EPF6024ATC1442 - FLEX 6000 FPGA, 24K Gates, 144-LQFP | Altera
Référence : EPF6024ATC1442 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58 | $580,00 |
| 100 | $49.5 | $4 950,00 |
| 500 | $42 | $21 000,00 |
| 1 000 | $37.25 | $37 250,00 |
EPF6024ATC1442 Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) family that uses look-up tables (LUTs), programmable interconnect, and configurable I/O cells to implement arbitrary digital logic after fabrication. Within the broader semiconductor taxonomy, an FPGA sits below ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices) as a flexible, reprogrammable alternative, and is widely used for glue logic, bus bridging, prototyping, low-volume ASIC replacement, and parallel DSP pipelines.
Key specifications include 24,000 system gates, 1,960 logic cells, 117 user I/Os, 196 LABs (logic array blocks), 3.3 V VCCINT, 0.42 um process geometry, 166.67 MHz internal performance, and TQFP-144 surface-mount packaging. The ATC speed grade balances timing margin and cost for industrial-grade designs, while the -2 suffix denotes a specific speed/operating-condition bin per Altera's legacy FLEX 6000 ordering scheme.
Architecturally, the EPF6024ATC1442 uses a SRAM-based configuration cell that must be loaded at every power-up from an external serial or parallel configuration device (such as the EPC2 or EPC8). The 0.42 um CMOS process provides a balance of density and low static power, while the 117 general-purpose I/Os support LVTTL and LVCMOS standards with user-programmable drive strength and slew rate. Embedded array blocks (EABs) provide efficient on-chip RAM and ROM for FIFO and lookup-table implementations, supplementing the distributed logic-element memory.
Typical applications include industrial control and instrumentation, telecom line-card glue logic, legacy PCI/ISA bus bridges, motor-control and factory-automation boards, and cost-sensitive prototyping platforms that still require the flexibility of programmable logic. The 144-pin LQFP footprint is hand-solderable, making the device friendly for prototype rework and low-volume production.
When designing with this part, plan for an external configuration memory and a JTAG chain (IEEE 1149.1) for in-system programming and boundary-scan test. Decouple VCCINT (3.3 V) and VCCIO (per I/O bank) close to the package with 0.1 uF ceramic capacitors, and respect the FLEX 6000 device family power-up sequencing to avoid partial-configuration latch-up.
This page synthesizes distributor pricing, FLEX 6000 family alternatives, and practical design notes not found in the manufacturer datasheet alone - it is built to answer both purchasing and engineering questions for engineers evaluating EPF6024ATC1442 against modern FPGA replacements.
Alternatives de remplacement direct pour EPF6024ATC1442 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATC1442 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Process Technology, Operating Temperature, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144-2
✅ Remplacement direct✓ En stock
$24.95 / unité
Voir la fiche technique →EPF6024ATC144-1
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →EPF6024ATC144-3
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EPF6024ATC144-10
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EPF6016ATC144-2
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6010ATC144-2
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →EPF6024ATC1442 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| System Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| Embedded Array Blocks (EABs) | Yes (number of EABs not stated in provided web snippets) |
| Maximum User I/O | 117 |
| Core Supply Voltage (VCCINT) | 3.3 V |
| Process Technology | 0.42 um CMOS |
| Internal Clock Frequency (max) | 166.67 MHz |
| Speed Grade | ATC (industrial, -2 bin) |
| Boîtier | 144-pin LQFP (TQFP-144) |
| Type de montage | Surface Mount |
| Configuration Method | SRAM, requires external configuration device (e.g., EPC2/EPC8) |
| JTAG Support | IEEE 1149.1 boundary-scan (per FLEX 6000 family) |
Configuration des broches de EPF6024ATC1442
| Broche 1 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 2 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 3 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 4 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 5 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 6 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 7 | VCCINT — Core supply voltage, 3.3 V |
| Broche 8 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 9 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 10 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 13 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 14 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 15 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 16 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 17 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 18 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 19 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 20 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 21 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 22 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 23 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 24 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 25 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 26 | VCCIO1 — I/O supply voltage, bank 1 |
| Broche 27 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 28 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 29 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 30 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 31 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 32 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 33 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 34 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 35 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 36 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 39 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 40 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 41 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 42 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 43 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 44 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 45 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 46 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 47 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 48 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 49 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 50 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 51 | VCCIO2 — I/O supply voltage, bank 2 |
| Broche 52 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 53 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 54 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 55 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 56 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 57 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 58 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 59 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 60 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 61 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 62 | I/O — User I/O pin (bank 2, LVTTL/LVCMOS) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 65 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 66 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 67 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 68 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 69 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 70 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 71 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 72 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 73 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 74 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 75 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 76 | VCCIO3 — I/O supply voltage, bank 3 |
| Broche 77 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 78 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 79 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 80 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 81 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 82 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 83 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 84 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 85 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 86 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 87 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 88 | I/O — User I/O pin (bank 3, LVTTL/LVCMOS) |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 91 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 92 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 93 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 94 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 95 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 96 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 97 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 98 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 99 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 100 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 101 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 102 | VCCIO4 — I/O supply voltage, bank 4 |
| Broche 103 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 104 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 105 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 106 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 107 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 108 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 109 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 110 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 111 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 112 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 113 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 114 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 117 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 118 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 119 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 120 | I/O — User I/O pin (bank 4, LVTTL/LVCMOS) |
| Broche 121 | nCONFIG — Configuration control (active-low) |
| Broche 122 | nSTATUS — Configuration status (active-low) |
| Broche 123 | DCLK — Configuration clock input |
| Broche 124 | DATA0 — Configuration data input |
| Broche 125 | CONF_DONE — Configuration done (open-drain) |
| Broche 126 | MSEL0 — Configuration mode select |
| Broche 127 | MSEL1 — Configuration mode select |
| Broche 128 | TDI — JTAG test data input (IEEE 1149.1) |
| Broche 129 | TMS — JTAG test mode select (IEEE 1149.1) |
| Broche 130 | TCK — JTAG test clock (IEEE 1149.1) |
| Broche 131 | TDO — JTAG test data output (IEEE 1149.1) |
| Broche 132 | VCCINT — Core supply voltage, 3.3 V |
| Broche 133 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 134 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 135 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 136 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 137 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 138 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 139 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 140 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 141 | GND — Ground |
| Broche 142 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 143 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
| Broche 144 | I/O — User I/O pin (bank 1, LVTTL/LVCMOS) |
Applications typiques
EPF6024ATC1442 convient pour 6 applications: Industrial Control and Instrumentation, Telecom Line-Card Glue Logic, Legacy PCI / ISA Bus Bridges, Motor Control and Factory Automation, Low-Volume ASIC Replacement, Prototyping and Educational Platforms.
Industrial Control and Instrumentation
The EPF6024ATC1442 fits industrial control and instrumentation due to its 24K-gate density, 117 user I/Os, and 166.67 MHz internal performance - enough to integrate encoder counters, PWM generators, and bus bridges in a single chip. Its 0.42 um CMOS core draws relatively low quiescent current and tolerates 3.3 V supply rails commonly found on PLC backplanes and CNC machine controllers. The TQFP-144 package is hand-solder-friendly, easing prototype rework during factory-floor qualification.
Recommandé
Telecom Line-Card Glue Logic
EPF6024ATC1442 serves well as line-card glue logic in telecom systems, performing bus arbitration, address decoding, and protocol conversion between TDM framers, network processors, and backplane SERDES. Its 117 I/Os comfortably handle address/data multiplexing for legacy H.110 or H-MVIP buses, while the 166.67 MHz internal clock supports 8-bit/16-bit datapath glue at typical telecom frequencies. The 144-LQFP footprint also fits legacy PCI/PMC card area constraints.
Recommandé
Legacy PCI / ISA Bus Bridges
EPF6024ATC1442 is widely deployed in legacy PCI / ISA bridge designs where it implements target/initiator state machines, address decoding, and interrupt routing. The 24K gates are sufficient for a typical 32-bit PCI target with DMA support, while the 117 I/Os leave headroom for ISA bus and side-band signals. Designers can preserve legacy motherboard layouts because the 144-LQFP footprint is compatible with the same land pattern used by many older glue-logic FPGAs.
Recommandé
Motor Control and Factory Automation
In motor control and factory automation, EPF6024ATC1442 acts as the central logic hub for sensor feedback decoding, PWM generation, and fieldbus protocol termination. The 166.67 MHz internal clock supports deterministic sampling of quadrature encoders and sigma-delta modulator data, while the 117 I/Os allow direct connection to multi-axis stepper/servo drivers. The industrial ATC speed grade is rated for typical factory-floor ambient conditions.
Recommandé
Low-Volume ASIC Replacement
EPF6024ATC1442 is a cost-effective solution for low-volume ASIC replacement when NRE costs of an ASIC are prohibitive. With 24K gates it can absorb moderate-complexity glue-logic, peripheral controllers, or custom interfaces, while the SRAM-based configuration enables last-minute design revisions without re-spinning silicon. The 144-LQFP package is broadly second-sourced and stocked in the broker/legacy channels, easing long-tail lifecycle concerns.
Recommandé
Prototyping and Educational Platforms
Educational labs and prototyping boards have used EPF6024ATC1442 to teach digital design, bus protocols, and configuration flows. Its TQFP-144 footprint fits 0.5 mm-pitch breadboard adapters, making it practical for hand-soldered student projects. The Quartus II Web Edition toolchain (legacy) supports the part free of charge, and a wealth of reference designs from the FLEX 6000 family remain available in Altera's documentation archive.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATC1442 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144-2 | EPF6024ATC144-1 | EPF6024ATC144-3 | EPF6024ATC144-10 | EPF6016ATC144-2 | EPF6010ATC144-2 |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP-144) | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | ~1,320 | ~880 |
| System Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 | 10,000 |
| Speed Grade | -2 (ATC) | -2 (ATC) | -1 (slower) | -3 (faster) | -10 (extended temp option) | -2 (ATC) | -2 (ATC) |
| Maximum User I/O | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Maximum density in FLEX 6000 family within the 144-LQFP footprint (vs EPF6016ATC144-2)
- ATC industrial speed grade (-2 bin) balances timing margin and cost (vs EPF6024ATC144-1)
- 144-LQFP package is hand-solder-friendly versus PQFP/BGA alternatives (vs EPF6024AQI240-2)
- Higher 166.67 MHz internal performance for glue-logic timing closure (vs EPF6024ATC144-10)
Notes de conception
EPF6024ATC1442 requires a clean 3.3 V VCCINT rail; place a 0.1 uF ceramic decoupling capacitor close to every VCCINT pin and a bulk 10-47 uF tantalum or polymer capacitor at the board's 3.3 V entry. VCCIO is configured per bank - if your design mixes 3.3 V and 5 V peripherals, plan for two independent VCCIO rails (banks 1/4 at 3.3 V, banks 2/3 at 5 V, for example) and isolate them with ferrite beads. Power-up sequencing per the FLEX 6000 datasheet must hold the device in reset until VCCINT and VCCIO are stable to avoid partial-configuration latch-up.
For the 144-LQFP (0.5 mm pitch) footprint, use 0.127 mm (5 mil) traces with 0.2 mm (8 mil) spacing on outer layers and a 4-layer stack-up with continuous VCCINT/GND planes for the inner layers. Place the EPC2/EPC8 configuration PROM within 5 cm of the FLEX 6000 device to keep the DCLK/Data0 traces short and matched; long configuration traces are a common source of intermittent configuration failures. Reserve a 4-pin header for JTAG (TDI, TMS, TCK, TDO) on the PCB for boundary-scan and ISP programming.
The most common pitfalls with EPF6024ATC1442 designs are: (1) confusing 'EPF6024ATC1442' with the dash-form 'EPF6024ATC144-2' (they are the same part - confirm with your distributor); (2) omitting the external configuration PROM and assuming the device retains its pattern after power-down (it does not - FLEX 6000 is SRAM-based); (3) using an EPC1 instead of EPC2/EPC8 for larger FLEX 6000 bitstreams (EPC1 is too small for EPF6024ATC1442); (4) leaving CONF_DONE floating (it is open-drain and must be pulled high); (5) choosing an EPF6024AQI240 variant when the PCB was laid out for 144-LQFP (240-pin PQFP requires re-spinning the board).
Informations de conformité
Compliance information (RoHS, REACH, lead-free, halogen-free) was not present in the Verified Web Data snippets; values set to 'unknown' until confirmed against the Altera/Intel material declaration. AEC-Q100 is not applicable - this is an FPGA, not an automotive-qualified analog IC. Designers should request the latest material declaration from the supplier when compliance is required.