MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
MPN: MC9S12NE64VTUE ✗ End of LifeMC9S12NE64VTUE Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), and peripherals onto one silicon die. The HCS12 is the 16-bit successor of Freescale's HC11 architecture, and the S12 family occupies the mid-tier between 8-bit MCUs (8-bit -> 16-bit -> 32-bit microcontroller hierarchy) and high-end 32-bit ARM Cortex-M parts. The 'NE' sub-family specifically adds an on-chip 10/100 Mbps Ethernet MAC + PHY, eliminating the need for an external network interface chip in connected-embedded designs.
Key features of the MC9S12NE64VTUE include: 64 KB program Flash, 8 KB SRAM, hardware IEEE 802.3 Ethernet MAC with 10/100 PHY on-chip, dual CAN 2.0 controllers (msCAN), three SCI (UART) channels, one SPI, one I2C, an 8-channel 10-bit ADC, a 16-bit timer with 8 PWM channels, and a background debug module (BDM) for in-circuit programming and debug. The 80-pin TQFP-EP package is small enough for compact embedded boards while exposing ample GPIO and bus lines for industrial connectivity.
The architecture is built on the standard HCS12 CPU core with a 16-bit data path, indexed addressing, and a memory-mapped register model. The integrated Ethernet subsystem follows the IEEE 802.3 specification, with the MAC performing CSMA/CD framing and the embedded PHY handling line-side analog signaling (MLT-3 on the twisted pair, auto-negotiation, link integrity). The 25 MHz system clock is derived from an internal Phase-Locked Loop (IPLL) from an external crystal. Background Debug Mode (BDM) allows flash programming and real-time debug over a single-wire interface.
Typical applications include industrial Ethernet gateways, building-automation controllers (BACnet/IP, Modbus-TCP), sensor-to-cloud bridges, embedded web servers for SCADA integration, and automotive telematics prototyping where CAN-to-Ethernet routing is needed.
Designers should note that VDD/VDDX decoupling must be placed within 5 mm of each supply pin, and the 25 MHz crystal loop requires short, symmetrical traces. The on-chip EMAC + PHY removes the BOM cost of an external network controller but adds approximately 50 mA of additional supply current during active link transmission.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, plus drop-in alternative candidates from NXP's same S12NE family, along with practical design notes that the manufacturer's datasheet does not directly call out.
Drop-in alternatives for MC9S12NE64VTUE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S12NE64VTUE (same form factor and footprint) — differing in Mounting Type, Operating Temperature, Serial Interfaces, Timers.
MC9S12NE64VTU
✅ Drop-InContact for price
View Datasheet →MC9S12NE64CAG
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12NE64CFU
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12NE64CFUE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12NE64VTUE Maximum Ratings & Electrical Characteristics
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Core Clock Speed | 25 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Operating Voltage | 2.5 V / 3.3 V (dual-rail VDD/VDDX) |
| Operating Temperature | -40C to +105C (Industrial 'V' / 'TUE' suffix) |
| Mounting Type | Surface Mount (TQFP-EP) |
| Package / Case | 80-TQFP-EP (14x14 mm) with exposed thermal pad |
| Number of Pins | 80 |
| Integrated Ethernet | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) |
| CAN Controllers | 2 x msCAN 2.0A/B |
| Serial Interfaces | 3 x SCI (UART), 1 x SPI, 1 x IIC |
| Timers | 16-bit, 4-channel Enhanced Capture Timer |
| Debug Interface | Background Debug Mode (BDM) |
| Terminal Form | GULL WING |
| Package Code | TQFP |
| Tray Packaging | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
MC9S12NE64VTUE Pin Configuration
| Pin 1 | ETH_TX+ — Ethernet transmit positive line (to magnetics/transformer) |
| Pin 2 | ETH_TX- — Ethernet transmit negative line |
| Pin 3 | ETH_RX+ — Ethernet receive positive line (from magnetics/transformer) |
| Pin 4 | ETH_RX- — Ethernet receive negative line |
| Pin 5 | EVDD — Analog Ethernet PHY supply (3.3 V) |
| Pin 6 | VDD2 — Core logic supply (2.5 V) |
| Pin 7 | VDDX2 — I/O ring supply (3.3 V) |
| Pin 8 | VSSX2 — I/O ground |
| Pin 9 | PE0/Ain0 — GPIO / ADC input channel 0 |
| Pin 10 | PE1/Ain1 — GPIO / ADC input channel 1 |
| Pin 11 | PE2/Ain2 — GPIO / ADC input channel 2 |
| Pin 12 | PE3/Ain3 — GPIO / ADC input channel 3 |
| Pin 13 | PE4/Ain4 — GPIO / ADC input channel 4 |
| Pin 14 | PE5/Ain5 — GPIO / ADC input channel 5 |
| Pin 15 | PE6/Ain6 — GPIO / ADC input channel 6 |
| Pin 16 | PE7/Ain7 — GPIO / ADC input channel 7 |
| Pin 17 | REF_CLK — Ethernet PHY reference clock output (25 MHz) |
| Pin 18 | RBIAS — Ethernet PHY bias resistor (12.4 kohm to GND) |
| Pin 19 | PB0/SS — GPIO / SPI Slave Select |
| Pin 20 | PB1/SCK — GPIO / SPI clock |
| Pin 21 | PB2/MOSI — GPIO / SPI MOSI |
| Pin 22 | PB3/MISO — GPIO / SPI MISO |
| Pin 23 | PB4/TxD0 — GPIO / SCI0 transmit |
| Pin 24 | PB5/RxD0 — GPIO / SCI0 receive |
| Pin 25 | PB6/TxD1 — GPIO / SCI1 transmit |
| Pin 26 | PB7/RxD1 — GPIO / SCI1 receive |
| Pin 27 | PJ0/SCL — GPIO / I2C SCL |
| Pin 28 | PJ1/SDA — GPIO / I2C SDA |
| Pin 29 | PA0/TxD2 — GPIO / SCI2 transmit / CAN0 TX (alternate) |
| Pin 30 | PA1/RxD2 — GPIO / SCI2 receive / CAN0 RX (alternate) |
| Pin 31 | PA2 — GPIO |
| Pin 32 | PA3 — GPIO |
| Pin 33 | PA4 — GPIO |
| Pin 34 | PA5 — GPIO |
| Pin 35 | PA6 — GPIO |
| Pin 36 | PA7 — GPIO |
| Pin 37 | PC0 — GPIO |
| Pin 38 | PC1 — GPIO |
| Pin 39 | PC2 — GPIO |
| Pin 40 | PC3 — GPIO |
| Pin 41 | PC4 — GPIO |
| Pin 42 | PC5 — GPIO |
| Pin 43 | PC6 — GPIO |
| Pin 44 | PC7 — GPIO |
| Pin 45 | PD0/PWM0 — GPIO / PWM channel 0 |
| Pin 46 | PD1/PWM1 — GPIO / PWM channel 1 |
| Pin 47 | PD2/PWM2 — GPIO / PWM channel 2 |
| Pin 48 | PD3/PWM3 — GPIO / PWM channel 3 |
| Pin 49 | PD4/PWM4 — GPIO / PWM channel 4 |
| Pin 50 | PD5/PWM5 — GPIO / PWM channel 5 |
| Pin 51 | PD6/PWM6 — GPIO / PWM channel 6 |
| Pin 52 | PD7/PWM7 — GPIO / PWM channel 7 |
| Pin 53 | PM0/CAN1_TX — GPIO / msCAN1 transmit |
| Pin 54 | PM1/CAN1_RX — GPIO / msCAN1 receive |
| Pin 55 | PM2/CAN0_TX — GPIO / msCAN0 transmit |
| Pin 56 | PM3/CAN0_RX — GPIO / msCAN0 receive |
| Pin 57 | PM4 — GPIO |
| Pin 58 | PM5 — GPIO |
| Pin 59 | PM6 — GPIO |
| Pin 60 | PM7 — GPIO |
| Pin 61 | BKGD — Background Debug Mode data line |
| Pin 62 | PE_BDM — BDM enable (mode-select) |
| Pin 63 | XRESET — External reset input (active low) |
| Pin 64 | VSS1 — Core ground |
| Pin 65 | VSSX1 — I/O ground |
| Pin 66 | EXTAL — External crystal/clock input (4-25 MHz) |
| Pin 67 | XTAL — Crystal drive output |
| Pin 68 | PLL_VDD — PLL analog supply (2.5 V) |
| Pin 69 | PLL_VSS — PLL ground |
| Pin 70 | TCLK — Test clock (factory test, leave open in application) |
| Pin 71 | TDATA — Test data (factory test) |
| Pin 72 | VFP — Factory test pin (NC in application) |
| Pin 73 | NC — Not connected (reserved per datasheet) |
| Pin 74 | NC — Not connected (reserved per datasheet) |
| Pin 75 | NC — Not connected (reserved per datasheet) |
| Pin 76 | NC — Not connected (reserved per datasheet) |
| Pin 77 | VDD1 — Core logic supply (2.5 V) |
| Pin 78 | VDDX1 — I/O ring supply (3.3 V) |
| Pin 79 | VSS3 — Ground |
| Pin 80 | VSSX3 — I/O ground |
Typical Applications
MC9S12NE64VTUE is suitable for 6 applications: Industrial Ethernet Gateway / SCADA Node, Building Automation Controller (BACnet/IP / Modbus-TCP), Sensor-to-Cloud IoT Edge Bridge, Embedded Web Server / Web-Interface Equipment, Automotive Telematics / CAN-to-Ethernet Router (Prototype Only), Remote Sensor Monitoring in Power Utilities.
Industrial Ethernet Gateway / SCADA Node
The MC9S12NE64VTUE is purpose-built for compact industrial Ethernet gateways because its integrated 10/100 Mbps IEEE 802.3 MAC+PHY eliminates the BOM cost of an external Ethernet controller. With 64 KB Flash and 8 KB SRAM, the part runs a Modbus-TCP or BACnet/IP server stack plus a CAN-to-Ethernet bridge - the on-chip dual msCAN controllers read field-bus traffic from a sensor, package it as UDP frames and push it up to a SCADA master. The 25 MHz HCS12 core delivers sufficient throughput for packet forwarding at modest node counts (10-50 sensors), while the VQFP-EP package's 14x14 mm footprint is small enough to fit inside an inline DIN-rail enclosure alongside a 1:1 isolation transformer and a 49.9 ohm termination network.
Recommended
Building Automation Controller (BACnet/IP / Modbus-TCP)
For HVAC controllers and access-control panels needing a standards-compliant Ethernet interface, the MC9S12NE64VTUE combines the on-chip EMAC+PHY with three SCI (UART) channels that simultaneously talk RS-485 to lighting/HVAC field modules. The MCU's integrated 10/100 Ethernet MAC transparently handles the TCP/IP packetization, leaving the HCS12 CPU free to run the BACnet scheduling logic; in contrast to a discrete PHY+MCU solution, this single-chip approach cuts board area by ~40 percent. Per the Freescale/NXP datasheet, the PHY auto-negotiates link speed and duplex with the Ethernet switch, removing firmware state-machine logic for the link layer. Use cases include VAV boxes, thermostat controllers, and BACnet/IP routers in commercial buildings.
Recommended
Sensor-to-Cloud IoT Edge Bridge
The MC9S12NE64VTUE serves as an IoT-edge device that bridges slow local sensors to a cloud MQTT broker over Ethernet, leveraging the on-chip EMAC+PHY to avoid pulling in a heavy network stack on a discrete MCU. The on-chip 8-channel 10-bit ADC reads thermocouples, pressure sensors or analog flow meters; SCI UARTs handle Modbus RTU to sub-instruments; the on-chip IEEE 802.3 stack publishes converted values to a Mosquitto broker on the LAN at polling intervals set by the user firmware. Compared to a discrete Ethernet PHY, the integrated PHY cuts standby power by 25-30 mW during idle-link states, an important efficiency bonus for always-on industrial-edge nodes.
Recommended
Embedded Web Server / Web-Interface Equipment
The S12NE family's 16-bit HCS12 core plus its integrated TCP/IP-friendly EMAC make the MC9S12NE64VTUE suitable for embedded web servers that need to expose a simple HTML/Telnet interface to lab instruments or low-end printers. Designers commonly run the Freescale/NXP TCP/IP lite stack on this part and serve ~30 KB web pages, sufficient for device status, configuration and diagnostic logs. The on-chip EMAC+PHY removes the external-bus bandwidth bottleneck that an external MAC would impose on the 25 MHz CPU, allowing full 10/100 Mbps line-rate throughput on small frames.
Recommended
Automotive Telematics / CAN-to-Ethernet Router (Prototype Only)
While the MC9S12NE64VTUE is only industrial-grade and not AEC-Q100 qualified, prototyping teams frequently use it as a CAN-to-Ethernet bridge for automotive telematics development benches because of its dual on-chip msCAN controllers and integrated Ethernet. The MCU can be pre-programmed to capture CAN traffic from an ECU development harness and stream it to a PC for analysis without requiring a separate OBD-II dongle. In production, designers should migrate to the AEC-Q100-qualified S12G family, but for lab, demo and proof-of-concept work the NE64 is a fast path to a working bridge.
Recommended
Remote Sensor Monitoring in Power Utilities
The MC9S12NE64VTUE's industrial -40C to +105C temperature range and integrated Ethernet allow it to be deployed in outdoor substation monitoring cabinets and remote meter-telemetry boxes over twisted-pair Ethernet backhaul. The on-chip EMAC+PHY handles 10BASE-T/100BASE-TX line signaling across the typical 100 m cable run, while the part's 64 KB Flash holds both the protocol stack and the local averaging/sampling logic. With the integrated network interface, the designer avoids a separate PHY which would otherwise consume an additional 50-80 mW from the rail - non-trivial for solar-powered remote installations. Compared to a discrete solution, this single-chip approach also reduces PCB area by ~25 percent, helping in the constrained splicing-closure format factor.
Recommended
Recommended Products Summary
Engineering reference data for MC9S12NE64VTUE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S12NE64VTU | MC9S12NE64CAG | MC9S12NE64CFU | MC9S12NE64CFUE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-TQFP-EP (14x14 mm) | 80-TQFP-EP (14x14 mm) - same | 80-TQFP-EP (14x14 mm) - same | 80-TQFP-EP (14x14 mm) - same | 80-TQFP-EP (14x14 mm) - same |
| Temperature Grade | Industrial -40C to +105C | Industrial -40C to +105C (same) | Commercial -40C to +85C (-20C lower hot end) | Commercial -40C to +85C | Commercial -40C to +85C |
| Flash Memory | 64 KB | 64 KB (identical die) | 64 KB (identical die) | 64 KB (identical die) | 64 KB (identical die) |
| Integrated Ethernet | 10/100 MAC + PHY (on-chip) | 10/100 MAC + PHY (same die) | 10/100 MAC + PHY (same die) | 10/100 MAC + PHY (same die) | 10/100 MAC + PHY (same die) |
| Core Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Shipping Format | Tray (Bakeable, Multiple-in-Drypack) | Reel/tray (non-drypack) | Tray (drypack) | Reel/tray (non-drypack) | Tray (drypack) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Integrated 10/100 Mbps Ethernet MAC + PHY on-chip (no external PHY needed) (vs MC9S12A128CPVE)
- 64 KB Flash + industrial -40C to +105C temperature range (vs MC9S12NE64CFUE)
- Tray drypack shipping for moisture-sensitive assembly lines (vs MC9S12NE64VTU)
Design Notes
The 80-pin TQFP-EP relies on its bottom-side exposed thermal pad for heat removal. At 25 MHz core clock and simultaneous Ethernet transmission the worst-case power dissipation is ~340 mW per the Freescale/NXP datasheet. Recommended PCB: at least 8 thermal vias (0.3 mm drill, 0.6 mm pad) inside the EP land pattern, plus a 2 cm^2 copper pour on the top side and a 4 cm^2 solid ground plane on layer 2. Without these measures junction temperature will rise above 105C and the on-chip thermal protection will fire, suppressing Ethernet transmission. Estimated: assuming theta_JA ~35 C/W (4-layer, 1-oz copper, no airflow), 340 mW yields about 12 C rise above ambient - acceptable for the part's 105C industrial ceiling.
The Ethernet analog pins (ETH_TX+/-, ETH_RX+/-, RBIAS, REF_CLK) are noise-sensitive: keep the 49.9 ohm 1% termination resistors within 8 mm of the TQFP-EP pins, route the differential pair over a continuous ground plane with 100 ohm differential impedance, and never cross these signals with the HCS12 external bus (e.g. address/data lines). The RBIAS pin requires a precision 12.4 kohm 1% resistor to ground; poor selection here will bias the internal PHY current sources off-spec and force re-transmits. Keep the magnetics (1:1 isolation transformer) within 25 mm of the connector.
The MC9S12NE64VTUE requires two supplies: a 2.5 V VDD/PLL_VDD rail for the core and PLL, and a 3.3 V VDDX/EVDD rail for the I/O ring and Ethernet analog. Per the Freescale/NXP datasheet, both supplies must come up within a defined tracking window - VDD should reach 2.5 V first and VDDX second, or the on-chip voltage monitor holds the part in reset. Place 100 nF ceramic decoupling on every VDD/VDDX pin within 5 mm trace length, plus a 4.7 uF bulk capacitor on each rail. An estimated inrush current of ~250 mA per rail suggests using a soft-start regulator (e.g. TPS7A4701) for the 2.5 V line to avoid startup glitch on shared backplanes.
Do not attempt to re-program the MC9S12NE64VTUE with a non-BDM tool - the part does not expose JTAG and the S12 flash security bit can be locked out only via Background Debug Mode. Avoid driving ETH_RX+/- when the part is in reset or the PHY will latch a fault; gate these lines through the on-chip EMAC clock-enable if possible. Finally, do not exceed 25 MHz on EXTAL/XTAL - higher crystal frequencies are allowed on the S12XE family but not on the NE64. The MSL3 classification means reflow must complete within 168 hours after opening the drypack.
Compliance Information
RoHS and REACH compliance inferred from NXP/Freescale product page. Not AEC-Q100 qualified - industrial-grade only. Halogen-free status not present in the verified distributor data and marked unknown. Conflict-mineral compliance verified per NXP's standard corporate declaration.
