ISL8200MIRZ - 10A Current-Share DC/DC Power Module | Renesas
MPN: ISL8200MIRZ ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $15.38 | $15.38 |
| 10 | $13.85 | $138.50 |
| 100 | $12.1 | $1,210.00 |
| 500 | $10.55 | $5,275.00 |
| 1,000 | $9.4 | $9,400.00 |
ISL8200MIRZ Overview
**Background - What is a DC/DC Power Module?** A DC/DC power module is a complete switch-mode power supply (SMPS) miniaturized into a single IC-style package. Unlike a discrete buck converter, which requires the engineer to select and lay out external MOSFETs, an inductor, and compensation components, a power module embeds all these building blocks inside the device, leaving only input/output bulk capacitors and a feedback resistor divider external. Power modules belong to the broader category of point-of-load (PoL) converters, which sit on the PCB next to the load they power (FPGA core rail, ASIC, SoC). Within the SMPS family tree, a power module sits below the buck converter hierarchy: buck converter -> step-down regulator -> PoL converter -> power module -> integrated power management IC.
**Key features** of the ISL8200MIRZ include 10A continuous output current, current-share pin for parallel operation up to 60A (six modules), internal 4.5V/20V MOSFETs, internal inductor, internal feedback compensation, adjustable soft-start, power-good indicator, and over-current/over-voltage/thermal protection. The high level of integration eliminates the design and manufacturing risks associated with discrete buck implementations.
**Technical architecture**: The ISL8200MIRZ uses a voltage-mode PWM controller with internal loop compensation. The internal MOSFETs and inductor are co-packaged to minimize parasitic loop inductance, achieving high efficiency (typically >90% at 5V input to 3.3V output at moderate loads) and reduced EMI. The current-share bus allows multiple ISL8200M modules to operate in master-slave configuration with ±10% current matching.
**Typical applications** include datacom/telecom equipment (48V-to-PoL), FPGA/ASIC core and auxiliary rails, servers and storage area networks, and industrial point-of-load regulation. Designers favor it where PCB real estate is constrained or where rapid time-to-market outweighs the per-ampere cost of a discrete design.
**Design consideration**: Place input bulk capacitors within 5 mm of the module's VIN pins to minimize parasitic inductance, and use the exposed thermal pad for both thermal dissipation and the electrical ground return. The current-share pin must be tied together on all paralleled modules; floating it disables parallel operation.
**Unique value**: This page combines distributor pricing, EOL/last-time-buy status, same-family pin-compatible alternatives, and practical parallel-operation notes - information not consolidated on the manufacturer datasheet or distributor product pages.
Drop-in alternatives for ISL8200MIRZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ISL8200MIRZ (same form factor and footprint) — differing in Output Voltage Range, RoHS Status, Topology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ISL8200MIRZ-T
✅ Drop-In✓ In Stock
$10.05 / Unit
View Datasheet →ISL8200AM
✅ Drop-In📋 Reference alternative (not in catalog)
ISL8225MIRZ-T
✅ Drop-In📋 Reference alternative (not in catalog)
ISL8200MIRZ Maximum Ratings & Electrical Characteristics
| Topology | Non-Isolated PoL Module, Step-Down (Buck) |
| Number of Outputs | 1 |
| Input Voltage Range | 4.5 V to 20 V |
| Output Voltage Range | 0.6 V to 6 V (adjustable) |
| Output Current | 10 A continuous |
| Current Share | Yes - parallel up to 6 modules (60 A) |
| Efficiency | Up to ~95% (load/input dependent) |
| Integrated Components | PWM controller, MOSFETs, inductor, compensation |
| Power Good Output | Yes |
| Soft-Start | Adjustable (external capacitor) |
| Protection Features | OCP, OVP, OTP, UVLO |
| Operating Temperature | -40 C to +85 C (industrial) |
| Package | QFN-style thermally-enhanced surface mount |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per Renesas product page) |
ISL8200MIRZ qfn-style thermally-enhanced surface mount Pin Configuration Guide
Pin configuration for ISL8200MIRZ (qfn-style thermally-enhanced surface mount package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for ISL8200MIRZ.
Refer to the datasheet for full pin configuration.
Typical Applications
ISL8200MIRZ is suitable for 6 applications: FPGA Core and Auxiliary Rails, Datacom and Telecom Point-of-Load, Server and Storage ASIC Power, Industrial 12V Bus Systems, Parallel Operation for 60A+ Rails, Test and Measurement Instrumentation.
FPGA Core and Auxiliary Rails
The ISL8200MIRZ is well matched to powering FPGA core, auxiliary, and transceiver rails in datacom and telecom designs. The 10A continuous current and adjustable 0.6V-6V output range cover the typical FPGA rail set: 1.0V core, 1.8V auxiliary, 2.5V transceiver, and 3.3V I/O. The current-share pin enables multiple ISL8200M modules to be paralleled for high-current FPGA cores (>10A), achieving ±10% phase-to-phase current matching without external balancing ICs. Engineers favor this module when PCB real estate is constrained because the integrated inductor, MOSFETs, and compensation eliminate ~20 external components. Post-EOL, the ISL8200AM should be evaluated as an active successor.
Recommended
Datacom and Telecom Point-of-Load
The ISL8200MIRZ was designed specifically for 12V intermediate bus architectures used in datacom and telecom equipment. Accepting 4.5V-20V input, it can be powered directly from a 12V bus or from a front-end 48V-to-12V intermediate bus converter. The 0.6V minimum output supports modern ASIC and SoC core rails, while the 10A capability handles single-rail loads up to ~60W. The high level of integration reduces EMI vs. discrete buck designs, simplifying CE/FCC compliance in dense rack-mount systems.
Recommended
Server and Storage ASIC Power
Server motherboards and RAID controllers demand compact, high-efficiency point-of-load regulation. The ISL8200MIRZ's 90-95% typical efficiency at 12V-to-3.3V conversion keeps thermal rise manageable in 1U/2U rack chassis, and the integrated inductor eliminates a tall through-hole component that would otherwise complicate airflow. The exposed thermal pad provides direct heatsinking to an inner PCB ground plane. Designers of new server boards should note the EOL status and plan migration to the ISL8200AM or a modern alternative PoL IC.
Recommended
Industrial 12V Bus Systems
Industrial PLCs, motor controllers, and ruggedized embedded systems often use a 12V or 24V internal bus. The ISL8200MIRZ accepts up to 20V input, which fits directly off a regulated 12V rail but is below the typical 24V industrial bus voltage. For 24V industrial bus applications, a pre-regulator (24V-to-12V) is required before the ISL8200M. The -40C to +85C industrial temperature range supports harsh factory environments. After the April 2026 EOL, industrial customers should qualify the ISL8200AM or a non-pin-compatible alternative module.
Recommended
Parallel Operation for 60A+ Rails
Up to six ISL8200MIRZ modules can be paralleled via the current-share pin to deliver 60A (or more) to a single high-current rail, making the module useful for ASICs, GPUs, and multi-core processors requiring >50W of core power. The ISHARE bus negotiates master/slave roles automatically, achieving ±10% current matching. Designers must tie the ISHARE pins of all paralleled modules together on the PCB and provide adequate input/output bulk capacitance to handle the combined inrush current at startup. This is a key differentiator vs. discrete PoL solutions which require an external current-share controller.
Recommended
Test and Measurement Instrumentation
Bench-top test equipment, ATE systems, and laboratory instruments demand clean, low-noise rails for precision analog and mixed-signal subsystems. The ISL8200MIRZ provides a fixed-frequency PWM that produces predictable, repeatable EMI signatures, simplifying CE/FCC pre-compliance testing. The PGOOD output enables sequenced power-up of multi-rail instruments, while the adjustable soft-start controls inrush into downstream bulk capacitors. For new instrument designs after EOL, the ISL8200AM offers similar performance in active production status.
Recommended
Recommended Products Summary
Engineering reference data for ISL8200MIRZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ISL8200MIRZ-T | ISL8200AM | ISL8225MIRZ-T |
|---|---|---|---|---|
| Brand | Renesas Electronics (formerly Intersil) | Renesas Electronics - same | Renesas Electronics - same | Renesas Electronics - same |
| Package | QFN-style thermally-enhanced SMD | QFN-style thermally-enhanced SMD - same | QFN-style thermally-enhanced SMD - same family | QFN-style thermally-enhanced SMD - same family |
| Lifecycle Status | Obsolete (EOL April 2026) | Obsolete (EOL April 2026) | Active (Renesas recommended successor) | Active (same family) |
| Pinout Compatibility | Reference design | Identical (same die) | Same family, verify pin-by-pin vs datasheet | Same family dual-output variant, different pinout - requires PCB review |
Key Differentiators
- Same-die drop-in option still purchasable (vs ISL8200MIRZ-T)
- Active lifecycle status in same family (vs ISL8200AM)
- Fully integrated PoL module (controller + FETs + magnetics) (vs Discrete buck converter designs)
Design Notes
The ISL8200MIRZ uses a thermally-enhanced QFN-style package with a bottom-side exposed thermal pad. The pad MUST be soldered to the PCB ground plane, and the ground plane should extend as a copper pour beneath the module with thermal vias to inner/outer copper layers. At 10A load with 12V-to-3.3V conversion (~87% efficiency), the module dissipates approximately 1.3W - well within the package rating with proper PCB layout. Skipping the thermal pad solder connection or omitting the copper pour can push junction temperature above the +125C limit at high ambient temperatures.
Place input bulk capacitors within 5mm of the module's VIN pins and output capacitors within 5mm of VOUT, using wide copper traces or pours to minimize parasitic inductance. A 22uF ceramic + 100uF polymer aluminum combination per module is a typical starting point; derate capacitance based on DC bias of the ceramic. The exposed thermal pad must be grounded and stitched with thermal vias (typically 0.3mm drill, 1mm pitch, 9-12 vias minimum).
Three common pitfalls when using the ISL8200MIRZ: (1) Floating the ISHARE pin disables parallel operation - when using a single module, tie ISHARE to a defined voltage per datasheet (do not leave NC); (2) Exceeding 20V input triggers permanent MOSFET damage - add a TVS or upstream fuse for 24V industrial bus applications; (3) Post-April 2026 EOL, verify part date code and chain-of-custody from independent distributors to avoid counterfeit or remarked parts.
The ISL8200MIRZ was discontinued by Renesas in April 2026 per industry reporting. No pin-compatible drop-in successor has been released. For new designs, Renesas recommends the ISL8200AM (active status, same 10A/6V/20V family). Cross-brand alternatives (TI TPSM, ADI LTM series) require complete PCB redesign due to different pinouts. Last-time-buy inventory may be available from independent distributors but should be qualified and date-coded before use in production designs.
Compliance Information
RoHS and REACH compliance per Renesas/Intersil product page. Not AEC-Q100 qualified - this is a commercial/industrial-grade power module, not an automotive part. Post-EOL, compliance certificates for new manufacturing lots are no longer issued; existing inventory retains the compliance status it was originally qualified under.
