M7AFS600-2FGG484I - 600K-Gate Fusion FPGA, 172 I/O | Microchip
MPN: M7AFS600-2FGG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $293.67 | $293.67 |
| 10 | $278.99 | $2,789.90 |
| 100 | $264.31 | $26,431.00 |
| 500 | $252.56 | $126,280.00 |
| 1,000 | $243.75 | $243,750.00 |
Drop-in alternatives for M7AFS600-2FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M7AFS600-2FG484I
✅ Drop-In✓ In Stock
$272.01 / Unit
View Datasheet →M7AFS600-FGG484I
✅ Drop-In✓ In Stock
$219.2 / Unit
View Datasheet →M7AFS600-1FGG484I
✅ Drop-In✓ In Stock
$228 / Unit
View Datasheet →M1AFS600-2FG484I
✅ Drop-In✓ In Stock
$97.6 / Unit
View Datasheet →M7AFS600-2FGG484I Maximum Ratings & Electrical Characteristics
| Family | Fusion (M7 military/extended screening) |
| System Gates | 600K |
| Number of I/O | 172 |
| Core Supply Voltage | 1.5 V |
| Package | 484-BGA (FBGA) |
| Ball Pitch | 1 mm |
| Speed Grade | -2 |
| Internal Timing Frequency (listed) | 1470.59 MHz |
| Process Technology | 130 nm |
| Configuration Technology | Flash-based, nonvolatile |
| Processor Support | ARM CoreMP7 |
| Operating Temperature | -40C to +85C |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Series | M7AFS600 |
| Programmable Resource (DigiKey listing) | 110592 |
M7AFS600-2FGG484I 484-bga (fbga) Pin Configuration Guide
Complete pinout information for M7AFS600-2FGG484I (484-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-2FGG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-2FGG484I is suitable for 6 applications: Industrial Automation Controllers, Avionics and Defense Interface Electronics, Medical Instrumentation, Communications Line Cards, Test and Measurement Equipment, Security and Surveillance Systems.
Industrial Automation Controllers
Industrial PLC and motion-control controllers benefit directly from the M7AFS600-2FGG484I's combination of 600K system gates, 172 user I/O, and flash-based instant-on configuration. Because the fabric is nonvolatile, the controller is operational within microseconds of power application - critical for safety interlocks and machine sequencing - and no external configuration flash is required on a noisy factory floor. The integrated mixed-signal monitoring blocks supervise board voltage and temperature, replacing discrete supervisory ICs and reducing BOM count. The 172 I/O support multiple banks of 3.3V-class interfaces such as SPI, UART, and parallel fieldbus glue logic, while the ARM CoreMP7 support enables soft-processor control loops alongside deterministic hardware state machines. The -40C to +85C range covers unconditioned cabinets and outdoor panels.
Recommended
Avionics and Defense Interface Electronics
The M7 prefix of the M7AFS600-2FGG484I denotes Microsemi's military/extended screening flow, which is exactly why defense and avionics integrators select it over the commercial AFS600. In interface applications - MIL-STD bus glue logic, sensor aggregation, and discrete-to-digital conversion - the 600K-gate flash fabric provides single-chip integration with instant-on behavior and configuration tamper resistance inherent to flash technology. The industrial-to-military extended screening, combined with the -40C to +85C (and better, per program flow) temperature coverage and 484-FBGA mechanical robustness, suits conduction-cooled embedded boards. Designers instantiate the ARM CoreMP7 soft processor for protocol handling while reserving fabric for deterministic timing-critical paths, and the nonvolatile boot eliminates configuration PROMs from high-vibration assemblies.
Recommended
Medical Instrumentation
Medical diagnostic devices - patient monitors, imaging front-end controllers, and lab analyzers - use the M7AFS600-2FGG484I to consolidate timing, interface, and supervisory logic in one 600K-gate device. The Fusion family's integrated voltage and temperature monitoring supports the continuous self-test records expected in IEC 60601-class equipment documentation, while flash configuration guarantees deterministic startup without configuration download delays. With 172 I/O the device bridges sensor arrays, communication ports, and display interfaces; the -2 speed grade provides timing headroom for high-rate data paths. Because the fabric is live-probe debug capable, firmware and RTL verification during design validation is simplified. The 484-FBGA with 1 mm pitch assembles on standard medical-grade SMT lines without exotic reflow profiles.
Recommended
Communications Line Cards
Telecom and datacom line cards deploy the M7AFS600-2FGG484I as backplane interface glue: framing logic, status aggregation, LED/drivers, and I2C/SMD management-bus arbitration. The 600K-gate capacity absorbs protocol state machines while the 172 I/O terminate card-edge and backplane signals across multiple I/O banks. Flash-based configuration with instant-on lets the card participate in hot-swap bring-up sequencing immediately, and the Fusion analog block reports card voltage/current telemetry to the shelf manager without a separate microcontroller. Distributor timing figures for the -2 grade (1470.59 MHz internal class) leave margin for fast serial interfacing at moderate rates. The -40C to +85C rating accommodates central-office ambient specifications, and the FBGA footprint routes cleanly on controlled-impedance backplane boards.
Recommended
Test and Measurement Equipment
Bench and automated test instruments use the M7AFS600-2FGG484I for channel control logic, trigger engines, and host-interface bridging. The nonvolatile flash fabric means the instrument is ready the moment power is applied, and live-probe debug allows engineers to inspect internal nodes during system bring-up - a workflow advantage unique to Actel-lineage flash FPGAs. With 600K gates and 172 I/O, the part implements multichannel pattern generators and acquisition state machines while the ARM CoreMP7 soft processor runs housekeeping and communication stacks (USB/UART/GPIB bridges). The -2 speed grade timing margin supports fast counter/timer paths. Its 1.5V core keeps dynamic power acceptable in fanless instruments, and the 484-FBGA package simplifies signal escape on dense mainboards.
Recommended
Security and Surveillance Systems
High-end surveillance and access-control platforms use the M7AFS600-2FGG484I to aggregate camera interfaces, tamper switches, and network PHY glue logic into a single 600K-gate fabric. The 172 I/O terminate parallel sensor buses and discrete alarm inputs across isolated I/O banks, while flash configuration provides instant-on monitoring with no boot window - important for security appliances expected to log from the moment mains power appears. The integrated analog monitoring reports enclosure temperature and rail health to the system controller. The -40C to +85C industrial range supports outdoor camera enclosures, and the ARM CoreMP7 support handles network stack offload. The 484-FBGA footprint also permits thermal-friendly placement across multilayer PCBs in fanless NVR housings.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-2FGG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-2FG484I | M7AFS600-FGG484I | M7AFS600-1FGG484I | M1AFS600-2FG484I |
|---|---|---|---|---|---|
| Package | 484-BGA (FBGA) | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | -2 | -2 | Standard | -1 | -2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Screening Flow | M7 military/extended | M7 military/extended | M7 military/extended | M7 military/extended | Standard commercial |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | [DATA_NEEDED] |
| Configuration | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile |
Key Differentiators
- Faster -2 speed grade timing (vs M7AFS600-1FGG484I)
- Lead-free FGG ball finish (vs M7AFS600-2FG484I)
- M7 military screening flow (vs M1AFS600-2FG484I)
Design Notes
Plan the power tree around a 1.5V core rail plus per-bank I/O voltages (3.3V-class per distributor listings). Fusion flash FPGAs are instant-on, but confirm inrush and sequencing against the family datasheet DC characteristics before fixing the regulator order. Estimate: at typical mid-density utilization, core current for a 600K-gate 130nm flash fabric is generally in the hundreds of milliamps - validate with Microchip Libero power analysis for your actual RTL rather than assuming. Decouple each supply ball cluster with bulk plus 0.1uF ceramics per Microsemi power application notes.
The 484-ball FBGA at 1 mm pitch requires a via-in-pad or dog-bone escape strategy on at least four signal layers to fan out all 172 user I/O plus power/ground balls. Follow the recommended land pattern in the Microsemi packaging document and use NSMD pads. Because the M7AFS600 is flash-based, no configuration PROM routing is needed, freeing board area - but reserve routing for JTAG/live-probe access headers, which are invaluable for debug on this family.
Do not confuse ordering-code suffixes when procuring: FGG denotes lead-free ball finish while FG denotes standard finish, and -1/-2 denote speed grades with measurably different timing (about 1.28 GHz-class vs 1470.59 MHz-class internal timing per Xecor/distributor comparisons). Mixing grades on one BOM can fail static timing at board test. Also, treat cross-brand FPGAs (Xilinx/AMD, Intel/Altera) as non-drop-in: different pinout, tools, and configuration architecture make replacement a full redesign.
Compliance Information
FGG ordering code denotes lead-free ball finish per Microsemi naming convention. Formal RoHS/REACH certificates should be pulled from the Microchip compliance portal for the exact order code; M7 screened parts may carry program-specific documentation.
