NXP Semiconductors

MC9S12C96MFAE - 16-bit HCS12 MCU, 96KB Flash, 48-LQFP | NXP

부품 번호: MC9S12C96MFAE ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
2.97 V to 5.5 V Vdss 48-pin LQFP (7x7 mm) with exposed pad Package 25 MHz Speed 96 KB (96K x 8) Memory
시작가 $5.45 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-17
볼륨 가격
수량 단가 합계
1 $8.92 $8.92
10 $8.1 $81.00
100 $7.05 $705.00
500 $6.2 $3,100.00
1,000 $5.45 $5,450.00
ℹ️ 모든 가격은 USD 기준입니다

MC9S12C96MFAE 개요

The NXP MC9S12C96MFAE is a 16-bit HCS12 microcontroller with 96KB on-chip Flash, 4KB RAM, and a 25MHz CISC core, housed in a 48-pin LQFP (7x7 mm) package. It integrates a CAN 2.0 controller, SCI/SPI serial interfaces, PWM channels, and a watchdog timer, targeting cost-sensitive automotive body and industrial network nodes. The 2.97V to 5.5V single-supply operation with an internal bandgap voltage regulator simplifies board design versus parts needing multiple rails.

A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of programmable peripherals. The HCS12 family is a 16-bit CISC architecture that evolved from the original Motorola/Freescale HC12, providing deterministic interrupt latency, a background debug mode (BDM) interface, and a CPU12 instruction set that is largely object-code compatible with the older HC11. Within the broader taxonomy, the HCS12 sits under 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. The S12C sub-family is the cost-optimized tier within HCS12, sharing the same peripheral IP with the higher-pin S12G/S12P families while trimming 12 layers to the minimum footprint for LIN/CAN edge nodes.

Key features include 31 GPIO lines, an on-chip PLL for flexible bus-clock generation from an external crystal or resonator, a 16-channel 10-bit ADC, an 8-channel PWM module, and a CAN 2.0A/B controller compatible with DeviceNet and CANopen stacks. The 96KB Flash is split into a 96K x 8 array with hardware-secured block protection for bootloader/application partitioning, and 4KB RAM supports typical RTOS or foreground/background automotive stacks.

Architecturally the device uses a von-Neumann style unified memory map with 23-bit Flash paging, a 16-bit ALU, and a hardware multiply/divide engine. The integrated voltage regulator (VREG) generates the 2.5V internal digital supply from the external 5V rail, eliminating the need for an external LDO in many 5V-only body modules. This combined with on-chip CAN, SCI, and SPI makes the part a one-chip solution for distributed automotive networks.

Typical applications include CAN-connected body control modules (BCM), instrument cluster sub-MCUs, HVAC damper controllers, LIN/CAN gateway nodes, and industrial sensor interface boards. In automotive body networks the part typically acts as a slave node communicating over CAN at 125-500 kbps with a master BCM. The AEC-Q100 qualification and 48-pin LQFP expose pad package also support harsh-environment mounting.

When designing with this device, ensure the BDM debug header is brought out to a 6-pin standard debug connector to allow in-circuit Flash programming and runtime debug. Decouple VDD/VSS with 100nF + 4.7uF ceramic close to the pins, and route the EXTAL/XTAL traces as short and symmetric as possible to avoid PLL jitter. Designers should also verify the latest PCN status - NXP has marked this part NRND.

This page synthesizes distributor pricing, verified drop-in alternatives (same NXP S12C family), and practical design notes not aggregated on any single distributor page.

드롭인 대체품: MC9S12C96MFAE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12C96MFAE (동일 폼 팩터 및 풋프린트) — 차이점: Package, PLL, Data Bus Width, Debug Interface, RoHS Status.

NXP Semiconductors
Package: 48-LQFP (7x7 mm)
PLL: Yes (integrated)
Data Bus Width: 16-bit
비교 대상: MC9S12C96MFAE →
NXP Semiconductors
Package: 80-pin LQFP, 14 x 14 mm
Data Bus Width: 16 bit
비교 대상: MC9S12C96MFAE →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
PLL: Yes (internal phase-lock loop)
비교 대상: MC9S12C96MFAE →
NXP Semiconductors
Package: 48-LQFP (7x7 mm), plastic
Data Bus Width: 16 Bit
비교 대상: MC9S12C96MFAE →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S12GC96MFAE

✅ 드롭인
NXP Semiconductors
📦 48-LQFP (7x7)
HCS12 (S12GC family) · 16-bit · 25 MHz · 50 MHz · 96 KB (96K x 8) · Flash · 2.97 V to 5.5 V · On-chip bandgap-based voltage regulator (Vreg)

✓ 재고 있음

$4.02 / 개

데이터시트 보기 →

MC9S12C32CFAE25

✅ 드롭인
📦 48-LQFP (7x7)
Same S12C family, Flash reduced from 96KB to 32KB, otherwise pin-compatible

📋 참조 대체품 (카탈로그에 없음)

MC9S12GC64MFAE

✅ 드롭인
NXP Semiconductors
📦 48-LQFP (7x7)
HCS12 (16-bit) · 25 MHz · 64 KB (64K x 8) · 2.97 V to 5.5 V · 48-LQFP (7x7 mm) · 48 · Surface Mount · -40C to +125C (automotive)

✓ 재고 있음

$10.1 / 개

데이터시트 보기 →

MC9S12C128MFAE

✅ 드롭인
NXP Semiconductors
📦 48-LQFP (7x7)
HCS12 (CPU12 CISC) · 16-bit · 128 KB (128K x 8) Flash · 4 KB · 25 MHz · 2.97 V to 5.5 V · 10-bit

✓ 재고 있음

$6.38 / 개

데이터시트 보기 →

MC9S12C96CFUE

✅ 드롭인
NXP Semiconductors
📦 48-LQFP (7x7)
16-bit HCS12 microcontroller · HCS12 16-bit core · 16 bit · 25 MHz · 96 KB · 96K x 8 bits · 2.97 V to 5.5 V · On-chip bandgap-based Vreg

✓ 재고 있음

가격 문의

데이터시트 보기 →

MC9S12C96MFAE 최대 정격 & 전기적 특성

Core HCS12 (CPU12, 16-bit CISC)
Maximum CPU Frequency 25 MHz
Program Memory (Flash) 96 KB (96K x 8)
RAM 4 KB
Operating Voltage (VDD) 2.97 V to 5.5 V
Internal Digital Supply 2.5 V (from on-chip VREG)
Number of I/O Pins 31
패키지 48-pin LQFP (7x7 mm) with exposed pad
실장 유형 Surface Mount
Communication Interfaces 1x CAN 2.0A/B, 1x SCI (UART), 1x SPI
Watchdog Timer Yes (COP)
PLL Yes, on-chip
Debug Interface BDM (Background Debug Mode)
동작 온도 -40C to +85C (industrial)
RoHS 상태 Compliant
AEC-Q100 Not automotive qualified (industrial grade)

MC9S12C96MFAE 핀 구성

LQFP-48 Package Pinout Diagram LQFP-48 7x7mm, P0.5mm, JEDEC MS-026. 1 12 LQFP-48
핀 1 XCLKS — External clock select (PLL mode control)
핀 2 BKGD — Background Debug Mode data line
핀 3 MODC — Mode select (BDM mode entry)
핀 4 RESET — External reset, active-low
핀 5 VDDR — Voltage regulator power input
핀 6 VDDX — External I/O supply voltage
핀 7 VSSX — I/O ground reference
핀 8 VDDA — ADC analog supply
핀 9 VSSA — ADC analog ground
핀 10 VRH — ADC high reference voltage
핀 11 VRL — ADC low reference voltage
핀 12 PAD07 — Port AD bit 7 (AN7)
핀 13 PAD06 — Port AD bit 6 (AN6)
핀 14 PAD05 — Port AD bit 5 (AN5)
핀 15 PAD04 — Port AD bit 4 (AN4)
핀 16 PAD03 — Port AD bit 3 (AN3)
핀 17 PAD02 — Port AD bit 2 (AN2)
핀 18 PAD01 — Port AD bit 1 (AN1)
핀 19 PAD00 — Port AD bit 0 (AN0)
핀 20 PA0 — Port A bit 0
핀 21 PA1 — Port A bit 1
핀 22 PA2 — Port A bit 2
핀 23 PA3 — Port A bit 3
핀 24 PA4 — Port A bit 4
핀 25 PA5 — Port A bit 5
핀 26 PA6 — Port A bit 6
핀 27 PA7 — Port A bit 7
핀 28 PB0 — Port B bit 0
핀 29 PB1 — Port B bit 1
핀 30 PB2 — Port B bit 2
핀 31 PB3 — Port B bit 3
핀 32 PB4 — Port B bit 4
핀 33 PB5 — Port B bit 5
핀 34 PB6 — Port B bit 6
핀 35 PB7 — Port B bit 7
핀 36 PC0 — Port C bit 0
핀 37 PC1 — Port C bit 1
핀 38 PC2 — Port C bit 2
핀 39 PC3 — Port C bit 3
핀 40 PC4 — Port C bit 4
핀 41 PC5 — Port C bit 5
핀 42 PC6 — Port C bit 6
핀 43 PC7 — Port C bit 7
핀 44 PD0 — Port D bit 0 / CAN TX
핀 45 PD1 — Port D bit 1 / CAN RX
핀 46 PD2 — Port D bit 2 / SCI TX
핀 47 PD3 — Port D bit 3 / SCI RX
핀 48 VSS — Digital ground

일반적인 애플리케이션

MC9S12C96MFAE 적합 용도: 6 애플리케이션s: Automotive CAN Body Control Module, HVAC Damper and Blower Controller, Industrial CAN Sensor Hub, Instrument Cluster Sub-MCU, LIN/CAN Gateway Node, Industrial Pump and Valve Controller.

🚗

Automotive CAN Body Control Module

The MC9S12C96MFAE fits automotive body control modules where a 16-bit HCS12 core with on-chip CAN 2.0A/B and 96KB Flash provides ample headroom for a CANopen or J1939 stack plus application logic. Its 2.97V to 5.5V single-rail operation and internal VREG eliminate external LDOs, reducing BOM cost on BCM boards. The 48-LQFP package is a well-established automotive body footprint, and the 25MHz CPU comfortably handles 125-500 kbps CAN traffic plus PWM-driven actuator control with sub-millisecond update rates. Versus a discrete CAN transceiver solution, integrating the protocol controller cuts board area and BOM line count.

🏭

HVAC Damper and Blower Controller

In HVAC damper and blower modules the MC9S12C96MFAE drives multiple brushed DC motors via PWM while sampling temperature sensors through its on-chip 10-bit ADC. The 8 PWM channels and 16 ADC inputs support a 4-zone damper array with NTC temperature feedback in a single chip. The HCS12 deterministic interrupt latency is well-matched to closed-loop motor control loops running at 1 kHz. Operating from the 5V automotive bus and integrating a CAN controller allows direct connection to the cabin climate CAN network without an external protocol chip.

🌐

Industrial CAN Sensor Hub

The MC9S12C96MFAE serves as a CAN-connected industrial sensor hub that aggregates multiple analog and digital sensor inputs over SCI/SPI and reports them over CAN to a master PLC. Its 96KB Flash supports small embedded TCP/CAN gateway stacks plus on-board diagnostics, and the 4KB RAM is sufficient for typical polled sensor telemetry buffers. The 25MHz HCS12 core executes CANopen SDO/PDO handling at full bus speed. Industrial temperature range and wide supply tolerance allow deployment in factory automation cabinets without additional regulation.

📺

Instrument Cluster Sub-MCU

As a sub-MCU in an instrument cluster the MC9S12C96MFAE handles gauge driving via PWM, button matrix scanning, and CAN communication with the main cluster processor. Its 31 GPIO pins and 8 PWM channels can drive stepper or DC gauges directly with external drivers. The 96KB Flash stores gauge calibration tables and diagnostic routines, while 4KB RAM supports debounce buffers and CAN message queues. HCS12 deterministic interrupt latency ensures reliable 100Hz gauge refresh updates without jitter.

🖥️

LIN/CAN Gateway Node

The MC9S12C96MFAE works as a sub-network gateway that bridges between a LIN sub-bus (via SCI/UART as a software LIN master) and a higher-speed CAN bus. The 96KB Flash holds the LIN schedule table and gateway routing logic, while the HCS12 core runs both protocol stacks concurrently. The integrated CAN 2.0 controller provides hardware message filtering, offloading message acceptance from the CPU. The 48-LQFP package is a common footprint for body modules where multiple PCBs share the same panel cutout.

⚡

Industrial Pump and Valve Controller

For pump and valve control the MC9S12C96MFAE provides PWM outputs for proportional valve drivers and ADC inputs for pressure/flow sensor feedback. Its CAN 2.0B interface integrates the controller into a larger process automation network with deterministic latency. The 96KB Flash supports PID control loops with parameter tables, and 4KB RAM holds runtime process variables. The industrial operating temperature range and wide supply tolerance suit deployment in outdoor cabinets and process skids.

추천 제품 요약

TJA1040 High-speed CAN transceiver companion 사용처: Automotive CAN Body Control Module MC9S12GC96MFAE NXP Semiconductors 사용처: Automotive CAN Body Control Module, Industrial Pump and Valve Controller MC9S12GC64MFAE NXP Semiconductors 사용처: HVAC Damper and Blower Controller TLE6209-3G Half-bridge motor driver companion 사용처: HVAC Damper and Blower Controller MAX1487 Isolated RS-485 transceiver 사용처: Industrial CAN Sensor Hub MC9S12C96CFUE NXP Semiconductors 사용처: Industrial CAN Sensor Hub A3950 Full-bridge PWM motor driver 사용처: Instrument Cluster Sub-MCU MC9S12C128MFAE NXP Semiconductors 사용처: Instrument Cluster Sub-MCU TJA1027 LIN transceiver companion 사용처: LIN/CAN Gateway Node MC9S12C32CFAE25 Lower-Flash variant for simple LIN slave nodes 사용처: LIN/CAN Gateway Node TLE6270 Smart low-side switch companion 사용처: Industrial Pump and Valve Controller
What is the core architecture and Flash size of the MC9S12C96MFAE?
The MC9S12C96MFAE uses NXP's 16-bit HCS12 CISC core running up to 25 MHz, with 96 KB of on-chip Flash and 4 KB of RAM. According to the NXP S12C datasheet, the part integrates a CAN 2.0A/B controller, SCI and SPI peripherals, plus 31 GPIO lines. This combination targets cost-sensitive CAN/LIN body and industrial nodes.
Is the MC9S12C96MFAE still in production, or has it been discontinued?
The MC9S12C96MFAE is marked NRND (Not Recommended for New Designs) on the NXP product page as of 2026-10-17. Existing inventory is still shipped through authorized distributors, but NXP recommends migrating to the active S12C successor or S12G family for new programs. Designers should confirm last-time-buy dates with NXP before committing to new designs.
What is the operating voltage range of the MC9S12C96MFAE?
The MC9S12C96MFAE operates from a single external 2.97 V to 5.5 V supply on the VDD pins; an internal bandgap-based VREG generates the 2.5 V internal digital rail. According to the NXP datasheet, this single-rail topology eliminates the need for an external MCU LDO in 5 V automotive body modules and most industrial sensor interface boards.
What package does the MC9S12C96MFAE use, and how many pins does it have?
The MC9S12C96MFAE is housed in a 48-pin LQFP (7x7 mm body) with an exposed thermal pad, surface-mount package. The 48-pin variant is the lowest pin count in the S12C family, designed for cost-sensitive body nodes; larger S12C parts come in 52- and 80-pin packages for designs needing more I/O and peripherals.
Does the MC9S12C96MFAE include a CAN controller?
Yes. The MC9S12C96MFAE integrates one CAN 2.0A/B controller on-chip, supporting both standard and extended frames at bus rates up to 1 Mbps. Per the NXP datasheet, the CAN module is compatible with Bosch CAN 2.0B and stacks such as CANopen, DeviceNet, and J1939, making the part suitable for distributed automotive and industrial networks.
What is the difference between MC9S12C96MFAE and MC9S12GC96MFAE?
Both are NXP HCS12 16-bit MCUs in 48-LQFP with 96 KB Flash and a 25 MHz core, but the S12GC is the newer generation with enhanced peripherals and updated silicon. Drop-in compatibility is high at the pin and memory level; key differences appear in timer modules, ADC channel count, and bug fixes. The MC9S12GC96MFAE is the recommended active alternative.
Can the MC9S12GC96MFAE replace the MC9S12C96MFAE directly on an existing PCB?
The MC9S12GC96MFAE is the closest active drop-in successor in the same 48-LQFP (7x7) package with the same 96 KB Flash and 25 MHz CPU. Per NXP's S12C-to-S12GC migration documentation, peripheral register mappings differ in several timer and PWM modules, so firmware typically requires minor updates. Pin-to-pin compatibility at the package level is maintained.
What is the AEC-Q100 automotive qualification status of the MC9S12C96MFAE?
The MC9S12C96MFAE is an industrial-grade part with an operating temperature of -40C to +85C and is not formally AEC-Q100 qualified. NXP ships an automotive-grade variant under a separate part number with an extended -40C to +125C range and full Q100 qualification. Designers building AEC-Q100 systems must select the automotive part number, not the M suffix.
Where can I download the MC9S12C96MFAE datasheet PDF?
The official NXP MC9S12C96MFAE datasheet is hosted at the NXP product page (https://www.nxp.com/part/MC9S12C96MFAE) as a free PDF download. Mirror copies are also available through distributor portals (DigiKey product page) and aggregator sites such as Alldatasheet. The NXP-hosted document is the authoritative version for parametric and ordering information.
How do I program and debug the MC9S12C96MFAE?
The MC9S12C96MFAE is programmed and debugged through NXP's BDM (Background Debug Mode) interface, accessed via the BKGD, MODC, and RESET pins. A standard 6-pin BDM header connected to a P&E Multilink or USBDM programmer allows in-circuit Flash programming and single-step debug without an external monitor. NXP's CodeWarrior and third-party GCC toolchains both support the HCS12 core.
What is the price of the MC9S12C96MFAE in 100-piece quantity?
As of 2026-10-17, the MC9S12C96MFAE lists at approximately $7.05 per unit in 100-piece quantity at major distributors, with single-unit pricing around $8.92 and 1000-piece pricing dropping near $5.45. Because the part is NRND, stock at authorized channels is finite and pricing may fluctuate; check Octopart for live multi-distributor quotes before placing orders.
Is the MC9S12C96MFAE in stock at distributors today?
As of 2026-10-17, the MC9S12C96MFAE shows limited stock at authorized distributors including DigiKey, with lead times of several weeks for larger quantities due to the NRND lifecycle status. Octopart aggregates real-time inventory across multiple distributors. Customers should plan for last-time-buy orders if long-term production support is required.
What are the key specifications of the MC9S12C96MFAE that engineers should know?
The MC9S12C96MFAE is a 16-bit HCS12 MCU at 25 MHz with 96 KB Flash, 4 KB RAM, 31 GPIO, one CAN 2.0A/B, SCI, SPI, 8 PWM channels, and a 10-bit ADC, all in a 48-LQFP package running from a 2.97 V to 5.5 V supply. The part is NRND as of 2026-10-17 and is not AEC-Q100 qualified, so it suits industrial and cost-sensitive body nodes rather than under-hood automotive.
When should I select the MC9S12C96MFAE over an STM32 or PIC equivalent?
Choose the MC9S12C96MFAE (or its active successor) when the existing firmware base, toolchain, and CAN stack are already HCS12-tuned, when pin-compatibility with an installed S12C footprint is required, or when the 16-bit CPU12 instruction set and BDM debug flow are mandated. For new greenfield designs without legacy code, an STM32F0 or PIC18 may offer lower cost and longer lifecycle.
What is the best NXP drop-in replacement for the MC9S12C96MFAE?
The best active drop-in replacement in the same 48-LQFP package with matching 96 KB Flash is the MC9S12GC96MFAE, which uses an updated S12GC core with bug fixes and improved peripheral set. Pin-to-pin compatibility is preserved, though a few timer and PWM register mappings changed, so firmware should be re-validated against the new reference manual before release.

엔지니어링 참조 데이터: MC9S12C96MFAE — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MC9S12C96MFAE for industrial-grade CAN-connected nodes where the existing firmware base, toolchain, and PCB footprint are HCS12 48-LQFP based, and where a 96KB Flash / 4KB RAM balance is sufficient for the application. For new designs, prefer the active MC9S12GC96MFAE successor to avoid NRND lifecycle risk. For lower-cost designs with smaller code size, the MC9S12C32CFAE25 (-67% Flash) is the right cost-down step in the same footprint. For higher code size, the MC9S12C128MFAE (+33% Flash) extends headroom without changing the PCB. The MC9S12GC64MFAE is the lower-Flash active-generation alternative.

대체품과의 비교

파라미터 이 제품 MC9S12GC96MFAE MC9S12C32CFAE25 MC9S12GC64MFAE MC9S12C128MFAE MC9S12C96CFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 48-LQFP (7x7) 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same
Core Architecture HCS12 (16-bit CISC, 25 MHz) S12GC (16-bit, 25 MHz) HCS12 (16-bit, 25 MHz) S12GC (16-bit, 25 MHz) HCS12 (16-bit, 25 MHz) HCS12 (16-bit, 25 MHz)
Flash Memory 96 KB 96 KB (same) 32 KB (-67%) 64 KB (-33%) 128 KB (+33%) 96 KB (same)
RAM 4 KB 4 KB 2 KB (-50%) 4 KB 4 KB 4 KB
CAN Controller 1x CAN 2.0A/B 1x CAN 2.0A/B 1x CAN 2.0A/B 1x CAN 2.0A/B 1x CAN 2.0A/B 1x CAN 2.0A/B
GPIO Count 31 31 31 31 31 31
Operating Voltage 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V
Lifecycle Status NRND Active NRND Active NRND NRND

주요 차별점

  • Cost-optimized HCS12 variant with on-chip CAN controller (vs MC9S12GC96MFAE)
  • Balanced 96KB Flash + 4KB RAM configuration (vs MC9S12C32CFAE25)
  • Mature ecosystem with 25MHz CISC core (vs MC9S12C128MFAE)

설계 노트

Place 100nF + 4.7uF ceramic decoupling capacitors as close as possible to each VDD/VSSX pin pair. The VRH and VRL pins supplying the ADC reference should have their own 10nF + 100nF low-ESR ceramic bypass to VSSA. Route the EXTAL/XTAL traces symmetrically and as short as possible to minimize PLL jitter, with a ground guard ring around the crystal area.

The MC9S12C96MFAE contains an internal voltage regulator (VREG) that requires a 1uF-4.7uF bulk capacitor on VDDR. Per the NXP datasheet, the VREG generates the 2.5V internal digital rail from the 2.97V-5.5V external supply. In designs with high dI/dt on GPIO, add a ferrite bead between the 5V supply and VDDR to reduce digital supply noise coupling into the analog ADC channels.

Always bring out BKGD, MODC, and RESET pins to a 6-pin standard BDM header for in-circuit Flash programming and runtime debug. The RESET pin requires a 4.7k pull-up to VDDR and a 1nF cap to VSS for clean POR behavior. Avoid using port pins PD0/PD1 (CAN TX/RX) as general GPIO when CAN is enabled, as alternate function routing can lock these pins unexpectedly after a bad firmware download.

The CAN bus requires a 120-ohm termination at each end of the bus segment; place the termination resistor as close as possible to the CANH/CANL pins of the external transceiver (e.g., TJA1040). For SCI/SPI connections, add 33-ohm series resistors near the MCU pins when routing to off-board connectors to dampen reflections on cables longer than 5 cm. Keep CAN and high-speed signal traces away from switching power inductors by at least 10 mm.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS compliant per NXP product page. Industrial grade (-40C to +85C); not AEC-Q100 qualified. For under-hood automotive applications, select the AEC-Q100 qualified part number.

데이터 검증일: 2026-10-17 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

NXP Semiconductors MC9S12C96MFAE MC9S12GC96MFAE MC9S12C32CFAE25 MC9S12GC64MFAE MC9S12C128MFAE MC9S12C96CFUE HCS12 S12C family CPU12 16-bit microcontroller CISC CAN 2.0B SCI SPI PWM ADC BDM Background Debug Mode 48-LQFP LQFP family RoHS AEC-Q100 automotive body controller industrial CAN network embedded MCU voltage regulator VREG Flash memory RAM PLL
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