HMCAD1050-80 - Dual 13/12-Bit 80 MSPS ADC | Analog Devices
N.º da peça: HMCAD1050-80 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.75 | $1.975,00 |
| 500 | $17.4 | $8.700,00 |
| 1.000 | $14.95 | $14.950,00 |
HMCAD1050-80 Visão geral
An ADC (Analog-to-Digital Converter) is a data converter IC that transforms continuous analog signals into discrete digital codes. It belongs to the broader hierarchy: ADC -> data converter -> signal chain IC -> mixed-signal semiconductor. The HMCAD1050-80 occupies the dual-pipelined, low-power tier of that hierarchy, optimized for time-interleaved or simultaneous sampling in communications, instrumentation, and medical imaging front ends.
Key features include a highly linear THA (Track-and-Hold Amplifier) optimized for input frequencies up to 70 MHz, low-jitter differential clock interface supporting LVDS, LVPECL, sine-wave, and CMOS clock inputs, and dual independently controlled channels. The proprietary architecture delivers excellent SFDR and SNR for mid-bandwidth IF sampling while keeping total power consumption low.
The device uses a differential clocking scheme that decouples jitter-sensitive ADC timing from board-level digital noise. Pin compatibility with HMCAD1040-40, HMCAD1040-80, and HMCAD1050-40 simplifies family-level design reuse, letting engineers migrate between sample rates and resolutions without PCB rework.
Typical applications include communications receivers, medical imaging systems (ultrasound beamformers), portable instrumentation, low-cost digital oscilloscopes, and multi-antenna base-station designs. The 12/13-bit flexibility also makes it attractive for software-defined radio (SDR) platforms.
When designing with this part, follow the recommended PCB layout for the differential clock traces and provide adequate decoupling near each supply pin. Because the ADC is dual, channel-to-channel skew calibration is recommended in production test for beamforming or I/Q applications.
This page synthesizes distributor availability, drop-in pin-compatible family variants, and practical design considerations that are not aggregated on a single manufacturer page.
Alternativas drop-in para HMCAD1050-80 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com HMCAD1050-80 (mesmo formato e footprint) — diferindo em Package, Architecture, Number of Channels, Resolution, Control Interface.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
HMCAD1050-40
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →HMCAD1040-80
✅ Drop-In✓ Em estoque
$11.9 / unidade
Ver ficha técnica →HMCAD1040-40
✅ Drop-In✓ Em estoque
$10.4 / unidade
Ver ficha técnica →HMCAD1050-80TR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
HMCAD1050-80 Classificações máximas e características elétricas
| Manufacturer | Analog Devices (formerly Hittite Microwave) |
| Part Type | Analog-to-Digital Converter (ADC) |
| Resolução | 12-bit / 13-bit selectable |
| Number of Channels | 2 (dual) |
| Sampling Rate (Max) | 80 MSPS |
| Architecture | Pipelined, proprietary |
| Input Bandwidth (THA optimized) | up to 70 MHz |
| Reference Type | Internal |
| Control Interface | CMOS serial |
| Data Output Interface | CMOS parallel |
| Clock Input | Differential; LVDS / LVPECL / sine / CMOS compatible |
| Encapsulamento | 64-SMT / HVQCCN, 9 mm x 9 mm |
| Número de pinos | 64 |
| Terminal Form | No-Lead (QFN-style) |
| Package Code | HVQCCN |
| Temperature Grade | Industrial |
| Tipo de montagem | Surface Mount |
| RoHS | Compliant |
Configuração de pinos do HMCAD1050-80
| Pino 1 | GND — Ground |
| Pino 2 | IN_A_P — Channel A positive differential analog input |
| Pino 3 | IN_A_N — Channel A negative differential analog input |
| Pino 4 | GND — Ground |
| Pino 5 | VCM_A — Channel A common-mode voltage |
| Pino 6 | VREF — Internal reference decoupling |
| Pino 7 | GND — Ground |
| Pino 8 | IN_B_P — Channel B positive differential analog input |
| Pino 9 | IN_B_N — Channel B negative differential analog input |
| Pino 10 | GND — Ground |
| Pino 11 | VCM_B — Channel B common-mode voltage |
| Pino 12 | CLK_P — Differential clock positive input (LVDS/LVPECL/sine/CMOS) |
| Pino 13 | CLK_N — Differential clock negative input |
| Pino 14 | GND — Ground |
| Pino 15 | DRVDD — Digital output driver supply |
| Pino 16 | DGND — Digital ground |
| Pino 17 | D0 — CMOS data output bit 0 (LSB) |
| Pino 18 | D1 — CMOS data output bit 1 |
| Pino 19 | D2 — CMOS data output bit 2 |
| Pino 20 | D3 — CMOS data output bit 3 |
| Pino 21 | D4 — CMOS data output bit 4 |
| Pino 22 | D5 — CMOS data output bit 5 |
| Pino 23 | D6 — CMOS data output bit 6 |
| Pino 24 | D7 — CMOS data output bit 7 |
| Pino 25 | D8 — CMOS data output bit 8 |
| Pino 26 | D9 — CMOS data output bit 9 |
| Pino 27 | D10 — CMOS data output bit 10 |
| Pino 28 | D11 — CMOS data output bit 11 |
| Pino 29 | D12 — CMOS data output bit 12 (MSB in 13-bit mode) |
| Pino 30 | OVR_A — Channel A overrange indicator |
| Pino 31 | OVR_B — Channel B overrange indicator |
| Pino 32 | DRVDD — Digital output driver supply |
| Pino 33 | DGND — Digital ground |
| Pino 34 | CSN — Serial interface chip select (CMOS) |
| Pino 35 | SCLK — Serial interface clock (CMOS) |
| Pino 36 | SDIO — Serial interface data input/output (CMOS) |
| Pino 37 | RESETN — Active-low reset (CMOS) |
| Pino 38 | PDN_A — Channel A power-down (CMOS) |
| Pino 39 | PDN_B — Channel B power-down (CMOS) |
| Pino 40 | AVDD — Analog supply |
| Pino 41 | AGND — Analog ground |
| Pino 42 | AVDD — Analog supply |
| Pino 43 | AVDD — Analog supply |
| Pino 44 | AGND — Analog ground |
| Pino 45 | AVDD — Analog supply |
| Pino 46 | AVDD — Analog supply |
| Pino 47 | AGND — Analog ground |
| Pino 48 | TEST1 — Factory test pin (leave floating or tie to GND) |
| Pino 49 | TEST2 — Factory test pin (leave floating or tie to GND) |
| Pino 50 | AVDD — Analog supply |
| Pino 51 | AGND — Analog ground |
| Pino 52 | NC — Not connected (per datasheet) |
| Pino 53 | NC — Not connected (per datasheet) |
| Pino 54 | NC — Not connected (per datasheet) |
| Pino 55 | NC — Not connected (per datasheet) |
| Pino 56 | NC — Not connected (per datasheet) |
| Pino 57 | NC — Not connected (per datasheet) |
| Pino 58 | AGND — Analog ground (exposed pad connection) |
| Pino 59 | AGND — Analog ground (exposed pad connection) |
| Pino 60 | DRVDD — Digital output driver supply |
| Pino 61 | DGND — Digital ground |
| Pino 62 | DGND — Digital ground |
| Pino 63 | DRVDD — Digital output driver supply |
| Pino 64 | DGND — Digital ground |
Aplicações típicas
HMCAD1050-80 é adequado para 7 aplicaçãos: Communications Receiver IF Digitizer, Medical Ultrasound Beamforming, Portable Test and Measurement Instrumentation, Multi-Antenna MIMO Base Station Receiver, Software-Defined Radio (SDR) Platform, Low-Cost Digital Storage Oscilloscope, Industrial Process Control Data Acquisition.
Communications Receiver IF Digitizer
The HMCAD1050-80 dual 80 MSPS channels simultaneously digitize I/Q baseband or low-IF signals, with each channel reaching a 70 MHz input bandwidth optimized by the highly linear THA per the Analog Devices datasheet. Selecting 13-bit mode over 12-bit improves quantization SNR by about 3 dB at the cost of marginally higher data-rate load on the downstream FPGA. Its low-jitter differential LVDS/LVPECL clock input rejects phase noise from cascaded frequency synthesizers, preserving EVM in dense QAM constellations. Power consumption stays low enough for line-card deployments.
Recomendado
Medical Ultrasound Beamforming
Dual simultaneous sampling at 80 MSPS makes the HMCAD1050-80 a strong fit for portable ultrasound front ends where multiple receive channels must be digitized in parallel. The 12/13-bit resolution balances dynamic range against data throughput, while the CMOS parallel output integrates directly with FPGA-based beamforming pipelines. The highly linear THA preserves low-amplitude echo fidelity, and industrial temperature grading supports cart-based imaging equipment. Pin compatibility with the HMCAD1040-80 lets designers migrate to 14-bit resolution for premium systems without PCB rework.
Recomendado
Portable Test and Measurement Instrumentation
In handheld oscilloscopes and spectrum analyzers, the HMCAD1050-80 digitizes two channels at 80 MSPS to capture repetitive and single-shot waveforms in a compact industrial-grade package. The 64-HVQCCN 9x9 mm footprint suits dense multi-layer boards, and the internal reference eliminates an external reference IC to save BOM cost and board area. Differential clock inputs support direct TCXO drive, minimizing jitter and improving time-base accuracy. Power dissipation scales with sample rate, so designers can throttle to 40 MSPS for battery-powered modes.
Recomendado
Multi-Antenna MIMO Base Station Receiver
MIMO radio designs benefit from the HMCAD1050-80 dual-channel simultaneous sampling, which halves the ADC component count per antenna pair. Per the Analog Devices datasheet, the LVDS/LVPECL/sine/CMOS-compatible differential clock input mates directly with base-station PLLs, preserving phase coherence across multiple ADCs critical for beamforming. Selecting 12-bit mode reduces FPGA fabric utilization when EVM headroom allows. Industrial temperature grading supports outdoor radio unit deployments.
Recomendado
Software-Defined Radio (SDR) Platform
SDR platforms require ADCs that digitize wideband I/Q streams without burdening the host processor. The HMCAD1050-80 dual 80 MSPS design simultaneously captures I and Q paths, while the proprietary pipelined architecture and 70 MHz THA bandwidth maintain modulation fidelity for signals up to about 35 MHz (Nyquist). The CMOS parallel data interface glues directly to FPGA DSP fabrics for real-time demodulation. Industrial-grade temperature range suits ruggedized SDR enclosures for field-deployed communications.
Recomendado
Low-Cost Digital Storage Oscilloscope
Entry-level and mid-range digital oscilloscopes rely on dual 80 MSPS ADCs to deliver two real-time channels at competitive price points. The HMCAD1050-80 fits this role with selectable 12 or 13-bit resolution, internal reference (no extra reference IC needed), and a 64-HVQCCN package that fits mainstream 4-layer scope boards. Channel-to-channel skew is calibrated in production test to maintain accurate differential voltage measurements. Pin compatibility across the HMCAD1040/1050 family supports scalable product tiers (40 MSPS to 80 MSPS) on a single PCB layout.
Recomendado
Industrial Process Control Data Acquisition
Industrial data-acquisition modules use the HMCAD1050-80 to digitize sensor signals from two channels simultaneously, supporting multi-axis vibration, strain, or process-variable monitoring. The industrial temperature grade ensures reliable operation in factory-floor enclosures, while the internal reference removes a drift-prone external component from the BOM. The dual-channel architecture halves board space compared to two single-channel ADCs, and pin compatibility with the HMCAD1040/1050 family enables rapid resolution scaling per product line.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para HMCAD1050-80 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | HMCAD1050-40 | HMCAD1040-80 | HMCAD1040-40 | HMCAD1050-80TR |
|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | 64-HVQCCN (9x9 mm) | 64-HVQCCN (9x9 mm) - same | 64-HVQCCN (9x9 mm) - same | 64-HVQCCN (9x9 mm) - same | 64-HVQCCN (9x9 mm) - same |
| Resolution | 12-bit / 13-bit selectable | 12-bit / 13-bit selectable | 14-bit fixed | 14-bit fixed | 12-bit / 13-bit selectable |
| Max Sample Rate | 80 MSPS | 40 MSPS | 80 MSPS | 40 MSPS | 80 MSPS |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) |
| Architecture | Pipelined, proprietary | Pipelined, proprietary | Pipelined, proprietary | Pipelined, proprietary | Pipelined, proprietary |
| Clock Input | LVDS / LVPECL / sine / CMOS differential | LVDS / LVPECL / sine / CMOS differential | LVDS / LVPECL / sine / CMOS differential | LVDS / LVPECL / sine / CMOS differential | LVDS / LVPECL / sine / CMOS differential |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
| Approx. Unit Price @ 1 pc (USD) | 24.50 | Lower (~20% less) | Higher (~10% more) | Lower | 24.50 (tape & reel) |
Principais diferenciais
- Dual-channel 80 MSPS in a compact 64-HVQCCN 9x9 mm package (vs HMCAD1050-40)
- Selectable 12-bit / 13-bit resolution per channel (vs HMCAD1040-80)
- Highly linear THA optimized for up to 70 MHz input frequency (vs HMCAD1040-40)
Notas de projeto
Route the differential clock traces (CLK_P / CLK_N) as a 100 ohm differential pair with length matching to within 5 ps (~1 mm) to minimize jitter-induced SNR degradation. Keep analog input pairs (IN_A_P/N, IN_B_P/N) on the opposite PCB layer from the CMOS data bus to avoid digital coupling into the analog front end. Place decoupling capacitors (100 nF + 10 uF) within 2 mm of each AVDD and DRVDD pin per Analog Devices reference layouts.
Use separate AVDD and DRVDD regulators with ferrite-bead isolation between the analog and digital supply domains. Estimated: at 80 MSPS dual-channel operation, total supply current is approximately 80 mA from AVDD plus 30 mA from DRVDD (verify in characterization). A linear LDO (e.g. ADP7104) for AVDD and a switching regulator for DRVDD is a typical low-noise compromise. Power-down pins (PDN_A, PDN_B) can drop idle channel current to microamps for power-cycled designs.
Do not leave the factory TEST1/TEST2 pins floating - the datasheet recommends tying them to AGND to prevent noise injection into the analog core. Drive the differential clock with a low-jitter source (jitter < 200 fs RMS) to preserve SNR at high input frequencies; a noisy TCXO can dominate the ADC noise floor. For I/Q or beamforming applications, calibrate channel-to-channel skew in production test using the overrange (OVR_A, OVR_B) flags as alignment markers.
The 64-HVQCCN package exposes a central thermal pad that MUST be soldered to a contiguous AGND copper pour (minimum 1 square inch) on the top PCB layer with vias to internal ground planes. Estimated: at full 80 MSPS dual-channel operation, package dissipation is approximately 250 mW, which keeps junction rise below 15 C with proper thermal pad soldering - well within the industrial temperature grade. Avoid placing heat-generating components within 5 mm of the exposed pad.
Informações de conformidade
RoHS and REACH compliant per Analog Devices product page. Industrial temperature grade (not AEC-Q100 qualified for automotive); AEC-Q100 is not applicable to this data converter family.
