MC33742PEPR2 - SBC w/ CAN, 2x LDO, 4 Wake | NXP | QFN-48
N.º da peça: MC33742PEPR2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.12 | $6,12 |
| 10 | $5.48 | $54,80 |
| 100 | $4.71 | $471,00 |
| 500 | $4.05 | $2.025,00 |
| 1.000 | $3.42 | $3.420,00 |
MC33742PEPR2 Visão geral
A System Basis Chip is a category of mixed-signal automotive IC that combines multiple power, communication, and supervisory functions that previously required several discrete components around an automotive microcontroller. Within the broader hierarchy, an SBC belongs to the power management and in-vehicle networking ecosystem alongside transceivers, voltage regulators, and watchdog supervisors. By collapsing these functions into one die, the MC33742 reduces PCB area, simplifies wiring harness interfaces, and helps automakers meet stringent quiescent-current budgets for modules that must remain in a low-power state when the vehicle is parked.
Key features include a fixed 5.0 V/200 mA LDO with current limit and overtemperature pre-warning, a second auxiliary 5.0 V regulator for sensor or communication supplies, four independent wake-up inputs that allow the ECU to exit Sleep mode from local events such as door-switch transitions or sensor edges, a high-speed CAN physical layer capable of 1 Mb/s operation, and a programmable reset generator with 15 ms duration. Internal protection covers thermal shutdown, watchdog timer, and battery voltage monitoring.
The device uses a mixed bipolar-CMOS process with an integrated charge pump and high-side drivers to support the CAN bus recessive/dominant drive symmetry. Its Sleep mode draws a very low quiescent current, allowing body and chassis ECUs to meet the < 100 µA sleep-current targets expected by major OEMs. Compared with discrete solutions, the SBC eliminates inter-IC glue logic and improves ESD/EMC robustness because all sensitive pins are co-located on a controlled silicon substrate.
Typical applications include HVAC control modules, body control modules, instrument clusters, door modules, and seat control units in 12 V automotive systems (5 V/9 V/12 V/15 V/18 V/24 V nominal battery compatibility per the datasheet). The integrated CAN interface makes it a natural fit for powertrain-adjacent and chassis nodes where HS-CAN is the dominant backbone.
For design, attach the exposed thermal pad to a continuous ground copper pour with multiple thermal vias. Place the two decoupling capacitors (one per LDO) directly at their respective output pins to keep load transients within regulation.
This page consolidates distributor pricing, drop-in compatible alternatives, and design guidance not bundled in the original 2004-vintage datasheet, giving procurement engineers and PCB designers a single practical reference.
Alternativas drop-in para MC33742PEPR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC33742PEPR2 (mesmo formato e footprint) — diferindo em CAN Data Rate, Operating Temperature, Package, Supply Voltage Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC33742EPR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33742SPEGR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33742PEG
✅ Drop-In✓ Em estoque
$4.05 / unidade
Ver ficha técnica →MC33742PEP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TLE7259-3GE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33742PEPR2 Especificações
| Product Type | System Basis Chip (SBC) with HS-CAN |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Encapsulamento | 48-QFN-EP (7x7 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| CAN Data Rate | 1 Mb/s (High-Speed CAN) |
| Number of CAN Drivers / Receivers | 1 / 1 |
| Integrated LDOs | 2 x 5.0 V / 200 mA low-dropout regulators |
| Wake-Up Inputs | 4 |
| Reset Duration | 15 ms |
| Supply Voltage Range | 5.5 V to 27 V (5V/9V/12V/15V/18V/24V automotive battery compatibility) |
| Operating Modes | Sleep / Standby / Stop / Normal |
| Protection Features | Current limit, overtemperature pre-warning, thermal shutdown, watchdog, battery voltage monitor |
| Temperatura de operação | -40C to +125C (automotive AEC-Q100 grade 1) |
| Status RoHS | Compliant |
| Lead Free Status | Lead Free |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Primary Applications | Automotive HVAC, body control modules, instrument clusters, door/seat modules |
Guia de Configuração de Pinos do MC33742PEPR2 48-qfn-ep (7x7 mm) with exposed pad
Configuração de pinos para MC33742PEPR2 (pacote 48-qfn-ep (7x7 mm) with exposed pad). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para MC33742PEPR2.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC33742PEPR2 é adequado para 6 aplicaçãos: HVAC Control Module, Body Control Module (BCM), Instrument Cluster, Door Module, Seat Control Unit, Automotive Sensor Node.
HVAC Control Module
The MC33742PEPR2 fits HVAC control modules because its two 5.0 V/200 mA LDOs separately power the MCU and the blower-driver logic, while the integrated HS-CAN transceiver links the HVAC node to the vehicle body network at 1 Mb/s. The four wake inputs detect signals such as door-switch transitions or climate-sensor edges so the module can exit Sleep mode. AEC-Q100 Grade 1 qualification and -40°C/+125°C operation suit under-dash mounting. Placed on the module PCB with the QFN exposed pad soldered to a 1 sq-in copper pour, the SBC supplies a clean rail to the MCU AVDD and handles bus faults automatically. Compared with discrete CAN + LDO + reset designs it reduces BOM by about 4 components, simplifying AEC-Q100 EMI compliance.
Recomendado
Body Control Module (BCM)
In a body control module the MC33742PEPR2 serves as the supply + communication backbone for door locks, lighting drivers and various switch inputs. The HS-CAN interface reaches the vehicle network at 1 Mb/s while the 5 V/200 mA LDOs feed the main MCU and a sensor rail. The four wake inputs handle ignition-key, door and lighting-switch events without waking the MCU - extending battery life. The integrated watchdog and overtemperature pre-warning lower the ECU software burden and ease ASIL B functional-safety analysis. The 48-QFN-EP (7x7) form factor fits compact BCM PCBs and supports external ground-plane thermal relief through the exposed pad, ensuring the part stays within its 125 °C thermal envelope even at 27 V supply and full CAN traffic. This combination is a common choice for premium body-electronics platforms.
Recomendado
Instrument Cluster
The MC33742PEPR2 supplies two isolated 5 V rails to an instrument-cluster MCU and its stepper-motor driver ICs, while the integrated HS-CAN interface carries vehicle-speed, RPM and fuel-level data from the powertrain CAN backbone at 1 Mb/s. The 15 ms reset generator ensures a deterministic MCU startup every crank cycle, critical for cluster boot during cold starts and brief battery dropouts. The four wake inputs let the cluster exit Sleep when the driver opens the door. With an exposed-pad QFN-48 package the SBC handles the wide thermal-load swings of an instrument-cluster environment (sun-load cabin temperatures) while keeping the CAN bus within spec. Compared with stand-alone CAN + LDO designs the SBC saves roughly 30% of board area, a meaningful win for slim cluster housings.
Recomendado
Door Module
Each power-window or power-mirror door module uses the MC33742PEPR2 to consolidate its supply and network functions. The 5 V/200 mA LDOs power the local MCU plus its mirror or window driver; the HS-CAN interface ties into the body-CAN segment; and the four wake inputs handle the door handle touch sensor, child-lock switch and mirror-fold command. AEC-Q100 Grade 1 ratings and -40°C/+125°C operation survive the harsh door-cavity thermal environment. The exposed thermal pad dissipates heat efficiently to the local PCB copper, while the integrated SBC protection (overtemperature pre-warning, watchdog, current limit) lets the door-module software drop functionality rather than latch off on a fault. Long cable runs and high bus noise are no problem because the on-chip transceiver provides the recessive/dominant symmetry the HS-CAN spec demands.
Recomendado
Seat Control Unit
In a power-seat or seat-heating module the MC33742PEPR2 powers the seat logic MCU and switch sensing network with its dual 5 V/200 mA LDOs while routing position and fault data onto the body CAN backbone at 1 Mb/s. Four wake inputs let the seat respond to switch presses from the driver and passenger sides without polling. The SBCs thermal shutdown and current limit protect the seat module against locked-rotor conditions on the seat motor. Its 48-QFN-EP (7x7) package and automotive-grade qualification support under-seat mounting where ambient temperatures climb to 105°C in summer. The integrated watchdog and reset simplify functional-safety documentation for ASIL A SEooC (seat-control) implementations, saving appreciable software effort versus discrete implementations.
Recomendado
Automotive Sensor Node
The MC33742PEPR2 provides the network and power front-end for distributed sensor nodes (parking assist, rain-light, ambient-light, occupant detection). The dual 5 V LDOs feed a small MCU plus the analog sensor front-end, while the HS-CAN interface provides the deterministic network backbone those nodes share with the BCM. Four wake inputs take sensor-flag signals directly so the node can power up in < 1 ms upon stimulus, preserving a low average quiescent current. AEC-Q100 Grade 1 plus the 7x7 mm exposed-pad QFN-48 footprint allow mounting directly behind the bumper or rear-view mirror cavity without thermal runaway. The integrated fault tolerance (overtemperature pre-warning, current limit, watchdog) helps the node survive the harsh under-bumper EMI environment without external protection circuitry.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC33742PEPR2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC33742EPR2 | MC33742SPEGR2 | MC33742PEG | MC33742PEP | TLE7259-3GE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon |
| Package | 48-QFN-EP (7x7) | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | DSO-8 (CAN only) |
| Function Block | HS-CAN + 2x LDO + 4 wake + reset | Identical (industrial grade) | Identical (alt SPI map) | Identical (tray pack) | Identical (tray pack) | HS-CAN only |
| CAN Data Rate | 1 Mb/s | 1 Mb/s | 1 Mb/s | 1 Mb/s | 1 Mb/s | 1 Mb/s |
| Integrated LDO Outputs | 2 x 5.0 V / 200 mA | 2 x 5.0 V / 200 mA | 2 x 5.0 V / 200 mA | 2 x 5.0 V / 200 mA | 2 x 5.0 V / 200 mA | None (CAN only) |
| Wake-Up Inputs | 4 | 4 | 4 | 4 | 4 | 0 (CAN transceiver only) |
| Supply Voltage Range | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 4.75 V to 5.25 V (transceiver only) |
| AEC-Q100 Grade | Grade 1 | Industrial grade | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
| RoHS / Lead Free | Compliant / Yes | Compliant / Yes | Compliant / Yes | Compliant / Yes | Compliant / Yes | Compliant / Yes |
Principais diferenciais
- Integrates HS-CAN + 2 LDOs + 4 wake + reset in one QFN-48 (vs TJA1043)
- Footprint-compatible variant family (vs MC33910 / MC33911)
- Five automotive battery rails covered in one part (vs Discrete CAN+LDO designs)
Notas de projeto
Solder the QFN-48 EP exposed pad directly to a 1 sq-in copper pour with a thermal via array (typically 9x 0.3 mm vias) for heat sinking. In worst-case operation (27 V supply, full CAN traffic, both LDOs at 200 mA) power dissipation reaches ~2 W; without the EP copper pour the junction temperature can exceed the 125°C AEC-Q100 Grade-1 limit. Estimated theta_JA on a 1 sq-in 4-layer PCB is ~25 °C/W, giving a ~50°C temperature rise at 2 W dissipation.
Place the two LDO output capacitors (4.7 µF ESR-stable ceramic or tantalum) within 50 mil of the VOUT pins to ensure loop stability and minimize load-transient excursions. Add a 100 nF Y-rated bypass from each LDO output to the local ground near the SBC. Keep the CANH/CANL traces matched in length and characteristic impedance (~120 Ω differential) and route them next to a continuous ground plane for 2 Mb/s-class EMI immunity.
Do not load the MC33742PEPR2's internal 5 V LDO with more than 200 mA per rail - exceeding this trips the internal current limit and resets the MCU. Verify the watchdog feeding period fits within the SPI configuration of the chosen variant (regular vs -S firmware). The wake-up inputs are edge- or level-selectable; misconfiguring the polarity in SPI can prevent the ECU from exiting Sleep, which is the most common field return for this SBC family.
Informações de conformidade
AEC-Q100 Grade 1 qualified per family datasheet; RoHS compliant and lead-free per DigiKey/NXP product listing.
