ISL8200MIRZ-T - 10A DC/DC Power Module, 4.5-20V Input | Renesas
N.º da peça: ISL8200MIRZ-T ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $15.38 | $15,38 |
| 10 | $14.1 | $141,00 |
| 100 | $12.55 | $1.255,00 |
| 500 | $11.2 | $5.600,00 |
| 1.000 | $10.05 | $10.050,00 |
ISL8200MIRZ-T Visão geral
A DC/DC power module is a fully integrated point-of-load (PoL) switching regulator that places the controller, power stage, and most passive components inside one package. Compared with discrete buck regulator designs, modules simplify PCB layout, shrink the BOM, shorten time-to-market, and provide validated thermal performance with a defined exposed thermal pad. ISL8200MIRZ-T sits within the broader taxonomy of DC/DC switching converters > switching voltage regulators > power management ICs > semiconductors.
Key features include 4.5 V to 20 V wide VIN range, 0.6 V to 6 V adjustable VOUT (single resistor-set), 10 A continuous output, current-share mode for parallel operation up to 60 A, internal soft-start, thermal protection, and a PGOOD indicator. Programmable switching frequency (200 kHz to 600 kHz) supports efficiency and component-size optimization per design target.
The architecture is a voltage-mode synchronous buck converter with adaptive drivers and a current-share loop. The exposed-pad QFN package provides a thermal resistance around 17 C/W (per datasheet), supporting convection-cooled operation up to ~7 W dissipation on a 4-layer JEDEC JESD51 board. Internal compensation simplifies the external BOM to a few ceramic capacitors, a single VOUT setting resistor, and an enable pull-up.
Typical applications include FPGA/CPLD core and I/O voltage rails, datacom and telecom PoL supplies, baseband and DSP power, high-current ASIC rails, and industrial controller 3.3 V/5 V/6 V rails. The current-share feature also makes the part suitable for compute boards that need 30 A or more with N+1 redundancy.
When designing with the ISL8200MIRZ-T, place input/output ceramic capacitors close to the module's bond-pad islands and solder the exposed pad to at least 1 square inch of 2 oz copper to keep junction temperatures within the datasheet thermal envelope. Always validate ripple at the load using actual bulk capacitors, not the minimum values shown in the schematic.
This page integrates distributor pricing, pin-compatible alternatives, application guidance, and design notes not provided on the manufacturer datasheet summary, giving engineers a single source for both sourcing and design decisions.
Alternativas drop-in para ISL8200MIRZ-T — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ISL8200MIRZ-T (mesmo formato e footprint) — diferindo em Output Voltage Range, RoHS Status, Topology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ISL8200MIRZ
✅ Drop-In✓ Em estoque
$9.4 / unidade
Ver ficha técnica →ISL8200AM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ISL8225MIRZ-T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ISL8200MIRZ-T Classificações máximas e características elétricas
| Product Type | Non-Isolated PoL DC/DC Power Module |
| Topologia | Synchronous Buck Converter |
| Faixa de tensão de entrada | 4.5 V to 20 V |
| Faixa de tensão de saída | 0.6 V to 6 V |
| Corrente máxima de saída | 10 A continuous (up to 60 A via parallel current share) |
| Frequência de comutação | 200 kHz to 600 kHz (programmable) |
| Peak Efficiency | approximately 95% at 12 V to 3.3 V |
| Número de saídas | 1 |
| Current Sharing | Supported, up to 6 modules parallel (60 A) |
| Output Voltage Setting | Single external resistor |
| Faixa de temperatura de operação | -40 C to +85 C |
| Package Type | QFN-15 (15 mm x 15 mm) with exposed thermal pad |
| Package Code | MIRZ (Renesas designation) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Status RoHS | Compliant |
Configuração de pinos do ISL8200MIRZ-T
| Pino 1 | VIN — Input supply voltage |
| Pino 2 | VIN — Input supply voltage |
| Pino 3 | PGND — Power ground |
| Pino 4 | PGND — Power ground |
| Pino 5 | LX — Switching node / inductor connection |
| Pino 6 | LX — Switching node / inductor connection |
| Pino 7 | VOUT — Regulated output voltage |
| Pino 8 | VOUT — Regulated output voltage |
| Pino 9 | EN/PGOOD — Enable input and power-good output |
| Pino 10 | RT/SYNC — Switching frequency setting / sync input |
| Pino 11 | SHARE — Current-share bus |
| Pino 12 | VOS — Voltage output sense |
| Pino 13 | SGND — Signal ground |
| Pino 14 | SS — Soft-start control |
| Pino 15 | PGOOD — Power-good indicator |
Aplicações típicas
ISL8200MIRZ-T é adequado para 6 aplicaçãos: FPGA Core and I/O Rail Power, Datacom and Telecom Point-of-Load Regulation, ASIC and DSP Power Supply, Industrial Controller Card Power, Test and Measurement Instrumentation, High-Current Compute Board Rails.
FPGA Core and I/O Rail Power
The ISL8200MIRZ-T is well matched to FPGA core and I/O voltage rails because its 0.6 V to 6 V output range covers every rail used by Xilinx, Altera/Intel, and Lattice FPGAs (VCCINT, VCCAUX, MGTAVCC, VCCO). The integrated 10 A synchronous stage reaches approximately 95% efficiency at 12 V to 3.3 V conversion, reducing thermal pressure on densely populated FPGA boards. The built-in current-share bus allows two modules to be paralleled for 20 A rails such as the VCCINT of large Kintex or Virtex-class parts. Designers benefit from the module's internal compensation, which removes the manual Type-III loop tuning typical of discrete buck regulator designs and shortens time-to-prototype on complex multi-rail FPGA boards.
Recomendado
Datacom and Telecom Point-of-Load Regulation
The ISL8200MIRZ-T serves as a compact PoL regulator in 5 V and 12 V intermediate bus architectures common to datacom and telecom boards. Its 4.5 V to 20 V input range accepts the 5 V or 12 V backplane bus directly, while the 0.6 V to 6 V output covers all standard server and switch ASIC core voltages. The current-share feature lets multiple modules feed high-current ASICs with N+1 redundancy, a typical requirement in carrier-grade gear. Internal soft-start and PGOOD simplify ASIC power-sequencing: connect PGOOD to the next rail's enable through a logic inverter for cascaded turn-on, eliminating the need for an external sequencer IC.
Recomendado
ASIC and DSP Power Supply
DSPs and high-performance ASICs often require tightly regulated 1.0 V to 1.8 V cores at 6 A to 10 A, an exact match for a single ISL8200MIRZ-T configured at 600 kHz switching frequency. The module's tight output accuracy and low output ripple keep DSP SNR budgets intact, particularly on ADCs and DACs adjacent to the DSP. Renesas documentation notes approximately 90% efficiency at 12 V to 1.8 V conversion around half-load, reducing heat dissipation and improving MTBF in fanless industrial designs. The internal current-mode control loop also provides good line-transient response, important when the upstream 12 V rail is shared with transient loads.
Recomendado
Industrial Controller Card Power
Industrial PLC and controller cards typically run on 24 V backplanes. With its 4.5 V to 20 V input range plus the documented ability to handle brief 24 V transients in some applications, the ISL8200MIRZ-T can still serve on 12 V or 18 V intermediate distributions common in industrial controllers. The single-resistor VOUT setting simplifies the BOM and rework on multi-voltage PLC designs where different rails are populated per variant. The exposed thermal pad and 4-layer PCB layout guidance yield reliable 85 C operation at full 10 A output, matching the -40 C to +85 C industrial spec.
Recomendado
Test and Measurement Instrumentation
Test equipment such as bench power supplies, signal analyzers, and data acquisition boards benefit from the ISL8200MIRZ-T's compact 15 mm x 15 mm area, which leaves room for dense analog front-ends. The module's low output ripple (typically <10 mV pk-pk at 1.5 V output with proper ceramic bypass) does not contaminate sensitive ADC reference rails, while its 0.6 V minimum supports low-voltage modern DACs. Designers can place the module close to the load on the same side of the PCB, minimizing loop area for cleaner measurements.
Recomendado
High-Current Compute Board Rails
By paralleling up to six ISL8200MIRZ-T modules, designers build a 60 A point-of-load rail for the most demanding compute ASICs (GPUs, large FPGAs, network processors). Each module's master/slave current-share loop balances the load automatically, so no external current-share controller is needed. The shared internal architecture ensures consistent loop response between modules, avoiding the dynamic-current sharing problems seen when paralleling discrete regulators. Two parallel modules suffice for the typical 20 A VRM rail of a mid-range FPGA + SoC compute card.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ISL8200MIRZ-T — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ISL8200MIRZ | ISL8200AM | ISL8225MIRZ-T | TPSM84824 |
|---|---|---|---|---|---|
| Package | QFN-15 (15 x 15 mm, MIRZ) | QFN-15 (15 x 15 mm, MIRZ) - same | QFN-15 (15 x 15 mm) - same | QFN-15 (15 x 15 mm, MIRZ) - same | microSiP - DIFFERENT footprint, NOT pin-compatible |
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Texas Instruments |
| Topology | Single 10 A buck module | Single 10 A buck module | Single 10 A buck module (generation update) | Dual 5 A buck module (10 A total) | Single 8 A buck |
| Maximum Output Current | 10 A (60 A parallel) | 10 A (60 A parallel) | 10 A (60 A parallel) | 2 x 5 A (10 A total) | 8 A |
Principais diferenciais
- Integrated 10 A power stage with internal compensation (vs Discrete buck regulator solutions)
- Built-in current-share bus for parallel operation up to 60 A (vs Single-module discrete regulators)
- Wide 4.5 V to 20 V input range in one QFN package (vs TPSM84824 (8 A only))
Notas de projeto
The ISL8200MIRZ-T 15 mm x 15 mm exposed-pad QFN enables effective heatsinking through the PCB. The Renesas datasheet reports approximately 17 C/W theta_JA on a 4-layer JEDEC JESD51 board, so at 5 W dissipation the junction rises about 85 C. For continuous 10 A operation at 12 V to 3.3 V (about 5.5 W dissipation worst case) at 85 C ambient, route the exposed pad to at least 1 square inch of 2 oz copper on top and an inner layer, and add thermal vias in a 1.2 mm pitch grid under the pad.
Place input and output ceramic capacitors within 100 mil of the module's bond-pad islands to minimize AC loop area. Use 22 microfarad or larger X7R ceramic on VIN plus two 10 microfarad ceramic capacitors at the load. The switching node (LX) should be kept short and isolated from sensitive analog traces; maintain at least 50 mil clearance. Per the Renesas layout guide, the exposed pad must be soldered to a continuous copper plane for both thermal and electrical ground.
Do not populate the SHARE pin if the module is used standalone - leave it floating or tied to SGND through a 100 kilohm resistor to disable current-share mode. Erroneously tying SHARE to VIN forces the module into slave mode and disables output regulation. Also avoid using Y5V or Z5U ceramic capacitors on the output: their capacitance drops significantly under DC bias and causes loop instability under load steps.
Informações de conformidade
RoHS compliant per Renesas product page and ordering information. MSL-3 moisture sensitivity. Not AEC-Q100 qualified (industrial-grade component, not automotive). Halogen-free status not explicitly stated in extracted snippets; default unknown per data authenticity rules.
