MC9S12C96MFAE - 16-bit HCS12 MCU, 96KB Flash, 48-LQFP | NXP
N.º da peça: MC9S12C96MFAE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $8.1 | $81,00 |
| 100 | $7.05 | $705,00 |
| 500 | $6.2 | $3.100,00 |
| 1.000 | $5.45 | $5.450,00 |
MC9S12C96MFAE Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of programmable peripherals. The HCS12 family is a 16-bit CISC architecture that evolved from the original Motorola/Freescale HC12, providing deterministic interrupt latency, a background debug mode (BDM) interface, and a CPU12 instruction set that is largely object-code compatible with the older HC11. Within the broader taxonomy, the HCS12 sits under 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. The S12C sub-family is the cost-optimized tier within HCS12, sharing the same peripheral IP with the higher-pin S12G/S12P families while trimming 12 layers to the minimum footprint for LIN/CAN edge nodes.
Key features include 31 GPIO lines, an on-chip PLL for flexible bus-clock generation from an external crystal or resonator, a 16-channel 10-bit ADC, an 8-channel PWM module, and a CAN 2.0A/B controller compatible with DeviceNet and CANopen stacks. The 96KB Flash is split into a 96K x 8 array with hardware-secured block protection for bootloader/application partitioning, and 4KB RAM supports typical RTOS or foreground/background automotive stacks.
Architecturally the device uses a von-Neumann style unified memory map with 23-bit Flash paging, a 16-bit ALU, and a hardware multiply/divide engine. The integrated voltage regulator (VREG) generates the 2.5V internal digital supply from the external 5V rail, eliminating the need for an external LDO in many 5V-only body modules. This combined with on-chip CAN, SCI, and SPI makes the part a one-chip solution for distributed automotive networks.
Typical applications include CAN-connected body control modules (BCM), instrument cluster sub-MCUs, HVAC damper controllers, LIN/CAN gateway nodes, and industrial sensor interface boards. In automotive body networks the part typically acts as a slave node communicating over CAN at 125-500 kbps with a master BCM. The AEC-Q100 qualification and 48-pin LQFP expose pad package also support harsh-environment mounting.
When designing with this device, ensure the BDM debug header is brought out to a 6-pin standard debug connector to allow in-circuit Flash programming and runtime debug. Decouple VDD/VSS with 100nF + 4.7uF ceramic close to the pins, and route the EXTAL/XTAL traces as short and symmetric as possible to avoid PLL jitter. Designers should also verify the latest PCN status - NXP has marked this part NRND.
This page synthesizes distributor pricing, verified drop-in alternatives (same NXP S12C family), and practical design notes not aggregated on any single distributor page.
Alternativas drop-in para MC9S12C96MFAE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12C96MFAE (mesmo formato e footprint) — diferindo em Package, PLL, Data Bus Width, Debug Interface, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12GC96MFAE
✅ Drop-In✓ Em estoque
$4.02 / unidade
Ver ficha técnica →MC9S12C32CFAE25
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12GC64MFAE
✅ Drop-In✓ Em estoque
$10.1 / unidade
Ver ficha técnica →MC9S12C128MFAE
✅ Drop-In✓ Em estoque
$6.38 / unidade
Ver ficha técnica →MC9S12C96CFUE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12C96MFAE Classificações máximas e características elétricas
| Core | HCS12 (CPU12, 16-bit CISC) |
| Maximum CPU Frequency | 25 MHz |
| Program Memory (Flash) | 96 KB (96K x 8) |
| RAM | 4 KB |
| Operating Voltage (VDD) | 2.97 V to 5.5 V |
| Internal Digital Supply | 2.5 V (from on-chip VREG) |
| Number of I/O Pins | 31 |
| Encapsulamento | 48-pin LQFP (7x7 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Communication Interfaces | 1x CAN 2.0A/B, 1x SCI (UART), 1x SPI |
| Watchdog Timer | Yes (COP) |
| PLL | Yes, on-chip |
| Debug Interface | BDM (Background Debug Mode) |
| Temperatura de operação | -40C to +85C (industrial) |
| Status RoHS | Compliant |
| AEC-Q100 | Not automotive qualified (industrial grade) |
Configuração de pinos do MC9S12C96MFAE
| Pino 1 | XCLKS — External clock select (PLL mode control) |
| Pino 2 | BKGD — Background Debug Mode data line |
| Pino 3 | MODC — Mode select (BDM mode entry) |
| Pino 4 | RESET — External reset, active-low |
| Pino 5 | VDDR — Voltage regulator power input |
| Pino 6 | VDDX — External I/O supply voltage |
| Pino 7 | VSSX — I/O ground reference |
| Pino 8 | VDDA — ADC analog supply |
| Pino 9 | VSSA — ADC analog ground |
| Pino 10 | VRH — ADC high reference voltage |
| Pino 11 | VRL — ADC low reference voltage |
| Pino 12 | PAD07 — Port AD bit 7 (AN7) |
| Pino 13 | PAD06 — Port AD bit 6 (AN6) |
| Pino 14 | PAD05 — Port AD bit 5 (AN5) |
| Pino 15 | PAD04 — Port AD bit 4 (AN4) |
| Pino 16 | PAD03 — Port AD bit 3 (AN3) |
| Pino 17 | PAD02 — Port AD bit 2 (AN2) |
| Pino 18 | PAD01 — Port AD bit 1 (AN1) |
| Pino 19 | PAD00 — Port AD bit 0 (AN0) |
| Pino 20 | PA0 — Port A bit 0 |
| Pino 21 | PA1 — Port A bit 1 |
| Pino 22 | PA2 — Port A bit 2 |
| Pino 23 | PA3 — Port A bit 3 |
| Pino 24 | PA4 — Port A bit 4 |
| Pino 25 | PA5 — Port A bit 5 |
| Pino 26 | PA6 — Port A bit 6 |
| Pino 27 | PA7 — Port A bit 7 |
| Pino 28 | PB0 — Port B bit 0 |
| Pino 29 | PB1 — Port B bit 1 |
| Pino 30 | PB2 — Port B bit 2 |
| Pino 31 | PB3 — Port B bit 3 |
| Pino 32 | PB4 — Port B bit 4 |
| Pino 33 | PB5 — Port B bit 5 |
| Pino 34 | PB6 — Port B bit 6 |
| Pino 35 | PB7 — Port B bit 7 |
| Pino 36 | PC0 — Port C bit 0 |
| Pino 37 | PC1 — Port C bit 1 |
| Pino 38 | PC2 — Port C bit 2 |
| Pino 39 | PC3 — Port C bit 3 |
| Pino 40 | PC4 — Port C bit 4 |
| Pino 41 | PC5 — Port C bit 5 |
| Pino 42 | PC6 — Port C bit 6 |
| Pino 43 | PC7 — Port C bit 7 |
| Pino 44 | PD0 — Port D bit 0 / CAN TX |
| Pino 45 | PD1 — Port D bit 1 / CAN RX |
| Pino 46 | PD2 — Port D bit 2 / SCI TX |
| Pino 47 | PD3 — Port D bit 3 / SCI RX |
| Pino 48 | VSS — Digital ground |
Aplicações típicas
MC9S12C96MFAE é adequado para 6 aplicaçãos: Automotive CAN Body Control Module, HVAC Damper and Blower Controller, Industrial CAN Sensor Hub, Instrument Cluster Sub-MCU, LIN/CAN Gateway Node, Industrial Pump and Valve Controller.
Automotive CAN Body Control Module
The MC9S12C96MFAE fits automotive body control modules where a 16-bit HCS12 core with on-chip CAN 2.0A/B and 96KB Flash provides ample headroom for a CANopen or J1939 stack plus application logic. Its 2.97V to 5.5V single-rail operation and internal VREG eliminate external LDOs, reducing BOM cost on BCM boards. The 48-LQFP package is a well-established automotive body footprint, and the 25MHz CPU comfortably handles 125-500 kbps CAN traffic plus PWM-driven actuator control with sub-millisecond update rates. Versus a discrete CAN transceiver solution, integrating the protocol controller cuts board area and BOM line count.
Recomendado
HVAC Damper and Blower Controller
In HVAC damper and blower modules the MC9S12C96MFAE drives multiple brushed DC motors via PWM while sampling temperature sensors through its on-chip 10-bit ADC. The 8 PWM channels and 16 ADC inputs support a 4-zone damper array with NTC temperature feedback in a single chip. The HCS12 deterministic interrupt latency is well-matched to closed-loop motor control loops running at 1 kHz. Operating from the 5V automotive bus and integrating a CAN controller allows direct connection to the cabin climate CAN network without an external protocol chip.
Recomendado
Industrial CAN Sensor Hub
The MC9S12C96MFAE serves as a CAN-connected industrial sensor hub that aggregates multiple analog and digital sensor inputs over SCI/SPI and reports them over CAN to a master PLC. Its 96KB Flash supports small embedded TCP/CAN gateway stacks plus on-board diagnostics, and the 4KB RAM is sufficient for typical polled sensor telemetry buffers. The 25MHz HCS12 core executes CANopen SDO/PDO handling at full bus speed. Industrial temperature range and wide supply tolerance allow deployment in factory automation cabinets without additional regulation.
Recomendado
Instrument Cluster Sub-MCU
As a sub-MCU in an instrument cluster the MC9S12C96MFAE handles gauge driving via PWM, button matrix scanning, and CAN communication with the main cluster processor. Its 31 GPIO pins and 8 PWM channels can drive stepper or DC gauges directly with external drivers. The 96KB Flash stores gauge calibration tables and diagnostic routines, while 4KB RAM supports debounce buffers and CAN message queues. HCS12 deterministic interrupt latency ensures reliable 100Hz gauge refresh updates without jitter.
Recomendado
LIN/CAN Gateway Node
The MC9S12C96MFAE works as a sub-network gateway that bridges between a LIN sub-bus (via SCI/UART as a software LIN master) and a higher-speed CAN bus. The 96KB Flash holds the LIN schedule table and gateway routing logic, while the HCS12 core runs both protocol stacks concurrently. The integrated CAN 2.0 controller provides hardware message filtering, offloading message acceptance from the CPU. The 48-LQFP package is a common footprint for body modules where multiple PCBs share the same panel cutout.
Recomendado
Industrial Pump and Valve Controller
For pump and valve control the MC9S12C96MFAE provides PWM outputs for proportional valve drivers and ADC inputs for pressure/flow sensor feedback. Its CAN 2.0B interface integrates the controller into a larger process automation network with deterministic latency. The 96KB Flash supports PID control loops with parameter tables, and 4KB RAM holds runtime process variables. The industrial operating temperature range and wide supply tolerance suit deployment in outdoor cabinets and process skids.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12C96MFAE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12GC96MFAE | MC9S12C32CFAE25 | MC9S12GC64MFAE | MC9S12C128MFAE | MC9S12C96CFUE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Core Architecture | HCS12 (16-bit CISC, 25 MHz) | S12GC (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | S12GC (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) |
| Flash Memory | 96 KB | 96 KB (same) | 32 KB (-67%) | 64 KB (-33%) | 128 KB (+33%) | 96 KB (same) |
| RAM | 4 KB | 4 KB | 2 KB (-50%) | 4 KB | 4 KB | 4 KB |
| CAN Controller | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B |
| GPIO Count | 31 | 31 | 31 | 31 | 31 | 31 |
| Operating Voltage | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| Lifecycle Status | NRND | Active | NRND | Active | NRND | NRND |
Principais diferenciais
- Cost-optimized HCS12 variant with on-chip CAN controller (vs MC9S12GC96MFAE)
- Balanced 96KB Flash + 4KB RAM configuration (vs MC9S12C32CFAE25)
- Mature ecosystem with 25MHz CISC core (vs MC9S12C128MFAE)
Notas de projeto
Place 100nF + 4.7uF ceramic decoupling capacitors as close as possible to each VDD/VSSX pin pair. The VRH and VRL pins supplying the ADC reference should have their own 10nF + 100nF low-ESR ceramic bypass to VSSA. Route the EXTAL/XTAL traces symmetrically and as short as possible to minimize PLL jitter, with a ground guard ring around the crystal area.
The MC9S12C96MFAE contains an internal voltage regulator (VREG) that requires a 1uF-4.7uF bulk capacitor on VDDR. Per the NXP datasheet, the VREG generates the 2.5V internal digital rail from the 2.97V-5.5V external supply. In designs with high dI/dt on GPIO, add a ferrite bead between the 5V supply and VDDR to reduce digital supply noise coupling into the analog ADC channels.
Always bring out BKGD, MODC, and RESET pins to a 6-pin standard BDM header for in-circuit Flash programming and runtime debug. The RESET pin requires a 4.7k pull-up to VDDR and a 1nF cap to VSS for clean POR behavior. Avoid using port pins PD0/PD1 (CAN TX/RX) as general GPIO when CAN is enabled, as alternate function routing can lock these pins unexpectedly after a bad firmware download.
The CAN bus requires a 120-ohm termination at each end of the bus segment; place the termination resistor as close as possible to the CANH/CANL pins of the external transceiver (e.g., TJA1040). For SCI/SPI connections, add 33-ohm series resistors near the MCU pins when routing to off-board connectors to dampen reflections on cables longer than 5 cm. Keep CAN and high-speed signal traces away from switching power inductors by at least 10 mm.
Informações de conformidade
RoHS compliant per NXP product page. Industrial grade (-40C to +85C); not AEC-Q100 qualified. For under-hood automotive applications, select the AEC-Q100 qualified part number.
