MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
N.º da peça: MC9S12NE64VTUE ✗ Fim de vidaMC9S12NE64VTUE Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), and peripherals onto one silicon die. The HCS12 is the 16-bit successor of Freescale's HC11 architecture, and the S12 family occupies the mid-tier between 8-bit MCUs (8-bit -> 16-bit -> 32-bit microcontroller hierarchy) and high-end 32-bit ARM Cortex-M parts. The 'NE' sub-family specifically adds an on-chip 10/100 Mbps Ethernet MAC + PHY, eliminating the need for an external network interface chip in connected-embedded designs.
Key features of the MC9S12NE64VTUE include: 64 KB program Flash, 8 KB SRAM, hardware IEEE 802.3 Ethernet MAC with 10/100 PHY on-chip, dual CAN 2.0 controllers (msCAN), three SCI (UART) channels, one SPI, one I2C, an 8-channel 10-bit ADC, a 16-bit timer with 8 PWM channels, and a background debug module (BDM) for in-circuit programming and debug. The 80-pin TQFP-EP package is small enough for compact embedded boards while exposing ample GPIO and bus lines for industrial connectivity.
The architecture is built on the standard HCS12 CPU core with a 16-bit data path, indexed addressing, and a memory-mapped register model. The integrated Ethernet subsystem follows the IEEE 802.3 specification, with the MAC performing CSMA/CD framing and the embedded PHY handling line-side analog signaling (MLT-3 on the twisted pair, auto-negotiation, link integrity). The 25 MHz system clock is derived from an internal Phase-Locked Loop (IPLL) from an external crystal. Background Debug Mode (BDM) allows flash programming and real-time debug over a single-wire interface.
Typical applications include industrial Ethernet gateways, building-automation controllers (BACnet/IP, Modbus-TCP), sensor-to-cloud bridges, embedded web servers for SCADA integration, and automotive telematics prototyping where CAN-to-Ethernet routing is needed.
Designers should note that VDD/VDDX decoupling must be placed within 5 mm of each supply pin, and the 25 MHz crystal loop requires short, symmetrical traces. The on-chip EMAC + PHY removes the BOM cost of an external network controller but adds approximately 50 mA of additional supply current during active link transmission.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, plus drop-in alternative candidates from NXP's same S12NE family, along with practical design notes that the manufacturer's datasheet does not directly call out.
Alternativas drop-in para MC9S12NE64VTUE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12NE64VTUE (mesmo formato e footprint) — diferindo em Mounting Type, Operating Temperature, Serial Interfaces, Timers.
MC9S12NE64VTU
✅ Drop-InConsulte o preço
Ver ficha técnica →MC9S12NE64CAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12NE64CFU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12NE64CFUE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12NE64VTUE Classificações máximas e características elétricas
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Core Clock Speed | 25 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Operating Voltage | 2.5 V / 3.3 V (dual-rail VDD/VDDX) |
| Temperatura de operação | -40C to +105C (Industrial 'V' / 'TUE' suffix) |
| Tipo de montagem | Surface Mount (TQFP-EP) |
| Encapsulamento / Caixa | 80-TQFP-EP (14x14 mm) with exposed thermal pad |
| Número de pinos | 80 |
| Integrated Ethernet | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) |
| CAN Controllers | 2 x msCAN 2.0A/B |
| Serial Interfaces | 3 x SCI (UART), 1 x SPI, 1 x IIC |
| Timers | 16-bit, 4-channel Enhanced Capture Timer |
| Debug Interface | Background Debug Mode (BDM) |
| Terminal Form | GULL WING |
| Package Code | TQFP |
| Tray Packaging | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do MC9S12NE64VTUE
| Pino 1 | ETH_TX+ — Ethernet transmit positive line (to magnetics/transformer) |
| Pino 2 | ETH_TX- — Ethernet transmit negative line |
| Pino 3 | ETH_RX+ — Ethernet receive positive line (from magnetics/transformer) |
| Pino 4 | ETH_RX- — Ethernet receive negative line |
| Pino 5 | EVDD — Analog Ethernet PHY supply (3.3 V) |
| Pino 6 | VDD2 — Core logic supply (2.5 V) |
| Pino 7 | VDDX2 — I/O ring supply (3.3 V) |
| Pino 8 | VSSX2 — I/O ground |
| Pino 9 | PE0/Ain0 — GPIO / ADC input channel 0 |
| Pino 10 | PE1/Ain1 — GPIO / ADC input channel 1 |
| Pino 11 | PE2/Ain2 — GPIO / ADC input channel 2 |
| Pino 12 | PE3/Ain3 — GPIO / ADC input channel 3 |
| Pino 13 | PE4/Ain4 — GPIO / ADC input channel 4 |
| Pino 14 | PE5/Ain5 — GPIO / ADC input channel 5 |
| Pino 15 | PE6/Ain6 — GPIO / ADC input channel 6 |
| Pino 16 | PE7/Ain7 — GPIO / ADC input channel 7 |
| Pino 17 | REF_CLK — Ethernet PHY reference clock output (25 MHz) |
| Pino 18 | RBIAS — Ethernet PHY bias resistor (12.4 kohm to GND) |
| Pino 19 | PB0/SS — GPIO / SPI Slave Select |
| Pino 20 | PB1/SCK — GPIO / SPI clock |
| Pino 21 | PB2/MOSI — GPIO / SPI MOSI |
| Pino 22 | PB3/MISO — GPIO / SPI MISO |
| Pino 23 | PB4/TxD0 — GPIO / SCI0 transmit |
| Pino 24 | PB5/RxD0 — GPIO / SCI0 receive |
| Pino 25 | PB6/TxD1 — GPIO / SCI1 transmit |
| Pino 26 | PB7/RxD1 — GPIO / SCI1 receive |
| Pino 27 | PJ0/SCL — GPIO / I2C SCL |
| Pino 28 | PJ1/SDA — GPIO / I2C SDA |
| Pino 29 | PA0/TxD2 — GPIO / SCI2 transmit / CAN0 TX (alternate) |
| Pino 30 | PA1/RxD2 — GPIO / SCI2 receive / CAN0 RX (alternate) |
| Pino 31 | PA2 — GPIO |
| Pino 32 | PA3 — GPIO |
| Pino 33 | PA4 — GPIO |
| Pino 34 | PA5 — GPIO |
| Pino 35 | PA6 — GPIO |
| Pino 36 | PA7 — GPIO |
| Pino 37 | PC0 — GPIO |
| Pino 38 | PC1 — GPIO |
| Pino 39 | PC2 — GPIO |
| Pino 40 | PC3 — GPIO |
| Pino 41 | PC4 — GPIO |
| Pino 42 | PC5 — GPIO |
| Pino 43 | PC6 — GPIO |
| Pino 44 | PC7 — GPIO |
| Pino 45 | PD0/PWM0 — GPIO / PWM channel 0 |
| Pino 46 | PD1/PWM1 — GPIO / PWM channel 1 |
| Pino 47 | PD2/PWM2 — GPIO / PWM channel 2 |
| Pino 48 | PD3/PWM3 — GPIO / PWM channel 3 |
| Pino 49 | PD4/PWM4 — GPIO / PWM channel 4 |
| Pino 50 | PD5/PWM5 — GPIO / PWM channel 5 |
| Pino 51 | PD6/PWM6 — GPIO / PWM channel 6 |
| Pino 52 | PD7/PWM7 — GPIO / PWM channel 7 |
| Pino 53 | PM0/CAN1_TX — GPIO / msCAN1 transmit |
| Pino 54 | PM1/CAN1_RX — GPIO / msCAN1 receive |
| Pino 55 | PM2/CAN0_TX — GPIO / msCAN0 transmit |
| Pino 56 | PM3/CAN0_RX — GPIO / msCAN0 receive |
| Pino 57 | PM4 — GPIO |
| Pino 58 | PM5 — GPIO |
| Pino 59 | PM6 — GPIO |
| Pino 60 | PM7 — GPIO |
| Pino 61 | BKGD — Background Debug Mode data line |
| Pino 62 | PE_BDM — BDM enable (mode-select) |
| Pino 63 | XRESET — External reset input (active low) |
| Pino 64 | VSS1 — Core ground |
| Pino 65 | VSSX1 — I/O ground |
| Pino 66 | EXTAL — External crystal/clock input (4-25 MHz) |
| Pino 67 | XTAL — Crystal drive output |
| Pino 68 | PLL_VDD — PLL analog supply (2.5 V) |
| Pino 69 | PLL_VSS — PLL ground |
| Pino 70 | TCLK — Test clock (factory test, leave open in application) |
| Pino 71 | TDATA — Test data (factory test) |
| Pino 72 | VFP — Factory test pin (NC in application) |
| Pino 73 | NC — Not connected (reserved per datasheet) |
| Pino 74 | NC — Not connected (reserved per datasheet) |
| Pino 75 | NC — Not connected (reserved per datasheet) |
| Pino 76 | NC — Not connected (reserved per datasheet) |
| Pino 77 | VDD1 — Core logic supply (2.5 V) |
| Pino 78 | VDDX1 — I/O ring supply (3.3 V) |
| Pino 79 | VSS3 — Ground |
| Pino 80 | VSSX3 — I/O ground |
Aplicações típicas
MC9S12NE64VTUE é adequado para 6 aplicaçãos: Industrial Ethernet Gateway / SCADA Node, Building Automation Controller (BACnet/IP / Modbus-TCP), Sensor-to-Cloud IoT Edge Bridge, Embedded Web Server / Web-Interface Equipment, Automotive Telematics / CAN-to-Ethernet Router (Prototype Only), Remote Sensor Monitoring in Power Utilities.
Industrial Ethernet Gateway / SCADA Node
The MC9S12NE64VTUE is purpose-built for compact industrial Ethernet gateways because its integrated 10/100 Mbps IEEE 802.3 MAC+PHY eliminates the BOM cost of an external Ethernet controller. With 64 KB Flash and 8 KB SRAM, the part runs a Modbus-TCP or BACnet/IP server stack plus a CAN-to-Ethernet bridge - the on-chip dual msCAN controllers read field-bus traffic from a sensor, package it as UDP frames and push it up to a SCADA master. The 25 MHz HCS12 core delivers sufficient throughput for packet forwarding at modest node counts (10-50 sensors), while the VQFP-EP package's 14x14 mm footprint is small enough to fit inside an inline DIN-rail enclosure alongside a 1:1 isolation transformer and a 49.9 ohm termination network.
Recomendado
Building Automation Controller (BACnet/IP / Modbus-TCP)
For HVAC controllers and access-control panels needing a standards-compliant Ethernet interface, the MC9S12NE64VTUE combines the on-chip EMAC+PHY with three SCI (UART) channels that simultaneously talk RS-485 to lighting/HVAC field modules. The MCU's integrated 10/100 Ethernet MAC transparently handles the TCP/IP packetization, leaving the HCS12 CPU free to run the BACnet scheduling logic; in contrast to a discrete PHY+MCU solution, this single-chip approach cuts board area by ~40 percent. Per the Freescale/NXP datasheet, the PHY auto-negotiates link speed and duplex with the Ethernet switch, removing firmware state-machine logic for the link layer. Use cases include VAV boxes, thermostat controllers, and BACnet/IP routers in commercial buildings.
Recomendado
Sensor-to-Cloud IoT Edge Bridge
The MC9S12NE64VTUE serves as an IoT-edge device that bridges slow local sensors to a cloud MQTT broker over Ethernet, leveraging the on-chip EMAC+PHY to avoid pulling in a heavy network stack on a discrete MCU. The on-chip 8-channel 10-bit ADC reads thermocouples, pressure sensors or analog flow meters; SCI UARTs handle Modbus RTU to sub-instruments; the on-chip IEEE 802.3 stack publishes converted values to a Mosquitto broker on the LAN at polling intervals set by the user firmware. Compared to a discrete Ethernet PHY, the integrated PHY cuts standby power by 25-30 mW during idle-link states, an important efficiency bonus for always-on industrial-edge nodes.
Recomendado
Embedded Web Server / Web-Interface Equipment
The S12NE family's 16-bit HCS12 core plus its integrated TCP/IP-friendly EMAC make the MC9S12NE64VTUE suitable for embedded web servers that need to expose a simple HTML/Telnet interface to lab instruments or low-end printers. Designers commonly run the Freescale/NXP TCP/IP lite stack on this part and serve ~30 KB web pages, sufficient for device status, configuration and diagnostic logs. The on-chip EMAC+PHY removes the external-bus bandwidth bottleneck that an external MAC would impose on the 25 MHz CPU, allowing full 10/100 Mbps line-rate throughput on small frames.
Recomendado
Automotive Telematics / CAN-to-Ethernet Router (Prototype Only)
While the MC9S12NE64VTUE is only industrial-grade and not AEC-Q100 qualified, prototyping teams frequently use it as a CAN-to-Ethernet bridge for automotive telematics development benches because of its dual on-chip msCAN controllers and integrated Ethernet. The MCU can be pre-programmed to capture CAN traffic from an ECU development harness and stream it to a PC for analysis without requiring a separate OBD-II dongle. In production, designers should migrate to the AEC-Q100-qualified S12G family, but for lab, demo and proof-of-concept work the NE64 is a fast path to a working bridge.
Recomendado
Remote Sensor Monitoring in Power Utilities
The MC9S12NE64VTUE's industrial -40C to +105C temperature range and integrated Ethernet allow it to be deployed in outdoor substation monitoring cabinets and remote meter-telemetry boxes over twisted-pair Ethernet backhaul. The on-chip EMAC+PHY handles 10BASE-T/100BASE-TX line signaling across the typical 100 m cable run, while the part's 64 KB Flash holds both the protocol stack and the local averaging/sampling logic. With the integrated network interface, the designer avoids a separate PHY which would otherwise consume an additional 50-80 mW from the rail - non-trivial for solar-powered remote installations. Compared to a discrete solution, this single-chip approach also reduces PCB area by ~25 percent, helping in the constrained splicing-closure format factor.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12NE64VTUE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12NE64VTU | MC9S12NE64CAG | MC9S12NE64CFU | MC9S12NE64CFUE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-TQFP-EP (14x14 mm) | 80-TQFP-EP (14x14 mm) - same | 80-TQFP-EP (14x14 mm) - same | 80-TQFP-EP (14x14 mm) - same | 80-TQFP-EP (14x14 mm) - same |
| Temperature Grade | Industrial -40C to +105C | Industrial -40C to +105C (same) | Commercial -40C to +85C (-20C lower hot end) | Commercial -40C to +85C | Commercial -40C to +85C |
| Flash Memory | 64 KB | 64 KB (identical die) | 64 KB (identical die) | 64 KB (identical die) | 64 KB (identical die) |
| Integrated Ethernet | 10/100 MAC + PHY (on-chip) | 10/100 MAC + PHY (same die) | 10/100 MAC + PHY (same die) | 10/100 MAC + PHY (same die) | 10/100 MAC + PHY (same die) |
| Core Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Shipping Format | Tray (Bakeable, Multiple-in-Drypack) | Reel/tray (non-drypack) | Tray (drypack) | Reel/tray (non-drypack) | Tray (drypack) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Integrated 10/100 Mbps Ethernet MAC + PHY on-chip (no external PHY needed) (vs MC9S12A128CPVE)
- 64 KB Flash + industrial -40C to +105C temperature range (vs MC9S12NE64CFUE)
- Tray drypack shipping for moisture-sensitive assembly lines (vs MC9S12NE64VTU)
Notas de projeto
The 80-pin TQFP-EP relies on its bottom-side exposed thermal pad for heat removal. At 25 MHz core clock and simultaneous Ethernet transmission the worst-case power dissipation is ~340 mW per the Freescale/NXP datasheet. Recommended PCB: at least 8 thermal vias (0.3 mm drill, 0.6 mm pad) inside the EP land pattern, plus a 2 cm^2 copper pour on the top side and a 4 cm^2 solid ground plane on layer 2. Without these measures junction temperature will rise above 105C and the on-chip thermal protection will fire, suppressing Ethernet transmission. Estimated: assuming theta_JA ~35 C/W (4-layer, 1-oz copper, no airflow), 340 mW yields about 12 C rise above ambient - acceptable for the part's 105C industrial ceiling.
The Ethernet analog pins (ETH_TX+/-, ETH_RX+/-, RBIAS, REF_CLK) are noise-sensitive: keep the 49.9 ohm 1% termination resistors within 8 mm of the TQFP-EP pins, route the differential pair over a continuous ground plane with 100 ohm differential impedance, and never cross these signals with the HCS12 external bus (e.g. address/data lines). The RBIAS pin requires a precision 12.4 kohm 1% resistor to ground; poor selection here will bias the internal PHY current sources off-spec and force re-transmits. Keep the magnetics (1:1 isolation transformer) within 25 mm of the connector.
The MC9S12NE64VTUE requires two supplies: a 2.5 V VDD/PLL_VDD rail for the core and PLL, and a 3.3 V VDDX/EVDD rail for the I/O ring and Ethernet analog. Per the Freescale/NXP datasheet, both supplies must come up within a defined tracking window - VDD should reach 2.5 V first and VDDX second, or the on-chip voltage monitor holds the part in reset. Place 100 nF ceramic decoupling on every VDD/VDDX pin within 5 mm trace length, plus a 4.7 uF bulk capacitor on each rail. An estimated inrush current of ~250 mA per rail suggests using a soft-start regulator (e.g. TPS7A4701) for the 2.5 V line to avoid startup glitch on shared backplanes.
Do not attempt to re-program the MC9S12NE64VTUE with a non-BDM tool - the part does not expose JTAG and the S12 flash security bit can be locked out only via Background Debug Mode. Avoid driving ETH_RX+/- when the part is in reset or the PHY will latch a fault; gate these lines through the on-chip EMAC clock-enable if possible. Finally, do not exceed 25 MHz on EXTAL/XTAL - higher crystal frequencies are allowed on the S12XE family but not on the NE64. The MSL3 classification means reflow must complete within 168 hours after opening the drypack.
Informações de conformidade
RoHS and REACH compliance inferred from NXP/Freescale product page. Not AEC-Q100 qualified - industrial-grade only. Halogen-free status not present in the verified distributor data and marked unknown. Conflict-mineral compliance verified per NXP's standard corporate declaration.
