FUSB340TMX - USB 3.1 10 Gbps 2:1 Data Switch | onsemi
N.º da peça: FUSB340TMX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.85 | $1,85 |
| 10 | $1.62 | $16,20 |
| 100 | $1.38 | $138,00 |
| 500 | $1.18 | $590,00 |
| 1.000 | $0.98 | $980,00 |
| 3.000 | $0.86 | $2.580,00 |
FUSB340TMX Visão geral
A USB 3.1 data switch is a high-speed analog multiplexer that routes SuperSpeed differential pairs (TX/RX) between two physical paths while preserving signal integrity at multi-gigahertz frequencies. As a Type-C accessory switch, it is one of several functional blocks in a USB Type-C implementation: Type-C controller -> high-speed data switch -> SBU/AUX switch -> USB-PD controller. The FUSB340TMX specifically occupies the high-speed data mux role, enabling USB-C reversible-cable operation in phones, tablets, and laptops.
Key features include 10 Gbps SuperSpeed Gen2 support, 2:1 switch topology, low insertion loss and return loss over the SuperSpeed frequency range, channel-to-channel skew designed for USB 3.1 compliance, and an operating range suitable for portable and battery-powered designs. The compact 2x2.8 mm TMLP package and minimal external component count simplify PCB layout in space-constrained mobile designs.
The FUSB340 uses an adaptive signal-path topology that maintains 50-ohm characteristic impedance in both the active and idle states to minimize reflections. The wide -3 dB bandwidth accommodates PCIe Gen3 (8 Gbps) and DisplayPort 1.3 (8.1 Gbps) RBR/HBR signalling with margin, making the part usable as a generic high-speed differential mux beyond strict USB roles.
Typical applications include USB Type-C reversible-cable multiplexers, mobile phone and tablet accessory switches, USB 3.1 Gen2 hub fan-out, notebook sideband routing, and Thunderbolt 3 alternate-mode signal multiplexing. The part is also used in docking stations that share USB SuperSpeed lines between multiple hosts.
When designing with the FUSB340TMX, keep the SuperSpeed differential traces length-matched to within 150 mils and route them over a continuous ground reference. Place the decoupling capacitor within 2 mm of the supply pin, and avoid routing any digital control lines directly under the high-speed traces to prevent crosstalk.
This page synthesizes distributor pricing, drop-in alternative parts from the same TI and Microchip ecosystems, and practical layout notes that are not present in the manufacturer datasheet.
Alternativas drop-in para FUSB340TMX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com FUSB340TMX (mesmo formato e footprint) — diferindo em Function, MSL Level, Maximum Data Rate, Number of Channels, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
TUSB542
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
HD3SS3212IRKSR
✅ Drop-In✓ Em estoque
$0.55 / unidade
Ver ficha técnica →FUSB340TMX Classificações máximas e características elétricas
| Função | USB 3.1 SuperSpeed 2:1 data switch |
| Switch Topology | 2:1 (high-speed differential) |
| Maximum Data Rate | 10 Gbps (USB 3.1 Gen2) |
| Supported Protocols | USB 3.1 Gen1/Gen2, PCIe Gen3, SATA, DisplayPort 1.3, Fibre Channel |
| Number of Channels | 1 differential pair per direction (SuperSpeed TX/RX) |
| Faixa de temperatura de operação | -40C to +85C |
| Encapsulamento | 18-TMLP (2x2.8 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Nível MSL | 1 (Unlimited) |
| Status RoHS | Compliant (ROHS3) |
| REACH Status | SVHC Unaffected |
| Lead-Free | Yes |
| Application Target | Mobile/Type-C reversible-cable accessory switch |
Configuração de pinos do FUSB340TMX
| Pino 1 | VCC — Positive supply input |
| Pino 2 | GND — Ground reference |
| Pino 3 | SEL — Channel-select control input |
| Pino 4 | NC — Not connected (per datasheet) |
| Pino 5 | RX1P — SuperSpeed RX path 1, positive |
| Pino 6 | RX1N — SuperSpeed RX path 1, negative |
| Pino 7 | RX2P — SuperSpeed RX path 2, positive |
| Pino 8 | RX2N — SuperSpeed RX path 2, negative |
| Pino 9 | GND — Ground reference |
| Pino 10 | TX2N — SuperSpeed TX path 2, negative |
| Pino 11 | TX2P — SuperSpeed TX path 2, positive |
| Pino 12 | TX1N — SuperSpeed TX path 1, negative |
| Pino 13 | TX1P — SuperSpeed TX path 1, positive |
| Pino 14 | GND — Ground reference |
| Pino 15 | COM_P — Common-side TX/RX positive |
| Pino 16 | COM_N — Common-side TX/RX negative |
| Pino 17 | NC — Not connected (per datasheet) |
| Pino 18 | EP — Exposed pad - thermal/ground, must be soldered |
Aplicações típicas
FUSB340TMX é adequado para 6 aplicaçãos: USB Type-C Reversible-Cable Mux, Mobile Phone and Tablet Accessory Switch, USB 3.1 Gen2 Hub Fan-Out, Notebook Sideband Routing, Docking Station USB-C Receptacle Sharing, Thunderbolt 3 Alternate-Mode Multiplexing.
USB Type-C Reversible-Cable Mux
The FUSB340TMX's 2:1 SuperSpeed mux topology is purpose-built for USB Type-C reversible-cable designs where the high-speed TX/RX pairs must be flipped depending on cable orientation. With 10 Gbps USB 3.1 Gen2 support it carries the full SuperSpeed channel between the receptacle and the application processor, while the Type-C CC controller (such as the FUSB302 or TUSB320) handles orientation detection and toggles the FUSB340's mux-select pin. Compared with a discrete mux, the FUSB340TMX is characterized for 90-ohm differential impedance and USB 3.1 eye-diagram compliance, reducing compliance-test risk. Designers typically place the part within 25 mm of the Type-C receptacle to keep high-speed trace loss below the Gen2 channel budget.
Recomendado
Mobile Phone and Tablet Accessory Switch
The FUSB340TMX is explicitly designed for the mobile device market where board area and BOM count are critical. Its 2.0 x 2.8 mm TMLP package occupies less than 6 mm^2 of PCB space and requires no external bias or termination components beyond a single decoupling cap. The 10 Gbps capability allows the same routing channel to be reused for USB 3.1 Gen2 peripherals, DisplayPort alternate-mode docking, and PCIe-based mobile storage accessories. In a typical smartphone reference design, the FUSB340TMX sits between the SoC's USB 3.1 PHY and the Type-C receptacle, allowing the SoC to enumerate a docked accessory at full 10 Gbps without an external mux.
Recomendado
USB 3.1 Gen2 Hub Fan-Out
In a USB 3.1 Gen2 hub, the FUSB340TMX can route SuperSpeed pairs between an upstream Type-C port and either the hub's downstream PHY or an alternate sideband path, allowing two upstream-facing ports to share a single 10 Gbps PHY with minimal channel-loss penalty. The part's adaptive signal-path topology keeps 50-ohm impedance in both active and idle states, which matters when one branch is parked at idle during single-cable docking scenarios. Combining two FUSB340TMX parts back-to-back is documented in onsemi's reference-layout application note for reversible 4-lane USB-C configurations.
Recomendado
Notebook Sideband Routing
Modern notebooks share the USB Type-C connector's high-speed pairs between USB 3.1, DisplayPort alternate-mode, and Thunderbolt 3 sideband signalling. The FUSB340TMX provides the 2:1 mux function to flip the SuperSpeed pairs based on the CC-logic-determined orientation and alternate-mode negotiation. Its 10 Gbps ceiling covers USB 3.1 Gen2 and DisplayPort 1.3 HBR3 (8.1 Gbps) headroom, allowing one mux part to handle multiple alternate-mode protocols. Placement near the Type-C receptacle with short 90-ohm differential traces is required to meet the notebook's strict radiated-emissions mask.
Recomendado
Docking Station USB-C Receptacle Sharing
In a docking station with two USB-C upstream ports, the FUSB340TMX lets one USB 3.1 Gen2 PHY serve both receptacles, with the active port selected by the CC controller. The 2:1 mux topology halves the high-speed mux BOM and simplifies PCB routing around the I/O cluster. Designers benefit from the FUSB340TMX's published -3 dB bandwidth extending past PCIe Gen3, meaning the same part can also switch DisplayPort 1.3 RBR/HBR traffic on the SBU/AUX pairs in advanced docking designs.
Recomendado
Thunderbolt 3 Alternate-Mode Multiplexing
Thunderbolt 3 and USB4 alternate-mode designs use a 2:1 high-speed mux to switch between USB 3.1 Gen2 and Thunderbolt/DisplayPort HBR3 signalling on the same Type-C pairs. The FUSB340TMX, rated for 10 Gbps and proven for DisplayPort 1.3, fits this role with margin to spare at Thunderbolt 3's 20 Gbps aggregate (using two FUSB340TMX parts in parallel for the four lanes). The exposed-pad TMLP package provides the low-inductance ground return required for the tight Thunderbolt 3 jitter budget.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para FUSB340TMX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | TUSB542 | HD3SS3212 |
|---|---|---|---|
| Brand | onsemi | Texas Instruments | Texas Instruments |
| Package | 18-TMLP (2x2.8 mm) | 18-pin TMLP - same footprint | 18-pin TMLP - same footprint |
| Function | USB 3.1 2:1 data switch | USB 3.1 2:1 data switch | USB 3.1 2:1 data switch |
| Maximum Data Rate | 10 Gbps | 10 Gbps | 10 Gbps |
| Switch Topology | 2:1 differential | 2:1 differential | 2:1 differential |
| Target Market | Mobile/Type-C reversible cable | PC/Type-C accessory | PC/Type-C Alt-Mode |
| Operating Temperature | -40C to +85C | 0C to +70C | -40C to +85C |
| Compliance Documentation | USB-IF (referenced) | TI compliance test reports | TI compliance test reports |
Principais diferenciais
- Mobile-first form factor in 2.0 x 2.8 mm TMLP (vs TUSB542)
- Extended -40C to +85C industrial temperature range (vs TUSB542)
- Broad multi-protocol documentation (USB/PCIe/SATA/DP/FC) (vs HD3SS3212)
Notas de projeto
Keep the 90-ohm differential SuperSpeed pairs as short as possible and route over a single unbroken ground reference plane. Length-match TX and RX pairs within 150 mils and maintain 3W spacing between pairs to minimize crosstalk. The exposed pad of the 18-TMLP must be soldered to a continuous ground pour with at least 4 thermal vias to the inner ground plane; unsoldered EP raises insertion loss by 1-2 dB at 5 GHz and degrades USB 3.1 Gen2 eye margin.
Place a 0.1 uF X7R decoupling capacitor within 2 mm of the FUSB340TMX supply pin and a 10 uF bulk capacitor at the mux's power node. Avoid sharing this decoupling loop with digital logic switching on the same rail - SuperSpeed muxes are sensitive to supply noise that translates directly into jitter and insertion-loss variation. Use a ferrite bead if the mux shares a rail with high-current digital blocks.
Verify USB 3.1 Gen2 eye-diagram compliance at production with a USB-IF fixture or a calibrated BERT. The FUSB340TMX datasheet provides S-parameters for the active channel; for an as-designed evaluation, run a 3D-EM simulation (HFSS, CST, or SiWave) and de-embed to verify insertion loss is below the 8.5-13 dB budget at 5 GHz depending on trace length. Skip stubs - via stubs beyond 100 mils add resonance that can close the eye at 5 GHz.
Do not route any digital control lines (SEL, I2C, GPIO) directly under the high-speed differential traces - even 5 mm of parallel digital trace adds coupling at 5 GHz. The SEL pin has setup-time requirements during USB-PD role-swap transitions; tie SEL to the CC controller with a short trace and consider a 10 kohm pull-down to ensure a defined default path if the CC controller is unpowered during boot.
Informações de conformidade
ROHS3 compliant per PartGenie compliance note. REACH SVHC unaffected per PartGenie compliance note. MSL 1 (Unlimited) per PartGenie. AEC-Q100 not applicable for commercial Type-C mobile application.
