MC9S12KT256MPVE - 16-Bit 256KB Flash HCS12 MCU | NXP
Référence : MC9S12KT256MPVE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2 180,00 |
| 500 | $18.95 | $9 475,00 |
| 1 000 | $17.4 | $17 400,00 |
MC9S12KT256MPVE Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of on-chip peripherals onto one silicon die. Within the broader taxonomy, MCUs belong to embedded processors -> microcontrollers -> HCS12 family, designed by NXP/Freescale for deterministic real-time control with strong interrupt handling, large Flash memory, and standard automotive connectivity peripherals.
The MC9S12KT256MPVE integrates a 16-bit CPU12 core capable of addressing 256KB of Flash through a unified memory map, supported by 12KB of RAM for variables and stack and 4KB of EEPROM for non-volatile parameter storage. The peripheral set includes two asynchronous Serial Communication Interfaces (SCI), three Serial Peripheral Interfaces (SPI), an IIC-bus controller, two 8-channel 10-bit Analog-to-Digital Converters (ADC), an 8-channel Input-Capture/Output-Compare (IC/OC) timer block, a Pulse-Width Modulation (PWM) unit, and 91 general-purpose I/O pins for direct digital interface.
The HCS12 architecture provides a 16-bit data path with variable-length instructions, supporting efficient C code generation while retaining deterministic interrupt latency required for closed-loop control. The integrated Background Debug Mode (BDM) allows in-circuit flash programming and real-time debug without an external emulator, simplifying prototyping and field firmware updates.
Typical applications include industrial motor control, automotive body and chassis ECUs, metering equipment, and general-purpose automotive and industrial automation. The 91 I/O count and flexible peripheral mix also suit robotics, building automation, and HMI subsystems.
When designing with the MC9S12KT256MPVE, provide adequate bulk decoupling on the 5V rail and keep the LQFP ground paddle soldered to a continuous ground plane for thermal dissipation and low-impedance signal return. The single-supply operation with internal voltage regulator simplifies the BOM compared to legacy dual-rail HCS12 designs.
This page synthesises distributor pricing, in-package drop-in alternatives within the MC9S12K family, and practical design notes that complement the NXP datasheet MC9S12KT256 (Rev. 1.16, 06/2010) without restating it verbatim.
Alternatives de remplacement direct pour MC9S12KT256MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12KT256MPVE (même facteur de forme et même empreinte) — différant par Core Processor, Package, Supply Voltage, ADC, Maximum Clock Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12KT256CPVE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12KT256VPVE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12DT256MPVE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.36 / unité
Voir la fiche technique →MC9S12A256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XDP512MAG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12DG256MPVE
✅ Remplacement direct✓ En stock
$75.08 / unité
Voir la fiche technique →MC9S12KT256MPVE Valeurs maximales et caractéristiques électriques
| Series | HCS12 |
| Core Processor | HCS12 (CPU12, 16-bit) |
| Core Size | 16-Bit |
| Speed | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB |
| Number of I/O | 91 |
| Oscillator Type | Internal |
| Connectivity | CAN, I2C, SCI, SPI |
| Peripherals | PWM, WDT, ADC, IC/OC timer |
| ADC | 2 x 8-channel, 10-bit |
| Tension d'alimentation | 2.5 V / 3.3 V / 5 V |
| Boîtier / Format | 112-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Temperature Grade | Automotive grade |
| Statut RoHS | Compliant |
Guide de configuration des broches du MC9S12KT256MPVE 112-lqfp (20 x 20 mm)
Configuration des broches du MC9S12KT256MPVE (boîtier 112-lqfp (20 x 20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12KT256MPVE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12KT256MPVE convient pour 6 applications: Automotive Body and Chassis ECUs, Industrial Motor Control and Drive, Smart Metering and Energy Measurement, Building Automation and HVAC, Automotive Instrument Clusters, Industrial Sensor and IO Modules.
Automotive Body and Chassis ECUs
The MC9S12KT256MPVE targets automotive body and chassis electronic control units where deterministic 16-bit processing, CAN connectivity, and 91 I/O lines are mandatory. Its 256KB Flash stores body and diagnostic stacks, while 4KB EEPROM retains learned trim values for power windows, seat position, mirror position, and lighting calibration across key-off cycles. The 25 MHz HCS12 core offers the interrupt latency needed for CAN-FD gateway duties and the PWM channels drive mirror-fold motors, headlamp levellers, and HVAC blend doors. Two 8-channel 10-bit ADCs sample thermistors, current shunts, and switch feedback from body modules. AEC-Q100 automotive temperature grading and 112-LQFP package thermal margin make the MC9S12KT256MPVE a strong fit for under-dash and engine-bay ECU placements.
Recommandé
Industrial Motor Control and Drive
The MC9S12KT256MPVE's integrated 8-channel IC/OC timer plus PWM unit drives three-phase BLDC and PMSM motors in industrial drives up to several kW. The dual 8-channel 10-bit ADC delivers simultaneous current sensing and back-EMF sampling for sensorless FOC algorithms, while the HCS12 core's deterministic interrupt response keeps the PWM-to-sample jitter inside the PWM window. The 256KB Flash holds vector control firmware plus telemetry stack, and 4KB EEPROM stores motor calibration parameters. The 91 I/O accommodate encoder inputs, fault comparators, relay drivers, and isolated gate-driver enables. The 112-LQFP's thermal envelope and 5V single-supply operation align with industrial 24V-bus rail architectures when paired with a DC-DC front end.
Recommandé
Smart Metering and Energy Measurement
Smart electricity meters and gas meters use the MC9S12KT256MPVE to combine metrology, display control, and PLC or wireless communication in a single 16-bit MCU. The 10-bit ADC with dual 8-channel input handles voltage and current sensing for class-0.5 metering, while the SCI and SPI channels drive PLC modems or RF sub-GHz transceivers for AMI backhaul. The 256KB Flash stores DLMS/COSEM stacks, tariff tables, and security libraries, and 4KB EEPROM logs billing events through blackout cycles. The 91 I/O drive segmented LCDs via external drivers, secure-key inputs, and tamper-detection switches. The automotive temperature grade aids outdoor cabinet installations where -40C cold-start and +125C rooftop operation are routine.
Recommandé
Building Automation and HVAC
Building automation controllers use the MC9S12KT256MPVE to run HVAC algorithms, fan-coil control, and BACnet or Modbus gateway stacks simultaneously. The HCS12 core executes proportional-integral loops for damper and valve actuators at 25 MHz with deterministic scheduling. Dual ADCs sample supply-air temperature, return-air temperature, humidity, and CO2 sensor outputs from the field bus. The triple SPI bus multiplexes user-interface keypads, external EEPROM for event logs, and SPI-controlled radios for wireless sensor network bindings. The 256KB Flash stores BACnet MS/TP and Modbus RTU stacks; the 4KB EEPROM retains scheduling overrides and audit logs across power interruptions.
Recommandé
Automotive Instrument Clusters
Mid-range instrument clusters rely on the MC9S12KT256MPVE to drive stepper-motor gauges, segment LCDs, and CAN diagnostics without an external graphics controller. The 91 I/O accommodate up to four stepper-motor gauge outputs, telltale LEDs, dimming phototransistor inputs, and the LIN/CAN diagnostics port. The PWM block fades the cluster backlight smoothly across day/night thresholds, while the IC/OC timer debounces the multi-position wiper stalk and turn-signal stalk without software polling jitter. The 256KB Flash holds the cluster graphics and J1939 stack, and the 12KB RAM buffers the J1939 message queue. The 4KB EEPROM stores odometer and trip-meter values that must survive battery disconnects per automotive regulations.
Recommandé
Industrial Sensor and IO Modules
Distributed industrial IO modules depend on the MC9S12KT256MPVE for deterministic field-bus handling and local signal conditioning in Profibus-DP or DeviceNet slave nodes. The dual 8-channel 10-bit ADC reads thermocouples, RTDs, pressure transducers, and 4-20 mA current loops without an external ADC chain. The triple SPI bus multiplexes digital IO expanders, secure-element ICs, and SPI-controlled isolators, while the I2C channel accesses EEPROM and RTC companions. The 256KB Flash runs Profibus-DP slave stacks or IO-Link master firmware, and 4KB EEPROM stores module identity and configuration across provisioning cycles. The 91 I/O lines drive status LEDs, mode keys, and the field-bus physical-interface logic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12KT256MPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12KT256CPVE | MC9S12KT256VPVE | MC9S12DT256MPVE | MC9S12A256CPVE | MC9S12XDP512MAG | MC9S12DG256MPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Core / Architecture | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12X 16-bit, 40 MHz + XGATE | HCS12 16-bit, 25 MHz |
| Program Memory | 256 KB Flash | 256 KB Flash | 256 KB Flash | 256 KB Flash | 256 KB Flash | 512 KB Flash | 256 KB Flash |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 32 KB | 12 KB |
| Number of I/O | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
| CAN Connectivity | Yes | Yes | Yes | Yes | No | Yes | Yes |
| Supply Voltage | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 5V | 5V | 2.5V / 3.3V / 5V | 5V |
Principaux différenciateurs
- Latest K-series revision with integrated 4KB EEPROM (vs MC9S12A256CPVE)
- Upgradable on same 112-LQFP footprint (vs MC9S12XDP512MAG)
- Single-supply 2.5V/3.3V/5V operation (vs MC9S12DT256MPVE / MC9S12DG256MPVE)
Notes de conception
Place a 10 uF bulk decoupling capacitor and a 100 nF ceramic bypass cap as close as possible to the VDD/VSS pins of the MC9S12KT256MPVE. The single-supply internal voltage regulator still requires low-impedance decoupling to suppress switching noise from the HCS12 bus cycles. Failure to provide adequate bulk capacitance results in brown-out resets during high-current peripheral activity such as simultaneous ADC sampling and PWM switching.
Although the 112-LQFP 20x20 mm package has a generous copper footprint for heat spreading, the automotive temperature grade forces operation up to +125 C junction. Ensure the PCB solder-pad layout uses a continuous ground plane and thermal vias under the package to keep junction-to-ambient thermal resistance low. Estimated: junction-to-ambient resistance of 35 C/W (per package datasheet) yields approximately 2.8 C rise per 80 mW of dissipated power, well within safe margins at the typical 1.5-2 W operating dissipation of an automotive body ECU.
Route the BDM (Background Debug Mode) signals to a 2x5 0.1 inch header or test pad cluster for in-circuit firmware updates during prototyping. Keep BDM traces short (<50 mm) and away from PWM or motor-drive traces to avoid debug-port glitches during high-current switching events. Provide a 4.7 kohm pull-up on the BKGD line to VDD to ensure reliable entry into BDM mode from the reset vector.
Do not attempt to drive the 91 I/O pins above their rated source/sink current. Each HCS12 GPIO pin sinks up to 25 mA; aggregate package dissipation must remain within thermal limits when driving multiple high-current loads. Always configure unused pins as outputs (not inputs) to avoid CMOS shoot-through current that can double quiescent supply current.
Informations de conformité
RoHS and REACH compliant per NXP product page. AEC-Q100 qualified ('M' suffix denotes automotive temperature grade). Lead-free per LQFP package termination. Halogen-free status not specifically listed in the verified web data.
