LPC11E67JBD64E - 50MHz Cortex-M0+ 128KB MCU | NXP
N.º da peça: LPC11E67JBD64E ✓ AtivoLPC11E67JBD64E Visão geral
An ARM Cortex-M0+ microcontroller is a compact embedded-processing device used to execute firmware, read sensors, control outputs, and manage communication peripherals. The LPC11Exx family sits within the broader hierarchy of microcontroller, embedded processor, semiconductor, and embedded-control systems. Its 32-bit architecture provides an efficient platform for cost-sensitive products requiring deterministic real-time control without the resources of a higher-performance Cortex-M processor.
The LPC11E67JBD64E provides 128KB of flash for program storage and 20KB of SRAM for data, stack, and working memory. Its maximum CPU frequency is 50 MHz. The device is supplied in a 64-LQFP package, providing 64 external pins for power, ground, resets, clock inputs, and peripheral connections. The verified distributor information also identifies the device as a 3.3 V part and as a member of the LPC11Exx family. Detailed GPIO allocation, operating-temperature limits, and individual peripheral characteristics remain subject to the manufacturer datasheet.
The ARM Cortex-M0+ core supports a compact instruction set optimized for embedded control, while the integrated memory allows firmware and working data to share a single package and PCB footprint. This integration reduces component count and simplifies board routing compared with a discrete processor-plus-memory implementation. The 50 MHz operating rate provides useful headroom for protocol handling, digital control loops, and supervisory tasks while maintaining a low-complexity architecture.
Typical uses include industrial control modules, sensor-hub boards, communication equipment, building automation, appliance controllers, and compact embedded data-acquisition products. The 128KB flash capacity is suitable for moderate firmware images, while 20KB SRAM supports networking stacks and control buffers without requiring external memory. Its 64-LQFP package also makes the device accessible for prototype assembly and conventional surface-mount manufacturing.
Designers should verify the complete pin assignment, peripheral multiplexing, and electrical limits against the manufacturer datasheet before layout release. The 3.3 V supply requirement should be paired with appropriate decoupling and signal-level planning for connected modules. Because exact GPIO, timing, temperature, and qualification data were not included in the verified results, those values should not be inferred from the family description alone.
This product record combines verified distributor specifications, official manufacturer identification, package information, sourcing references, and engineering-focused selection guidance. It also distinguishes the LPC11E67JBD64E from higher-memory family variants and documents the limited number of confirmed pin-compatible alternatives rather than presenting unverified substitutes as drop-in devices.
Alternativas drop-in para LPC11E67JBD64E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LPC11E67JBD64E (mesmo formato e footprint) — diferindo em CPU Architecture, Flash Memory.
LPC11U67JBD64E
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →LPC11E67JBD64E Classificações máximas e características elétricas
| CPU Core | ARM Cortex-M0+ |
| CPU Architecture | 32-bit ARM |
| Maximum CPU Frequency | 50 MHz |
| Flash Memory | 128 KB |
| Flash Organization | 128K x 8 bits |
| SRAM | 20 KB |
| Product Family | LPC11Exx scalable entry-level MCU |
| Tensão de alimentação | 3.3 V |
| Package Type | 64-pin LQFP |
| Package Dimensions | 10 mm x 10 mm |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do LPC11E67JBD64E 10 mm x 10 mm
Configuração de pinos para LPC11E67JBD64E (pacote 10 mm x 10 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LPC11E67JBD64E.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LPC11E67JBD64E é adequado para 6 aplicaçãos: Industrial Sensor Hub, Building Automation Controller, Ethernet-Connected Control Module, USB Communication Adapter, Appliance Control Board, Digital Power-Supply Supervisor.
Industrial Sensor Hub
The LPC11E67JBD64E fits compact sensor-hub designs because its 50 MHz ARM Cortex-M0+ core can execute acquisition control, filtering, and communication tasks while the 128KB flash stores application firmware and the 20KB SRAM supports working buffers. It is placed directly on the primary control PCB and connected to sensor interfaces through its mixed-signal and digital peripherals. The 64-LQFP package provides dedicated external connections, while the 3.3 V operating class simplifies integration with low-voltage sensor circuits. Confirm the exact GPIO allocation, analog limits, and temperature grade against the datasheet before production.
Recomendado
Building Automation Controller
The LPC11E67JBD64E is appropriate for a building-automation controller when deterministic embedded logic, local I/O, and communication management are needed without a high-cost application processor. Its 50 MHz Cortex-M0+ core can supervise sensors, debounce inputs, execute control sequences, and manage protocol tasks, while 128KB of flash accommodates a substantial firmware image. The 20KB SRAM provides space for protocol state and short data queues. In a controller installed behind a 24 V facility network, a suitable power-conversion front end and level translation would be required; the MCU itself is identified as a 3.3 V device.
Recomendado
Ethernet-Connected Control Module
The LPC11E67JBD64E can serve as the supervisory controller in an Ethernet-enabled module by running the main control loop and communicating with a dedicated network interface. The 128KB flash accommodates firmware, configuration data, and network-state parameters, while the 20KB SRAM supports packet buffers and application state at the 50 MHz Cortex-M0+ operating rate. In this architecture, the MCU handles local I/O and sequencing rather than replacing the Ethernet controller's PHY and transceiver functions. This separation keeps the embedded design compact while allowing a dedicated interface to handle network traffic and physical-layer requirements.
Recomendado
USB Communication Adapter
The LPC11E67JBD64E can be used in a communication adapter that combines local control with an external serial interface, provided USB device support is not required by the design. Its 50 MHz ARM Cortex-M0+ core is suitable for protocol conversion, configuration handling, and status reporting, and 128KB of flash is sufficient for moderate firmware without external program memory. The 20KB SRAM supports packet staging and stack state. A CP2102-family bridge may provide USB-to-UART connectivity while the LPC11E67 manages the application side; careful UART baud-rate, buffer, and timing checks are required.
Recomendado
Appliance Control Board
The LPC11E67JBD64E suits appliance control boards where the firmware must coordinate sensors, outputs, user inputs, and service communications. Its 50 MHz Cortex-M0+ core provides responsive control without an application processor, and the combined 128KB flash and 20KB SRAM support embedded firmware, configuration, and working state. The 64-LQFP footprint exposes more pins than a small leadless package and can simplify access to buttons, indicator signals, relays, and communication transceivers. Actual GPIO availability, pin multiplexing, and electrical limits must be checked because the supplied verified excerpts do not enumerate the complete pin function table.
Recomendado
Digital Power-Supply Supervisor
The LPC11E67JBD64E can monitor and coordinate a compact digital power system because its 50 MHz core provides enough performance for sequencing logic, fault-state evaluation, and communications. The 128KB flash can retain calibration data and supervisory firmware, while 20KB SRAM supports state machines and logging buffers. It would typically collect voltage, temperature, and current information through suitable sensing and interface circuits, then actuate enables or report faults through digital outputs. Because exact analog-performance and timer parameters were not supplied, designers must verify acquisition accuracy, response time, and watchdog behavior directly in the manufacturer documentation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC11E67JBD64E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC11U67JBD64E |
|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors |
| CPU Core | ARM Cortex-M0+ | ARM Cortex-M0+ |
| CPU Frequency | 50 MHz | 50 MHz |
| Flash Memory | 128 KB | 128 KB |
| SRAM | 20 KB | 20 KB |
| Supply Voltage | 3.3 V | 3.3 V |
| USB-Oriented Functionality | Base LPC11E67 configuration | USB-oriented U-series configuration |
Principais diferenciais
- Balanced embedded memory configuration (vs LPC11E68JBD64E)
- Directly identified 64-pin package (vs LPC11E67JBD64)
- 50 MHz Cortex-M0+ processing performance (vs LPC11U67JBD64E)
Notas de projeto
The verified listing identifies LPC11E67JBD64E as a 3.3 V device, but the supplied data does not include the complete operating-voltage range or decoupling recommendation. Place the input capacitor and any required bulk capacitance at the power pins using the exact manufacturer layout and values. Confirm the regulator's tolerance, startup behavior, and maximum supply ramp before connecting sensitive or safety-related external circuitry.
Reserve all 64 LQFP lands, including power, ground, and any exposed-pad or thermal-pad requirements defined by the official package drawing. Keep crystal or clock paths, reset traces, and sensitive inputs away from switching nodes and high-current relay or power-converter paths. Because the verified excerpts do not provide the complete pin table, freeze the board pinout only after cross-checking every net against the manufacturer datasheet.
Do not treat LPC11E68JBD64E as an identical drop-in substitute: the verified comparison reports 256KB of flash and 36KB of SRAM, versus 128KB and 20KB in LPC11E67JBD64E. Likewise, LPC11U67JBD64E adds USB-oriented functionality, so software support, pin multiplexing, and USB requirements must be reviewed. Validate any substitution with firmware, timing, brownout, and peripheral tests.
Provide local supply and ground planes around the MCU while maintaining the manufacturer's recommended current-return path. Avoid routing fast digital outputs adjacent to analog or clock inputs, and place external decoupling as close as practical to the relevant pins. The 64-LQFP footprint offers generous routing access, but high pin density can still create unintended coupling between adjacent signals if return paths and guard spacing are neglected.
Informações de conformidade
The supplied verified results do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for the exact LPC11E67JBD64E ordering code. Compliance should be confirmed through the current NXP product declaration and supporting compliance documentation.
