MC9S12KT256MPVE - 16-Bit 256KB Flash HCS12 MCU | NXP
N.º da peça: MC9S12KT256MPVE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2.180,00 |
| 500 | $18.95 | $9.475,00 |
| 1.000 | $17.4 | $17.400,00 |
MC9S12KT256MPVE Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of on-chip peripherals onto one silicon die. Within the broader taxonomy, MCUs belong to embedded processors -> microcontrollers -> HCS12 family, designed by NXP/Freescale for deterministic real-time control with strong interrupt handling, large Flash memory, and standard automotive connectivity peripherals.
The MC9S12KT256MPVE integrates a 16-bit CPU12 core capable of addressing 256KB of Flash through a unified memory map, supported by 12KB of RAM for variables and stack and 4KB of EEPROM for non-volatile parameter storage. The peripheral set includes two asynchronous Serial Communication Interfaces (SCI), three Serial Peripheral Interfaces (SPI), an IIC-bus controller, two 8-channel 10-bit Analog-to-Digital Converters (ADC), an 8-channel Input-Capture/Output-Compare (IC/OC) timer block, a Pulse-Width Modulation (PWM) unit, and 91 general-purpose I/O pins for direct digital interface.
The HCS12 architecture provides a 16-bit data path with variable-length instructions, supporting efficient C code generation while retaining deterministic interrupt latency required for closed-loop control. The integrated Background Debug Mode (BDM) allows in-circuit flash programming and real-time debug without an external emulator, simplifying prototyping and field firmware updates.
Typical applications include industrial motor control, automotive body and chassis ECUs, metering equipment, and general-purpose automotive and industrial automation. The 91 I/O count and flexible peripheral mix also suit robotics, building automation, and HMI subsystems.
When designing with the MC9S12KT256MPVE, provide adequate bulk decoupling on the 5V rail and keep the LQFP ground paddle soldered to a continuous ground plane for thermal dissipation and low-impedance signal return. The single-supply operation with internal voltage regulator simplifies the BOM compared to legacy dual-rail HCS12 designs.
This page synthesises distributor pricing, in-package drop-in alternatives within the MC9S12K family, and practical design notes that complement the NXP datasheet MC9S12KT256 (Rev. 1.16, 06/2010) without restating it verbatim.
Alternativas drop-in para MC9S12KT256MPVE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12KT256MPVE (mesmo formato e footprint) — diferindo em Core Processor, Package, Supply Voltage, ADC, Maximum Clock Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12KT256CPVE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S12KT256VPVE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S12DT256MPVE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.36 / unidade
Ver ficha técnica →MC9S12A256CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XDP512MAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12DG256MPVE
✅ Drop-In✓ Em estoque
$75.08 / unidade
Ver ficha técnica →MC9S12KT256MPVE Classificações máximas e características elétricas
| Series | HCS12 |
| Core Processor | HCS12 (CPU12, 16-bit) |
| Core Size | 16-Bit |
| Speed | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB |
| Number of I/O | 91 |
| Oscillator Type | Internal |
| Connectivity | CAN, I2C, SCI, SPI |
| Peripherals | PWM, WDT, ADC, IC/OC timer |
| ADC | 2 x 8-channel, 10-bit |
| Tensão de alimentação | 2.5 V / 3.3 V / 5 V |
| Encapsulamento / Caixa | 112-LQFP (20 x 20 mm) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Temperature Grade | Automotive grade |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do MC9S12KT256MPVE 112-lqfp (20 x 20 mm)
Configuração de pinos para MC9S12KT256MPVE (pacote 112-lqfp (20 x 20 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC9S12KT256MPVE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC9S12KT256MPVE é adequado para 6 aplicaçãos: Automotive Body and Chassis ECUs, Industrial Motor Control and Drive, Smart Metering and Energy Measurement, Building Automation and HVAC, Automotive Instrument Clusters, Industrial Sensor and IO Modules.
Automotive Body and Chassis ECUs
The MC9S12KT256MPVE targets automotive body and chassis electronic control units where deterministic 16-bit processing, CAN connectivity, and 91 I/O lines are mandatory. Its 256KB Flash stores body and diagnostic stacks, while 4KB EEPROM retains learned trim values for power windows, seat position, mirror position, and lighting calibration across key-off cycles. The 25 MHz HCS12 core offers the interrupt latency needed for CAN-FD gateway duties and the PWM channels drive mirror-fold motors, headlamp levellers, and HVAC blend doors. Two 8-channel 10-bit ADCs sample thermistors, current shunts, and switch feedback from body modules. AEC-Q100 automotive temperature grading and 112-LQFP package thermal margin make the MC9S12KT256MPVE a strong fit for under-dash and engine-bay ECU placements.
Recomendado
Industrial Motor Control and Drive
The MC9S12KT256MPVE's integrated 8-channel IC/OC timer plus PWM unit drives three-phase BLDC and PMSM motors in industrial drives up to several kW. The dual 8-channel 10-bit ADC delivers simultaneous current sensing and back-EMF sampling for sensorless FOC algorithms, while the HCS12 core's deterministic interrupt response keeps the PWM-to-sample jitter inside the PWM window. The 256KB Flash holds vector control firmware plus telemetry stack, and 4KB EEPROM stores motor calibration parameters. The 91 I/O accommodate encoder inputs, fault comparators, relay drivers, and isolated gate-driver enables. The 112-LQFP's thermal envelope and 5V single-supply operation align with industrial 24V-bus rail architectures when paired with a DC-DC front end.
Recomendado
Smart Metering and Energy Measurement
Smart electricity meters and gas meters use the MC9S12KT256MPVE to combine metrology, display control, and PLC or wireless communication in a single 16-bit MCU. The 10-bit ADC with dual 8-channel input handles voltage and current sensing for class-0.5 metering, while the SCI and SPI channels drive PLC modems or RF sub-GHz transceivers for AMI backhaul. The 256KB Flash stores DLMS/COSEM stacks, tariff tables, and security libraries, and 4KB EEPROM logs billing events through blackout cycles. The 91 I/O drive segmented LCDs via external drivers, secure-key inputs, and tamper-detection switches. The automotive temperature grade aids outdoor cabinet installations where -40C cold-start and +125C rooftop operation are routine.
Recomendado
Building Automation and HVAC
Building automation controllers use the MC9S12KT256MPVE to run HVAC algorithms, fan-coil control, and BACnet or Modbus gateway stacks simultaneously. The HCS12 core executes proportional-integral loops for damper and valve actuators at 25 MHz with deterministic scheduling. Dual ADCs sample supply-air temperature, return-air temperature, humidity, and CO2 sensor outputs from the field bus. The triple SPI bus multiplexes user-interface keypads, external EEPROM for event logs, and SPI-controlled radios for wireless sensor network bindings. The 256KB Flash stores BACnet MS/TP and Modbus RTU stacks; the 4KB EEPROM retains scheduling overrides and audit logs across power interruptions.
Recomendado
Automotive Instrument Clusters
Mid-range instrument clusters rely on the MC9S12KT256MPVE to drive stepper-motor gauges, segment LCDs, and CAN diagnostics without an external graphics controller. The 91 I/O accommodate up to four stepper-motor gauge outputs, telltale LEDs, dimming phototransistor inputs, and the LIN/CAN diagnostics port. The PWM block fades the cluster backlight smoothly across day/night thresholds, while the IC/OC timer debounces the multi-position wiper stalk and turn-signal stalk without software polling jitter. The 256KB Flash holds the cluster graphics and J1939 stack, and the 12KB RAM buffers the J1939 message queue. The 4KB EEPROM stores odometer and trip-meter values that must survive battery disconnects per automotive regulations.
Recomendado
Industrial Sensor and IO Modules
Distributed industrial IO modules depend on the MC9S12KT256MPVE for deterministic field-bus handling and local signal conditioning in Profibus-DP or DeviceNet slave nodes. The dual 8-channel 10-bit ADC reads thermocouples, RTDs, pressure transducers, and 4-20 mA current loops without an external ADC chain. The triple SPI bus multiplexes digital IO expanders, secure-element ICs, and SPI-controlled isolators, while the I2C channel accesses EEPROM and RTC companions. The 256KB Flash runs Profibus-DP slave stacks or IO-Link master firmware, and 4KB EEPROM stores module identity and configuration across provisioning cycles. The 91 I/O lines drive status LEDs, mode keys, and the field-bus physical-interface logic.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12KT256MPVE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12KT256CPVE | MC9S12KT256VPVE | MC9S12DT256MPVE | MC9S12A256CPVE | MC9S12XDP512MAG | MC9S12DG256MPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Core / Architecture | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12X 16-bit, 40 MHz + XGATE | HCS12 16-bit, 25 MHz |
| Program Memory | 256 KB Flash | 256 KB Flash | 256 KB Flash | 256 KB Flash | 256 KB Flash | 512 KB Flash | 256 KB Flash |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 32 KB | 12 KB |
| Number of I/O | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
| CAN Connectivity | Yes | Yes | Yes | Yes | No | Yes | Yes |
| Supply Voltage | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 5V | 5V | 2.5V / 3.3V / 5V | 5V |
Principais diferenciais
- Latest K-series revision with integrated 4KB EEPROM (vs MC9S12A256CPVE)
- Upgradable on same 112-LQFP footprint (vs MC9S12XDP512MAG)
- Single-supply 2.5V/3.3V/5V operation (vs MC9S12DT256MPVE / MC9S12DG256MPVE)
Notas de projeto
Place a 10 uF bulk decoupling capacitor and a 100 nF ceramic bypass cap as close as possible to the VDD/VSS pins of the MC9S12KT256MPVE. The single-supply internal voltage regulator still requires low-impedance decoupling to suppress switching noise from the HCS12 bus cycles. Failure to provide adequate bulk capacitance results in brown-out resets during high-current peripheral activity such as simultaneous ADC sampling and PWM switching.
Although the 112-LQFP 20x20 mm package has a generous copper footprint for heat spreading, the automotive temperature grade forces operation up to +125 C junction. Ensure the PCB solder-pad layout uses a continuous ground plane and thermal vias under the package to keep junction-to-ambient thermal resistance low. Estimated: junction-to-ambient resistance of 35 C/W (per package datasheet) yields approximately 2.8 C rise per 80 mW of dissipated power, well within safe margins at the typical 1.5-2 W operating dissipation of an automotive body ECU.
Route the BDM (Background Debug Mode) signals to a 2x5 0.1 inch header or test pad cluster for in-circuit firmware updates during prototyping. Keep BDM traces short (<50 mm) and away from PWM or motor-drive traces to avoid debug-port glitches during high-current switching events. Provide a 4.7 kohm pull-up on the BKGD line to VDD to ensure reliable entry into BDM mode from the reset vector.
Do not attempt to drive the 91 I/O pins above their rated source/sink current. Each HCS12 GPIO pin sinks up to 25 mA; aggregate package dissipation must remain within thermal limits when driving multiple high-current loads. Always configure unused pins as outputs (not inputs) to avoid CMOS shoot-through current that can double quiescent supply current.
Informações de conformidade
RoHS and REACH compliant per NXP product page. AEC-Q100 qualified ('M' suffix denotes automotive temperature grade). Lead-free per LQFP package termination. Halogen-free status not specifically listed in the verified web data.
