MC9S12XD256MAG - 16-Bit HCS12X 80MHz 256KB Flash MCU | NXP
N.º da peça: MC9S12XD256MAG ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.85 | $1.985,00 |
| 500 | $18.2 | $9.100,00 |
| 1.000 | $17.1 | $17.100,00 |
MC9S12XD256MAG Visão geral
Background: HCS12X is NXP's (formerly Freescale) 16-bit microcontroller architecture, evolved from the HCS12 CISC core. It targets automotive body, chassis, and powertrain applications as well as industrial control. The S12XD sub-family adds the XGATE coprocessor for high-bandwidth peripheral servicing and deterministic interrupt response, and shares its peripheral set, programmer's model, and interrupt stacking with HCS12, simplifying migration of legacy HCS12 code bases.
Key features of the MC9S12XD256MAG include 256 KB (256K x 8) of Flash program memory, 12 KB of RAM, 4 KB of EEPROM, an 80 MHz bus-rated CPU with a 25 MHz bus clock typical, dual CAN (msCAN) controllers, multiple SCI/SPI/PWM/IIC peripherals, an 8-channel 10-bit ADC, and an operating voltage range of 2.5 V/5 V that suits automotive 5 V rails.
Technically, the HCS12X core pairs the main CPU with the XGATE peripheral coprocessor for time-critical I/O offload, allowing interrupt latency below 1 us in many configurations. The 144-LQFP package exposes up to four 8-bit Ports (PJ-PK and PT) plus additional PAD/ADDR/DATA buses that allow external memory expansion.
Typical applications include automotive body control modules, industrial PLCs, HVAC controllers, sensor fusion front-ends, and CAN gateway nodes where the dual msCAN modules and large Flash footprint are decisive.
Design consideration: PCB designers should leave generous copper pour under the exposed thermal pad of the 144-LQFP and keep the analog AVREF/VDDA traces short and decoupled to maximise ADC performance; the HCS12X background-debug-mode (BDM) interface should remain accessible for in-circuit debug.
This page synthesises distributor pricing, same-family LQFP alternatives, and practical design notes not collected on the manufacturer product page.
Alternativas drop-in para MC9S12XD256MAG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12XD256MAG (mesmo formato e footprint) — diferindo em ADC, Package, Supply Voltage, Core, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XDT256CAG
✅ Drop-In✓ Em estoque
$17.4 / unidade
Ver ficha técnica →MC9S12XDT256MAG
✅ Drop-In✓ Em estoque
$10.65 / unidade
Ver ficha técnica →MC9S12XDP512MAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12XDP512CAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XEQ512MAG
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →MC9S12XA256MAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XD256MAG Classificações máximas e características elétricas
| Core Architecture | HCS12X (S12XD) |
| Largura do barramento de dados | 16-bit |
| CPU Clock (max) | 80 MHz |
| Program Memory | 256 KB Flash (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Tensão de alimentação | 2.5 V / 5 V |
| CAN Controllers | 2 x msCAN |
| SCI | Up to 2 |
| SPI | Up to 1 |
| ADC | 8-channel, 10-bit |
| PWM Channels | 8 (standard S12 PWM) |
| XGATE Coprocessor | Yes |
| Encapsulamento | 144-LQFP (20 x 20 mm) |
| Temperatura de operação | -40C to +125C (Automotive grade) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do MC9S12XD256MAG
| Pino 1 | PE1 — Port E bit 1 (general-purpose I/O, IRQ) |
| Pino 2 | PE0 — Port E bit 0 (general-purpose I/O, XIRQ) |
| Pino 3 | BKGD — Background Debug Mode |
| Pino 4 | RESET — External reset input (active low) |
| Pino 5 | VDDR |
| Pino 6 | VDD |
| Pino 7 | VSS |
| Pino 8 | VDDPLL — PLL supply |
| Pino 9 | VSSPLL — PLL ground |
| Pino 10 | TEST — Test mode (tie to VSS for normal operation) |
| Pino 11 | XCLKS — Clock select (configuration) |
| Pino 12 | EXTAL — External clock/crystal input |
| Pino 13 | XTAL — Crystal output |
| Pino 14 | PAD00 — External address/data bus bit 0 |
| Pino 15 | PAD01 — External address/data bus bit 1 |
| Pino 16 | PAD02 — External address/data bus bit 2 |
| Pino 17 | PAD03 — External address/data bus bit 3 |
| Pino 18 | PAD04 — External address/data bus bit 4 |
| Pino 19 | PAD05 — External address/data bus bit 5 |
| Pino 20 | PAD06 — External address/data bus bit 6 |
| Pino 21 | PAD07 — External address/data bus bit 7 |
| Pino 22 | PAD08 — External address/data bus bit 8 |
| Pino 23 | PAD09 — External address/data bus bit 9 |
| Pino 24 | PAD10 — External address/data bus bit 10 |
| Pino 25 | PAD11 — External address/data bus bit 11 |
| Pino 26 | PAD12 — External address/data bus bit 12 |
| Pino 27 | PAD13 — External address/data bus bit 13 |
| Pino 28 | PAD14 — External address/data bus bit 14 |
| Pino 29 | PAD15 — External address/data bus bit 15 |
| Pino 30 | PAD16 — External address/data bus bit 16 |
| Pino 31 | PAD17 — External address/data bus bit 17 |
| Pino 32 | PAD18 — External address/data bus bit 18 |
| Pino 33 | PAD19 — External address/data bus bit 19 |
| Pino 34 | PAD20 — External address/data bus bit 20 |
| Pino 35 | PAD21 — External address/data bus bit 21 |
| Pino 36 | PAD22 — External address/data bus bit 22 |
| Pino 37 | PAD23 — External address/data bus bit 23 |
| Pino 38 | PE2 — Port E bit 2 |
| Pino 39 | PE3 — Port E bit 3 |
| Pino 40 | PE4 — Port E bit 4 |
| Pino 41 | PE5 — Port E bit 5 |
| Pino 42 | PE6 — Port E bit 6 |
| Pino 43 | PE7 — Port E bit 7 |
| Pino 44 | PJ0 — Port J bit 0 |
| Pino 45 | PJ1 — Port J bit 1 |
| Pino 46 | PJ2 — Port J bit 2 (XIRQ) |
| Pino 47 | PJ3 — Port J bit 3 |
| Pino 48 | PJ4 — Port J bit 4 |
| Pino 49 | PJ5 — Port J bit 5 |
| Pino 50 | PJ6 — Port J bit 6 |
| Pino 51 | PJ7 — Port J bit 7 |
| Pino 52 | PK0 — Port K bit 0 |
| Pino 53 | PK1 — Port K bit 1 |
| Pino 54 | PK2 — Port K bit 2 |
| Pino 55 | PK3 — Port K bit 3 |
| Pino 56 | PK4 — Port K bit 4 |
| Pino 57 | PK5 — Port K bit 5 |
| Pino 58 | PK6 — Port K bit 6 |
| Pino 59 | PK7 — Port K bit 7 |
| Pino 60 | PA0 — Port A bit 0 |
| Pino 61 | PA1 — Port A bit 1 |
| Pino 62 | PA2 — Port A bit 2 |
| Pino 63 | PA3 — Port A bit 3 |
| Pino 64 | PA4 — Port A bit 4 |
| Pino 65 | PA5 — Port A bit 5 |
| Pino 66 | PA6 — Port A bit 6 |
| Pino 67 | PA7 — Port A bit 7 |
| Pino 68 | PB0 — Port B bit 0 |
| Pino 69 | PB1 — Port B bit 1 |
| Pino 70 | PB2 — Port B bit 2 |
| Pino 71 | PB3 — Port B bit 3 |
| Pino 72 | PB4 — Port B bit 4 |
| Pino 73 | PB5 — Port B bit 5 |
| Pino 74 | PB6 — Port B bit 6 |
| Pino 75 | PB7 — Port B bit 7 |
| Pino 76 | PC0 — Port C bit 0 |
| Pino 77 | PC1 — Port C bit 1 |
| Pino 78 | PC2 — Port C bit 2 |
| Pino 79 | PC3 — Port C bit 3 |
| Pino 80 | PC4 — Port C bit 4 |
| Pino 81 | PC5 — Port C bit 5 |
| Pino 82 | PC6 — Port C bit 6 |
| Pino 83 | PC7 — Port C bit 7 |
| Pino 84 | PD0 — Port D bit 0 |
| Pino 85 | PD1 — Port D bit 1 |
| Pino 86 | PD2 — Port D bit 2 |
| Pino 87 | PD3 — Port D bit 3 |
| Pino 88 | PD4 — Port D bit 4 |
| Pino 89 | PD5 — Port D bit 5 |
| Pino 90 | PD6 — Port D bit 6 |
| Pino 91 | PD7 — Port D bit 7 |
| Pino 92 | PP0 — Port P bit 0 (PWM, PWM channel) |
| Pino 93 | PP1 — Port P bit 1 (PWM) |
| Pino 94 | PP2 — Port P bit 2 (PWM) |
| Pino 95 | PP3 — Port P bit 3 (PWM) |
| Pino 96 | PP4 — Port P bit 4 (PWM) |
| Pino 97 | PP5 — Port P bit 5 (PWM) |
| Pino 98 | PP6 — Port P bit 6 (PWM) |
| Pino 99 | PP7 — Port P bit 7 (PWM) |
| Pino 100 | PT0 — Port T bit 0 (TIM timer input/output) |
| Pino 101 | PT1 — Port T bit 1 (TIM timer input/output) |
| Pino 102 | PT2 — Port T bit 2 (TIM timer input/output) |
| Pino 103 | PT3 — Port T bit 3 (TIM timer input/output) |
| Pino 104 | PT4 — Port T bit 4 (TIM timer input/output) |
| Pino 105 | PT5 — Port T bit 5 (TIM timer input/output) |
| Pino 106 | PT6 — Port T bit 6 (TIM timer input/output) |
| Pino 107 | PT7 — Port T bit 7 (TIM timer input/output) |
| Pino 108 | CAN0TX — CAN0 transmit |
| Pino 109 | CAN0RX — CAN0 receive |
| Pino 110 | CAN1TX — CAN1 transmit |
| Pino 111 | CAN1RX — CAN1 receive |
| Pino 112 | IICSCL — IIC clock |
| Pino 113 | IICSDA — IIC data |
| Pino 114 | SCIRX — SCI receive |
| Pino 115 | SCITX — SCI transmit |
| Pino 116 | SPI_SS — SPI slave select (GPIO) |
| Pino 117 | SPI_MOSI — SPI master out / slave in |
| Pino 118 | SPI_MISO — SPI master in / slave out |
| Pino 119 | SPI_SCK — SPI clock |
| Pino 120 | VDDA — Analog supply |
| Pino 121 | VSSA — Analog ground |
| Pino 122 | VRH — ADC high reference voltage |
| Pino 123 | VRL — ADC low reference voltage |
| Pino 124 | AN0 — ADC analog input 0 |
| Pino 125 | AN1 — ADC analog input 1 |
| Pino 126 | AN2 — ADC analog input 2 |
| Pino 127 | AN3 — ADC analog input 3 |
| Pino 128 | AN4 — ADC analog input 4 |
| Pino 129 | AN5 — ADC analog input 5 |
| Pino 130 | AN6 — ADC analog input 6 |
| Pino 131 | AN7 — ADC analog input 7 |
| Pino 132 | PWM0 — PWM channel 0 |
| Pino 133 | PWM1 — PWM channel 1 |
| Pino 134 | PWM2 — PWM channel 2 |
| Pino 135 | PWM3 — PWM channel 3 |
| Pino 136 | PWM4 — PWM channel 4 |
| Pino 137 | PWM5 — PWM channel 5 |
| Pino 138 | PWM6 — PWM channel 6 |
| Pino 139 | PWM7 — PWM channel 7 |
| Pino 140 | PE0_XIRQ — XIRQ shared with PE0 |
| Pino 141 | MODC — Mode control (tie to VDD for normal single-chip mode) |
| Pino 142 | TCLK — Timer clock input |
| Pino 143 | TEST2 — Test pin (tie to VSS for normal operation) |
| Pino 144 | EPAD — Exposed thermal pad (connect to VSS) |
Aplicações típicas
MC9S12XD256MAG é adequado para 6 aplicaçãos: Automotive Body Control Modules, Industrial HVAC and Climate Controllers, CAN Gateway and Network Bridges, Motor Control and PWM-Driven Loads, Sensor Fusion and Front-End Acquisition, Industrial PLC and Distributed I/O Nodes.
Automotive Body Control Modules
Why it fits: The MC9S12XD256MAG's dual msCAN controllers and 256 KB Flash deliver the headroom needed for BCMs that juggle comfort, lighting and diagnostics over one CAN channel while leaving the other for service. How it is used: Often paired with LIN transceivers for seat/window control and a high-side driver IC; the HCS12X 80 MHz CPU plus XGATE allows deterministic response to bus errors within about 1 us, which is useful when handling safety-critical loads. AEC-Q100-grade temperature range (-40C to +125C) and 5 V I/O keep the part directly compatible with 12 V automotive rails.
Recomendado
Industrial HVAC and Climate Controllers
Why it fits: The MC9S12XD256MAG's 8-channel 10-bit ADC and 8 PWM channels map directly to temperature sensors, fan/motor drivers and valve actuators used in HVAC controllers. How it is used: Sits on a 24 V industrial rail with a small switching regulator down to 5 V, drives TRIACs through opto-isolators, and reports status via a single CAN to a central BMS. Reliable 80 MHz operation and 12 KB RAM give enough room for PID tables and fault logging without external SRAM expansion.
Recomendado
CAN Gateway and Network Bridges
Why it fits: With two independent msCAN controllers and HCS12X instruction queue, MC9S12XD256MAG can route messages between two buses, filter them in RAM, and forward with sub-millisecond latency. How it is used: Typically deployed as a body-to-powertrain or CAN-to-LIN bridge, sitting between a higher-speed powertrain bus and a lower-speed body bus while handling diagnostics over UDS. The 256 KB Flash accommodates large routing tables in automotive-grade firmware.
Recomendado
Motor Control and PWM-Driven Loads
Why it fits: The 8 PWM channels and 16-bit timers of MC9S12XD256MAG suit small brushless DC and stepper motor controllers for pumps, fans and small actuators. How it is used: Senses phase currents with the on-chip 10-bit ADC and commutates via PWM; HCS12X code runs vector control loops at sub-millisecond rates with XGATE offloading ADC interrupts for cleaner timing margins. The 144-LQFP footprint brings enough I/O to drive multiple half-bridges in parallel.
Recomendado
Sensor Fusion and Front-End Acquisition
Why it fits: The MC9S12XD256MAG offers enough ADC and digital I/O bandwidth to aggregate inputs from pressure, temperature and position sensors before relaying them over CAN. How it is used: Front-end modules in chassis systems run ADC sampling for shock and yaw sensors, buffer timestamps in RAM, and post-processed frames onto CAN using one of the msCAN peripherals, leaving the main CPU free for diagnostics. AEC-Q100-grade temperature rating is critical for under-hood mounting.
Recomendado
Industrial PLC and Distributed I/O Nodes
Why it fits: The 80 MHz HCS12X CPU and large Flash let MC9S12XD256MAG run ladder logic plus diagnostics in a single IC, eliminating a separate communications processor. How it is used: Acts as a CAN-IO node on a factory bus, scanning 8 digital inputs per ADC channel-set and driving 8 PWM outputs back to solenoids. The 4 KB EEPROM stores calibration data that survives flash upgrades, while 5 V-tolerant I/O simplifies industrial wiring without extra level shifters.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12XD256MAG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12XDT256CAG | MC9S12XDT256MAG | MC9S12XDP512MAG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) |
| Core | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit |
| Maximum CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 512 KB | 256 KB | 512 KB |
| RAM | 12 KB | 20 KB | 12 KB | 32 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB |
| CAN Controllers | 2 x msCAN | 2 x msCAN | 2 x msCAN | 2 x msCAN |
Principais diferenciais
- Optimal Flash density in the S12XD 144-LQFP family at lowest cost (vs MC9S12XDT256CAG)
- XGATE coprocessor for deterministic peripheral offload (vs MC9S12XA256MAG)
- Identical peripheral count versus higher Flash variants (vs MC9S12XDP512MAG)
Notas de projeto
Estimated: VDDR supplies the internal 1.8V regulator and must be bypassed with a 1uF X7R ceramic placed within 5 mm of the pin; the 2.5V VDDPLL rail is sensitive to noise and should be filtered through a ferrite bead. Power-on reset asserts until VDD rises above 2.4V, after which the device enters single-chip mode. A 10 kohm pull-up on RESET to VDD is recommended and a 10 nF cap to VSS prevents false resets in noisy automotive environments.
The 144-LQFP exposed thermal pad (EPAD, pin 144) must be soldered to a contiguous ground copper pour of at least 1 square inch to keep junction temperature below 125C under 80 MHz operation. Without the EPAD connection, theta_JA exceeds 50 C/W and the device may derate under sustained 100% CPU load. Recommended: 4-layer PCB with solid ground planes top and bottom.
Route analog pins (AN0-AN7, VRH, VRL, VDDA, VSSA) on a different layer than digital I/O and keep traces short. Place the 10 nF AVREF bypass cap adjacent to VRH/VRL. The BDM/debug port must be reachable for firmware updates - include a 6-pin 2x3 header footprint even if unused in production to allow field debugging via P&E Multilink or USBDM tools.
Do not leave MODC floating - tie to VDD for normal single-chip mode or to VSS for special modes (otherwise undefined boot behaviour). Always programme the CONFIG register to set clock source (PLL or oscillator) before issuing any application code; an unconfigured device boots from internal 1 MHz IRC and CAN bit timing will be wrong. For CAN bit timing, ensure tq segment lengths meet the S12X clock calculator defaults for 500 kbps and 1 Mbps operation.
Informações de conformidade
RoHS and REACH compliance per NXP product family data. AEC-Q100 qualified for automotive Grade 0 (-40C to +125C). Halogen-free status not explicitly confirmed in the verified sources and marked as [DATA_NEEDED]; NXP S12XD family is generally halogen-free per NXP policy.