LCMXO3L-1300E-5UWG36C - 1280 LUT MachXO3 FPGA, 36-WLCSP | Lattice
N.º da peça: LCMXO3L-1300E-5UWG36C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.5 | $7,50 |
| 10 | $6.85 | $68,50 |
| 100 | $5.95 | $595,00 |
| 500 | $5.4 | $2.700,00 |
| 1.000 | $4.95 | $4.950,00 |
| 3.000 | $4.5 | $13.500,00 |
LCMXO3L-1300E-5UWG36C Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable routing, and I/O cells that can be reconfigured after manufacturing. Within the FPGA family hierarchy, the MachXO3L sits as a 'control PLD' sub-category bridging traditional CPLDs and high-density FPGAs, optimized for low-static-power always-on logic. From a system-level perspective, this positions MachXO3L between pure CPLDs (such as Lattice's ispMACH 4000) and high-density SRAM FPGAs (such as Lattice ECP5 or Xilinx Artix-7), making it well suited for I/O expansion, peripheral bridging, and power-sequencing roles.
Key features of the LCMXO3L-1300E-5UWG36C include 1280 LUT4 logic elements, 64 Kbits of embedded SRAM, 28 user I/O pins, support for multiple I/O standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V and LVDS, and on-chip non-volatile configuration memory enabling instant-on functionality. The device integrates features typically requiring external components: a hardened I2C, SPI, and timer/counter block, plus built-in PLLs and flexible I/O banks. The 36-ball WLCSP provides the smallest possible footprint for space-constrained designs such as wearables, IoT edge devices, mobile platforms, and camera modules.
From an architectural standpoint, the MachXO3L uses Lattice's proprietary non-volatile cell technology combined with a low-power 65 nm process. This eliminates the need for external boot memory and provides instant-on behavior (typically <1 ms wake-up), which is required in applications such as power-supply sequencing, system-reset fan-out, and LED control. The device also includes built-in support for Lattice's Diamond or Lattice Propel/Lattice Radiant design environments, and IP libraries for common interfaces.
Typical applications for the LCMXO3L-1300E-5UWG36C include I/O expansion and voltage-translation bridges between processors and peripherals, LED driving and animation in consumer products, glue logic in industrial control boards, and low-power control PLD roles in always-on subsystems. The small WLCSP package is also well suited to camera and image-sensor modules where board real estate is at a premium.
When designing with this part, note that the 36-ball WLCSP requires careful PCB layout - an appropriate NSMD land pattern with via-in-pad or microvia technology is typically required for reliable assembly. For prototype work, consider using the pin-compatible LCMXO3L-1300E-5UWG36CTR (tape and reel packaging variant) for the same silicon. The commercial temperature grade limits the device to 0 °C to +85 °C ambient; for industrial deployments select the IT-suffix variant.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a single source for engineers evaluating the LCMXO3L-1300E-5UWG36C for new designs or as a replacement for legacy control PLDs.
Alternativas drop-in para LCMXO3L-1300E-5UWG36C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LCMXO3L-1300E-5UWG36C (mesmo formato e footprint) — diferindo em Configuration Memory, Mounting Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LCMXO3L-1300E-5UWG36CTR
✅ Drop-In✓ Em estoque
$3.55 / unidade
Ver ficha técnica →LCMXO3L-1300E-5UWG36CTR1K
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3L-1300E-5UWG36CTR50
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3L-1300E-5UWG36ITR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-1300E-5UWG36C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3L-1300E-5UWG36C Classificações máximas e características elétricas
| Family | MachXO3L |
| Logic Elements / LUTs | 1280 |
| Total RAM Bits | 65536 |
| Number of User I/O | 28 |
| Number of LABs / CLBs | 160 |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| Encapsulamento | 36-ball WLCSP (UWG) |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Commercial (C) |
| Temperatura de operação | 0 °C to +85 °C |
| Configuration Memory | Non-volatile (built-in flash) |
| I/O Standards Supported | LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVDS |
| Embedded Hard IP | I2C, SPI, timer/counter, PLL |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do LCMXO3L-1300E-5UWG36C 36-ball wlcsp (uwg)
Configuração de pinos para LCMXO3L-1300E-5UWG36C (pacote 36-ball wlcsp (uwg)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LCMXO3L-1300E-5UWG36C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LCMXO3L-1300E-5UWG36C é adequado para 6 aplicaçãos: I/O Expansion and Voltage Translation Bridge, LED Driving and Animation in Consumer Products, Glue Logic in Industrial Control Boards, Always-On Control PLD in IoT Edge Devices, Camera and Image-Sensor Module Control, Power-Supply Sequencing and Reset Fan-Out.
I/O Expansion and Voltage Translation Bridge
The LCMXO3L-1300E-5UWG36C fits I/O expansion and voltage-translation bridge roles because it provides 28 user I/Os across multiple LVCMOS standards (1.2/1.5/1.8/2.5/3.3 V) plus LVDS, allowing a single low-pin-count MPU to connect to sensors, FPGAs, or peripherals operating at different voltage domains. Its 1280 LUTs deliver sufficient capacity for 8-bit/16-bit bus multiplexing, address-latch fan-out, and reset-sequencing glue logic without consuming any software CPU cycles. Placed near the SoC with a 100 nF decoupling per VCCIO bank, the device replaces multiple discrete level shifters and 74-series buffers, shrinking BOM cost and PCB area. Compared with a discrete logic implementation the LCMXO3L is reprogrammable, allowing last-minute pin reassignment.
Recomendado
LED Driving and Animation in Consumer Products
The LCMXO3L-1300E-5UWG36C suits LED driving and animation because its non-volatile instant-on configuration brings up the LED pattern within 1 ms of power-on, matching the instant-response requirement of consumer appliances. The 28 user I/Os can drive multiple LED channels with PWM dimming generated by the on-chip timer/counter hard IP, freeing the host MCU from software PWM interrupts. The 36-ball WLCSP occupies under 12 mm² of board space, ideal for thin LED controllers in PCBs, gaming peripherals, and decorative products. Estimated: at 10 MHz internal clock and 8-bit PWM resolution the device supports up to 28 simultaneous LED channels with sub-microsecond step resolution.
Recomendado
Glue Logic in Industrial Control Boards
The LCMXO3L-1300E-5UWG36C integrates industrial control glue logic because its 1280 LUTs replace dozens of 74-series logic gates on a single 36-ball WLCSP, dramatically reducing PCB complexity. The integrated I2C and SPI hard IP blocks enable side-band communication with sensors and HMI displays without consuming host MCU UART/SPI peripherals. The hardened PLLs let the device generate skew-adjusted clocks for ADCs and motor-control timers. Placed near the industrial MCU and the field-side isolation barrier, the MachXO3L provides deterministic <1 ms power-on for safe-state initialization before MCU firmware runs.
Recomendado
Always-On Control PLD in IoT Edge Devices
The LCMXO3L-1300E-5UWG36C acts as an always-on control PLD in IoT edge devices because its 65 nm low-power process and instant-on non-volatile memory keep power consumption under 1 mW static while remaining responsive to wake events. The 1280 LUTs can monitor a sensor interrupt line, debounce a push-button, and wake the host MPU via GPIO without any host software overhead. With 65536 bits of embedded SRAM the device can buffer small packets before the main application processor is fully awake. Deployed alongside a Bluetooth or Wi-Fi module, it provides reliable wake-up and battery-management support for low-duty-cycle IoT endpoints.
Recomendado
Camera and Image-Sensor Module Control
The LCMXO3L-1300E-5UWG36C fits camera and image-sensor modules because its 36-ball WLCSP occupies only 3.4 × 3.4 mm, the smallest package in the MachXO3 family, ideal for sensor PCBs where every mm² counts. The device can fan-out a CSI-2 clock, perform MIPI-to-LVDS bridging (via the hard PLL and I/O serdes), and sequence the sensor's reset, power-down, and standby pins. Its 28 user I/Os support a multi-sensor array configuration. Deployed in wearable cameras, machine-vision modules, and AR/VR sensor stacks, the MachXO3L replaces multiple discrete timing chips with a single reconfigurable device.
Recomendado
Power-Supply Sequencing and Reset Fan-Out
The LCMXO3L-1300E-5UWG36C handles power-supply sequencing and reset fan-out because its non-volatile instant-on behavior guarantees deterministic power-up before the host SoC and peripherals are released from reset. The 28 user I/Os can drive individual enable and reset lines for voltage regulators, signal-conditioners, and PHYs, with sequence timing implemented in LUT logic. The integrated I2C and SPI hard IP enables read-back of voltage-rail status from digital power monitors for fault logging. Estimated: a typical 6-rail sequencing sequence at 10 ms intervals uses under 100 LUTs, leaving abundant headroom for additional housekeeping logic.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LCMXO3L-1300E-5UWG36C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LCMXO3L-1300E-5UWG36CTR | LCMXO3L-1300E-5UWG36CTR1K | LCMXO3L-1300E-5UWG36CTR50 | LCMXO3L-1300E-5UWG36ITR | LCMXO3LF-1300E-5UWG36C |
|---|---|---|---|---|---|---|
| Package | 36-ball WLCSP (UWG) | 36-ball WLCSP (UWG) - same | 36-ball WLCSP (UWG) - same | 36-ball WLCSP (UWG) - same | 36-ball WLCSP (UWG) - same | 36-ball WLCSP (UWG) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor - same | Lattice Semiconductor - same | Lattice Semiconductor - same | Lattice Semiconductor - same | Lattice Semiconductor - same |
| LUT Count | 1280 | 1280 | 1280 | 1280 | 1280 | 1280 |
| Embedded SRAM Bits | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same | Industrial (-40C to +100C) | Commercial (0C to +85C) - same |
| Packaging Format | Tray | Tape & Reel (250/reel) | Tape & Reel (1000/reel) | Tape & Reel (50/reel) | Tape & Reel | Tray |
| Hardened MIPI D-PHY | No | No | No | No | No | Yes |
| DDR Memory Controller IP | No | No | No | No | No | Yes |
Principais diferenciais
- Same-family LCMXO3LF feature upgrade path on the same footprint (vs LCMXO3LF-1300E-5UWG36C)
- Industrial temperature grade option available (vs LCMXO3L-1300E-5UWG36ITR)
- Tape-and-reel packaging variants for production scale (vs LCMXO3L-1300E-5UWG36CTR1K)
Notas de projeto
The 36-ball UWG WLCSP uses a 0.4 mm ball pitch and requires an NSMD land pattern with via-in-pad or microvia technology for reliable assembly. Per Lattice application note AN8066, the recommended stencil aperture is 1:1 to the pad with a 100 µm-thick stencil, and the PCB should specify ENIG or OSP surface finish. A 'dog-bone' fan-out pattern is acceptable for prototypes but via-in-pad is preferred for production to avoid solder-bridge risk on adjacent balls.
Decouple each VCCIO bank with a 100 nF ceramic capacitor placed within 5 mm of the package ball, and add a 4.7 µF bulk capacitor on the VCC core rail. The 1.2 V core supply must ramp monotonically; if the system requires sequencing between VCC and VCCIO banks, the MachXO3L can hold its outputs in tri-state until both rails are stable by leaving PROGRAM_N low during ramp. Per the datasheet, the device draws approximately 1 mA of static current plus I/O-bank-dependent dynamic current.
Do not confuse the LCMXO3L (logic-optimized, no MIPI/DDR hard IP) with the LCMXO3LF (feature-rich, with MIPI and DDR hard IP) when ordering - they share the same UWG36 ball-out but the 'F' suffix indicates additional hard IP blocks. Also note that the commercial 'C' grade (0 °C to +85 °C) and the industrial 'I' grade (-40 °C to +100 °C) have different qualification levels - choose I grade for outdoor, automotive, or industrial deployments. Programming requires a Lattice HW-USBN-2A cable and Diamond or Propel software.
Keep the JTAG pins (TDI, TDO, TMS, TCK) routed with no more than 25 mm of trace length and protected by a 4.7 kΩ pull-up on TCK/TMS/TDI per the Lattice programming guide. For high-speed LVDS pairs, match the positive and negative trace lengths within 0.5 mm and reference them over a continuous ground plane on an adjacent layer. Avoid routing I/O signals across the WLCSP substrate shadow on inner layers to minimize coupling.
Informações de conformidade
RoHS and REACH compliance per Lattice product page. Not AEC-Q100 qualified - for automotive applications select the AEC-Q100 qualified variant if available or upgrade to the LCMXO3LF sub-family. The 'C' suffix denotes commercial temperature grade (0C to +85C); industrial applications should use the 'I' suffix variant.
