LM75BIMM-5/NOPB - ±2°C I2C Temp Sensor, 3V-5.5V | TI
N.º da peça: LM75BIMM-5/NOPB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.2 | $22,00 |
| 100 | $1.78 | $178,00 |
| 500 | $1.45 | $725,00 |
| 1.000 | $1.18 | $1.180,00 |
LM75BIMM-5/NOPB Visão geral
A digital temperature sensor is an integrated circuit that converts on-chip thermal conditions into a calibrated digital word readable by a microcontroller. Compared with discrete NTC thermistors or RTDs, they integrate the sensor, signal conditioning, ADC, and a serial interface on one die, eliminating calibration, linearization, and external ADC circuitry. The LM75B sits inside the hierarchy: temperature sensor -> sensor IC -> analog/mixed-signal semiconductor - in short, a self-contained thermal data source for embedded systems.
Key features include a factory-calibrated accuracy of ±2°C across the full -55°C to +125°C range, 0.5°C resolution (9-bit signed), a dedicated OS (overtemperature shutdown) open-drain alert pin for interrupt or comparator-style system response, and three address-select pins (A0-A2) that allow up to eight devices on a single I2C bus. Power consumption is rated at 1 mA active and 4 uA shutdown current, and the part is rated for -55°C to +125°C operation with shutdown current of 4 uA per the manufacturer datasheet.
The LM75B uses a bandgap-temperature proportional core feeding a Sigma-Delta modulator to generate the digital code, achieving noise as low as 0.125°C over the 20 Hz to 100 kHz bandwidth while eliminating the need for external signal conditioning. The OS comparator and polarity-programmable INT/CMP_TSTAT pin allow hardware-based thermal protection without host intervention, reducing firmware overhead in safety-critical designs.
Typical applications include thermal management in computing platforms and 1U/2U servers, system over-temperature protection in industrial controllers, portable battery-powered consumer electronics, cold-junction compensation in thermistor/RTD circuits, and general embedded system health monitoring. Designers value its ability to deliver calibrated digital data directly to a microcontroller or BMC over a two-wire bus.
When designing with the LM75B, place the VSSOP-8 package close to the heat source (such as a power stage or SoC) and connect the OS pin to the host interrupt or shutdown controller for failsafe behavior. Decouple the supply with a 100 nF ceramic capacitor placed within 5 mm of the VDD pin to meet I2C noise immunity requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para LM75BIMM-5/NOPB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LM75BIMMX-5/NOPB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LM75BIMM-3/NOPB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LM75BIMM/NOPB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
TMP75BIDR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MAX7500MUA+
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LM75BIMM-5/NOPB Classificações máximas e características elétricas
| Tipo de sensor | Digital, Local |
| Faixa de medição | -55°C to +125°C |
| Accuracy (max) | ±2°C |
| Resolução | 9-bit (0.5°C/LSB) |
| Tensão de alimentação | 3.0 V to 5.5 V |
| Supply Current (active) | 1 mA (typical) |
| Supply Current (shutdown) | 4 uA (typical) |
| Interface | I2C / SMBus-compatible (2-wire) |
| Address Pins | A0, A1, A2 (3 pins, up to 8 addresses) |
| Alert Output | OS pin, overtemperature/shutdown, open-drain |
| Tipo de saída | Analog and Digital |
| Temperatura de operação | -55°C to +125°C |
| Encapsulamento | VSSOP-8 (DGK) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do LM75BIMM-5/NOPB
| Pino 1 | SDA — I2C data (bidirectional, open-drain) |
| Pino 2 | SCL — I2C clock input |
| Pino 3 | OS — Overtemperature alert, open-drain (also CMP_TSTAT in comparator configuration) |
| Pino 4 | GND — Ground |
| Pino 5 | A2 — I2C address select bit 2 |
| Pino 6 | A1 — I2C address select bit 1 |
| Pino 7 | A0 — I2C address select bit 0 |
| Pino 8 | VDD — Supply voltage, 3.0V to 5.5V |
Aplicações típicas
LM75BIMM-5/NOPB é adequado para 7 aplicaçãos: Server and Storage Thermal Monitoring, Industrial Over-Temperature Protection, Portable Consumer Electronics, Cold-Junction Compensation for Thermocouples, IoT and Smart Home Sensor Nodes, Automotive Cabin and Battery Pack Monitoring, LED Lighting Thermal Management.
Server and Storage Thermal Monitoring
The LM75BIMM-5/NOPB delivers ±2°C temperature data directly to a host BMC or microcontroller over I2C, making it ideal for server and SSD thermal monitoring. Up to 8 devices can share a single 2-wire bus via A0-A2 address pins, enabling multi-zone monitoring of CPU socket, DIMM, inlet, and outlet. The OS open-drain pin drives a hardware interrupt for fan speed-up or system throttle, reducing firmware latency. With 4 uA shutdown current, the part supports low-power standby modes in 1U/2U server platforms.
Recomendado
Industrial Over-Temperature Protection
The LM75BIMM-5/NOPB is well suited to industrial PLC and motor-drive boards where components must be protected against thermal runaway. The OS alert pin can directly drive a relay, MOSFET gate, or shutdown circuit, providing hardware-level protection independent of firmware execution. ±2°C accuracy from -55°C to +125°C covers the full industrial operating range. The 3.0-5.5V supply matches typical 3.3V and 5V industrial rails without level shifters.
Recomendado
Portable Consumer Electronics
Battery-powered wearables and portable consumer devices benefit from the LM75BIMM-5/NOPB's 4 uA shutdown current and 1 mA active current, which together minimize impact on battery life. The small VSSOP-8 footprint fits inside smartphones, tablets, and Bluetooth earbuds where board space is at a premium. The OS pin can wake the host MCU when chassis temperature exceeds limits, supporting efficient event-driven thermal management.
Recomendado
Cold-Junction Compensation for Thermocouples
The LM75BIMM-5/NOPB serves as a low-cost local reference for cold-junction compensation in thermocouple measurement systems. Placing the IC near the thermocouple terminal allows the MCU to add the LM75B reading to the thermocouple Seebeck voltage calculation, achieving system accuracy within a few degrees across -55°C to +125°C. The I2C interface reduces wiring compared with analog compensation circuits.
Recomendado
IoT and Smart Home Sensor Nodes
IoT sensor nodes for HVAC, indoor climate, and appliance monitoring integrate the LM75BIMM-5/NOPB as the temperature channel thanks to its small footprint, low 4 uA shutdown current, and I2C multi-drop capability. The OS pin can trigger MCU wake-up only when temperature thresholds are crossed, allowing the node to sleep most of the time. Compatible with 3.3V wireless MCUs like CC2538 or ESP32 without level shifting.
Recomendado
Automotive Cabin and Battery Pack Monitoring
Although not AEC-Q100 qualified, the LM75BIMM-5/NOPB's -55°C to +125°C operating range and robust I2C interface make it usable in non-safety automotive applications such as cabin climate modules, infotainment thermal management, and aftermarket battery pack monitoring. Designers must add external ESD protection and follow OEM EMI guidelines. For safety-critical applications, the TI LM75B-Q1 AEC-Q100 variant is the recommended drop-in upgrade.
Recomendado
LED Lighting Thermal Management
High-brightness LED modules require thermal foldback to prevent lumen degradation and color shift. The LM75BIMM-5/NOPB placed adjacent to the LED PCB provides continuous temperature data, enabling the driver IC to reduce current when the LED approaches its Tj limit. The OS pin can directly modulate a PWM enable line for instant hardware protection. ±2°C accuracy is sufficient for typical LED thermal derating curves.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LM75BIMM-5/NOPB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LM75BIMMX-5/NOPB | LM75BIMM-3/NOPB | LM75BIMM/NOPB | TMP75BIDR | MAX7500MUA+ |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Analog Devices |
| Package | VSSOP-8 (DGK) | VSSOP-8 (DGK) - same | VSSOP-8 (DGK) - same | VSSOP-8 (DGK) - same | VSSOP-8 (DGK) - same | uMAX-8 (8-pin micro-max) - same footprint family |
| Supply Voltage | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 2.7 V to 5.5 V | 3.0 V to 5.5 V |
| Accuracy | ±2°C | ±2°C | ±2°C | ±2°C | ±2°C (max), ±0.5°C typ | ±2°C |
| Resolution | 9-bit (0.5°C/LSB) | 9-bit (0.5°C/LSB) | 9-bit (0.5°C/LSB) | 9-bit (0.5°C/LSB) | 12-bit (0.0625°C/LSB) | 9-bit (0.5°C/LSB) |
| Interface | I2C / SMBus | I2C / SMBus | I2C / SMBus | I2C / SMBus | I2C / SMBus | I2C / SMBus |
| Address Pins | A0, A1, A2 (8 addresses) | A0, A1, A2 (8 addresses) | A0, A1, A2 (8 addresses) | A0, A1, A2 (8 addresses) | A0, A1, A2 (8 addresses) | A0, A1, A2 (8 addresses) |
| Operating Temperature | -55°C to +125°C | -55°C to +125°C | -55°C to +125°C | -55°C to +125°C | -55°C to +125°C | -55°C to +125°C |
Principais diferenciais
- Three address-select pins supporting up to 8 devices per bus (vs MAX7500MUA+)
- Factory-calibrated ±2°C with no external components (vs Discrete NTC thermistor solution)
- Integrated OS alert pin for hardware-level thermal protection (vs MAX7500MUA+)
- Wide 3.0V to 5.5V supply range (vs TMP75BIDR)
Notas de projeto
Always connect the OS pin to a pull-up resistor (10 kOhm typical) to VDD. The OS output is open-drain and cannot drive high without a pull-up. Failure to add the pull-up is the most common cause of 'sensor not triggering interrupt' bugs in production. Verify the pull-up voltage matches the supply voltage to avoid leakage into other rails.
Place the LM75BIMM-5/NOPB physically close to the heat source being monitored (typically within 5-10 mm). Use thermal vias under the exposed pad to the GND plane to pull heat INTO the die for accurate local sensing. Avoid placing the IC near other heat-dissipating components whose thermal mass could bias the measurement.
Decouple VDD (pin 8) with a 100 nF X7R ceramic capacitor placed within 5 mm of the IC pin. For noisy 5V industrial rails, add a 10 uF bulk capacitor in parallel. The I2C SDA and SCL lines also require pull-up resistors (typically 4.7 kOhm at 400 kHz fast-mode) to VDD. Insufficient decoupling can cause I2C NACK errors under load transients.
When using multiple LM75B devices on the same I2C bus, ensure each A0/A1/A2 combination is unique. Duplicate addresses cause bus contention and corrupted reads. Keep total bus capacitance below 400 pF; for long traces, use a buffer like the LTC4311 or PCA9600 to extend the bus. The OS pins can be wire-ORed if multiple alert sources feed one interrupt line.
Estimated: at 1 mA active current and 5V supply, the LM75B self-heating dissipation is approximately 5 mW. Using a typical VSSOP-8 theta_JA of 200 C/W, this causes a self-heating temperature rise of about 1°C above the measured junction. For high-precision lab measurements, disable shutdown only during the read window to minimize self-heating bias.
Informações de conformidade
RoHS compliant per TI product page (/NOPB suffix indicates NiPdAu lead-free finish). Not AEC-Q100 qualified - use LM75B-Q1 variant for automotive. Halogen-free status not explicitly stated in verified web data.
