LVTTL/LVCMOS support cover typical bus-bridge, address-decoding, and custom peripheral-controller tasks. The 144-LQFP package is easy to hand-prototype and re-work, which suits maintenance work on older industrial controllers. Engineers select this device when modernizing only specific functions inside a legacy system that retains the original FLEX 6000 footprint. The bitstream is loaded at power-up via EPC2/EPC8 configuration ROM, preserving the original system architecture.
Recomendado
Telecom Line-Card Interface Logic
The EPF6024ATC144-10 fits telecom line-card interface designs that require custom framing, E1/T1 glue, or proprietary protocol conversion. Its 117 user I/O pins can support parallel backplane interfaces and multiple serial channels, while its SRAM-based configuration allows field re-programmability for protocol updates. Telecom line cards often carry FPGAs as auxiliary logic alongside the main processor, and the EPF6024ATC144-10 has historically been used in legacy TDM/PDH equipment. For new line-card designs, Cyclone IV or Cyclone V FPGAs are recommended instead, but for maintaining installed bases the EPF6024ATC144-10 remains a valid choice.
Recomendado
Retro ASIC Prototyping Platform
The EPF6024ATC144-10 fits retro ASIC prototyping platforms where engineers emulate an older ASIC die using a programmable fabric. Its 1,960 logic elements support medium-scale RTL designs, and the JTAG boundary-scan (IEEE 1149.1) interface simplifies on-board debug. Educational institutions and hobbyists continue to use the EPF6024ATC144-10 in FPGA development kits (legacy Altera Nios development boards, university curricula). For new prototype work, the Cyclone series is preferred, but the EPF6024ATC144-10 remains available for legacy kit maintenance and educational use.
Recomendado
Custom Peripheral Controller
The EPF6024ATC144-10 fits custom peripheral controller designs where a microcontroller alone cannot meet timing or I/O requirements. Its 117 user I/O pins can drive multiple buses, custom peripherals, and external memory interfaces concurrently. Designers can implement timers, DMA controllers, and protocol engines that augment a host CPU. The SRAM-based configuration allows in-system firmware updates, useful for evolving interface standards. The 144-LQFP package offers ample signal margin for hand-routed prototypes and small-volume production runs.
Recomendado
Test & Measurement Front-End Logic
The EPF6024ATC144-10 fits test & measurement front-end logic where custom timing generators, pulse shapers, or data-acquisition pre-processors are needed. Its 1,960 logic elements can implement state machines and timing logic for test instrumentation, while its 3.3V I/O is compatible with standard logic analyzers and bench equipment. The JTAG interface simplifies bench debug. For new T&M products, Cyclone series FPGAs are recommended, but legacy test equipment in service often retains FLEX 6000 family designs for long-term calibration stability.
Recomendado
Legacy Avionics Bus Interface (Maintenance)
The EPF6024ATC144-10 fits legacy avionics bus-interface applications where the airframe platform has a long service life and original equipment uses FLEX 6000 family devices. Such platforms often require form-fit-function replacements during scheduled maintenance. The 144-LQFP package and FLEX 6000 architecture allow qualified drop-in alternatives within the same family (EPF6024ATC144-3N, EPF6024ATC144-2N). For new avionics designs, RTCA DO-254 compliance and radiation tolerance typically drive selection toward modern radiation-hardened FPGAs (Microsemi/RT ProASIC3, Xilinx Virtex-5QV).
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024ATC144-10 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024ATC144-3N | EPF6024ATC144-2N | EPF6024ATC144-1N | EPF6024ATC144 | EPF6024ATC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| Maximum User I/O | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -10 | -3N (faster) | -2N (faster) | -1N (slower) | unspecified | -1 (slower, commercial temp) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Memory | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) |
| JTAG Support | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Cost-optimized -10 speed grade for legacy designs (vs EPF6024ATC144-3N)
- Industrial temperature range variant available (vs EPF6024ATC144-1)
- Smaller PCB footprint vs higher-pin-count FLEX 6000 variants (vs EPF6024AQC240-3N)
Notas de projeto
The EPF6024ATC144-10 requires a stable 3.3V core supply (VCCINT) and a separate VCCIO supply per I/O bank. Place 100nF decoupling capacitors close to every VCCINT pin and one bulk 10uF tantalum or ceramic capacitor on each VCCIO rail. Because the FLEX 6000 family is SRAM-based, supply voltage must ramp monotonically; a brown-out during configuration will corrupt the bitstream. Add a power-good supervisor (e.g., MAX811 or TPS3839) to hold nCONFIG low until VCCINT stabilizes.
Common pitfalls with the EPF6024ATC144-10: (1) Forgetting the external configuration memory - FLEX 6000 FPGAs cannot boot without an EPC2/EPC8 or equivalent bitstream source. (2) Mixing 5V and 3.3V signals - the FLEX 6000 I/O is 3.3V LVTTL/LVCMOS, so a level translator is needed for any 5V bus. (3) JTAG chain conflicts when programming - ensure the TCK/TMS/TDI/TDO pins are not loaded by external buffers that could interfere with the ByteBlaster download cable.
PCB layout for the 144-LQFP package requires a 0.5 mm pitch land pattern with thermal vias under the exposed pad (if present). Route single-ended signals on the inner layers to keep the outer layers free for power and ground. Match trace lengths for clocks (CLK0-CLK3) within 1 cm to minimize skew. Place the EPC2/EPC8 configuration ROM within 5 cm of the FPGA to keep the DCLK/Data0 traces short and free of stubs.
Estimated: at 100% logic utilization with all I/O toggling at 50 MHz, the EPF6024ATC144-10 dissipates approximately 0.5-1 W. The 144-LQFP package relies on PCB copper for heat dissipation; provide at least 1 square inch of unbroken ground plane on the top layer beneath the device. For high ambient temperatures (>70C), use a copper pour on inner layers with thermal vias to spread heat.
Informações de conformidade
Compliance status not confirmed in verified web data. As a legacy Altera/Intel PSG product from the FLEX 6000 family (launched circa 1999), original parts were SnPb-finish; later die revs may have been lead-free. Confirm RoHS compliance on the specific lot/date code before use in RoHS-restricted designs.