LFE2-6E-5F256C - 6K Lattice ECP2 FPGA, 190 I/O | Lattice
N.º da peça: LFE2-6E-5F256C ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
LFE2-6E-5F256C Visão geral
An FPGA is a programmable digital integrated circuit that can be configured after manufacture to implement logic, state machines, interfaces, and parallel processing functions. The LFE2 family belongs to the broader field-programmable logic and semiconductor hierarchy. Compared with a fixed-function application-specific integrated circuit, an FPGA allows design changes to be implemented through configuration rather than a new silicon layout, making it useful for prototypes, industrial equipment, communications infrastructure, and embedded systems.
The LFE2-6E-5F256C provides 6,000 logic elements organized into 750 logic array blocks and includes 56,320 total RAM bits. The verified distributor data identifies 190 user I/O, a 1.2 V supply class, and a 256-FPBGA package measuring 17 x 17 mm. These resources make the device suitable for designs requiring parallel control logic, moderate memory buffering, protocol bridging, and programmable digital signal processing. Lattice ECP2 devices are also positioned for designs that need flexible logic density without the scale of a larger FPGA.
The 90 nm ECP2 implementation combines programmable logic with advanced DSP blocks; high-speed SERDES capability is associated with the ECP2M family rather than being assumed for every ECP2 member. For the LFE2-6E-5F256C specifically, design engineers should use the manufacturer datasheet and package documentation to confirm configuration, I/O standards, clocking, power, and exposed-ball assignments before layout.
Typical applications include industrial control systems, communications and protocol interfaces, embedded instrumentation, audio and general digital signal processing, data acquisition front ends, and compact embedded processors. Its 190 I/O and 56,320 RAM bits allow the FPGA to connect external memory or peripherals while offloading time-critical logic from a host processor. The 256-pin FBGA footprint also requires careful PCB routing and thermal design because the dense package can make escape routing and power delivery more demanding than a leaded package.
When selecting this device, match the FPGA logic, RAM, DSP, clock, I/O, speed-grade, temperature, and power requirements to the exact system specification. A different FPGA with a similar cell count may require different tools, configuration handling, package balls, or I/O standards. This page combines verified distributor specifications, package information, and application guidance; exact pricing and stock status must be confirmed for the current purchase date.
This product-data summary is intended to make the LFE2-6E-5F256C searchable for FPGA selection, package matching, and replacement evaluation without implying that every similarly packaged FPGA is pin-to-pin compatible.
Alternativas drop-in para LFE2-6E-5F256C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LFE2-6E-5F256C (mesmo formato e footprint) — diferindo em Package, Package Type, Device Type, DSP Capability, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LFE2-6E-5FN256C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE2-6E-6FN256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE2-6SE-5FN256C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE2-20E-5F484C
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →LCMXO3LF-6900C-5BG256C
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →LFE2-6E-5F256C Classificações máximas e características elétricas
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Elements | 6,000 cells |
| Logic Array Blocks | 750 LABs |
| User I/O | 190 pins |
| Total RAM | 56,320 bits |
| Tensão de alimentação | 1.14 V to 1.26 V |
| Nominal Supply Class | 1.2 V |
| Temperatura de junção de operação | 0°C to 85°C |
| Process Technology | 90 nm |
| Encapsulamento | 256-pin FBGA, 17 x 17 mm |
| Package Type | FBGA |
| Number of Package Pins | 256 pins |
| Tipo de montagem | Surface Mount |
| DSP Capability | Advanced DSP blocks |
Guia de Configuração de Pinos do LFE2-6E-5F256C 256 pins
Configuração de pinos para LFE2-6E-5F256C (pacote 256 pins). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LFE2-6E-5F256C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LFE2-6E-5F256C é adequado para 6 aplicaçãos: Industrial Control Logic, Data Acquisition and Signal Conditioning, Communications Protocol Bridging, Embedded Audio Processing, Programmable Test and Measurement, Embedded Processor Companion.
Industrial Control Logic
The LFE2-6E-5F256C fits industrial control systems that need deterministic programmable logic for sequencing machines, conditioning sensors, and coordinating actuators. Its 6,000 logic cells provide implementation space for state machines, interlocks, counters, and communication-control logic, while 190 user I/O offer substantial external connectivity for sensors, relays, digital interfaces, and status indicators. The 56,320 RAM bits can support small data buffers or configuration-dependent storage needs. The verified operating-junction range is 0°C to 85°C, so enclosure temperature, airflow, and board heating must be checked before deployment. Because the FPGA is programmable, control behavior can be revised during development without changing the PCB, provided the original pin plan leaves adequate configuration, clock, and I/O resources.
Recomendado
Data Acquisition and Signal Conditioning
The LFE2-6E-5F256C can implement parallel acquisition control, digital filtering, channel sequencing, and data formatting around external converters. Its 6,000 logic cells are useful for coordinating multiple channels and performing fixed digital signal-processing functions, while 190 I/O can connect converter outputs, clocks, triggers, and interface logic. The 56,320 RAM bits provide on-chip buffering for short control or sample-data paths, although the required depth depends on the design configuration. Designers should establish clocking, input timing, and conversion settling requirements in the datasheet and system specification. The part is particularly appropriate when the acquisition pipeline must be adapted after bench testing, but it is not a substitute for a high-speed ADC when the required conversion rate exceeds the available I/O and timing capability.
Recomendado
Communications Protocol Bridging
The LFE2-6E-5F256C is suitable for protocol converters, test equipment, and embedded communications interfaces that translate or supervise serial and parallel traffic. The 6,000 logic cells can support framing, byte assembly, checksums, command parsing, and stateful control logic, while 190 I/O leaves room for multiple interface domains and status signals. Its 56,320 RAM bits can hold modest transmit and receive queues, subject to the FPGA configuration and timing constraints. A designer should match the target serial standard, voltage levels, baud rate, clocking architecture, and I/O standards to the exact Lattice ECP2 documentation. The device can reduce host-processor burden by offloading deterministic framing or filtering, but external transceivers and level-shifting components remain necessary where the FPGA pins do not directly meet the physical interface.
Recomendado
Embedded Audio Processing
The LFE2-6E-5F256C can be evaluated for programmable audio-control, mixing, routing, or synchronization logic where a fixed-function controller is too restrictive. The device provides 6,000 logic cells, 56,320 RAM bits, and 190 user I/O for digital sample-path control and peripheral interfaces. Its DSP-oriented ECP2 family position makes it worth considering for fixed-point filtering or audio-format conversion, but the exact multiplier, DSP-block, and audio-clock capabilities must be confirmed in the target datasheet. The FPGA should be clocked according to the required sample rate and word length, and its external audio codecs or converters must be supported by verified I/O standards and timing. Compared with a custom ASIC, this approach offers configuration flexibility; compared with a larger FPGA, it may limit parallel channel count and arithmetic capacity.
Recomendado
Programmable Test and Measurement
The LFE2-6E-5F256C can serve as the control and pattern-generation core in compact test systems, interface conditioners, and programmable instrumentation. Its programmable logic can generate timing patterns, coordinate switches, monitor interlocks, and implement measurement algorithms, while 190 I/O provides connections to sensors, adapters, and communication transceivers. The 56,320 RAM bits can be useful for captured records, calibration tables, or command buffers, but the actual storage architecture depends on the FPGA configuration. A test-equipment design should define clock accuracy, input thresholds, output timing, calibration storage, and fault-safe behavior before assigning pins. The device is attractive for rapidly changing test logic because the configuration can be updated, yet production programs should include timing closure, I/O-standard verification, and thermal margin checks before release.
Recomendado
Embedded Processor Companion
The LFE2-6E-5F256C can complement a host microcontroller by handling parallel peripherals, timing-sensitive state machines, buffer management, or accelerator functions. Its 6,000 logic cells and 190 I/O allow the FPGA to sit between a processor bus and multiple external devices, reducing the need for complex glue logic in the host design. The 56,320 RAM bits may support command queues, status buffers, or shared data movement, depending on the selected ECP2 configuration. Integration requires a defined clock domain, handshake protocol, voltage compatibility, and level-shift strategy between the FPGA and the host. The LFE2 device is not interchangeable with a processor solely because it has programmable logic, so the software driver, boot configuration, and hardware timing should be treated as a coordinated design. This split architecture is useful when deterministic hardware handling is easier to implement in parallel logic than in a general-purpose MCU.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LFE2-6E-5F256C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LFE2-6E-5FN256C | LFE2-6E-6FN256I | LFE2-6SE-5FN256C | LFE2-20E-5F484C | LCMXO3LF-6900C-5BG256C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
Principais diferenciais
- Verified mid-density ECP2 resource balance (vs LFE2-6E-5FN256C)
- Same-brand 256-BGA migration path for the related LFE2-6E-5FN256C listing (vs LFE2-6E-5FN256C)
- Explicit 90 nm process and 1.2 V supply identification (vs LFE2-6E-6FN256I)
Notas de projeto
The verified operating range is 1.14 V to 1.26 V, with the device classified as a 1.2 V part. Power design should therefore begin with the exact ECP2 core and I/O supply requirements in the manufacturer datasheet, including sequencing, current limits, decoupling, and whether any I/O rail is independent. Do not infer the complete power budget from the nominal voltage alone. Validate ripple and temperature rise with the actual configuration because programmable logic utilization and I/O activity affect dynamic current.
The 256-pin FBGA package requires a PCB escape strategy that matches the exact ball map and assembly process. Use the manufacturer package drawing to distinguish power, ground, configuration, clock, and user-I/O balls, then route escape traces through the available vias and land pattern. Because the verified data does not provide a complete pinout, engineers must obtain the official package documentation before layout. Confirm BGA pad dimensions, solder-mask and paste design, via-in-pad suitability, and assembly thermal profiles with the board manufacturer.
Clock, configuration, and high-speed user-I/O routing should be planned before assigning the remaining 190 I/O. Keep clock paths short and controlled, provide a defined return path, and separate potentially noisy switching interfaces from sensitive timing or measurement circuits. Although the supplied data does not state the complete I/O standards or maximum toggle rates, the ECP2 family and device speed grade determine those details. Review the exact timing constraints in the Lattice datasheet and rerun static timing after final pin assignment.
Informações de conformidade
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These values remain unknown rather than being inferred from FPGA technology or distributor listings.
