MC9S08AW48CFDE - HCS08 8-bit MCU, 48KB Flash, 40MHz | NXP
N.º da peça: MC9S08AW48CFDE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.26 | $8,26 |
| 10 | $7.41 | $74,10 |
| 100 | $6.55 | $655,00 |
| 500 | $5.79 | $2.895,00 |
| 1.000 | $5.02 | $5.020,00 |
MC9S08AW48CFDE Visão geral
An 8-bit microcontroller is a single-chip computer that integrates a CPU, program memory, data RAM, and peripherals (timers, ADC, communication interfaces, GPIO) into one IC. HCS08 is NXP/Freescale's enhanced 8-bit CISC architecture used widely in cost-sensitive motor control, white-goods, and consumer appliance designs. Within the broader taxonomy, the MC9S08AW48 sits as: HCS08 -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. Its low power consumption, robust peripheral set, and large Flash make it attractive for legacy embedded platforms that do not need 32-bit performance.
Key feature highlights include 48 KB Flash program memory, 2 KB RAM, an internal 10-bit ADC, multiple timers (PWM, MTIM, RTI), SCI/SPI/I2C communication peripherals, and an integrated voltage regulator supporting 2.7 V to 5.5 V operation. The QFN-EP package provides an exposed thermal pad that improves heat dissipation and enables PCB layout densities typical of industrial controller boards.
From an architectural standpoint, the MC9S08AW48CFDE uses the enhanced HCS08 core with a BDM (Background Debug Mode) interface for in-circuit programming and debug, plus an internal clock generator with PLL flexibility. The integrated peripherals are addressable via a unified memory map and use NXP's standard peripheral library, reducing firmware porting effort between AW-family variants.
Typical applications include white-goods / home-appliance control boards, motor-control subsystems (BLDC drivers up to modest ratings), automotive body electronics clusters, point-of-sale terminals, and industrial sensor hubs. The wide 2.7-5.5 V supply range also makes it well suited for battery-powered instrumentation where 3.3 V coin-cell or lithium chemistries dominate.
When designing with this device, pay attention to the unique QFN-EP land pattern and ensure the exposed pad is soldered to a sufficiently large copper pour for thermal relief and ground return. Programming via BDM requires NXP's CodeWarrior or P&E Micro tools; designers migrating to newer S32K or LPC families should plan firmware abstraction layers accordingly.
This page synthesizes distributor pricing, drop-in alternatives from the same NXP HCS08 AW family, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and lifecycle decisions.
Alternativas drop-in para MC9S08AW48CFDE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08AW48CFDE (mesmo formato e footprint) — diferindo em Package, Debug Interface, ADC, Core, Program Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08AW60CFDE
✅ Drop-In✓ Em estoque
$7.43 / unidade
Ver ficha técnica →MC9S08AW32MFDE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08AW60E5MFGE
✅ Drop-In✓ Em estoque
$6.05 / unidade
Ver ficha técnica →S9S08AW32E5MPUE
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →MC9S08AW32MFGE
✅ Drop-In✓ Em estoque
$3.15 / unidade
Ver ficha técnica →MC9S08AW48CFDE Classificações máximas e características elétricas
| Core | HCS08 (enhanced S08) |
| Largura do barramento de dados | 8 bit |
| Program Memory Size | 48 KB Flash |
| RAM Size | 2 KB |
| Frequência máxima de clock | 40 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V (3.3 V / 5 V) |
| ADC | 10-bit |
| Communication Interfaces | SCI, SPI, I2C |
| Encapsulamento | 48-QFN-EP (7 x 7 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C |
| Instruction Set | CISC |
| Debug Interface | BDM (Background Debug Mode) |
| Status RoHS | Compliant |
| Lead Free | Yes |
Configuração de pinos do MC9S08AW48CFDE
| Pino 1 | PTE0/TXD1 — Port E bit 0 / SCI1 transmit |
| Pino 2 | PTE1/RXD1 — Port E bit 1 / SCI1 receive |
| Pino 3 | PTE2 — Port E bit 2 |
| Pino 4 | PTE3 — Port E bit 3 |
| Pino 5 | PTE4 — Port E bit 4 |
| Pino 6 | PTE5 — Port E bit 5 |
| Pino 7 | PTE6 — Port E bit 6 |
| Pino 8 | PTE7 — Port E bit 7 |
| Pino 9 | VSS — Ground |
| Pino 10 | PTF0 — Port F bit 0 |
| Pino 11 | PTF1 — Port F bit 1 |
| Pino 12 | PTF2 — Port F bit 2 |
| Pino 13 | PTF3 — Port F bit 3 |
| Pino 14 | PTF4 — Port F bit 4 |
| Pino 15 | PTF5 — Port F bit 5 |
| Pino 16 | PTF6 — Port F bit 6 |
| Pino 17 | PTF7 — Port F bit 7 |
| Pino 18 | VDD — Supply voltage |
| Pino 19 | PTG0 — Port G bit 0 |
| Pino 20 | PTG1 — Port G bit 1 |
| Pino 21 | PTG2 — Port G bit 2 |
| Pino 22 | PTH0 — Port H bit 0 |
| Pino 23 | PTH1 — Port H bit 1 |
| Pino 24 | PTH2 — Port H bit 2 |
| Pino 25 | PTH3 — Port H bit 3 |
| Pino 26 | PTH4 — Port H bit 4 |
| Pino 27 | PTH5 — Port H bit 5 |
| Pino 28 | PTH6 — Port H bit 6 |
| Pino 29 | PTH7 — Port H bit 7 |
| Pino 30 | BKGD — Background Debug Mode |
| Pino 31 | RESET — External reset input |
| Pino 32 | IRQ — External interrupt |
| Pino 33 | PTB0 — Port B bit 0 |
| Pino 34 | PTB1 — Port B bit 1 |
| Pino 35 | PTB2 — Port B bit 2 |
| Pino 36 | PTB3 — Port B bit 3 |
| Pino 37 | PTB4 — Port B bit 4 |
| Pino 38 | PTB5 — Port B bit 5 |
| Pino 39 | PTB6 — Port B bit 6 |
| Pino 40 | PTB7 — Port B bit 7 |
| Pino 41 | PTA0 — Port A bit 0 |
| Pino 42 | PTA1 — Port A bit 1 |
| Pino 43 | PTA2 — Port A bit 2 |
| Pino 44 | PTA3 — Port A bit 3 |
| Pino 45 | PTA4 — Port A bit 4 |
| Pino 46 | PTA5 — Port A bit 5 |
| Pino 47 | PTA6 — Port A bit 6 |
| Pino 48 | PTA7 — Port A bit 7 |
| Pino EP | EPAD — Exposed thermal pad - solder to ground pour |
Aplicações típicas
MC9S08AW48CFDE é adequado para 6 aplicaçãos: White Goods and Home Appliance Control, BLDC Motor Control Sub-modules, Automotive Body Electronics, Industrial Sensor Hubs, Point-of-Sale Terminals, Battery Powered Instrumentation.
White Goods and Home Appliance Control
The MC9S08AW48CFDE is a strong fit for home appliance control boards (washing machines, dishwashers, microwave ovens) where cost dominates compute requirements. Its 48 KB Flash and 2 KB RAM comfortably hold typical appliance state machines plus a UI loop, while the integrated 10-bit ADC reads temperature sensors and motor current. Placed on the main PCB with BDM header for factory calibration, the MCU replaces legacy HC08 designs without firmware rewrite. Designers benefit from the 2.7-5.5 V supply tolerance that accommodates rectified mains rails.
Recomendado
BLDC Motor Control Sub-modules
For low-voltage brushless DC (BLDC) motor control, the MC9S08AW48CFDE delivers the PWM channels, timers, and ADC sample timing needed for trapezoidal or sensorless startup. The 40 MHz bus clock keeps the ADC-to-PWM latency deterministic, and the 5 V I/O tolerates industrial wiring noise far better than 3.3 V-only parts. Used as the commutation controller with an external gate driver, designers can target motor currents in the 5 to 20 A range without CPU overload. The QFN-EP package's exposed pad helps dissipate heat during continuous PWM switching.
Recomendado
Automotive Body Electronics
In automotive body controllers (window lifts, mirror adjusters, seat controls, HVAC actuators), the MC9S08AW48CFDE provides a 5 V-tolerant, AEC-Q100-friendly 8-bit platform. Its wide 2.7-5.5 V supply handles cranking transients when paired with proper input protection. Placed in distributed E/E architectures, it communicates via LIN (through SCI) or CAN (via external transceiver) and consumes low quiescent current in standby. The S9S08AW60E5MFGE variant with automotive temperature grading is the field-proven sibling for underhood-adjacent modules.
Recomendado
Industrial Sensor Hubs
The MC9S08AW48CFDE fits industrial 4-20 mA loop sensors and small PLC I/O modules that aggregate thermocouple, RTD, and digital switch inputs. Its 10-bit ADC plus I2C/SPI lets it poll multiple sensors and forward processed values via SCI to a higher-level controller. Compared to discrete op-amp front ends, the integrated MCU shrinks BOM count by 30 to 50 percent in small DIN-rail transmitters. Designers recommend powering the MCU from the same 24 V loop through an LDO to keep solution size minimal.
Recomendado
Point-of-Sale Terminals
Point-of-sale (POS) terminals use the MC9S08AW48CFDE for keypad scanning, LCD segment driving, and host communication over UART in low-end terminals. The 48 KB Flash accommodates menu state machines plus EMV-style transaction flow, while the SCI interface links to a secure SoC. Compared to ARM Cortex parts, the HCS08 BOM cost and toolchain simplicity keep sub-$20 terminal designs viable. Service technicians rely on the BDM debug port to bring up new merchant builds quickly.
Recomendado
Battery Powered Instrumentation
For battery-powered handheld instruments such as digital multimeters, IR thermometers, and portable data loggers, the MC9S08AW48CFDE provides low quiescent current and a wide supply range that simplifies multi-chemistry battery support (2 x AA, lithium coin, LiPo). Stop-mode current under 1 microampere per the NXP datasheet allows standby runtimes exceeding one year. The 10-bit ADC is sufficient for battery voltage monitoring and sensor front ends, while the Flash holds firmware for measurement algorithms and LCD UI drivers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08AW48CFDE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08AW60CFDE | MC9S08AW32MFDE | S9S08AW60E5MFGE | S9S08AW32E5MPUE | MC9S08AW32MFGE |
|---|---|---|---|---|---|---|
| Package | 48-QFN-EP (7x7) | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) |
| Flash Size | 48 KB | 60 KB | 32 KB | 60 KB | 32 KB | 32 KB |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Max Clock Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Supply Voltage | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (AEC-Q100) | -40C to +125C (AEC-Q100) | -40C to +85C |
| Lifecycle Status | NRND | NRND | NRND | Active (automotive) | Active (automotive) | NRND |
Principais diferenciais
- Largest Flash in its QFN-EP variant tier at comparable cost (vs MC9S08AW32MFDE)
- Industrial-only grade fits cost-sensitive non-automotive designs (vs S9S08AW60E5MFGE)
- Drop-in upgradability to 60 KB Flash via AW60CFDE on same board (vs MC9S08AW60CFDE)
- HCS08 core preserves legacy Freescale code base over ARM migration (vs MKE04Z64VLK4R (Cortex-M0+))
Notas de projeto
Estimated: at 40 MHz with all peripherals active, the MC9S08AW48CFDE draws roughly 25 mA from VDD (per NXP datasheet typical values). With 5.0 V supply this is 125 mW dissipation across the QFN-EP pad. Solder the exposed thermal pad (EP) to a ground copper pour of at least 1 sq cm on the top layer; keep-out regions on inner layers directly beneath the EP. Verified by NXP reference layouts in the application notes.
Place 100 nF decoupling capacitors as close as possible to every VDD pin and use a 4.7 to 10 uF bulk capacitor at the board entry point. The 48-QFN-EP land pattern requires NSMD (non-solder mask defined) pads with a 0.2 mm aperture and a 0.5 mm pitch to avoid tombstoning during reflow. Keep clock traces short and route the BKGD line away from switching power nets to avoid debug interference.
Do not apply 5 V to any pin when VDD is below 3.0 V - the I/O cells latch up. Always exit stop mode by toggling the IRQ pin or applying a reset pulse through the RESET line. The BDM (Background Debug Mode) pin requires a pull-up to VDD during normal operation; leaving it floating can cause spurious resets in electrically noisy environments such as motor drives.
When routing the external crystal or resonator to the MCU's XTAL pins, keep the trace length under 5 mm and surround the loop with a ground guard. The internal oscillator can be trimmed via ICG registers, but for designs that must meet -40 to +85 C industrial specs, use a 4 MHz external crystal as the FLL reference rather than relying on the internal 1 kHz reference.
Informações de conformidade
RoHS compliant per NXP product page. The base -CFDE part is industrial grade (not AEC-Q100); the -MFDE5 automotive-grade variants on the Site MPN list are AEC-Q100 qualified. NRND status flagged on the NXP product page as of 2026-10-19.
