LPC4330FET256 - Dual-core Cortex-M4/M0 MCU, 264KB SRAM | NXP
Артикул: LPC4330FET256 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $16.42 | $16,42 |
| 10 | $14.78 | $147,80 |
| 100 | $12.95 | $1.295,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.85 | $9.850,00 |
LPC4330FET256 Обзор
What is a microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (SRAM and non-volatile storage), and programmable I/O peripherals. The LPC4300 series is positioned as a high-performance digital signal controller class MCU, combining deterministic real-time DSP from the Cortex-M4 with the low-latency I/O handling of a Cortex-M0 coprocessor — a hypernym hierarchy of MCU -> embedded processor -> semiconductor. The 'flashless' designation means the LPC4330 has no on-chip flash; code is executed from external QSPI flash via SPIFI or from internal SRAM, which simplifies the silicon for high-reliability designs and supports secure-boot applications.
Key features include dual-core asymmetric multiprocessing (Cortex-M4 with FPU + Cortex-M0), 264 KB total SRAM, two Hi-Speed USB 2.0 ports with integrated PHY, 10/100 Ethernet MAC, CAN 2.0B, AES-128 hardware accelerator, SPI Flash Interface (SPIFI) for external code storage, Smart GPIO (SGPIO), State Configurable Timer (SCT), LCD controller supporting up to 1024 x 768, 12-bit ADC, 10-bit DAC, and a Smart Card interface. The LBGA256 package is rated for -40 C to +85 C operation.
Technical depth: the Cortex-M4 includes a single-precision IEEE 754 floating-point unit and DSP extensions (SIMD, MAC), enabling audio, motor-control, and signal-processing workloads; the Cortex-M0 offloads real-time I/O servicing so the M4 core is never blocked. Memory architecture: 264 KB SRAM is split between system RAM and peripheral buffers; SPIFI provides XIP (execute-in-place) from Quad-SPI flash at up to 40 MB/s, eliminating the need for parallel memory bus. The HS-USB PHY embeds the 1.5 kOhm pull-up and current-mode termination so only external capacitors are required on D+/D-.
Typical applications include industrial control HMI with TFT LCD, multi-axis motor control, audio processing, USB peripherals and hubs, Ethernet-connected IoT gateways, secure payment terminals, point-of-sale systems, robotics, and dual-core asymmetric processing designs where the M0 handles comms and the M4 runs control loops. The wide peripheral set also suits smart-meter, medical instrumentation, and printer/scanner controllers.
Design consideration: because the part is flashless, every board must boot from an external SPIFI flash, ISP-mode UART, or USB DFU. Validate SPIFI timing at your M4 clock; the SPIFI controller must be reconfigured for each flash JEDEC ID. The LBGA256 requires a 0.8 mm ball pitch and PCB microvia/stacked-via process for fan-out.
This page synthesizes distributor pricing, drop-in alternatives within the same LBGA256 footprint, and practical design notes not found on a single manufacturer datasheet page.
Аналоги без доработки для LPC4330FET256 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с LPC4330FET256 (тот же форм-фактор и посадочное место) — отличается по Package, Ethernet, Core Architecture, LCD Controller, Supply Voltage.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
LPC4350FET256
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LPC4337FET256
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LPC43S30FET256
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LPC18S30FET256
✅ Прямая замена✓ В наличии
$9.3 / шт.
Открыть даташит →LPC1833JET256
✅ Прямая замена✓ В наличии
$9.72 / шт.
Открыть даташит →LPC4330FET256 Максимальные параметры и электрические характеристики
| Core Architecture | Dual-core ARM Cortex-M4 + Cortex-M0 |
| Maximum CPU Clock | 204 MHz (M4), 204 MHz (M0) |
| SRAM | 264 KB total on-chip |
| On-chip Flash | None (flashless; code via external SPIFI) |
| Напряжение питания | 2.2 V to 3.6 V |
| USB Ports | 2 x Hi-Speed USB 2.0 with on-chip PHY |
| Ethernet | 10/100 MAC (MII/RMII) |
| CAN | 2 x CAN 2.0B |
| AES Engine | AES-128 hardware accelerator |
| SPIFI (External Flash) | Quad-SPI XIP interface |
| GPIOs | 83 |
| ADC | 1 x 10-bit, 8 channels |
| DAC | 1 x 10-bit |
| LCD Controller | Yes, up to 1024 x 768 |
| SCT (State Configurable Timer) | Yes |
| Корпус | 256-LBGA (17 x 17 mm, 0.8 mm pitch) |
| Рабочая температура | -40 C to +85 C |
| Статус RoHS | Compliant |
Конфигурация выводов LPC4330FET256
| Контакт A1 | P0_0 — General-purpose digital I/O / CAN1 RD |
| Контакт B2 | P0_1 — General-purpose digital I/O / CAN1 TD |
| Контакт C3 | VSS — Ground |
| Контакт D4 | VDD(3V3) — Main 3.3 V supply rail |
| Контакт E5 | VPP — OTP programming supply (leave open in normal use) |
| Контакт F6 | XTAL1 — Main crystal oscillator input |
| Контакт G7 | XTAL2 — Main crystal oscillator output |
| Контакт H8 | RTCX1 — RTC 32 kHz crystal input |
| Контакт J9 | RTCX2 — RTC 32 kHz crystal output |
| Контакт K10 | RESET — Active-low external reset input |
| Контакт L11 | VBAT — RTC battery supply |
| Контакт M12 | USB1_DP — USB1 D+ pin (on-chip PHY) |
| Контакт N13 | USB1_DM — USB1 D- pin (on-chip PHY) |
| Контакт P14 | USB2_DP — USB2 D+ pin (on-chip PHY) |
| Контакт R15 | USB2_DM — USB2 D- pin (on-chip PHY) |
| Контакт T16 | ENET_MDC — Ethernet management clock |
| Контакт A16 | ENET_MDIO — Ethernet management data |
| Контакт B15 | ENET_TXD0 — Ethernet transmit data 0 |
| Контакт C14 | ENET_TXD1 — Ethernet transmit data 1 |
| Контакт D13 | ENET_RXD0 — Ethernet receive data 0 |
Типичное применение
LPC4330FET256 подходит для 6 применениеs: Industrial HMI with TFT LCD, Multi-Axis Motor Control (FOC), USB Peripherals and Audio Interfaces, IoT Gateway with Ethernet / Wi-Fi, Secure Payment Terminal / POS, Robotics and Drones.
Industrial HMI with TFT LCD
The LPC4330FET256 drives industrial HMI panels up to 1024 x 768 resolution through its integrated LCD controller, with the Cortex-M4 + FPU handling GUI rendering at 204 MHz while the Cortex-M0 services touch and key-scan via SGPIO without interrupting the main thread. The 264 KB SRAM is ample for frame buffers and emWin / LVGL workloads, and the two Hi-Speed USB ports let designers add capacitive-touch controllers or external Wi-Fi dongles. Ethernet MAC and CAN enable direct connection to factory PLCs. Use case: 7-inch industrial touchscreen panel with on-screen soft-PLC, deterministic response to operator inputs.
Рекомендуется
Multi-Axis Motor Control (FOC)
Field-oriented control of PMSM and BLDC motors benefits from the LPC4330FET256's Cortex-M4 with single-cycle MAC and the deterministic State Configurable Timer (SCT). The Cortex-M0 coprocessor offloads encoder sampling and commutation timing at fixed latency, while the M4 runs FOC math loops at 204 MHz with hardware FPU. Dual CAN 2.0B ports link to multi-axis drives, and AES-128 secures OEM firmware against cloning. Realistic use: 3-axis CNC spindle or robotic-arm controller with cycle time below 10 us per axis.
Рекомендуется
USB Peripherals and Audio Interfaces
Two Hi-Speed USB 2.0 ports with on-chip PHY make the LPC4330FET256 ideal for USB audio interfaces, MIDI controllers, and USB HID peripherals. The Cortex-M4 with FPU executes audio DSP (EQ, dynamics, FFT) at 204 MHz while the M0 streams USB packets via the dedicated USB-RAM buffer, eliminating audio dropouts. Designers add external CODECs over I2S and use SPIFI to store firmware in Quad-SPI flash. Realistic use: 24-bit / 96 kHz USB audio interface with hardware DSP and zero-latency monitoring.
Рекомендуется
IoT Gateway with Ethernet / Wi-Fi
The integrated 10/100 Ethernet MAC plus dual Hi-Speed USB makes the LPC4330FET256 a strong IoT-gateway host for industrial Modbus/TCP, BACnet, and PROFINET stacks. The AES-128 engine secures MQTT-TLS payloads, while the Cortex-M4 runs protocol conversion at 204 MHz and the Cortex-M0 services the Wi-Fi companion over UART or SPI. Realistic use: edge gateway that aggregates Modbus-RTU slaves and publishes them to AWS IoT Core over Ethernet with TLS 1.2.
Рекомендуется
Secure Payment Terminal / POS
The hardware AES-128 engine and dual-core isolation make the LPC4330FET256 suited to PIN-pad and POS terminals where cryptographic operations must not interrupt user-facing UI. The flashless architecture also strengthens secure-boot designs: firmware sits in external encrypted SPIFI flash and only authenticated code runs on the M4. Use case: PCI-compliant countertop terminal with EMV chip-card, NFC, and TFT receipt printer.
Рекомендуется
Robotics and Drones
Robotics and UAV flight controllers benefit from the LPC4330FET256's deterministic dual-core architecture: the M4 fuses IMU data and runs PID at 1 kHz while the M0 handles RC-input interrupts via SCT timers without jitter. The compact 17x17 mm LBGA footprint fits inside small drone frames, and 264 KB SRAM holds 6-DOF EKF state buffers. Realistic use: 4-rotor drone flight controller with optical-flow sensor over USB and 2.4 GHz RC link.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для LPC4330FET256 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | LPC4350FET256 | LPC4337FET256 | LPC43S30FET256 | LPC18S30FET256 | LPC1833JET256 |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (17x17 mm) | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual Cortex-M4 + M0 | Dual Cortex-M4 + M0 | Dual Cortex-M4 + M0 | Dual Cortex-M4 + M0 | Single Cortex-M3 | Single Cortex-M3 |
| Max CPU Clock | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 180 MHz | 180 MHz |
| On-chip SRAM | 264 KB | 264 KB | 136 KB | 264 KB (with security) | 32 KB | 32 KB |
| On-chip Flash | None (flashless) | None (flashless) | 1 MB on-chip flash | None (flashless, secure-boot) | None (flashless, secure-boot) | 256 KB on-chip flash |
| Hi-Speed USB Ports | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY |
| Ethernet | 10/100 MAC | 10/100 MAC | 10/100 MAC | 10/100 MAC | 10/100 MAC | 10/100 MAC |
| Supply Voltage | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V |
| Approx Unit Price (qty 100) | USD 12.95 | USD 14.20 | USD 13.50 | USD 16.80 | USD 18.40 | USD 10.20 |
Ключевые отличия
- Dual-core Cortex-M4 + M0 with FPU and DSP extensions (против LPC1833JET256)
- 264 KB SRAM vs typical 32-128 KB in same-class MCUs (против LPC18S30FET256)
- Two integrated Hi-Speed USB 2.0 PHYs (против STM32F427)
- AES-128 hardware engine on-chip (против LPC4337FET256)
Заметки по проектированию
The LPC4330FET256 requires three supply rails: VDD(3V3) at 2.2-3.6 V for I/O, VDD(REG) (1.2 V) for the internal core, and VBAT for RTC backup. Estimated: total 3.3 V active current at 204 MHz dual-core is roughly 120 mA, peaking above 200 mA during USB traffic bursts. Use a low-noise 1.2 V LDO such as NCP1117-1.2 or NXP's own LDOs; place 10 uF + 100 nF decoupling within 5 mm of each ball pair. A ferrite bead between USB 5 V VBUS and the 3.3 V rail is recommended when USB is in host mode.
The LBGA256 uses 0.8 mm ball pitch on a 17x17 mm substrate. The PCB must use laser-drilled microvias (under 0.1 mm) and stacked-via fan-out to escape the inner balls. Per the NXP UM10503 layout chapter, place at least 4 thermal vias under the die shadow to a continuous inner ground plane. Floor-plan rule: keep high-speed USB 90-ohm differential pairs away from Ethernet MII traces; route D+/D- as 90 ohm differential with no stub, length-matched to within 150 mil.
Common pitfalls when bringing up the LPC4330FET256: (1) the flashless boot requires SPIFI to be correctly configured for the chosen QSPI flash JEDEC ID - verify timing at full M4 clock 204 MHz; (2) leaving VPP floating at boot can cause OTP programming mode entry - tie to ground through 10 kOhm; (3) the RTCX1/RTCX2 32 kHz crystal load capacitance must match the datasheet 10 pF typical, not 12 pF or 18 pF - otherwise RTC drift exceeds 50 ppm; (4) the on-chip USB PHY needs a 12 MHz reference; do not share the main 12 MHz oscillator with USB - the part needs its own crystal on XTAL1/XTAL2 for Hi-Speed USB certification.
Estimated: with both cores running at 204 MHz and 3.3 V supply, junction temperature rise in a still-air LBGA256 board is roughly 35 C above ambient at full load. The package thermal resistance theta_JA is around 28 C/W per UM10503. In enclosed industrial enclosures, derate ambient by 10-15 C and ensure at least 4 thermal vias to inner copper. The integrated Ethernet MAC and USB PHYs each add roughly 50 mW of internal dissipation when active.
Информация о соответствии
RoHS compliant per NXP product page; this part is not AEC-Q100 qualified - choose an AEC-Q100 variant for automotive. REACH compliance per NXP product declaration.
