EPM570M256I5N - MAX II CPLD, 440 Macrocells, 256-MBGA | Intel
N.º da peça: EPM570M256I5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $41.98 | $41,98 |
| 10 | $38.42 | $384,20 |
| 100 | $31.95 | $3.195,00 |
| 500 | $27.83 | $13.915,00 |
| 1.000 | $24.66 | $24.660,00 |
EPM570M256I5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the deterministic timing of PAL/GAL architecture with modern flash memory cells. The hierarchy is: logic cell -> macrocell -> logic array block (LAB) -> CPLD. CPLDs sit between discrete 74-series glue logic and FPGAs in terms of density and complexity, offering instant-on operation, single-chip non-volatile storage of the bitstream, and predictable pin-to-pin propagation delays that make them ideal for control-plane and interface-bridging roles.
The EPM570M256I5N delivers 440 macrocells / 570 logic elements, supports up to 160 user I/Os at LVCMOS/LVTTL levels, and provides 5.4 ns tPD (fastest speed grade I5), measured through the MAX II MultiCore interconnect. It integrates 8 Kbits of user flash memory (UFM) block for storing parameter data, serial numbers, or firmware revisions alongside the configuration. Built on a 0.18 µm CMOS process, the device consumes substantially less static power than the legacy MAX 7000 series it replaced, while retaining the same Quartus II / Quartus Prime design flow and JTAG-based in-system programmability (ISP).
Typical applications include bus-bridging between legacy microcontrollers and modern processors (e.g., 8-bit MCU to 32-bit ARM SoC), I/O expansion in industrial PLC backplanes, address decoding and chip-select generation in FPGA-based systems, and level shifting between mixed-voltage domains. The instant-on flash-based architecture suits power-sequenced designs and safety-critical boot paths where an SRAM-based FPGA cannot satisfy cold-start latency.
When designing with this device, ensure your JTAG chain order is correct for ISP, leave at least 4 user I/Os unused as JTAG TDO/TMS/TCK/TDI to keep boundary-scan capability, and verify that the 1.8 V internal core is generated by the on-chip regulator - no external LDO is needed but decoupling must follow the Quartus II pin assignment tool's recommendations.
Alternativas drop-in para EPM570M256I5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570M256I5N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Family, Configuration Memory, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GM256I5N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPM570Z256I5N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EPM570F256C5N
✅ Drop-In✓ Em estoque
$17.03 / unidade
Ver ficha técnica →EPM570F256I5N
✅ Drop-In✓ Em estoque
$19.85 / unidade
Ver ficha técnica →EPM570T100I5N
✅ Drop-In✓ Em estoque
$12.49 / unidade
Ver ficha técnica →5M570ZT100I5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.74 / unidade
Ver ficha técnica →EPM570M256I5N Classificações máximas e características elétricas
| Family | MAX II |
| Macro Cells | 440 |
| Logic Elements | 570 |
| Number of User I/Os | 160 |
| Propagation Delay (tPD) | 5.4 ns |
| Maximum Frequency (fMAX) | 201.1 MHz |
| Operating Temperature (TJ) | -40C to +100C (industrial) |
| Operating Temperature (ambient) | -40C to +85C |
| Supply Voltage - Core | 2.5 V / 3.3 V internal |
| Supply Voltage - I/O | 1.5 V, 1.8 V, 2.5 V, 3.3 V (multi-voltage I/O bank) |
| Process Technology | 0.18 µm CMOS |
| User Flash Memory (UFM) | 8 Kbits |
| Package Type | 256-MBGA (Micro FineLine BGA, 11x11 mm) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Lead Status | Lead Free |
| Programmability | In-System Programmable (JTAG/ISP) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EPM570M256I5N 256-mbga (micro fineline bga, 11x11 mm)
Configuração de pinos para EPM570M256I5N (pacote 256-mbga (micro fineline bga, 11x11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM570M256I5N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM570M256I5N é adequado para 6 aplicaçãos: Industrial PLC I/O Expansion, FPGA-SoC Glue Logic and Chip-Select Generation, Legacy MCU to Modern SoC Bus Bridging, Display and Video Interface Bridging, Motor Control and Drive Signal Generation, Industrial Communication Protocol Conversion.
Industrial PLC I/O Expansion
The EPM570M256I5N is well suited for industrial PLC I/O expansion, where 160 user I/Os and 5.4 ns tPD enable deterministic bus decoding and signal multiplexing. The MAX II non-volatile architecture ensures instant-on operation without external boot memory, critical for safety PLCs that must reach a known state within milliseconds of power-up. The industrial temperature grade (I5N suffix) supports -40C to +100C junction operation, while the 256-MBGA package allows compact PLC backplane designs. Unlike SRAM-based FPGAs, the MAX II's flash-based configuration eliminates bitstream load latency. Designers typically pair the EPM570M256I5N with an ARM Cortex-M4 host MCU and use its multi-voltage I/O banks to bridge 3.3 V logic to 5 V field sensors directly.
Recomendado
FPGA-SoC Glue Logic and Chip-Select Generation
As a companion device to FPGA or SoC processors, the EPM570M256I5N excels at address decoding and chip-select generation for multi-bank memory systems. With 440 macrocells, the device can implement dozens of independent CS signals with 5.4 ns latency, far faster than software-driven GPIO toggling. The flash-based configuration means pre-programmed boot decoding is available immediately after FPGA configuration begins, supporting tight power-sequence timing. The 160 user I/Os handle multiple SPI, I2C, and parallel memory interfaces simultaneously. Compared to discrete 74-series logic, the MAX II consolidates 20-30 packages into one BGA, reducing PCB area and BOM cost in FPGA development kits and reference designs.
Recomendado
Legacy MCU to Modern SoC Bus Bridging
The EPM570M256I5N is ideal for bus-bridging between legacy 8/16-bit microcontrollers and modern 32-bit ARM SoCs. With multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) in independently configurable banks, the device can directly connect a 5 V-tolerant legacy bus to a 1.8 V SoC without external level shifters. The 8-Kbit User Flash Memory (UFM) block stores serial numbers and calibration constants alongside the configuration, useful for inventory and field-service tracking. The 5.4 ns propagation delay ensures cycle-time compatibility with 100 MHz+ SoC peripheral buses. Industrial designers routinely use this part in controller upgrade projects where a new SoC must communicate with an existing 8051 or PIC-based sensor interface.
Recomendado
Display and Video Interface Bridging
The EPM570M256I5N supports display interface bridging between LCD controllers, FPGA framebuffers, and HDMI/LVDS drivers. Its 160 user I/Os accommodate parallel RGB, LVDS 4-channel, and SPI display interfaces simultaneously, while the 5.4 ns tPD supports pixel clock rates beyond 100 MHz. The MAX II's deterministic timing simplifies timing closure compared to SRAM FPGAs. The 8-Kbit UFM can store display EDID data or gamma tables. The 256-MBGA package provides ample signal routing for high-speed display signals. Industrial HMI designers use this CPLD to translate between legacy MCU graphics interfaces and modern MIPI-DSI or LVDS panels without requiring an FPGA.
Recomendado
Motor Control and Drive Signal Generation
For motor control applications, the EPM570M256I5N provides deterministic PWM generation and quadrature encoder interfacing alongside a host DSP or MCU. The 5.4 ns propagation delay enables precise dead-time insertion and shoot-through protection in three-phase inverter control, while 160 I/Os accommodate multiple encoder inputs, gate driver signals, and fault monitoring. The industrial temperature grade supports under-hood automotive and industrial motor drive environments. The flash-based CPLD architecture means the motor control logic is available immediately at power-up, supporting fast-start safety requirements. Designers pair this part with a dsPIC or TI C2000 host MCU for field-oriented control (FOC) implementations.
Recomendado
Industrial Communication Protocol Conversion
The EPM570M256I5N excels at protocol conversion between industrial fieldbuses such as RS-485, CAN, Modbus, EtherCAT, and Profibus. With 440 macrocells, designers can implement UART, SPI, I2C, and custom protocol state machines simultaneously without host MCU intervention. The MAX II's 5.4 ns tPD supports CAN bit rates up to 1 Mbps and RS-485 communication at 10 Mbps. The industrial operating temperature range allows deployment in factory automation environments. The flash-based architecture enables field firmware updates via JTAG or parallel programming, ideal for protocol bridges in retrofit industrial installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570M256I5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GM256I5N | EPM570Z256I5N | EPM570F256C5N | EPM570F256I5N | 5M570ZT100I5N |
|---|---|---|---|---|---|---|
| Package | 256-MBGA (11x11 mm) | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA - same footprint |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II | MAX II G | MAX II Z | MAX II | MAX II | MAX V |
| Macro Cells | 440 | 440 | 440 | 440 | 440 | 440 |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Operating Temperature | -40C to +100C (TJ) | -40C to +100C (TJ) | -40C to +100C (TJ) | 0C to +85C (commercial, C5N) | -40C to +100C (TJ) | -40C to +100C (TJ) |
Principais diferenciais
- Non-volatile flash-based configuration with instant-on operation (vs EPM570F256C5N)
- Integrated 8-Kbit User Flash Memory (UFM) for parameter storage (vs EPM570F256C5N)
- Industrial temperature grade (I5N suffix) supporting -40C to +100C junction (vs EPM570F256C5N)
- Multi-voltage I/O bank support (1.5 V, 1.8 V, 2.5 V, 3.3 V) (vs EPM570T100I5N (100-pin TQFP))
Notas de projeto
Estimated: At fMAX = 201.1 MHz with all 160 I/Os toggling at 50% utilization, the MAX II EPM570M256I5N consumes approximately 50-80 mA from a 3.3 V supply (0.16-0.26 W). Add bulk decoupling of 10 µF tantalum + 0.1 µF ceramic near each VCCIO bank, plus 1 µF near the VCCINT pins. The internal core voltage regulator generates 1.8 V from the external 2.5/3.3 V supply; ensure VCCIO is stable before VCCINT ramps. Avoid driving outputs before configuration completes to prevent I/O contention.
The 256-MBGA package uses 0.5 mm ball pitch on an 11x11 mm substrate, requiring laser-drilled microvias and 4-mil trace/space PCB capability. Fanout with dog-bone pattern to break-out the inner balls; allow at least 0.3 mm clearance from balls to inner vias. Place JTAG test points (TCK, TMS, TDO, TDI) on a 0.1-inch header for in-system programming access. Match impedance for high-speed LVDS or DDR interfaces using controlled-impedance routing; the I/O bank voltages can mix within the same package if banks are powered independently.
Do not enable JTAG boundary-scan unless TCK is driven cleanly; floating TCK can cause unintended reconfiguration. Always set unused I/Os to 'input tri-stated' in the Quartus pin assignment file. The 8-Kbit UFM block shares programming time with the logic array - do not read UFM during in-system programming. Avoid simultaneous VCCINT and VCCIO ramp with large differential delays (>100 ms), which can trigger POR (power-on reset) glitches. If migrating to MAX II Z (EPM570Z256I5N), verify the lower internal core voltage does not affect timing closure on existing designs.
Estimated: For the 256-MBGA package, allocate at least 4 PCB layers with continuous ground plane on layer 2 directly under the BGA for thermal dissipation. The MAX II consumes 50-80 mA typical but can spike to 200 mA during in-system programming; thermal via array (9 thermal vias in a 3x3 pattern under the central balls) reduces theta-JA from approximately 30 C/W to 18 C/W. Place the JTAG connector within 5 cm of the device to minimize noise pickup on TCK.
Informações de conformidade
Lead-free 256-MBGA package, RoHS compliant per Heisener and Intel product information. Not AEC-Q100 qualified - this is an industrial temperature part, not automotive grade.
