MC9S12XA256CAG - 16-Bit 256KB Flash HCS12X MCU | NXP
N.º da peça: MC9S12XA256CAG ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.2 | $282,00 |
| 100 | $22.85 | $2.285,00 |
| 500 | $18.4 | $9.200,00 |
| 1.000 | $15.95 | $15.950,00 |
MC9S12XA256CAG Visão geral
A microcontroller is a single-chip computer containing a CPU core, program and data memory, and integrated peripherals such as timers, ADC, communication interfaces, and GPIO. HCS12X is an enhanced superset of the original HCS12, adding an XGATE co-processor for I/O servicing in higher-end members, increasing the bus width and extending the interrupt handling. Within the broader taxonomy, HCS12X MCUs sit under 16-bit microcontrollers -> automotive/industrial microcontrollers -> embedded processors -> semiconductors. They typically serve as the central ECU controller in body electronics, instrument clusters, and chassis subsystems where deterministic real-time behaviour, low EMI, and code efficiency matter more than raw MHz. The S12XA family specifically targets the 256KB-Flash tier, balancing memory capacity, peripheral count, and cost.
Key features of the MC9S12XA256CAG include 256KB on-chip Flash (256K x 8), 119 GPIO pins, and a rich peripheral set: EBI/EMI external bus, I2C, IrDA, LINbus, SCI, SPI, PWM, plus LVD (low-voltage detect), POR (power-on reset), and WDT (watchdog timer). The integrated peripherals reduce external component count, which improves EMI signature and PCB simplicity, while 119 I/O paths support keypad scanning, segment LCD driving, sensor multiplexing and actuator H-bridge PWM without referencing a companion transponder.
The HCS12X architecture combines the standard S12 CPU with up to 20-bit address space and 80 MHz operation, plus an enhanced interrupt controller and background debug mode (BDM) for in-circuit programming and real-time debug. The 256KB Flash is organised as 256K x 8, supporting in-application reprogramming via the standard S12 Flash routine interface, with optional security bits and EEPROM emulation through Flash partitioning.
Typical applications for the MC9S12XA256CAG include automotive body controllers, instrument clusters, HVAC control modules, door modules with LIN nodes, and industrial PLC/HVAC control. Its wide temperature range and LIN/SPI/CAN-friendly peripheral set make it well-suited to chassis network and 12 V DC environment common in vehicle ECUs. Designers should budget for BDM header access during development and follow NXP EMC guidelines for the 144-LQFP PCB layout to maintain EMI performance. This page synthesises distributor pricing, lifecycle signals, and drop-in alternatives for the MC9S12XA256CAG that are not consolidated in any single manufacturer page.
Alternativas drop-in para MC9S12XA256CAG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12XA256CAG (mesmo formato e footprint) — diferindo em Mounting Type, Package, Core, Operating Temperature, Program Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XA256CAL
✅ Drop-In✓ Em estoque
$26.91 / unidade
Ver ficha técnica →MC9S12XA256VAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XD256CAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XET256CAG
✅ Drop-In✓ Em estoque
$10.55 / unidade
Ver ficha técnica →MC9S12XDP512CAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XA256CAG Classificações máximas e características elétricas
| Core | HCS12X (S12XA family) |
| Core Size | 16-bit |
| Maximum CPU Clock | 80 MHz |
| Program Memory Size | 256 KB (256K x 8) |
| Program Memory Type | FLASH |
| Encapsulamento | 144-LQFP (20x20 mm) |
| Number of I/O Pins | 119 |
| Connectivity | EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Temperatura de operação | -40C to +85C |
| Tipo de montagem | Surface Mount (LQFP, gull-wing) |
Guia de Configuração de Pinos do MC9S12XA256CAG 144-lqfp (20x20 mm)
Configuração de pinos para MC9S12XA256CAG (pacote 144-lqfp (20x20 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC9S12XA256CAG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC9S12XA256CAG é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster ECU, HVAC Control Module, Door Module with LIN Nodes, Industrial PLC / HVAC Controller, Automotive Lighting Controller.
Automotive Body Control Module
The MC9S12XA256CAG is well-suited as the central ECU in body-control modules driving lighting, mirrors, central locking, and wiper functions. Its 256KB Flash comfortably holds body-controller firmware including LIN node stacks, while the integrated SCI/SPI/I2C blocks handle LINbus, peripheral sensor and actuator links, and 119 GPIO pins support direct keypad and load-drive connections. Compared with newer S12XE parts, the HCS12X core has lower interrupt latency variance, beneficial for deterministic door-lock and lighting response. Designers place it on a 4-layer PCB following the NXP EMC reference layout; BDM header access during development enables in-circuit debug and Flash programming without an extra emulator. The -40C to +85C industrial temperature grade covers cabin environments but not under-hood, so for under-hood BCMs designers should look at the CAL or VAG temperature-grade variants.
Recomendado
Instrument Cluster ECU
Instrument clusters require a deterministic 16-bit controller to drive stepper-motor gauges, segment LCDs, and CAN/LIN communication with the body network. The MC9S12XA256CAG delivers this with its 80 MHz HCS12X core, PWM timers for backlight dimming and gauge drive, 119 GPIO pins for gauge/button matrix wiring, and EBI for optional external graphics memory. The 256KB Flash stores cluster graphics tables and CAN/LIN stack, while 12KB of RAM is sufficient for pointer animations. Although the MC9S12XA256CAG lacks the XGATE co-processor of the S12XD/S12XE families, most gauge tasks remain CPU-managed within 80 MHz headroom. A recommended pattern is to put the IC directly on the cluster PCB next to the LCD driver, using NXP's reference PCB stack-up to maintain EMI margins across the AM/FM band.
Recomendado
HVAC Control Module
In HVAC control modules the MC9S12XA256CAG runs the climate-control algorithm, drives BLDC or stepper damper motors via PWM, and talks to the body network over LIN or CAN. The 256KB Flash stores look-up tables for PID loops and sensor calibration curves, while the integrated ADC channels read temperature and pressure sensors. Its 16-bit HCS12X core delivers deterministic timing for the control loop, and 119 GPIO pins support the fan-speed PWM outputs and the segment-LCD indicators typical of HVAC panels. The HCS12X core also has hardware divider and extended indexed addressing, which simplifies the lookup-heavy climate code. Compared with newer S12XE parts, the HCS12X core on the XA has lower active current, helpful when the HVAC module is battery-fed through the body controller's quiescent rail.
Recomendado
Door Module with LIN Nodes
Door modules consolidate window lift, mirror adjust, and door-lock functions, and typically communicate with the body controller over LINbus. The MC9S12XA256CAG fits this role with its SCI block operating as LIN master/slave, integrated PWM for window motor soft-start, and 119 GPIO for mirror switch and lock actuator wiring. The 256KB Flash is enough for window anti-pinch algorithms and LIN diagnostic stacks. The HCS12X core's fast interrupt handling ensures the anti-pinch loop runs at a stable sample rate, while the WDT and LVD peripherals protect against supply brown-outs in the door environment. Where the design requires two LIN channels and a CAN interface, the MC9S12XET256CAG with XGATE is the recommended successor, but for single-LIN doors the MC9S12XA256CAG remains adequate.
Recomendado
Industrial PLC / HVAC Controller
Beyond automotive, the MC9S12XA256CAG is also used in industrial PLCs, programmable HVAC controllers, and building-automation nodes. Its 16-bit HCS12X core, 256KB Flash, and 119 GPIO pins give it sufficient headroom for ladder-logic interpreters or HVAC scheduling firmware, while LINbus/SPI/I2C connectivity supports sensor and actuator networks. The -40C to +85C industrial temperature grade covers factory-floor cabinets and rooftop HVAC enclosures. Designers in this space often pair the MCU with isolated RS-485 transceivers for trunk-line communication and use the EBI to attach external SRAM for logging. Because the part is obsolete, new industrial designs should evaluate MC9S12XET256CAG as the active successor with code-compatibility, or migrate to NXP Kinetis E series for ARM Cortex-M0+ toolchain familiarity.
Recomendado
Automotive Lighting Controller
Adaptive front-light and rear-lighting modules use the MC9S12XA256CAG to drive matrix-LED or stepper-actuated headlamp leveling, with LIN or CAN back to the BCM. The HCS12X core's 80 MHz clock and PWM channels support the multi-channel LED current control required by matrix-beam systems, while 256KB Flash stores beam-pattern algorithms and diagnostic logs. 119 GPIO pins provide direct PWM and sense lines for each LED string and motor driver. Compared with the higher-end S12XE parts, the MC9S12XA256CAG is lower cost and easier to qualify when XGATE co-processing is not required. Designers should follow NXP's PCB layout guidelines for automotive lighting EMC and add ESD protection on the LIN/CAN lines; lifetime-buy planning is recommended given the part's obsolete status.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12XA256CAG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12XA256CAL | MC9S12XA256VAG | MC9S12XD256CAG | MC9S12XET256CAG | MC9S12XDP512CAG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Core | HCS12X (S12XA) | HCS12X (S12XA) - same | HCS12X (S12XA) - same | HCS12X (S12XD) - +XGATE | HCS12X (S12XE) - +enhanced XGATE | HCS12X (S12XD) - +XGATE |
| Maximum CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB |
| XGATE Co-processor | No | No | No | Yes | Yes (enhanced) | Yes |
| Operating Temperature | -40C to +85C | -40C to +105C | -40C to +105C (automotive) | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Active / NRND | Active | Active |
| GPIO Count | 119 | 119 | 119 | 119 | 119 | 119 |
Principais diferenciais
- Lower-cost S12XA tier with no XGATE co-processor (vs MC9S12XET256CAG)
- Industrial temperature grade vs higher-temp automotive grade (vs MC9S12XA256VAG)
- Smaller Flash vs 512KB siblings (vs MC9S12XDP512CAG)
Notas de projeto
Estimated: the MC9S12XA256CAG in 144-LQFP (20x20) has a typical theta_JA in the 35-45 C/W range depending on PCB copper area. At 80 MHz full-speed CPU activity, the device draws roughly 50-70 mA active current from a 5 V supply, yielding ~250-350 mW dissipation. With four-layer PCB and NXP reference layout, junction rise stays under 15 C above ambient, but in sealed automotive enclosures designers should still validate with thermocouples. For under-hood or sun-heated cabin applications, prefer the MC9S12XA256CAL or MC9S12XA256VAG which are qualified to higher temperature grades on the same die.
Follow NXP's S12XA reference four-layer PCB stack-up with continuous ground plane under the LQFP, 0.1 uF decoupling on every VDD/VSS pin pair within 3 mm trace length, and a 10 uF bulk capacitor on each 5 V and 2.5 V rail. Keep the oscillator traces within 10 mm of the MCU and guard them with ground on both sides. The BDM (background debug mode) header (BKGD, MODC, VDDR, VSS) should be brought to a 2x5 header for in-circuit debug and Flash programming. EMC performance on the 144-LQFP package is sensitive to decoupling placement - poor decoupling will couple switching noise onto the LIN/CAN lines.
Three pitfalls are common when designing with the MC9S12XA256CAG. First, because the part is no longer manufactured, do not start a new high-volume design with it without securing lifetime-buy inventory or qualifying a successor - lead time is shown as 'To Be Confirmed' on multiple distributors and prices will rise as stock depletes. Third, the HCS12X core's interrupt vector table is mapped differently from the HCS12 - existing HCS12 code may need vector relocation. Fourth, security lock bits are one-time-programmable - locking the Flash incorrectly bricks the device, so develop with security disabled and only enable in the production image after full validation.
The MC9S12XA256CAG's SCI block, when configured as LIN master, requires a LIN transceiver IC between the SCI TX/RX pins and the bus; the MCU's logic-level pins cannot drive the LIN bus directly. For CAN, the same applies - use an external CAN transceiver (e.g. NXP TJA1040). The PWM outputs can drive small FET gates directly but for high-current loads use a dedicated MOSFET driver. The EBI/EMI external bus is shared with GPIO on some pins - if EBI is enabled, those GPIO pins are no longer usable for digital I/O, which affects the available GPIO count for your design.
Informações de conformidade
Compliance status was not present in the verified web data; request the official NXP RoHS/REACH certificate from a franchised distributor before EU-bound shipment. The CAG suffix denotes a commercial/industrial temperature grade, while CAL and VAG suffixes denote automotive-grade parts.
