EPF8452AQC160-5 - 452 FFs, 336 LEs FLEX 8000 FPGA | Altera
N.º da peça: EPF8452AQC160-5 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1.395,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.85 | $9.850,00 |
EPF8452AQC160-5 Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing designers to implement custom digital logic without fabricating a custom ASIC. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and SPLDs, and are widely used for glue logic, prototyping, low-volume production, and acceleration tasks. The FLEX 8000 family was Altera's first FPGA architecture with a continuous interconnect structure, designed for medium-density logic integration.
Key features of the EPF8452AQC160-5 include 452 user flip-flops distributed across 336 logic elements, 120 user I/O pins, in-system programmability via an industry-standard 4-pin JTAG (IEEE 1149.1) interface, and MultiVolt I/O supporting mixed-voltage systems. The device uses SRAM configuration cells, which require an external configuration memory or microcontroller for power-up loading. Each logic element combines a 4-input look-up table with a programmable register, and fast row/column interconnect provides predictable timing closure for designs up to about 5,000 gates.
Architecturally, the EPF8452AQC160-5 is fabricated on a 0.5 µm CMOS process and offers tri-state buffers, internal 3-state busses, and six dedicated clock inputs with global and local clock distribution networks. The MultiVolt I/O feature allows output pins to drive either 3.3 V or 5.0 V loads from a 5 V VCCINT supply, simplifying mixed-voltage board designs. JTAG support enables boundary-scan testing per IEEE 1149.1, easing board-level testability for high-density designs.
Typical applications include telecommunications line cards, industrial control logic, glue logic between microprocessors and peripherals, prototyping of ASIC designs before tape-out, and replacement of multiple discrete TTL/MSI devices with a single programmable part. Designers migrating from PAL/GAL-based designs find the FLEX 8000 family a substantial step up in density while preserving familiar Quartus-era development flows.
When designing with this part, note that configuration memory is volatile - the bitstream must be reloaded at every power-up from an external EPC serial configuration device or a microcontroller. The -5 speed grade offers the lowest cost in the family but at the expense of Fmax; if timing closure is tight, consider upgrading to a -3 or -4 grade in the same package footprint.
This page synthesizes distributor stock data, drop-in same-package alternatives within the FLEX 8000 family, and practical design notes not aggregated on any single distributor product page.
Alternativas drop-in para EPF8452AQC160-5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF8452AQC160-5 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF8452AQC160-4
✅ Drop-In✓ Em estoque
$11 / unidade
Ver ficha técnica →EPF8452AQC160-4N
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EPF8452AQC160-3
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EPF8452AQC160-3AC
✅ Drop-In✓ Em estoque
$14.1 / unidade
Ver ficha técnica →EPF8452AQC160-2
✅ Drop-In✓ Em estoque
$23.85 / unidade
Ver ficha técnica →EPF8452AQC160-5 Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements (LEs) | 336 |
| Flip-Flops | 452 |
| User I/O Pins | 120 |
| Total Package Pins | 160 |
| Encapsulamento | 160-pin PQFP (Plastic Quad Flat Pack) |
| Speed Grade | -5 (slowest commercial) |
| Process Technology | 0.5 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V or 5.0 V (MultiVolt I/O) |
| Configuration Method | SRAM, serial (EPC) or parallel, JTAG (IEEE 1149.1) |
| Operating Temperature Grade | Commercial |
| Tipo de montagem | Surface Mount (Gull Wing) |
| Terminal Form | Gull Wing |
| Package Code | QFP (PQFP160) |
| Status RoHS | unknown |
Configuração de pinos do EPF8452AQC160-5
| Pino 1 | I/O — User I/O pin (bank) |
| Pino 2 | I/O — User I/O pin (bank) |
| Pino 3 | I/O — User I/O pin (bank) |
| Pino 4 | I/O — User I/O pin (bank) |
| Pino 5 | VCCINT — 5 V core supply |
| Pino 6 | I/O — User I/O pin (bank) |
| Pino 7 | I/O — User I/O pin (bank) |
| Pino 8 | I/O — User I/O pin (bank) |
| Pino 9 | I/O — User I/O pin (bank) |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O pin (bank) |
| Pino 12 | I/O — User I/O pin (bank) |
| Pino 13 | I/O — User I/O pin (bank) |
| Pino 14 | I/O — User I/O pin (bank) |
| Pino 15 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 16 | I/O — User I/O pin (bank) |
| Pino 17 | I/O — User I/O pin (bank) |
| Pino 18 | I/O — User I/O pin (bank) |
| Pino 19 | I/O — User I/O pin (bank) |
| Pino 20 | GND — Ground |
| Pino 21 | I/O — User I/O pin (bank) |
| Pino 22 | I/O — User I/O pin (bank) |
| Pino 23 | I/O — User I/O pin (bank) |
| Pino 24 | I/O — User I/O pin (bank) |
| Pino 25 | I/O — User I/O pin (bank) |
| Pino 26 | I/O — User I/O pin (bank) |
| Pino 27 | VCCINT — 5 V core supply |
| Pino 28 | I/O — User I/O pin (bank) |
| Pino 29 | I/O — User I/O pin (bank) |
| Pino 30 | I/O — User I/O pin (bank) |
| Pino 31 | I/O — User I/O pin (bank) |
| Pino 32 | GND — Ground |
| Pino 33 | I/O — User I/O pin (bank) |
| Pino 34 | I/O — User I/O pin (bank) |
| Pino 35 | I/O — User I/O pin (bank) |
| Pino 36 | I/O — User I/O pin (bank) |
| Pino 37 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 38 | I/O — User I/O pin (bank) |
| Pino 39 | I/O — User I/O pin (bank) |
| Pino 40 | I/O — User I/O pin (bank) |
| Pino 41 | I/O — User I/O pin (bank) |
| Pino 42 | GND — Ground |
| Pino 43 | I/O — User I/O pin (bank) |
| Pino 44 | I/O — User I/O pin (bank) |
| Pino 45 | I/O — User I/O pin (bank) |
| Pino 46 | I/O — User I/O pin (bank) |
| Pino 47 | I/O — User I/O pin (bank) |
| Pino 48 | I/O — User I/O pin (bank) |
| Pino 49 | VCCINT — 5 V core supply |
| Pino 50 | I/O — User I/O pin (bank) |
| Pino 51 | I/O — User I/O pin (bank) |
| Pino 52 | I/O — User I/O pin (bank) |
| Pino 53 | I/O — User I/O pin (bank) |
| Pino 54 | GND — Ground |
| Pino 55 | I/O — User I/O pin (bank) |
| Pino 56 | I/O — User I/O pin (bank) |
| Pino 57 | I/O — User I/O pin (bank) |
| Pino 58 | I/O — User I/O pin (bank) |
| Pino 59 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 60 | I/O — User I/O pin (bank) |
| Pino 61 | I/O — User I/O pin (bank) |
| Pino 62 | I/O — User I/O pin (bank) |
| Pino 63 | I/O — User I/O pin (bank) |
| Pino 64 | GND — Ground |
| Pino 65 | I/O — User I/O pin (bank) |
| Pino 66 | I/O — User I/O pin (bank) |
| Pino 67 | I/O — User I/O pin (bank) |
| Pino 68 | I/O — User I/O pin (bank) |
| Pino 69 | I/O — User I/O pin (bank) |
| Pino 70 | I/O — User I/O pin (bank) |
| Pino 71 | VCCINT — 5 V core supply |
| Pino 72 | I/O — User I/O pin (bank) |
| Pino 73 | I/O — User I/O pin (bank) |
| Pino 74 | I/O — User I/O pin (bank) |
| Pino 75 | I/O — User I/O pin (bank) |
| Pino 76 | GND — Ground |
| Pino 77 | I/O — User I/O pin (bank) |
| Pino 78 | I/O — User I/O pin (bank) |
| Pino 79 | I/O — User I/O pin (bank) |
| Pino 80 | I/O — User I/O pin (bank) |
| Pino 81 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 82 | I/O — User I/O pin (bank) |
| Pino 83 | I/O — User I/O pin (bank) |
| Pino 84 | I/O — User I/O pin (bank) |
| Pino 85 | I/O — User I/O pin (bank) |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — User I/O pin (bank) |
| Pino 88 | I/O — User I/O pin (bank) |
| Pino 89 | I/O — User I/O pin (bank) |
| Pino 90 | I/O — User I/O pin (bank) |
| Pino 91 | I/O — User I/O pin (bank) |
| Pino 92 | I/O — User I/O pin (bank) |
| Pino 93 | VCCINT — 5 V core supply |
| Pino 94 | I/O — User I/O pin (bank) |
| Pino 95 | I/O — User I/O pin (bank) |
| Pino 96 | I/O — User I/O pin (bank) |
| Pino 97 | I/O — User I/O pin (bank) |
| Pino 98 | GND — Ground |
| Pino 99 | I/O — User I/O pin (bank) |
| Pino 100 | I/O — User I/O pin (bank) |
| Pino 101 | I/O — User I/O pin (bank) |
| Pino 102 | I/O — User I/O pin (bank) |
| Pino 103 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 104 | I/O — User I/O pin (bank) |
| Pino 105 | I/O — User I/O pin (bank) |
| Pino 106 | I/O — User I/O pin (bank) |
| Pino 107 | I/O — User I/O pin (bank) |
| Pino 108 | GND — Ground |
| Pino 109 | I/O — User I/O pin (bank) |
| Pino 110 | I/O — User I/O pin (bank) |
| Pino 111 | I/O — User I/O pin (bank) |
| Pino 112 | I/O — User I/O pin (bank) |
| Pino 113 | I/O — User I/O pin (bank) |
| Pino 114 | I/O — User I/O pin (bank) |
| Pino 115 | VCCINT — 5 V core supply |
| Pino 116 | I/O — User I/O pin (bank) |
| Pino 117 | I/O — User I/O pin (bank) |
| Pino 118 | I/O — User I/O pin (bank) |
| Pino 119 | I/O — User I/O pin (bank) |
| Pino 120 | GND — Ground |
| Pino 121 | I/O — User I/O pin (bank) |
| Pino 122 | I/O — User I/O pin (bank) |
| Pino 123 | I/O — User I/O pin (bank) |
| Pino 124 | I/O — User I/O pin (bank) |
| Pino 125 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 126 | I/O — User I/O pin (bank) |
| Pino 127 | I/O — User I/O pin (bank) |
| Pino 128 | I/O — User I/O pin (bank) |
| Pino 129 | I/O — User I/O pin (bank) |
| Pino 130 | GND — Ground |
| Pino 131 | I/O — User I/O pin (bank) |
| Pino 132 | I/O — User I/O pin (bank) |
| Pino 133 | I/O — User I/O pin (bank) |
| Pino 134 | I/O — User I/O pin (bank) |
| Pino 135 | I/O — User I/O pin (bank) |
| Pino 136 | I/O — User I/O pin (bank) |
| Pino 137 | VCCINT — 5 V core supply |
| Pino 138 | I/O — User I/O pin (bank) |
| Pino 139 | I/O — User I/O pin (bank) |
| Pino 140 | I/O — User I/O pin (bank) |
| Pino 141 | I/O — User I/O pin (bank) |
| Pino 142 | GND — Ground |
| Pino 143 | I/O — User I/O pin (bank) |
| Pino 144 | I/O — User I/O pin (bank) |
| Pino 145 | I/O — User I/O pin (bank) |
| Pino 146 | I/O — User I/O pin (bank) |
| Pino 147 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pino 148 | I/O — User I/O pin (bank) |
| Pino 149 | I/O — User I/O pin (bank) |
| Pino 150 | I/O — User I/O pin (bank) |
| Pino 151 | I/O — User I/O pin (bank) |
| Pino 152 | GND — Ground |
| Pino 153 | TDI — JTAG test data input (IEEE 1149.1) |
| Pino 154 | TMS — JTAG test mode select (IEEE 1149.1) |
| Pino 155 | TCK — JTAG test clock (IEEE 1149.1) |
| Pino 156 | TDO — JTAG test data output (IEEE 1149.1) |
| Pino 157 | nSTATUS — Configuration status (open-drain) |
| Pino 158 | nCONFIG — Configuration start (active-low) |
| Pino 159 | CONF_DONE — Configuration complete (open-drain) |
| Pino 160 | DCLK — Configuration clock (serial mode) |
Aplicações típicas
EPF8452AQC160-5 é adequado para 6 aplicaçãos: Telecommunications Line Cards, Industrial Control Logic, ASIC Prototyping and Emulation, Legacy Replacement for Multiple TTL/MSI Devices, Test and Measurement Instrumentation Front-Ends, Avionics and Military Legacy Interfaces.
Telecommunications Line Cards
The EPF8452AQC160-5 fits telecommunications line-card glue logic thanks to its 336 logic elements and 120 user I/Os in the 160-pin PQFP package. The MultiVolt I/O feature lets output pins drive either 3.3 V or 5.0 V backplane buses directly from a single 5 V core supply, simplifying mixed-voltage line-card designs. With 452 flip-flops distributed across the logic array, the device comfortably implements state-machine-rich protocols such as HDLC framing, UTOPIA-style backplane interfaces, and custom channel-associated signalling. Engineers place the FPGA between a network processor and PHY devices, where the -5 speed grade is sufficient for line-rate glue at sub-100 MHz operation and the PQFP footprint enables rework-friendly assembly on legacy production lines. The dedicated JTAG port supports boundary-scan tests on dense multi-layer line-card PCBs.
Recomendado
Industrial Control Logic
In industrial control systems, the EPF8452AQC160-5 serves as a flexible glue-logic and protocol-bridge device, replacing dozens of 74-series TTL/MSI packages with a single programmable part. The 120 user I/Os comfortably handle parallel I/O expansion for PLC backplanes, sensor arrays, and motor-driver interfaces, while the 336 LEs and 452 FFs implement PWM timing, encoder decoding, and deterministic state machines. The 5 V core and MultiVolt I/O permit direct interface to legacy 5 V industrial peripherals alongside modern 3.3 V microcontrollers. The -5 speed grade is adequate for typical control-loop frequencies up to a few tens of MHz, and the commercial temperature grade suits indoor cabinet environments. JTAG boundary-scan aids in factory test of high-density industrial controller PCBs.
Recomendado
ASIC Prototyping and Emulation
The EPF8452AQC160-5 is well suited as an ASIC prototyping platform for designs of up to roughly 5,000 gates, allowing engineers to validate RTL behaviour in real silicon before committing to mask costs. The 336 LEs and 452 flip-flops comfortably host moderate-complexity cores such as custom peripherals, bus arbiters, and signal-processing datapaths. In-system programmability via JTAG shortens the iteration cycle, and the MultiVolt I/O simplifies prototyping across both 3.3 V and 5.0 V ASIC pad libraries. The -5 speed grade provides conservative timing margins that mirror pre-layout ASIC estimates, while faster -3 or -4 grades in the same footprint allow exploration of timing closure. Re-using one PQFP160 footprint across prototype and production speeds simplifies board spin.
Recomendado
Legacy Replacement for Multiple TTL/MSI Devices
The EPF8452AQC160-5 excels at board-level consolidation of discrete 74LS/74HC logic, replacing dozens of small- and medium-scale integration packages with one programmable device. The 336 LEs map directly onto hundreds of equivalent gates, while the 120 user I/Os absorb all glue-logic pins without external bus expansion. Designers use this part to reduce BOM complexity, lower assembly cost, and shrink board area on legacy equipment that must remain serviceable for decades. The 5 V core and MultiVolt I/O mean the FPGA can drop into boards originally designed for TTL signalling, preserving the surrounding analog and power sections. Configuration memory can be one-time-programmed via parallel mode for non-field-upgradable designs.
Recomendado
Test and Measurement Instrumentation Front-Ends
In test and measurement equipment, the EPF8452AQC160-5 implements timing generators, custom waveform synthesizers, and protocol-aware trigger logic. The 452 flip-flops support long counter chains for frequency measurement, while the 336 LEs implement state-machine-driven sequencing. The 120 user I/Os are ample for parallel display drivers, button/keyboard interfaces, and front-panel multiplexed buses typical of benchtop instruments. The -5 grade's lower toggle rate is acceptable in human-scale timing applications where edge placement needs are modest, while the same PQFP160 footprint allows a design to migrate to the -3 grade if sub-100 ns resolution is later required. JTAG boundary-scan accelerates factory self-test on densely populated motherboards.
Recomendado
Avionics and Military Legacy Interfaces
The EPF8452AQC160-5 in its industrial-temperature variant is used in long-lifecycle avionics and military platforms where the FLEX 8000 architecture has accumulated decades of qualification history. Its 336 LEs and 120 user I/Os support MIL-STD-1553 bus bridges, ARINC 429 receivers, and custom discrete-to-digital conversion paths. The MultiVolt I/O lets the part bridge between 5 V avionics buses and 3.3 V modern processors, replacing multiple bus-driver ICs. Designers leverage the JTAG boundary-scan for depot-level board testing on deployed equipment where field-replaceable units must be verified rapidly. The PQFP160 footprint is well established in through-hole-to-surface-mount retrofit designs for older airframes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF8452AQC160-5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF8452AQC160-4 | EPF8452AQC160-4N | EPF8452AQC160-3 | EPF8452AQC160-3AC | EPF8452AQC160-2 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | PQFP-160 | PQFP-160 (same) | PQFP-160 (same) | PQFP-160 (same) | PQFP-160 (same) | PQFP-160 (same) |
| Logic Elements | 336 | 336 | 336 | 336 | 336 | 336 |
| Flip-Flops | 452 | 452 | 452 | 452 | 452 | 452 |
| User I/O | 120 | 120 | 120 | 120 | 120 | 120 |
| Speed Grade | -5 (slowest) | -4 (faster) | -4N (faster, lead-free) | -3 (fastest commercial) | -3AC (fastest, AC suffix) | -2 (industrial temp) |
| Temperature Grade | Commercial | Commercial | Commercial (lead-free) | Commercial | Commercial | Industrial |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| MultiVolt I/O | 3.3 V / 5.0 V | 3.3 V / 5.0 V | 3.3 V / 5.0 V | 3.3 V / 5.0 V | 3.3 V / 5.0 V | 3.3 V / 5.0 V |
| Configuration Interface | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG |
Principais diferenciais
- Slowest and lowest-cost speed grade in the FLEX 8000 PQFP-160 family (vs EPF8452AQC160-3)
- Drop-in upgrade path available in the same PQFP-160 footprint (vs EPF8452AQC160-4)
- MultiVolt I/O supports mixed 3.3 V / 5.0 V board designs (vs FPGAs without MultiVolt I/O)
Notas de projeto
Provide a clean 5 V supply on every VCCINT pin (4 pins per FLEX 8000 datasheet) with at least one 0.1 µF decoupling capacitor per VCCINT pin placed within 3 mm of the package. VCCIO must be tied to either 3.3 V or 5.0 V via the MultiVolt configuration before I/O operation; mixing VCCIO between banks is not permitted on the 160-pin PQFP. Add a bulk 47 µF tantalum or 100 µF aluminum polymer capacitor near the device for transient handling during configuration bit-stream loads.
The 160-pin PQFP has 0.65 mm pitch leads with a 31 mm × 31 mm body footprint. Route all signals on inner layers and use a solid ground plane on layer 2 directly beneath the device for return-path continuity. Maintain at least 8 mil trace width with 8 mil clearance on outer layers, and use microvia-in-pad if manufacturing budget allows to escape the fine-pitch perimeter pads. A 4-layer stack-up (signal/ground/power/signal) is strongly recommended for the 120 user I/Os.
Do not leave nCONFIG floating - it must be tied to VCC through a 10 kΩ pull-up so the device reliably enters configuration mode at power-up. nSTATUS and CONF_DONE are open-drain outputs and require external pull-ups to VCC (typically 10 kΩ). The DCLK pin must remain stable during configuration to avoid partial bit-stream corruption, and the JTAG chain should include buffer devices if mixed-voltage devices are placed on the same TCK line.
Estimated: at maximum toggling rate the EPF8452AQC160-5 may dissipate around 0.5-1.0 W with a typical 5 V VCCINT. The PQFP-160 package's θJA of approximately 40-50 °C/W (estimated, depends on PCB copper area) yields a junction temperature rise of 20-50 °C above ambient - normally well within the commercial 0-70 °C operating range. For industrial-temperature (-2) variants verify derating against the −40 °C to +85 °C window.
Informações de conformidade
RoHS and lead-free status depend on suffix: standard EPF8452AQC160-5 is non-RoHS by historical default; the -4N variant in the same package is the lead-free option. AEC-Q100 is not applicable to FPGAs in this product class.