EPM240T100I3N - 192-Macrocell MAX II CPLD, 100-TQFP, Industrial | Intel
N.º da peça: EPM240T100I3N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.1 | $81,00 |
| 100 | $7.05 | $705,00 |
| 500 | $6.2 | $3.100,00 |
| 1.000 | $5.45 | $5.450,00 |
EPM240T100I3N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple SPLDs/GLUE-logic PALs and high-density FPGAs in the programmable logic hierarchy. CPLD -> programmable logic -> PLD -> digital logic -> semiconductor. MAX II devices use a flash-based configuration cell instead of an external configuration ROM, giving them instant-on behavior (sub-millisecond wake-up), deterministic timing (no boot loader), and excellent suitability for I/O expansion, bus bridging, power-sequencing glue logic, and state-machine control. Compared to FPGAs, CPLDs such as the EPM240 offer lower static power, fixed propagation delay, and unlimited in-system reprogrammability via JTAG.
Key features of the EPM240T100I3N include 192 macrocells distributed across 4 logic array blocks (LABs), 80 maximum user I/O, 4.6 ns pin-to-pin logic delay, a JTAG/IEEE 1149.1 compliant interface for in-system programmability (ISP), MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and an internal oscillator usable for simple clocking. The on-chip User Flash Memory block (8 Kbits) can store constants, serial numbers, or board revision IDs without an external EEPROM.
Architecturally, the MAX II family uses a continuous, non-segmented flash memory cell per macrocell. Combined with a fine-grained logic element and a global LAB interconnect, this yields predictable 4.6 ns tPD1 propagation delay regardless of how many macrocells are used, simplifying static timing closure. The 100-pin TQFP package uses a standard JEDEC 14x14 mm body, 0.5 mm pitch, MSL-3 moisture sensitivity, and a -40C to +100C industrial junction temperature rating.
Typical applications include I/O expansion and voltage-level translation in industrial controllers, glue-logic integration on FPGA-based motherboards, power-sequencer and watchdog controllers, JTAG-controlled bus bridges (I2C/SPI to parallel), LED-driver state machines, and motor-control peripheral interfaces. The instant-on, non-volatile nature of the EPM240 is especially valuable in safety-critical or deterministic-latency designs where FPGAs cannot meet cold-boot timing.
Designers should note that the EPM240T100I3N is being phased out as part of the MAX II EOL roadmap; new designs should consider the MAX V family (5M80ZE64, 5M160ZE64) or MAX 10 (10M02) family for long-term availability. The Quartus II / Quartus Prime design software with MAX II device support remains available from Intel. This page synthesizes distributor pricing, same-brand drop-in alternatives (EPM240T100C5N, EPM240T100C4N, EPM240GT100I5N, EPM240GT100C5N, EPM240GT100C4N), and design notes not found in the manufacturer datasheet.
Alternativas drop-in para EPM240T100I3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM240T100I3N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, RoHS Status, Process Technology, Programming Interface.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM240T100C5N
✅ Drop-In✓ Em estoque
$4.65 / unidade
Ver ficha técnica →EPM240T100C4N
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →EPM240T100C3N
✅ Drop-In✓ Em estoque
$9.05 / unidade
Ver ficha técnica →EPM240T100A5N
✅ Drop-In✓ Em estoque
$7.05 / unidade
Ver ficha técnica →EPM240GT100I5N
✅ Drop-In✓ Em estoque
$6.31 / unidade
Ver ficha técnica →EPM240GT100C5N
✅ Drop-In✓ Em estoque
$9.2 / unidade
Ver ficha técnica →EPM240GT100C4N
✅ Drop-In✓ Em estoque
$5.3 / unidade
Ver ficha técnica →EPM570T100C5N
✅ Drop-In✓ Em estoque
$10.2 / unidade
Ver ficha técnica →EPM240T100I3N Classificações máximas e características elétricas
| Family | MAX II |
| Device Logic Elements / Macrocells | 192 macrocells |
| Maximum User I/O Pins | 80 |
| Number of Logic Array Blocks (LABs) | 4 |
| On-chip User Flash Memory | 8 Kbits |
| Internal Performance | 304 MHz |
| Pin-to-pin Logic Delay (tPD1) | 4.6 ns |
| Global Clock Networks | 4 |
| Technology Node | 0.18 um, 6-layer-metal flash CMOS |
| Supply Voltage - Core | 2.5 V / 3.3 V |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperatura de junção de operação | -40C to +100C (industrial, 'I' grade) |
| Speed Grade | 3 |
| Encapsulamento | TQFP-100 (T100), 14x14 mm, 0.5 mm pitch |
| Programming Interface | JTAG / IEEE 1149.1 ISP |
| Instant-on (non-volatile) | Yes (flash-based) |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
Configuração de pinos do EPM240T100I3N
| Pino 1 | GND — Ground |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | I/O — User I/O (bank 1) |
| Pino 12 | GND — Ground |
| Pino 13 | I/O — User I/O (bank 1) |
| Pino 14 | I/O — User I/O (bank 1) |
| Pino 15 | I/O — User I/O (bank 1) |
| Pino 16 | I/O — User I/O (bank 1) |
| Pino 17 | I/O — User I/O (bank 1) |
| Pino 18 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 19 | I/O — User I/O (bank 1) |
| Pino 20 | I/O — User I/O (bank 1) |
| Pino 21 | I/O — User I/O (bank 1) |
| Pino 22 | I/O — User I/O (bank 1) |
| Pino 23 | GND — Ground |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 2) |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 28 | I/O — User I/O (bank 2) |
| Pino 29 | I/O — User I/O (bank 2) |
| Pino 30 | I/O — User I/O (bank 2) |
| Pino 31 | I/O — User I/O (bank 2) |
| Pino 32 | GND — Ground |
| Pino 33 | I/O — User I/O (bank 2) |
| Pino 34 | I/O — User I/O (bank 2) |
| Pino 35 | I/O — User I/O (bank 2) |
| Pino 36 | I/O — User I/O (bank 2) |
| Pino 37 | I/O — User I/O (bank 2) |
| Pino 38 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 39 | I/O — User I/O (bank 2) |
| Pino 40 | I/O — User I/O (bank 2) |
| Pino 41 | I/O — User I/O (bank 2) |
| Pino 42 | I/O — User I/O (bank 2) |
| Pino 43 | GND — Ground |
| Pino 44 | I/O — User I/O (bank 3) |
| Pino 45 | I/O — User I/O (bank 3) |
| Pino 46 | I/O — User I/O (bank 3) |
| Pino 47 | I/O — User I/O (bank 3) |
| Pino 48 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 49 | I/O — User I/O (bank 3) |
| Pino 50 | I/O — User I/O (bank 3) |
| Pino 51 | I/O — User I/O (bank 3) |
| Pino 52 | I/O — User I/O (bank 3) |
| Pino 53 | GND — Ground |
| Pino 54 | I/O — User I/O (bank 3) |
| Pino 55 | I/O — User I/O (bank 3) |
| Pino 56 | I/O — User I/O (bank 3) |
| Pino 57 | I/O — User I/O (bank 3) |
| Pino 58 | I/O — User I/O (bank 3) |
| Pino 59 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 60 | I/O — User I/O (bank 3) |
| Pino 61 | I/O — User I/O (bank 3) |
| Pino 62 | I/O — User I/O (bank 3) |
| Pino 63 | I/O — User I/O (bank 3) |
| Pino 64 | GND — Ground |
| Pino 65 | I/O — User I/O (bank 4) |
| Pino 66 | I/O — User I/O (bank 4) |
| Pino 67 | I/O — User I/O (bank 4) |
| Pino 68 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 69 | I/O — User I/O (bank 4) |
| Pino 70 | I/O — User I/O (bank 4) |
| Pino 71 | I/O — User I/O (bank 4) |
| Pino 72 | I/O — User I/O (bank 4) |
| Pino 73 | GND — Ground |
| Pino 74 | I/O — User I/O (bank 4) |
| Pino 75 | I/O — User I/O (bank 4) |
| Pino 76 | I/O — User I/O (bank 4) |
| Pino 77 | I/O — User I/O (bank 4) |
| Pino 78 | I/O — User I/O (bank 4) |
| Pino 79 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 80 | I/O — User I/O (bank 4) |
| Pino 81 | I/O — User I/O (bank 4) |
| Pino 82 | I/O — User I/O (bank 4) |
| Pino 83 | I/O — User I/O (bank 4) |
| Pino 84 | TMS — JTAG Test Mode Select |
| Pino 85 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Pino 86 | TCK — JTAG Test Clock |
| Pino 87 | I/O — User I/O (bank 4 / JTAG bank) |
| Pino 88 | I/O — User I/O (bank 4) |
| Pino 89 | TDO — JTAG Test Data Out |
| Pino 90 | GND — Ground |
| Pino 91 | I/O — User I/O (bank 4) |
| Pino 92 | I/O — User I/O (bank 4) |
| Pino 93 | I/O — User I/O (bank 4) |
| Pino 94 | TDI — JTAG Test Data In |
| Pino 95 | VCCINT — Core supply voltage |
| Pino 96 | I/O — User I/O (bank 4) |
| Pino 97 | I/O — User I/O (bank 4) |
| Pino 98 | I/O — User I/O (bank 4) |
| Pino 99 | I/O — User I/O (bank 4) |
| Pino 100 | GND — Ground |
Aplicações típicas
EPM240T100I3N é adequado para 6 aplicaçãos: Industrial I/O Expansion and Voltage Level Translation, FPGA Configuration and Power-Sequencing Glue Logic, Bus Bridging (I2C/SPI/UART to Parallel GPIO), LED Driver and Lighting State-Machine Controllers, Motor Control Peripheral Interface, Test and Measurement Instrument Front-Ends.
Industrial I/O Expansion and Voltage Level Translation
The EPM240T100I3N's 80 MultiVolt I/O pins and 1.5/1.8/2.5/3.3 V bank support make it ideal for expanding GPIOs or bridging mismatched voltage domains in industrial PLC backplanes. With 4.6 ns tPD1 and deterministic timing, the device delivers glitch-free level shifting between 3.3 V host MCUs and 1.8 V FPGAs without external buffers. Its industrial -40C to +100C junction range survives factory-floor thermal stress, and the 8 Kbit on-chip flash stores board IDs and calibration constants, eliminating a separate EEPROM. Compared to discrete 74LVC buffers, this CPLD reduces board area by 60% and improves design flexibility via JTAG re-programmability. Recommended for: PLCs, industrial sensor hubs, factory-automation modules.
Recomendado
FPGA Configuration and Power-Sequencing Glue Logic
The EPM240T100I3N is widely used as a companion CPLD to large FPGAs to handle power sequencing, DONE-pin monitoring, JTAG fan-out, and partial reconfiguration triggers. Its instant-on flash-based design wakes up in microseconds and releases the FPGA's nCONFIG/nCE pins in deterministic order, eliminating FPGA boot-failure risk in mission-critical systems. With 192 macrocells and 80 I/O, the EPM240 can implement complex state machines for multi-rail sequencing (e.g., 1.0 V VCCINT then 1.8 V VTT then 3.3 V I/O), each rail monitored by an analog comparator input. The 100-pin TQFP package allows it to sit adjacent to the FPGA on the same PCB layer. Recommended for: data-center accelerator cards, 5G baseband boards, high-end FPGA development kits.
Recomendado
Bus Bridging (I2C/SPI/UART to Parallel GPIO)
The EPM240T100I3N's combination of 192 macrocells and 80 user I/O enables serial-to-parallel bus bridges that fan out a low-pin-count MCU I2C or SPI port into 16, 24, or 32 GPIO lines. Engineers implement address-decoding state machines in the LABs, with 4.6 ns tPD1 latency keeping bus turn-around times below 100 ns even at 1 MHz I2C Fast-mode. The on-chip flash holds I2C device address maps that can be reconfigured via JTAG for board-revision changes, ideal for prototype-to-production transitions. The industrial temperature range supports outdoor and automotive-in-cabin deployments. Recommended for: legacy MCU replacements, sensor hubs, test fixtures.
Recomendado
LED Driver and Lighting State-Machine Controllers
Architectural and stage-lighting controllers use the EPM240T100I3N to generate DMX-512, SPI, or PWM outputs that drive chains of WS2812B or APA102 LED pixels. The 4 LABs each contain 16 macrocells and 16 associated DFFs, which the design can partition into independent PWM generators with 16-bit resolution at 1 kHz refresh - more than enough for 256 dim levels per channel. The 80 I/O pins can drive 24 PWM channels directly with hardware debounce and dead-time insertion. The instant-on flash-based configuration means the lighting show restarts within milliseconds after power-cycle, with no waiting for FPGA bitstream loads. The industrial temperature rating handles outdoor LED facade deployments. Recommended for: stage lighting, architectural LEDs, signage controllers.
Recomendado
Motor Control Peripheral Interface
The EPM240T100I3N is used in brushless-DC and stepper motor-control boards to generate quadrature encoder interfaces (QEI), Hall-sensor decoders, and PWM-with-dead-time controllers for the gate-driver front end. The 4.6 ns tPD1 propagation delay combined with MultiVolt I/O lets the CPLD interface directly to 1.8 V FPGA controllers and 3.3 V Hall sensors on the same board. The 4 global clock networks can be routed to independent PWM channels, simplifying timing closure on 6-step commutation tables. The 8 Kbit user flash stores motor calibration tables and serial numbers. Recommended for: drones, robotic actuators, CNC machines, e-bike controllers.
Recomendado
Test and Measurement Instrument Front-Ends
Test-equipment manufacturers embed the EPM240T100I3N as a glue-logic hub in bench oscilloscopes, logic analyzers, and protocol analyzers where deterministic pin-to-pin timing is mandatory. The 80 I/O pins can be user-configured into 4 independent test pods (16 channels each), each generating programmable stimulus patterns with sub-5 ns skew. The JTAG/ISP interface allows field upgrades of test vectors without disassembling the unit. The industrial -40C to +100C range meets lab and field-test thermal requirements. The 8 Kbit flash stores customer license keys and instrument calibration data, eliminating external EEPROM. Recommended for: oscilloscopes, protocol analyzers, production-line ICT fixtures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM240T100I3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM240T100C5N | EPM240T100C4N | EPM240T100C3N | EPM240T100A5N | EPM240GT100I5N | EPM570T100C5N |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 (T100) | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same |
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Macrocell Count | 192 | 192 (same die) | 192 (same die) | 192 (same die) | 192 (same die) | 240 (enhanced) | 570 (3x logic capacity) |
| Maximum User I/O | 80 | 80 | 80 | 80 | 80 | 80 | 76 (4 pins reserved) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | 3 | 5 (faster) | 4 | 3 (same) | 5 (faster) | 5 | 5 |
| On-chip User Flash | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Supply Voltage (Core) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Pin-to-pin Logic Delay (tPD1) | 4.6 ns (speed grade 3) | 3.5 ns (speed grade 5) | 4.0 ns (speed grade 4) | 4.6 ns (speed grade 3) | 3.5 ns (speed grade 5) | 3.5 ns (speed grade 5) | 3.5 ns (speed grade 5) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- Industrial temperature grade at speed grade 3 (vs EPM240T100C5N)
- Same TQFP-100 footprint with 240 macrocells (vs EPM240GT100I5N)
- 8 Kbit on-chip user flash eliminates external EEPROM (vs Discrete EEPROM + 74-series glue logic)
- 3x logic capacity with same package footprint (vs EPM570T100C5N)
Notas de projeto
Place all VCCINT and VCCIO decoupling capacitors within 2 mm of their respective pins. Use 0.1 uF X7R ceramic capacitors on each VCCIO bank pin and 10 uF bulk tantalum or polymer capacitors on each VCCINT pin. The TQFP-100 package has 4 GND pins (1, 12, 23, 32, 43, 53, 64, 73, 84 area) - tie all to a low-impedance ground plane with multiple vias to reduce ground bounce on JTAG transitions. Estimated: junction temperature rise is negligible (<5C) at typical 100 MHz operation given the 0.18 um flash process low static current.
Configure JTAG chain ordering so the EPM240T100I3N is upstream of any downstream FPGA or configuration device. Use a 4.7 kohm pull-up on TCK and a 4.7 kohm pull-up on TMS to keep the JTAG state machine in Test-Logic-Reset during power-up. If the board is deployed in noisy industrial environments, add a 33 ohm series damping resistor on TCK to suppress ringing below 100 MHz. MultiVolt I/O banks should not be mixed-voltage during in-system programming - hold all banks at 3.3 V during JTAG ISP for reliable configuration.
Do not confuse the EPM240T100I3N (industrial, speed grade 3) with the EPM240T100C5N (commercial, speed grade 5). The 'I' suffix indicates industrial temperature grade and the '3' suffix indicates speed grade 3; commercial parts use 'C' and grades 3/4/5/8. Mixing the two part numbers in a BOM for an industrial-rated board will fail at low temperature or high junction temperature. Note that the EPM570T100C5N shares the TQFP-100 footprint but pins 37 and 90 must be tied to GND and pins 39 and 88 to 3.3V - leaving them as I/O (like EPM240) will prevent the EPM570 from configuring. Reference: Altera MAX II vertical migration AN-422.
Allocate the four global clock networks (CLK0-CLK3) only to high-fanout clock inputs to preserve timing margins. Avoid routing general-purpose logic through the dedicated clock pins - they have special input buffers optimized for low-jitter clocks. For designs with multiple clock domains, place the CPLD within 50 mm of the clock source and use matched-length traces on differential clock pairs. The exposed thermal pad on TQFP-100 (if present on the package variant) should be soldered to a thermal copper pour to improve heat dissipation in high-utilization designs exceeding 80% macrocell usage.
Informações de conformidade
RoHS compliant per the manufacturer ordering information. The EPM240T100I3N is not AEC-Q100 qualified; for automotive applications choose the EPM240T100A5N (automotive grade). REACH SVHC status to be confirmed by the latest manufacturer Material Declaration.
