MC9S12C96MFAE - 16-bit HCS12 MCU, 96KB Flash, 48-LQFP | NXP
Référence : MC9S12C96MFAE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $8.1 | $81,00 |
| 100 | $7.05 | $705,00 |
| 500 | $6.2 | $3 100,00 |
| 1 000 | $5.45 | $5 450,00 |
MC9S12C96MFAE Présentation
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of programmable peripherals. The HCS12 family is a 16-bit CISC architecture that evolved from the original Motorola/Freescale HC12, providing deterministic interrupt latency, a background debug mode (BDM) interface, and a CPU12 instruction set that is largely object-code compatible with the older HC11. Within the broader taxonomy, the HCS12 sits under 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. The S12C sub-family is the cost-optimized tier within HCS12, sharing the same peripheral IP with the higher-pin S12G/S12P families while trimming 12 layers to the minimum footprint for LIN/CAN edge nodes.
Key features include 31 GPIO lines, an on-chip PLL for flexible bus-clock generation from an external crystal or resonator, a 16-channel 10-bit ADC, an 8-channel PWM module, and a CAN 2.0A/B controller compatible with DeviceNet and CANopen stacks. The 96KB Flash is split into a 96K x 8 array with hardware-secured block protection for bootloader/application partitioning, and 4KB RAM supports typical RTOS or foreground/background automotive stacks.
Architecturally the device uses a von-Neumann style unified memory map with 23-bit Flash paging, a 16-bit ALU, and a hardware multiply/divide engine. The integrated voltage regulator (VREG) generates the 2.5V internal digital supply from the external 5V rail, eliminating the need for an external LDO in many 5V-only body modules. This combined with on-chip CAN, SCI, and SPI makes the part a one-chip solution for distributed automotive networks.
Typical applications include CAN-connected body control modules (BCM), instrument cluster sub-MCUs, HVAC damper controllers, LIN/CAN gateway nodes, and industrial sensor interface boards. In automotive body networks the part typically acts as a slave node communicating over CAN at 125-500 kbps with a master BCM. The AEC-Q100 qualification and 48-pin LQFP expose pad package also support harsh-environment mounting.
When designing with this device, ensure the BDM debug header is brought out to a 6-pin standard debug connector to allow in-circuit Flash programming and runtime debug. Decouple VDD/VSS with 100nF + 4.7uF ceramic close to the pins, and route the EXTAL/XTAL traces as short and symmetric as possible to avoid PLL jitter. Designers should also verify the latest PCN status - NXP has marked this part NRND.
This page synthesizes distributor pricing, verified drop-in alternatives (same NXP S12C family), and practical design notes not aggregated on any single distributor page.
Alternatives de remplacement direct pour MC9S12C96MFAE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12C96MFAE (même facteur de forme et même empreinte) — différant par Package, PLL, Data Bus Width, Debug Interface, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12GC96MFAE
✅ Remplacement direct✓ En stock
$4.02 / unité
Voir la fiche technique →MC9S12C32CFAE25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12GC64MFAE
✅ Remplacement direct✓ En stock
$10.1 / unité
Voir la fiche technique →MC9S12C128MFAE
✅ Remplacement direct✓ En stock
$6.38 / unité
Voir la fiche technique →MC9S12C96CFUE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12C96MFAE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (CPU12, 16-bit CISC) |
| Maximum CPU Frequency | 25 MHz |
| Program Memory (Flash) | 96 KB (96K x 8) |
| RAM | 4 KB |
| Operating Voltage (VDD) | 2.97 V to 5.5 V |
| Internal Digital Supply | 2.5 V (from on-chip VREG) |
| Number of I/O Pins | 31 |
| Boîtier | 48-pin LQFP (7x7 mm) with exposed pad |
| Type de montage | Surface Mount |
| Communication Interfaces | 1x CAN 2.0A/B, 1x SCI (UART), 1x SPI |
| Watchdog Timer | Yes (COP) |
| PLL | Yes, on-chip |
| Debug Interface | BDM (Background Debug Mode) |
| Température de fonctionnement | -40C to +85C (industrial) |
| Statut RoHS | Compliant |
| AEC-Q100 | Not automotive qualified (industrial grade) |
Configuration des broches de MC9S12C96MFAE
| Broche 1 | XCLKS — External clock select (PLL mode control) |
| Broche 2 | BKGD — Background Debug Mode data line |
| Broche 3 | MODC — Mode select (BDM mode entry) |
| Broche 4 | RESET — External reset, active-low |
| Broche 5 | VDDR — Voltage regulator power input |
| Broche 6 | VDDX — External I/O supply voltage |
| Broche 7 | VSSX — I/O ground reference |
| Broche 8 | VDDA — ADC analog supply |
| Broche 9 | VSSA — ADC analog ground |
| Broche 10 | VRH — ADC high reference voltage |
| Broche 11 | VRL — ADC low reference voltage |
| Broche 12 | PAD07 — Port AD bit 7 (AN7) |
| Broche 13 | PAD06 — Port AD bit 6 (AN6) |
| Broche 14 | PAD05 — Port AD bit 5 (AN5) |
| Broche 15 | PAD04 — Port AD bit 4 (AN4) |
| Broche 16 | PAD03 — Port AD bit 3 (AN3) |
| Broche 17 | PAD02 — Port AD bit 2 (AN2) |
| Broche 18 | PAD01 — Port AD bit 1 (AN1) |
| Broche 19 | PAD00 — Port AD bit 0 (AN0) |
| Broche 20 | PA0 — Port A bit 0 |
| Broche 21 | PA1 — Port A bit 1 |
| Broche 22 | PA2 — Port A bit 2 |
| Broche 23 | PA3 — Port A bit 3 |
| Broche 24 | PA4 — Port A bit 4 |
| Broche 25 | PA5 — Port A bit 5 |
| Broche 26 | PA6 — Port A bit 6 |
| Broche 27 | PA7 — Port A bit 7 |
| Broche 28 | PB0 — Port B bit 0 |
| Broche 29 | PB1 — Port B bit 1 |
| Broche 30 | PB2 — Port B bit 2 |
| Broche 31 | PB3 — Port B bit 3 |
| Broche 32 | PB4 — Port B bit 4 |
| Broche 33 | PB5 — Port B bit 5 |
| Broche 34 | PB6 — Port B bit 6 |
| Broche 35 | PB7 — Port B bit 7 |
| Broche 36 | PC0 — Port C bit 0 |
| Broche 37 | PC1 — Port C bit 1 |
| Broche 38 | PC2 — Port C bit 2 |
| Broche 39 | PC3 — Port C bit 3 |
| Broche 40 | PC4 — Port C bit 4 |
| Broche 41 | PC5 — Port C bit 5 |
| Broche 42 | PC6 — Port C bit 6 |
| Broche 43 | PC7 — Port C bit 7 |
| Broche 44 | PD0 — Port D bit 0 / CAN TX |
| Broche 45 | PD1 — Port D bit 1 / CAN RX |
| Broche 46 | PD2 — Port D bit 2 / SCI TX |
| Broche 47 | PD3 — Port D bit 3 / SCI RX |
| Broche 48 | VSS — Digital ground |
Applications typiques
MC9S12C96MFAE convient pour 6 applications: Automotive CAN Body Control Module, HVAC Damper and Blower Controller, Industrial CAN Sensor Hub, Instrument Cluster Sub-MCU, LIN/CAN Gateway Node, Industrial Pump and Valve Controller.
Automotive CAN Body Control Module
The MC9S12C96MFAE fits automotive body control modules where a 16-bit HCS12 core with on-chip CAN 2.0A/B and 96KB Flash provides ample headroom for a CANopen or J1939 stack plus application logic. Its 2.97V to 5.5V single-rail operation and internal VREG eliminate external LDOs, reducing BOM cost on BCM boards. The 48-LQFP package is a well-established automotive body footprint, and the 25MHz CPU comfortably handles 125-500 kbps CAN traffic plus PWM-driven actuator control with sub-millisecond update rates. Versus a discrete CAN transceiver solution, integrating the protocol controller cuts board area and BOM line count.
Recommandé
HVAC Damper and Blower Controller
In HVAC damper and blower modules the MC9S12C96MFAE drives multiple brushed DC motors via PWM while sampling temperature sensors through its on-chip 10-bit ADC. The 8 PWM channels and 16 ADC inputs support a 4-zone damper array with NTC temperature feedback in a single chip. The HCS12 deterministic interrupt latency is well-matched to closed-loop motor control loops running at 1 kHz. Operating from the 5V automotive bus and integrating a CAN controller allows direct connection to the cabin climate CAN network without an external protocol chip.
Recommandé
Industrial CAN Sensor Hub
The MC9S12C96MFAE serves as a CAN-connected industrial sensor hub that aggregates multiple analog and digital sensor inputs over SCI/SPI and reports them over CAN to a master PLC. Its 96KB Flash supports small embedded TCP/CAN gateway stacks plus on-board diagnostics, and the 4KB RAM is sufficient for typical polled sensor telemetry buffers. The 25MHz HCS12 core executes CANopen SDO/PDO handling at full bus speed. Industrial temperature range and wide supply tolerance allow deployment in factory automation cabinets without additional regulation.
Recommandé
Instrument Cluster Sub-MCU
As a sub-MCU in an instrument cluster the MC9S12C96MFAE handles gauge driving via PWM, button matrix scanning, and CAN communication with the main cluster processor. Its 31 GPIO pins and 8 PWM channels can drive stepper or DC gauges directly with external drivers. The 96KB Flash stores gauge calibration tables and diagnostic routines, while 4KB RAM supports debounce buffers and CAN message queues. HCS12 deterministic interrupt latency ensures reliable 100Hz gauge refresh updates without jitter.
Recommandé
LIN/CAN Gateway Node
The MC9S12C96MFAE works as a sub-network gateway that bridges between a LIN sub-bus (via SCI/UART as a software LIN master) and a higher-speed CAN bus. The 96KB Flash holds the LIN schedule table and gateway routing logic, while the HCS12 core runs both protocol stacks concurrently. The integrated CAN 2.0 controller provides hardware message filtering, offloading message acceptance from the CPU. The 48-LQFP package is a common footprint for body modules where multiple PCBs share the same panel cutout.
Recommandé
Industrial Pump and Valve Controller
For pump and valve control the MC9S12C96MFAE provides PWM outputs for proportional valve drivers and ADC inputs for pressure/flow sensor feedback. Its CAN 2.0B interface integrates the controller into a larger process automation network with deterministic latency. The 96KB Flash supports PID control loops with parameter tables, and 4KB RAM holds runtime process variables. The industrial operating temperature range and wide supply tolerance suit deployment in outdoor cabinets and process skids.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12C96MFAE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12GC96MFAE | MC9S12C32CFAE25 | MC9S12GC64MFAE | MC9S12C128MFAE | MC9S12C96CFUE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Core Architecture | HCS12 (16-bit CISC, 25 MHz) | S12GC (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | S12GC (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) |
| Flash Memory | 96 KB | 96 KB (same) | 32 KB (-67%) | 64 KB (-33%) | 128 KB (+33%) | 96 KB (same) |
| RAM | 4 KB | 4 KB | 2 KB (-50%) | 4 KB | 4 KB | 4 KB |
| CAN Controller | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B |
| GPIO Count | 31 | 31 | 31 | 31 | 31 | 31 |
| Operating Voltage | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| Lifecycle Status | NRND | Active | NRND | Active | NRND | NRND |
Principaux différenciateurs
- Cost-optimized HCS12 variant with on-chip CAN controller (vs MC9S12GC96MFAE)
- Balanced 96KB Flash + 4KB RAM configuration (vs MC9S12C32CFAE25)
- Mature ecosystem with 25MHz CISC core (vs MC9S12C128MFAE)
Notes de conception
Place 100nF + 4.7uF ceramic decoupling capacitors as close as possible to each VDD/VSSX pin pair. The VRH and VRL pins supplying the ADC reference should have their own 10nF + 100nF low-ESR ceramic bypass to VSSA. Route the EXTAL/XTAL traces symmetrically and as short as possible to minimize PLL jitter, with a ground guard ring around the crystal area.
The MC9S12C96MFAE contains an internal voltage regulator (VREG) that requires a 1uF-4.7uF bulk capacitor on VDDR. Per the NXP datasheet, the VREG generates the 2.5V internal digital rail from the 2.97V-5.5V external supply. In designs with high dI/dt on GPIO, add a ferrite bead between the 5V supply and VDDR to reduce digital supply noise coupling into the analog ADC channels.
Always bring out BKGD, MODC, and RESET pins to a 6-pin standard BDM header for in-circuit Flash programming and runtime debug. The RESET pin requires a 4.7k pull-up to VDDR and a 1nF cap to VSS for clean POR behavior. Avoid using port pins PD0/PD1 (CAN TX/RX) as general GPIO when CAN is enabled, as alternate function routing can lock these pins unexpectedly after a bad firmware download.
The CAN bus requires a 120-ohm termination at each end of the bus segment; place the termination resistor as close as possible to the CANH/CANL pins of the external transceiver (e.g., TJA1040). For SCI/SPI connections, add 33-ohm series resistors near the MCU pins when routing to off-board connectors to dampen reflections on cables longer than 5 cm. Keep CAN and high-speed signal traces away from switching power inductors by at least 10 mm.
Informations de conformité
RoHS compliant per NXP product page. Industrial grade (-40C to +85C); not AEC-Q100 qualified. For under-hood automotive applications, select the AEC-Q100 qualified part number.
