ESD451DPLR - 0.5pF ±30kV ESD Diode | Texas Instruments
N.º da peça: ESD451DPLR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0.0825 | $0,08 |
| 10 | $0.0825 | $0,83 |
| 100 | $0.0825 | $8,25 |
| 500 | $0.0825 | $41,25 |
| 1.000 | $0.0825 | $82,50 |
ESD451DPLR Visão geral
A TVS diode, or transient-voltage-suppression diode, is a semiconductor protection component that diverts short-duration electrostatic-discharge energy away from a sensitive circuit. A bidirectional ESD diode provides symmetric protection for positive and negative transients. In the protection hierarchy, ESD451DPLR belongs to the discrete-semiconductor category and is used at connector or board-edge interfaces where electrostatic discharge can damage low-voltage ICs.
Verified manufacturer and distributor data identify ±30kV IEC 61000-4-2 protection, 0.5pF typical I/O capacitance, and suitability for high-speed interfaces including USB 3.0. The low capacitance helps preserve fast-edge data transmission, while bidirectional conduction supports protection of signal conductors that may experience either transient polarity. The 5.5V rating and 9.5V typical clamp voltage are important when choosing the correct protection location and ensuring that normal signal operation is not affected.
The extremely low dynamic resistance is identified by the manufacturer as 0.19Ω in the supplied product-page snippet. This low resistance helps reduce voltage stress during an ESD event. The device is designed for surface-mount assembly and is available through distributors such as DigiKey, Mouser, LCSC, and Xecor. Distributor listings describe the part as a TVS diode with a 6A 8/20µs peak-pulse current rating, although the complete electrical test conditions should be taken from the manufacturer datasheet.
Typical uses include USB 3.0 ports, high-speed serial interfaces, audio and communication connectors, and other low-voltage I/O ports exposed to electrostatic discharge. The compact footprint is advantageous in mobile, wearable, and space-constrained equipment, but placement requires close proximity to the connector or entry point so that the ESD current does not travel through unprotected PCB traces.
When designing around ESD451DPLR, first verify that the protected line operates below the device's stated working-voltage limit and that its signal integrity is compatible with 0.5pF typical capacitance. Place the diode close to the external connector, route the protected trace away from sensitive areas, and provide a short return path. Validate the completed design with the applicable system-level ESD test rather than assuming that a single component guarantees compliance.
This page combines verified manufacturer specifications, distributor availability information, drop-in replacement research, and PCB-level protection guidance to provide a practical engineering reference for ESD451DPLR selection and implementation.
Alternativas drop-in para ESD451DPLR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ESD451
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ESD451DPLR.B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ULC0521CLV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ESD451DPLR Classificações máximas e características elétricas
| Product Type | Bidirectional ESD protection TVS diode |
| Number of Channels | 1 channel |
| ESD Rating | ±30 kV per IEC 61000-4-2 |
| IEC 61000-4-2 Level | Greater than Level 4 |
| I/O Capacitance | 0.5 pF typical |
| Working Voltage | 5.5 V |
| Typical Clamp Voltage | 9.5 V typical |
| Peak Pulse Current | 6 A at 8/20 µs |
| Dynamic Resistance | 0.19 Ω |
| Bidirectional Conduction | Yes |
| Encapsulamento | 2-X2SON, 0.6 mm × 0.3 mm |
| Package Family | Surface-mount SMD |
| Tipo de montagem | Surface mount |
| Orderable MPN | ESD451DPLR |
| Interface Application | USB 3.0 and other high-speed interfaces |
Configuração de pinos do ESD451DPLR
| Pino 1 | IO — Protected bidirectional I/O terminal |
| Pino 2 | GND — Ground or return terminal; exact terminal arrangement must be confirmed from the TI package drawing |
Aplicações típicas
ESD451DPLR é adequado para 6 aplicaçãos: USB 3.0 High-Speed Data Ports, Low-Voltage Communication Connectors, Audio and Headset I/O Protection, Mobile and Wearable Devices, Industrial Control and Measurement Interfaces, High-Speed Serial Interface Protection.
USB 3.0 High-Speed Data Ports
ESD451DPLR fits USB 3.0 and other high-speed data lines because its 0.5pF typical I/O capacitance limits the capacitive load added at the connector. Texas Instruments identifies USB 3.0 as an example interface for this device. Place the diode near the external connector and ground its ESD current before the trace reaches the host controller. Verify the complete channel capacitance, insertion-loss budget, and system ESD margin during validation.
Recomendado
Low-Voltage Communication Connectors
Use ESD451DPLR on communication lines exposed to user contact or cable discharge. Its bidirectional ±30kV IEC 61000-4-2 capability is useful for protecting low-voltage transceivers, while 0.5pF typical capacitance helps maintain signal integrity. Keep the protection path short and connect it to a suitable low-impedance return. System-level testing remains necessary because connector geometry and enclosure grounding determine the final ESD performance.
Recomendado
Audio and Headset I/O Protection
ESD451DPLR can protect exposed audio or headset I/O lines where electrostatic discharge could damage a codec, amplifier input, or connector interface. The device's bidirectional behavior covers both transient polarities, and its low 0.5pF typical capacitance helps avoid unnecessarily degrading high-bandwidth signals. Place it at the connector side and confirm that the protection device's clamp voltage is compatible with the audio signal amplitude and ground reference.
Recomendado
Mobile and Wearable Devices
The 0.6mm × 0.3mm 2-X2SON package is useful in mobile phones, wearables, and other compact products where board area is limited. ESD451DPLR combines compact placement with ±30kV IEC 61000-4-2 component protection and 0.5pF typical capacitance. Assembly teams should verify solder-paste volume, component orientation, and the availability of adequate copper for the ESD current path, especially near exposed buttons, connectors, and touch interfaces.
Recomendado
Industrial Control and Measurement Interfaces
Industrial systems with exposed cable or connector interfaces can benefit from the ESD451DPLR's bidirectional protection and low capacitance. The device helps protect sensitive logic without adding a large capacitive burden to the signal path. For industrial equipment, verify the enclosure, chassis, protective-earth, and cable-discharge strategy as well as the IC rating. The component rating alone does not replace an IEC-compliant system ESD design.
Recomendado
High-Speed Serial Interface Protection
ESD451DPLR is appropriate for many high-speed serial interfaces because its 0.5pF typical I/O capacitance reduces the reactive loading associated with ESD protection. The compact package can be placed close to a board edge or connector without occupying a large area. Designers should still evaluate trace impedance, return-path continuity, connector parasitics, and the cumulative capacitance of the complete interface before releasing the layout.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ESD451DPLR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ESD451 | ESD451DPLR.B | ULC0521CLV |
|---|---|---|---|---|
| Package | 2-X2SON (0.6mm × 0.3mm) | 2-X2SON option | 2-X2SON (0.6mm × 0.3mm) | DFN0603 package |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Diodes Incorporated |
Principais diferenciais
- Very low capacitance for high-speed protection (vs ULC0521CLV)
- High verified ESD withstand rating (vs ULC0521CLV)
- Compact 2-X2SON footprint (vs ULC0521CLV)
- Bidirectional I/O protection (vs ULC0521CLV)
Notas de projeto
Place ESD451DPLR immediately adjacent to the connector or board-entry point so the transient current is diverted before it reaches the protected interface. Keep the connector-to-diode trace short, use a continuous low-impedance return path, and avoid placing sensitive routing between the connector and protection device. The compact 2-X2SON footprint requires checking paste volume and solder-joint inspection rules.
Use the 0.5pF typical I/O capacitance as an input to the interface budget, not as a guarantee of zero signal impact. Validate edge rate, insertion loss, crosstalk, and timing with the complete connector, routing, and receiving device present. For very fast lines, minimize stub branches and maintain a controlled return path so the ESD device does not become an unintended discontinuity.
Do not select ESD451DPLR solely from its ±30kV component rating. Confirm that the normal line amplitude remains within the 5.5V working-voltage context, that the 9.5V typical clamp voltage is acceptable for downstream devices, and that the PCB ground or chassis path can carry the transient. Validate the final enclosure and cable arrangement with the applicable system-level ESD test.
The 0.6mm × 0.3mm package is optimized for compact surface-mount assemblies but is demanding for automated placement and inspection. Verify land-pattern dimensions against the latest Texas Instruments package drawing, use the manufacturer-recommended solder mask and paste design, and inspect for bridging between the two closely spaced terminals. Do not infer dimensions from a generic 0201 or DFN drawing.
Informações de conformidade
The verified data explicitly references IEC 61000-4-2 but does not provide extracted RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. These fields remain unknown rather than being inferred.
