Altera

EPF8452AQC160-5 - 452 FFs, 336 LEs FLEX 8000 FPGA | Altera

Référence : EPF8452AQC160-5 ✗ Fin de vie

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5 V Vdss 160 Package -5 (slowest commercial) Speed

À partir de $9.85 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-11

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$18.5	$18,50
10	$16.2	$162,00
100	$13.95	$1 395,00
500	$11.4	$5 700,00
1 000	$9.85	$9 850,00

ℹ️ Tous les prix sont en USD

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EPF8452AQC160-5 Présentation

The Altera (now Intel) EPF8452AQC160-5 is a member of the FLEX 8000 family of CMOS SRAM-based Field Programmable Gate Arrays, delivering 452 flip-flops and 336 logic elements in a 160-lead PQFP (Plastic Quad Flat Pack) package with 120 I/O pins. Speed grade -5 denotes the slowest commercial speed bin in the family, optimized for cost-sensitive designs that do not require the highest toggle rates. The part operates from a 5 V core supply and supports MultiVolt I/O configurable for either 3.3 V or 5.0 V operation.

An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing designers to implement custom digital logic without fabricating a custom ASIC. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and SPLDs, and are widely used for glue logic, prototyping, low-volume production, and acceleration tasks. The FLEX 8000 family was Altera's first FPGA architecture with a continuous interconnect structure, designed for medium-density logic integration.

Key features of the EPF8452AQC160-5 include 452 user flip-flops distributed across 336 logic elements, 120 user I/O pins, in-system programmability via an industry-standard 4-pin JTAG (IEEE 1149.1) interface, and MultiVolt I/O supporting mixed-voltage systems. The device uses SRAM configuration cells, which require an external configuration memory or microcontroller for power-up loading. Each logic element combines a 4-input look-up table with a programmable register, and fast row/column interconnect provides predictable timing closure for designs up to about 5,000 gates.

Architecturally, the EPF8452AQC160-5 is fabricated on a 0.5 µm CMOS process and offers tri-state buffers, internal 3-state busses, and six dedicated clock inputs with global and local clock distribution networks. The MultiVolt I/O feature allows output pins to drive either 3.3 V or 5.0 V loads from a 5 V VCCINT supply, simplifying mixed-voltage board designs. JTAG support enables boundary-scan testing per IEEE 1149.1, easing board-level testability for high-density designs.

Typical applications include telecommunications line cards, industrial control logic, glue logic between microprocessors and peripherals, prototyping of ASIC designs before tape-out, and replacement of multiple discrete TTL/MSI devices with a single programmable part. Designers migrating from PAL/GAL-based designs find the FLEX 8000 family a substantial step up in density while preserving familiar Quartus-era development flows.

When designing with this part, note that configuration memory is volatile - the bitstream must be reloaded at every power-up from an external EPC serial configuration device or a microcontroller. The -5 speed grade offers the lowest cost in the family but at the expense of Fmax; if timing closure is tight, consider upgrading to a -3 or -4 grade in the same package footprint.

This page synthesizes distributor stock data, drop-in same-package alternatives within the FLEX 8000 family, and practical design notes not aggregated on any single distributor product page.

Alternatives de remplacement direct pour EPF8452AQC160-5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF8452AQC160-5 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.

EPF8452AQC160-2

Intel

Package: 160-pin PQFP (160-BQFP), gull-wing

Operating Temperature: 0 °C to 70 °C (commercial)

Process Technology: 0.42 µm CMOS SRAM