LPC54606J512BD100E - 220MHz Cortex-M4 MCU 512KB Flash | NXP
N.º da peça: LPC54606J512BD100E ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.97 | $14,97 |
| 10 | $13.48 | $134,80 |
| 100 | $11.99 | $1.199,00 |
| 500 | $10.74 | $5.370,00 |
| 1.000 | $9.52 | $9.520,00 |
LPC54606J512BD100E Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash for program code and SRAM for data), peripherals, and I/O. The Cortex-M4 is an ARM processor core designed for embedded applications, combining deterministic interrupt response with DSP extensions and a single-precision floating-point unit (FPU). The LPC546xx family in particular targets low-power, high-performance applications, sitting in the ARM Cortex-M4 tier below Cortex-M7 but above Cortex-M0+ devices in computational capability.
Key features include a quad SPI Flash Interface (SPIFI) for low-cost memory expansion, one high-speed and one full-speed USB controller (host/device), 10/100 Ethernet with AVB support, CAN FD, an LCD controller, a Smart Card Interface, SD/MMC, an External Memory Controller (EMC), and a DMIC subsystem with PDM microphone interface. Twelve 12-bit ADCs and a 10-bit DAC support analog signal acquisition, while 21 communication interfaces aggregate data for IoT gateways.
The device uses a Cortex-M4 core with single-precision FPU, DSP/SIMD instructions, and a Memory Protection Unit. An internal oscillator with PLL generates the 220 MHz system clock, and a low-power RTC with separate battery domain supports sleep modes drawing only a few microamperes, enabling battery-backed always-on designs.
Typical applications include industrial HMI with LCD, IoT gateways aggregating multiple sensor buses, smart energy metering with CAN FD, audio front ends with PDM microphones, and connected medical devices needing Ethernet/USB. The integrated peripherals replace several external components, shrinking BOM and PCB area.
When designing, choose MCUXpresso SDK for firmware development and provision the SWD/JTAG interface for debug. Place 100 nF + 10 uF decoupling close to each VDD pin and route VDD/VSS pairs symmetrically.
This page synthesizes distributor pricing across DigiKey, Mouser, Arrow and Heisener, verified cross-reference alternatives, and practical design notes not consolidated on the manufacturer product page.
Alternativas drop-in para LPC54606J512BD100E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LPC54606J512BD100E (mesmo formato e footprint) — diferindo em Core, Operating Temperature, Package, Maximum Clock Frequency, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LPC54608J512BD100E
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LPC54607J512BD100E
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LPC54605J256BD100E
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
STM32F407VGT6
✅ Drop-In✓ Em estoque
$7.55 / unidade
Ver ficha técnica →STM32F405VGT6
✅ Drop-In✓ Em estoque
$8.1 / unidade
Ver ficha técnica →GD32F405VGT6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC54606J512BD100E Classificações máximas e características elétricas
| Core | ARM Cortex-M4 with FPU and DSP |
| Frequência máxima de clock | 220 MHz |
| Program Memory Size | 512 KB (512K x 8) Flash |
| RAM Size | 200 KB (200K x 8) SRAM |
| EEPROM Size | 16 KB |
| Supply Voltage (Vcc/Vdd) | 1.71 V to 3.6 V |
| Temperatura de operação | -40C to +105C |
| Encapsulamento | 100-pin LQFP (14x14 mm) |
| ADC | 12 x 12-bit |
| DAC | 1 x 10-bit |
| USB | 1 x High-Speed + 1 x Full-Speed Host/Device |
| Ethernet | 10/100 Mbps with AVB support |
| CAN | CAN FD |
| Memory Expansion | SPIFI (Quad SPI), External Memory Controller (EMC) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do LPC54606J512BD100E
| Pino 1 | P0_29 — General purpose I/O |
| Pino 2 | P0_30 — General purpose I/O |
| Pino 3 | VDD — Supply voltage (1.71-3.6V) |
| Pino 4 | VSS — Ground |
| Pino 5 | P1_15 — General purpose I/O |
| Pino 6 | P1_16 — General purpose I/O |
| Pino 7 | P1_17 — General purpose I/O |
| Pino 8 | P1_18 — General purpose I/O |
| Pino 9 | P2_0 — General purpose I/O |
| Pino 10 | P2_1 — General purpose I/O |
| Pino 11 | VDD — Supply voltage |
| Pino 12 | VSS — Ground |
| Pino 13 | P3_19 — General purpose I/O |
| Pino 14 | P3_20 — General purpose I/O |
| Pino 15 | P4_0 — General purpose I/O / EMC_A0 |
| Pino 16 | P4_1 — General purpose I/O / EMC_A1 |
| Pino 17 | P4_2 — General purpose I/O / EMC_A2 |
| Pino 18 | P4_3 — General purpose I/O / EMC_A3 |
| Pino 19 | P4_4 — General purpose I/O / EMC_A4 |
| Pino 20 | P4_5 — General purpose I/O / EMC_A5 |
| Pino 21 | P4_6 — General purpose I/O / EMC_A6 |
| Pino 22 | P4_7 — General purpose I/O / EMC_A7 |
| Pino 23 | VDD — Supply voltage |
| Pino 24 | VSS — Ground |
| Pino 25 | P4_8 — General purpose I/O / EMC_A8 |
| Pino 26 | P4_9 — General purpose I/O / EMC_A9 |
| Pino 27 | P4_10 — General purpose I/O / EMC_A10 |
| Pino 28 | P4_11 — General purpose I/O / EMC_A11 |
| Pino 29 | P4_12 — General purpose I/O / EMC_A12 |
| Pino 30 | P4_13 — General purpose I/O / EMC_A13 |
| Pino 31 | P4_14 — General purpose I/O / EMC_A14 |
| Pino 32 | P4_15 — General purpose I/O / EMC_A15 |
| Pino 33 | VDD — Supply voltage |
| Pino 34 | VSS — Ground |
| Pino 35 | P5_0 — General purpose I/O / EMC_D0 |
| Pino 36 | P5_1 — General purpose I/O / EMC_D1 |
| Pino 37 | P5_2 — General purpose I/O / EMC_D2 |
| Pino 38 | P5_3 — General purpose I/O / EMC_D3 |
| Pino 39 | P5_4 — General purpose I/O / EMC_D4 |
| Pino 40 | P5_5 — General purpose I/O / EMC_D5 |
| Pino 41 | P5_6 — General purpose I/O / EMC_D6 |
| Pino 42 | P5_7 — General purpose I/O / EMC_D7 |
| Pino 43 | VDD — Supply voltage |
| Pino 44 | VSS — Ground |
| Pino 45 | P6_0 — General purpose I/O / EMC_D8 |
| Pino 46 | P6_1 — General purpose I/O / EMC_D9 |
| Pino 47 | P6_2 — General purpose I/O / EMC_D10 |
| Pino 48 | P6_3 — General purpose I/O / EMC_D11 |
| Pino 49 | P6_4 — General purpose I/O / EMC_D12 |
| Pino 50 | P6_5 — General purpose I/O / EMC_D13 |
| Pino 51 | P6_6 — General purpose I/O / EMC_D14 |
| Pino 52 | P6_7 — General purpose I/O / EMC_D15 |
| Pino 53 | VDD — Supply voltage |
| Pino 54 | VSS — Ground |
| Pino 55 | P6_8 — General purpose I/O / EMC_D16 |
| Pino 56 | P6_9 — General purpose I/O / EMC_D17 |
| Pino 57 | P6_10 — General purpose I/O / EMC_D18 |
| Pino 58 | P6_11 — General purpose I/O / EMC_D19 |
| Pino 59 | P6_12 — General purpose I/O / EMC_D20 |
| Pino 60 | P7_0 — General purpose I/O / EMC_D21 |
| Pino 61 | P7_1 — General purpose I/O / EMC_D22 |
| Pino 62 | P7_2 — General purpose I/O / EMC_D23 |
| Pino 63 | VDD — Supply voltage |
| Pino 64 | VSS — Ground |
| Pino 65 | P7_3 — General purpose I/O / EMC_D24 |
| Pino 66 | P7_4 — General purpose I/O / EMC_D25 |
| Pino 67 | P7_5 — General purpose I/O / EMC_D26 |
| Pino 68 | P7_6 — General purpose I/O / EMC_D27 |
| Pino 69 | P7_7 — General purpose I/O / EMC_D28 |
| Pino 70 | P8_0 — General purpose I/O / EMC_D29 |
| Pino 71 | P8_1 — General purpose I/O / EMC_D30 |
| Pino 72 | P8_2 — General purpose I/O / EMC_D31 |
| Pino 73 | VDD — Supply voltage |
| Pino 74 | VSS — Ground |
| Pino 75 | P8_3 — General purpose I/O |
| Pino 76 | P8_4 — General purpose I/O |
| Pino 77 | P8_5 — General purpose I/O |
| Pino 78 | P8_6 — General purpose I/O |
| Pino 79 | P8_7 — General purpose I/O |
| Pino 80 | P8_8 — General purpose I/O |
| Pino 81 | P9_0 — General purpose I/O |
| Pino 82 | P9_1 — General purpose I/O |
| Pino 83 | VDD — Supply voltage |
| Pino 84 | VSS — Ground |
| Pino 85 | P9_2 — General purpose I/O |
| Pino 86 | P9_3 — General purpose I/O |
| Pino 87 | XTALIN — Crystal oscillator input |
| Pino 88 | XTALOUT — Crystal oscillator output |
| Pino 89 | RESET — Reset input (active low) |
| Pino 90 | VREFN — ADC reference negative |
| Pino 91 | VREFP — ADC reference positive |
| Pino 92 | VDDA — Analog supply |
| Pino 93 | VSSA — Analog ground |
| Pino 94 | SWDIO — Serial Wire Debug I/O |
| Pino 95 | SWCLK — Serial Wire Debug clock |
| Pino 96 | P0_0 — General purpose I/O |
| Pino 97 | P0_1 — General purpose I/O |
| Pino 98 | P0_2 — General purpose I/O |
| Pino 99 | P0_3 — General purpose I/O |
| Pino 100 | P0_4 — General purpose I/O |
Aplicações típicas
LPC54606J512BD100E é adequado para 7 aplicaçãos: Industrial HMI with LCD, IoT Gateway / Edge Node, Smart Energy Metering with CAN FD, Audio Front End with PDM Microphones, Connected Medical Device, Automotive Infotainment / Telematics, Smart Home / Building Automation Hub.
Industrial HMI with LCD
The LPC54606J512BD100E's integrated LCD controller drives TFT panels up to WVGA resolution directly, eliminating external graphics chips and shrinking BOM. Its 220 MHz Cortex-M4 with FPU renders responsive touch UIs while the 200 KB SRAM holds full frame buffers for smooth animation. The 12-bit ADC reads analog sensor inputs (temperature, pressure, potentiometers) for operator feedback. Hardware crypto and secure boot from NXP support tamper-resistant industrial control panels, while the wide 1.71-3.6V supply tolerates 24V industrial bus rails via simple LDO front-ends. Ethernet AVB and CAN FD enable real-time machine-to-machine communication in factory automation networks.
Recomendado
IoT Gateway / Edge Node
With 21 communication interfaces including dual USB, 10/100 Ethernet AVB, CAN FD, SD/MMC, SPIFI, and Smart Card, the LPC54606J512BD100E consolidates an entire IoT gateway into a single chip. The Cortex-M4 with DSP handles on-device analytics and protocol translation (Modbus, BACnet, MQTT) before forwarding to the cloud. Its 512 KB Flash stores full TLS stacks and OTA bootloader, while 200 KB SRAM buffers burst sensor traffic. The Cortex-M4's deterministic interrupt latency ensures time-sensitive IoT operations complete predictably, critical for industrial IoT where missed deadlines cause process faults.
Recomendado
Smart Energy Metering with CAN FD
The LPC54606J512BD100E's integrated CAN FD controller enables high-bandwidth communication between smart meters and concentrators at 5 Mbps, doubling classical CAN throughput for grid telemetry. The 12-bit ADC at 12 channels reads current transformers and voltage dividers for accurate Class 0.5 metering, while the RTC with battery domain maintains time-of-use billing during power outages. The 200 KB SRAM buffers interval data between transmissions. Security features including hardware AES, secure boot, and TrustZone-M prevent firmware tampering and meter bypass attacks common in deployed energy systems.
Recomendado
Audio Front End with PDM Microphones
The LPC54606J512BD100E includes a dedicated DMIC subsystem with PDM microphone interface, supporting multi-mic arrays for voice capture and beamforming in smart speakers and conference systems. Its DSP extensions accelerate audio codecs (Opus, AAC, SBC) and noise suppression algorithms on-chip, offloading cloud processing. The 220 MHz headroom runs full-duplex audio pipelines without compromising on other system tasks. Combined with Ethernet AVB, the device streams time-synchronized audio over networks for distributed microphone arrays, AVB-compliant installations, and pro-audio recording equipment.
Recomendado
Connected Medical Device
For connected medical devices such as patient monitors, infusion pumps, and diagnostic peripherals, the LPC54606J512BD100E combines USB device connectivity for host systems with Ethernet for hospital networks. Its Cortex-M4F FPU computes vital-sign algorithms (heart rate from PPG, SpO2, respiration) with deterministic timing. The wide 1.71-3.6V supply supports Li-ion battery packs for portable devices, while the RTC with battery domain timestamps medical events during transport. Hardware AES and secure boot satisfy IEC 62443 requirements for medical cybersecurity, increasingly mandated for FDA-cleared connected devices.
Recomendado
Automotive Infotainment / Telematics
While not AEC-Q100 qualified, the LPC54606J512BD100E's CAN FD, dual USB, Ethernet, and LCD controller serve automotive aftermarket infotainment and fleet telematics applications operating from -40C to +105C. Its Cortex-M4 DSP decodes compressed audio and routes camera inputs to displays. The 200 KB SRAM handles telematics protocol stacks (OBD-II, UDS) while the 512 KB Flash stores multi-language UI assets and CAN database files. Combined with external LTE/5G modems via USB, the device forms compact connected vehicle gateways for fleet management and insurance telematics services.
Recomendado
Smart Home / Building Automation Hub
The LPC54606J512BD100E consolidates multiple smart-home protocols into a single hub: Wi-Fi/BLE via USB dongles, Thread/Zigbee via SPI, and wired connections via Ethernet and CAN. Its 512 KB Flash runs full home automation stacks (Matter, HomeKit, custom), while 200 KB SRAM buffers concurrent device connections. The RTC with battery backup maintains time sync for security cameras and presence detection during power outages. Hardware crypto accelerators authenticate Matter commissioning without burdening the main CPU, leaving headroom for rule engines and voice control integration.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC54606J512BD100E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC54608J512BD100E | LPC54607J512BD100E | LPC54605J256BD100E | STM32F407VGT6 | GD32F405VGT6 |
|---|---|---|---|---|---|---|
| Package | LQFP-100 (14x14) | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | STMicroelectronics | GigaDevice | ||
| Core | Cortex-M4F 220 MHz | Cortex-M4F 220 MHz | Cortex-M4F 168 MHz | Cortex-M4F 168 MHz | ||
| Flash | 512 KB | 512 KB | 1 MB | 1 MB | ||
| SRAM | 200 KB | 104 KB | 192 KB | 192 KB | ||
| Ethernet | 10/100 + AVB | 10/100 + AVB | 10/100 (no AVB) | None on some revs | ||
| USB | HS + FS Host/Device | HS + FS | OTG HS + OTG FS | OTG FS only | ||
| LCD Controller | Yes (integrated) | Yes | No (LTDC on F429 only) | No | ||
| CAN FD | Yes | Yes | No (classic CAN only) | No (classic CAN only) |
Principais diferenciais
- Highest SRAM in LPC546xx family at 200 KB (vs LPC54608J512BD100E)
- Built-in Ethernet AVB without external MAC (vs STM32F407VGT6)
- Integrated LCD controller at this price tier (vs STM32F407VGT6 / GD32F405VGT6)
- Higher 220 MHz core clock than 168 MHz competitors (vs STM32F407VGT6 / GD32F405VGT6)
Notas de projeto
Place one 100 nF ceramic decoupling capacitor within 3 mm of every VDD pin and one 10 uF bulk capacitor per VDD domain on the LPC54606J512BD100E. The 1.71-3.6V supply is tolerant of Li-ion direct connection, but place a ferrite bead between analog VDDA and digital VDD to prevent digital switching noise coupling into the 12-bit ADC reference. Use a low-noise LDO (e.g., TPS7A4701RGWR from Site MPN list) for VDDA in metering applications where ADC accuracy is critical.
The LQFP-100 (14x14 mm) package has theta_JA of approximately 50 C/W on a 4-layer JEDEC test board with no airflow. At 220 MHz active with all peripherals enabled, the LPC54606J512BD100E draws around 100 mA typical, dissipating 330 mW at 3.3V. Junction temperature rise of 16.5 C above ambient is well within the 105 C rating for most environments, but thermal relief copper pours on top of the LQFP land pattern are still recommended for designs operating above 85 C ambient.
The 0.5 mm pitch LQFP-100 footprint requires PCB traces of 0.2 mm width or finer with matched impedance routing for high-speed USB and Ethernet differential pairs. Route USB_DP/DM and ETH_TXP/N as 90 ohm differential pairs with length matching to within 150 mil. Keep SPIFI clock traces under 50 mm with series termination to avoid ringing when driving external SPI Flash at 50+ MHz. Provide a 4-layer PCB with continuous ground plane beneath the device to minimize EMI from the 220 MHz core.
Do not leave unused LQFP pins floating on the LPC54606J512BD100E - configure them as outputs driving low or as inputs with internal pull-downs enabled in the IOCON register to prevent CMOS input oscillation that increases quiescent current. Ensure the SWDIO/SWCLK pins are not repurposed by application code without debugger-aware logic, as disabling SWD can brick the device (require ISP mode via UART for recovery). The internal 12 MHz IRC is sufficient for USB operation but not for CAN FD at 5 Mbps - use the high-speed crystal oscillator for CAN FD applications.
When routing the LPC54606J512BD100E's external memory controller (EMC) bus to external SRAM or NAND Flash, keep address and data traces under 100 mm with controlled 50 ohm impedance. Use series damping resistors (22-33 ohm) on heavily loaded data lines to reduce ringing. For SD/MMC interfaces, add ESD protection diodes (e.g., USBLC6-2SC6) near the connector and route CLK with 50 ohm impedance away from sensitive analog inputs.
Informações de conformidade
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - for automotive AEC-Q100 applications use NXP S32K or KEAZ families. Lead-free and halogen-free per NXP environmental data.
