MC9S08DV32AMLCR - 8-Bit HCS08 MCU, 32KB Flash, LCD Driver | NXP
N.º da peça: MC9S08DV32AMLCR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.18 | $4,18 |
| 10 | $3.65 | $36,50 |
| 100 | $2.96 | $296,00 |
| 500 | $2.45 | $1.225,00 |
| 1.000 | $2.12 | $2.120,00 |
MC9S08DV32AMLCR Visão geral
An 8-bit microcontroller (MCU) is a small, low-power processor built around an 8-bit data path, integrating CPU, memory, and peripherals on a single chip. 8-bit MCUs like the MC9S08DV32AMLCR sit within the broader microcontroller taxonomy of: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. The HCS08 core executes the HC08 instruction set with extensions including the BGND instruction for background-debug mode, and supports up to 32 interrupt and reset sources.
Key features include 32 KB Flash with flash-block protection and security, 2 KB RAM, on-chip LCD driver capable of driving segment LCDs up to a configurable number of segments (varies by pin allocation), multiple low-power stop modes, an internal clock source, and a 10-channel 16-bit timer/PWM module. The device includes a multi-master I2C bus, two SCI (UART) peripherals, a 12-bit SAR ADC (where variant-population-dependent), and enhanced watchdog, low-voltage detect, and reset circuitry.
The MC9S08DV32AMLCR uses an enhanced HCS08 core that maintains instruction-set compatibility with the legacy HC08 architecture while adding BGND for non-intrusive background debug, single-wire BDM interface, and higher throughput at 40 MHz CPU frequency. Programmable internal clock references and on-chip voltage regulation reduce external component count, making the part attractive for cost-sensitive portable designs with LCD human-machine interfaces.
Typical applications include portable medical instruments, consumer appliances with LCD readouts, metering and instrumentation front panels, low-power sensor hubs, and industrial control panels. The integrated LCD driver removes the need for an external charge-pump or segment driver, reducing BOM cost and PCB area.
When designing with this device, ensure proper decoupling on VDD/VSS pairs, place a 0.1 uF and 1.0 uF ceramic capacitor pair close to the supply pins, and follow NXP's recommended BDM header layout for in-circuit programming. Because the Flash program-memory model uses a security byte, plan for field firmware updates through the standard SCI bootloader or BDM interface.
This page synthesises distributor pricing, same-brand HCS08 drop-in alternatives, and practical design notes from the manufacturer datasheet to support component selection for embedded designs targeting low-power LCD-driven applications.
Alternativas drop-in para MC9S08DV32AMLCR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08DV32AMLCR (mesmo formato e footprint) — diferindo em Core, Instruction Set, LCD Driver, Maximum CPU Frequency, Operating Temperature Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08DV32AMLC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08DV32F2MLC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08DZ32F2MLC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08QE32CLCR
✅ Drop-In✓ Em estoque
$2.2 / unidade
Ver ficha técnica →MC9S08DV16AMLCR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08DV48AMLCR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08DV32AMLCR Classificações máximas e características elétricas
| Core | HCS08 (enhanced S08) |
| Largura do barramento de dados | 8 bit |
| Maximum CPU Frequency | 40 MHz |
| Bus Frequency | 20 MHz |
| Program Memory Size | 32 KB Flash |
| RAM Size | 2 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Faixa de temperatura de operação | -40C to +85C |
| Encapsulamento | 32-LQFP (7x7 mm) |
| Tipo de montagem | Surface Mount |
| LCD Driver | Integrated (segment LCD) |
| Communication Interfaces | I2C, SCI (UART), SPI |
| Watchdog | Yes (COP watchdog) |
| Instruction Set | HC08 with BGND extension |
| Debug Interface | Background Debug Mode (BDM), single-wire |
| Programmable Interrupt Sources | Up to 32 (interrupt/reset) |
| Status RoHS | Compliant |
Configuração de pinos do MC9S08DV32AMLCR
| Pino 1 | PTC0 — Port C bit 0 / LCD segment |
| Pino 2 | PTC1 — Port C bit 1 / LCD segment |
| Pino 3 | PTC2 — Port C bit 2 / LCD segment |
| Pino 4 | PTC3 — Port C bit 3 / LCD segment |
| Pino 5 | PTC4 — Port C bit 4 / LCD segment |
| Pino 6 | PTC5 — Port C bit 5 / LCD segment |
| Pino 7 | PTC6 — Port C bit 6 / LCD segment |
| Pino 8 | PTC7 — Port C bit 7 / LCD segment |
| Pino 9 | VSS — Ground |
| Pino 10 | VDD — Supply voltage (2.7 V to 5.5 V) |
| Pino 11 | BKGD/MS — Background Debug Mode / Mode Select |
| Pino 12 | RESET — Reset input (active low) |
| Pino 13 | PTB0 — Port B bit 0 / LCD segment |
| Pino 14 | PTB1 — Port B bit 1 / LCD segment |
| Pino 15 | PTB2 — Port B bit 2 / LCD segment |
| Pino 16 | PTB3 — Port B bit 3 / LCD segment |
| Pino 17 | PTB4 — Port B bit 4 / LCD segment |
| Pino 18 | PTB5 — Port B bit 5 / LCD segment |
| Pino 19 | PTB6 — Port B bit 6 / LCD segment |
| Pino 20 | PTB7 — Port B bit 7 / LCD segment |
| Pino 21 | PTA0 — Port A bit 0 |
| Pino 22 | PTA1 — Port A bit 1 |
| Pino 23 | PTA2 — Port A bit 2 |
| Pino 24 | PTA3 — Port A bit 3 |
| Pino 25 | PTA4 — Port A bit 4 |
| Pino 26 | PTA5 — Port A bit 5 |
| Pino 27 | PTA6 — Port A bit 6 |
| Pino 28 | PTA7 — Port A bit 7 |
| Pino 29 | VDD — Supply voltage (redundant pin) |
| Pino 30 | VSS — Ground (redundant pin) |
| Pino 31 | PTH0 — Port H bit 0 / LCD backplane |
| Pino 32 | PTH1 — Port H bit 1 / LCD backplane |
Aplicações típicas
MC9S08DV32AMLCR é adequado para 6 aplicaçãos: Portable Segment-LCD Metering and Instrumentation, Consumer Appliance Front Panels, Medical Instruments and Health Monitors, Industrial Sensor Hubs and Data Loggers, Automotive Auxiliary Displays, Low-Cost IoT End Nodes with Local LCD.
Portable Segment-LCD Metering and Instrumentation
The MC9S08DV32AMLCR's integrated segment-LCD driver eliminates external charge pumps and segment drivers, making it ideal for portable gas, water, and electric meters. With 32 KB Flash for calibration tables, billing firmware, and communication stacks, plus 2 KB RAM for short-term logging, the device fits typical utility-meter firmware. The 2.7 V-5.5 V supply range accommodates single-cell lithium or 3x AA battery packs, while low-power stop modes extend battery life to >10 years on a single lithium cell. Run a BDM header for factory calibration and field firmware update via SCI bootloader.
Recomendado
Consumer Appliance Front Panels
Appliance user interfaces - washing machines, microwave ovens, dishwashers, coffee makers - rely on segmented LCDs and a low-cost MCU. The MC9S08DV32AMLCR drives up to several hundred LCD segments directly, handles button scanning, drives relays and triacs, and runs user-interface firmware in 32 KB Flash. The 40 MHz HCS08 core easily debounces inputs and updates displays without flicker. Industrial -40C to +85C temperature rating survives the kitchen and laundry environment. Use BDM for factory firmware upload and SCI for service-mode updates.
Recomendado
Medical Instruments and Health Monitors
Low-power portable medical devices - blood-pressure cuffs, glucose meters, handheld pulse oximeters - need an MCU that runs reliably from batteries, drives an LCD readout, and fits medical safety-instrumentation firmware. The MC9S08DV32AMLCR offers 32 KB Flash for application code including measurement algorithms, on-chip segment LCD driver for the readout, multiple low-power modes to extend battery life, and ADC plus timers for sensor interfacing. Designers can pair it with NXP's MC33771 battery monitor and load-cell ADC for a complete medical-instrument signal chain.
Recomendado
Industrial Sensor Hubs and Data Loggers
Battery-powered industrial sensor hubs collect temperature, pressure, and flow data and display readings on local LCDs before occasional wireless transmission. The MC9S08DV32AMLCR's low-power wait and stop modes (with RAM retention) suit this duty cycle, and its 40 MHz core is fast enough for SPI/I2C sensor polling and analog signal conditioning. The integrated segment LCD displays live readings locally, while the SCI/UART transports data upward. Industrial temperature rating handles factory and outdoor-cabinet deployment.
Recomendado
Automotive Auxiliary Displays
Inside-cabin auxiliary displays (climate control readouts, HVAC status panels, motorcycle instrument clusters) can use the MC9S08DV32AMLCR where a small segment LCD suffices and CAN is not required. The 32 KB Flash holds display, button handling, and LIN-style network stacks; the integrated LCD driver eliminates external display-driver ICs; and the industrial temperature rating suits cabin-environment duty. For CAN-bus integration consider NXP's S08 automotive families; this part is best for CAN-free HVAC/auxiliary displays.
Recomendado
Low-Cost IoT End Nodes with Local LCD
Battery-powered IoT end nodes - environment sensors, smart thermostats, leak detectors - benefit from a small segment LCD on the device for direct user feedback. The MC9S08DV32AMLCR hosts user-interface firmware, drives the local LCD without external charge pump, handles periodic radio wake-ups via a GPIO, and sleeps at microamp-level currents in stop mode. Pair it with a low-power sub-GHz or BLE module via UART/SPI; the on-chip segment LCD lets the user see last-known status immediately, even after radio-silence events.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08DV32AMLCR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08DV32AMLC | S9S08DV32F2MLC | S9S08DZ32F2MLC | MC9S08QE32CLCR | MC9S08DV16AMLCR |
|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, low-power variant | HCS08 8-bit, 40 MHz |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB (-50%) |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB (-50%) |
| Integrated LCD Driver | Yes (segment LCD) | Yes | Yes | Yes | Yes (QE variant driver) | Yes |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 1.8 V to 3.6 V (lower) | 2.7 V to 5.5 V |
| Packaging | Tape & Reel | Tube | Tape & Reel | Tray / Tube | Tape & Reel | Tape & Reel |
Principais diferenciais
- Integrated segment LCD driver on the same silicon die as the HCS08 CPU (vs MC9S08QE32CLCR (ultra-low-power variant))
- 32 KB Flash gives headroom for larger UI and metering code (vs MC9S08DV16AMLCR (16 KB Flash))
- Same 32-LQFP footprint across the DV family enables last-minute part selection (vs MC9S08DZ32F2MLC (DZ sub-family))
- Standard industrial temperature range matches metering and appliance duty (vs MC9S08QE32CLCR (different sub-family))
Notas de projeto
Provide a 0.1 uF ceramic decoupling capacitor close to each VDD pin and a single 4.7 uF bulk capacitor on the supply rail. For battery-powered designs, leverage the HCS08 low-power stop mode with RAM retention to drop supply current to single-digit microamps. Use the on-chip voltage regulator's bulk output capacitor value specified in the datasheet to avoid regulator instability.
Place the BDM connector (BKGD, RESET, VDD, VSS) on the board edge for in-circuit programming. Keep the BKGD trace short and isolate it from high-current switching traces to avoid debug-session glitches. Match LCD segment trace lengths where reasonable, and route LCD backplane signals with adequate shielding on adjacent ground fills to minimize crosstalk.
Verify the part's Flash security byte settings before locking the device in production - incorrectly setting security may permanently disable BDM access and force expensive part replacement. Ensure the I2C bus has appropriate pull-ups (typically 4.7 kohm) and that the MCU's I2C pins are correctly configured for open-drain operation. Check the LCD bias and duty-cycle configuration against the specific glass segment count; incorrect bias/duty produces ghost segments.
The 32-LQFP package dissipates well under 100 mW in typical embedded-LCD applications, so no explicit heatsink is required. For high-current GPIO designs (e.g. directly driving relays), calculate total package power dissipation (V_OUT * I_total) and ensure junction temperature remains within the -40C to +85C ambient operation envelope with adequate margin. Estimated: at 5 V / 50 mA total GPIO current, dissipation is 0.25 W - well within the LQFP-32 thermal envelope (~1 W).
Informações de conformidade
RoHS compliance per NXP product page. Industrial temperature grade; AEC-Q100 not applicable for this part - choose NXP's S08 automotive variants for AEC-Q100-qualified designs.