M1AFS1500-FGG484I - Fusion FPGA 1.5M Gates 484-BGA | Microchip
N.º da peça: M1AFS1500-FGG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $235 | $235,00 |
| 10 | $211.5 | $2.115,00 |
| 100 | $188 | $18.800,00 |
| 500 | $169.2 | $84.600,00 |
| 1.000 | $152.28 | $152.280,00 |
M1AFS1500-FGG484I Visão geral
A field programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, programmable interconnects, and I/O cells that designers configure in the field via hardware description languages such as Verilog or VHDL. Within the programmable logic hierarchy, the Fusion family occupies the mixed-signal FPGA tier, combining flash-based programmable fabric with configurable analog blocks, large flash memory, and clock management circuitry in a monolithic 130nm CMOS device.
Key features include flash-based configuration (no external boot flash required, instant-on startup), an embedded ARM Cortex-M1 processor for embedded control, comprehensive on-chip clock generation and management, and configurable analog peripherals such as ADC, comparators, and voltage monitors that reduce external bill-of-material cost. The 1.5V core supply and up to 350 MHz fabric operation support demanding computation and data-path designs.
Technically, the device is built on a 130nm flash-based process, which provides inherent design security and immunity to configuration upset compared with SRAM FPGAs. The fabric provides 276,480 bits of user memory alongside hard FIFOs and clock conditioning circuits, and the FGG484 ball-grid package delivers dense, reliable surface-mount interconnect for high-I/O designs.
Typical applications include industrial automation controllers, mixed-signal sensor aggregation, portable instrumentation, motor control, and secure embedded systems where the ARM Cortex-M1 handles protocol stacks while the fabric implements custom logic interfaces.
When designing with this device, verify power-rail sequencing of the 1.5V core and I/O banks, and confirm that the industrial -40C to +85C rating covers the worst-case junction temperature under your thermal budget.
This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and application guidance not found in the manufacturer datasheet, with pricing as of 2026-09-02.
Alternativas drop-in para M1AFS1500-FGG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com M1AFS1500-FGG484I (mesmo formato e footprint) — diferindo em Package, System Gates, Process Technology, Family, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
M1AFS1500-2FGG484I
✅ Drop-In✓ Em estoque
$201.11 / unidade
Ver ficha técnica →M1AFS1500-1FGG484
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →M1AFS1500-2FG484
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →M1AFS1500-1FG484
✅ Drop-In✓ Em estoque
$1089.55 / unidade
Ver ficha técnica →AFS1500-FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
M1AFS600-FG484I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →M7AFS600-FGG484I
✅ Drop-In✓ Em estoque
$219.2 / unidade
Ver ficha técnica →M1AFS1500-FGG484I Classificações máximas e características elétricas
| Series | Fusion (M1AFS1500) |
| Logic Cells | 38400 |
| System Gates | 1500000 (1.5M) |
| Total Memory Bits | 276480 |
| Number of I/Os | 223 |
| Embedded Processor | ARM Cortex-M1 |
| Technology | 130 nm CMOS, flash-based configuration |
| Tensão de alimentação de operação | 1.5 V |
| Frequência máxima de clock | 350 MHz |
| Temperatura de operação | -40C to +85C |
| Encapsulamento / Caixa | 484-BGA (FBGA) |
| Estilo de montagem | SMD/SMT |
| Packaging | Tray |
| Programmability Type | In-System Programmable (flash-based) |
| Speed Grade | Standard (unmarked speed suffix) |
| Analog Peripherals | Configurable analog block (ADC, comparators, voltage monitors) |
| Clock Management | On-chip clock generation and management circuitry |
Guia de Configuração de Pinos do M1AFS1500-FGG484I 484-bga (fbga)
Configuração de pinos para M1AFS1500-FGG484I (pacote 484-bga (fbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para M1AFS1500-FGG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
M1AFS1500-FGG484I é adequado para 6 aplicaçãos: Industrial Automation Controllers, Mixed-Signal Sensor Aggregation, Portable Test and Measurement Instrumentation, Motor Control Drives, Secure Embedded Systems, Communication Interface Bridges.
Industrial Automation Controllers
The M1AFS1500-FGG484I fits industrial automation controllers that must merge real-time I/O handling with protocol processing. Its ARM Cortex-M1 processor runs communication stacks (e.g., fieldbus framing) while the 1.5M-gate flash-based fabric implements deterministic I/O scanning, encoder interfaces, and safety interlock logic with microsecond latency. Flash configuration gives instant-on startup, so controllers are live within milliseconds of power application - a requirement for machines that must resume production quickly after outages. The 223 user I/Os accommodate dense sensor and actuator banks, and the -40C to +85C industrial rating covers control-cabinet environments. Placing the FPGA between field wiring and a host CPU offloads hard-real-time tasks from software, improving cycle-time determinism; the trade-off is a 1.5V core rail and multiple I/O bank rails that must be sequenced correctly in the power tree.
Recomendado
Mixed-Signal Sensor Aggregation
The M1AFS1500-FGG484I is well suited to mixed-signal sensor aggregation nodes because the Fusion family integrates a configurable analog block - ADC, comparators, and voltage monitors - alongside the digital fabric in one 130nm CMOS die. Sensor front ends for temperature, pressure, and current monitoring can be conditioned and digitized on-chip, then time-stamped, filtered, and packetized by the 38,400-cell fabric, reducing external component count and board area in the 484-FBGA footprint. The 276,480 bits of on-chip memory buffer burst-sensor data without external RAM in small systems. Flash-based configuration also keeps the analog calibration and digital datapath loaded at power-up without a boot flash. Designers should budget the analog block's limited channel count carefully: for systems needing more than a handful of analog inputs, external multiplexing or additional ADCs remain necessary.
Recomendado
Portable Test and Measurement Instrumentation
In portable test and measurement instruments, the M1AFS1500-FGG484I provides the acquisition datapath and system control in a single 1.5V-supply device. The 350 MHz maximum fabric clock supports high-rate counters, pattern generators, and trigger engines, while the ARM Cortex-M1 handles menus, calibration routines, and USB or UART communication. Because configuration is flash-based, the instrument is ready to measure instantly at power-up - important for handheld and battery-powered equipment where users expect immediate operation. The 223 I/Os in the 484-FBGA connect front-end attenuators, comparators, and display interfaces without fanout devices. Power-sensitive portable designs should note that FPGA static and dynamic current at high fabric utilization can dominate battery budget; using clock gating and lower speed grades where timing allows extends runtime materially.
Recomendado
Motor Control Drives
The M1AFS1500-FGG484I serves industrial motor-control drives by generating deterministic PWM patterns and processing quadrature-encoder feedback entirely in hardware, achieving loop update rates software-only controllers cannot match. The ARM Cortex-M1 executes the speed and position control loops and fieldbus command interface, while the 1.5M-gate fabric implements multi-channel PWM with dead-time insertion, fault blanking, and safety shutdown paths. The configurable analog block provides integrated current-sense monitoring via its ADC and comparators, enabling fast over-current protection without a separate supervisor IC. The industrial -40C to +85C rating and 484-FBGA solder reliability suit drive enclosures. A key design consideration: PWM switching noise couples into the analog block, so careful ground partitioning and filtering of the analog supply rail are required to preserve measurement accuracy.
Recomendado
Secure Embedded Systems
For secure embedded systems, the M1AFS1500-FGG484I leverages the Fusion family's flash-based configuration fabric, which is inherently more resistant to bitstream interception than SRAM FPGAs because the configuration lives in nonvolatile flash on the die and is not loaded from an external device at every power-up. The ARM Cortex-M1 runs authentication and key-handling firmware while the fabric implements custom cryptographic datapaths, secure boot state machines, and anti-tamper logic. The monolithic 130nm device removes the external boot-flash attack surface entirely, and the 1.5M-gate capacity accommodates AES-class or state-specific datapaths with margin. Designers should still apply Microchip's FlashLock and design-security features documented in the Fusion security user guide, and verify that the standard (non-Q) temperature grade of -40C to +85C meets the deployment environment.
Recomendado
Communication Interface Bridges
The M1AFS1500-FGG484I works well as a communication interface bridge, translating between legacy and modern protocols. The 223 I/Os and 484-FBGA density support multiple parallel interfaces simultaneously - for example, a 16-bit parallel bus on one side and serial links on the other - while the fabric implements protocol conversion, buffering, and clock-domain crossing logic at the 350 MHz maximum fabric rate. The 276,480 bits of on-chip memory provide FIFO depth for rate matching, and the integrated clock management circuitry generates the clean domain clocks needed across mixed-protocol designs. The ARM Cortex-M1 manages link bring-up, status reporting, and housekeeping. Because flash configuration is instant-on, bridges return to service immediately after power cycles in remote or unattended installations; the main trade-off is that I/O bank voltage assignment must be planned early to match both protocol sides.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para M1AFS1500-FGG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | M1AFS1500-2FGG484I | M1AFS1500-1FGG484 | AFS1500-FGG484I | M1AFS600-FG484I |
|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (Microsemi legacy) | Microchip Technology |
| System Gates | 1.5M | 1.5M | 1.5M | 1.5M | 600K |
| User I/O | 223 | 223 | 223 | 223 | 223 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Processor | ARM Cortex-M1 (M1 variant) | ARM Cortex-M1 | ARM Cortex-M1 | Not M1-marked (base Fusion) | ARM Cortex-M1 |
Principais diferenciais
- ARM Cortex-M1 embedded processor in the M1 flow (vs AFS1500-FGG484I)
- Largest capacity in the same 484-FBGA footprint (vs M1AFS600-FG484I)
- Flash-based instant-on configuration (vs SRAM FPGAs (Xilinx/Intel))
- Speed grade flexibility on the same footprint (vs M1AFS1500-2FGG484I)
Notas de projeto
The M1AFS1500-FGG484I lists a 1.5V operating supply, but a complete Fusion FPGA design requires multiple rails (core, I/O banks, and analog block) per the Fusion datasheet power-supply section. Build the power tree early in the design and verify rail sequencing: flash-based Fusion devices are tolerant of most power-up sequences, but I/O bank voltages must respect the pin assignment in Libero SoC. Estimated: dynamic core current scales with fabric clock rate and toggling activity, so budget regulators with at least 30% headroom above Libero SmartPower estimates.
The 484-FBGA ball pitch requires careful escape routing; use via-in-pad or dogbone escapes on the outer ball rows and plan inner-row breakouts before finalizing layer count - typically at least 6 layers for this ball count. Place 100nF ceramic decoupling capacitors close to each supply ball group and bulk capacitance near the regulator. Follow the PCB land-pattern recommendations in the manufacturer datasheet and Microchip FPGA packaging application notes for reflow profile and MSL handling of the tray-packed BGA.
The I grade guarantees -40C to +85C ambient operation, but junction temperature under full fabric utilization can run well above ambient. Estimated: with typical core dynamic power for a 1.5M-gate design and the 484-BGA thermal resistance, a 4-layer board with a solid ground plane usually keeps junction temperature within rating, but high-utilization designs at elevated ambient should run Microchip's thermal estimator or add copper pour/heatsink. Verify timing at the worst-case junction temperature corner in Libero static timing analysis.
Do not confuse the M1 and non-M1 part flows: M1AFS1500 devices support the ARM Cortex-M1 processor flow, and designs targeting the M1 part must be compiled with the matching Libero SoC device selection. Also confirm the speed grade of any substitute before dropping it in - replacing the standard grade with a -1 part (e.g., M1AFS1500-1FGG484) can break timing closure on paths designed near the 350 MHz fabric limit. Always re-run implementation and timing analysis when changing any part-number suffix.
Informações de conformidade
Compliance status was not stated in the retrieved distributor data; the GG suffix in the part number conventionally indicates a lead-free (Pb-free) Microchip offering, but official RoHS/REACH declarations should be confirmed from Microchip's product page before export documentation.