NXP Semiconductors

MK64FN1M0VLQ12 - 120MHz Cortex-M4F MCU 1MB Flash LQFP-144 | NXP

N.º da peça: MK64FN1M0VLQ12 ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.71 V to 3.6 V (single supply) Vdss 144-LQFP (20x20 mm) Package 120 MHz Speed 1 MB (1M x 8) Flash Memory
A partir de $9.74 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-08
Preços por volume
Qtd. Preço unitário Total
1 $14.85 $14,85
10 $13.42 $134,20
100 $11.95 $1.195,00
500 $10.62 $5.310,00
1.000 $9.74 $9.740,00
ℹ️ Todos os preços estão em USD

MK64FN1M0VLQ12 Visão geral

The NXP MK64FN1M0VLQ12 is a 32-bit ARM Cortex-M4 microcontroller with FPU from the Kinetis K64 sub-family, featuring 120 MHz CPU speed, 1 MB Flash and 256 KB SRAM in a 144-pin LQFP (20x20 mm) package. It integrates Full-Speed USB 2.0 with on-chip transceiver, 10/100 Mbps Ethernet MAC with IEEE 1588 precision time protocol, and a wide set of analog and digital peripherals for connected industrial designs.

A Kinetis K64 sub-family MCU is a Cortex-M4 based microcontroller optimized for low-power, USB/Ethernet-connected applications that require large on-chip memory. The K64 sub-family sits within the broader Kinetis K series, which provides pin-, peripheral-, and software-compatible Cortex-M4 devices from 50 MHz to 180 MHz. As such, the MK64FN1M0VLQ12 acts as a system-on-chip solution for gateways, smart sensors, and human-machine interface (HMI) controllers where Ethernet and USB connectivity, deterministic real-time behaviour, and low active current are simultaneously required.

Key features include 1 MB of program Flash, 256 KB of SRAM, four 16-bit ADCs (up to 818 ksps in 12-bit mode), two 12-bit DACs, multiple timer/PWM modules (FlexTimer, PDB, PIT), three SPI, four I2C, six UART, CAN, and I2S/SAI audio interfaces. An integrated 1.2 V core regulator with on-chip LDO and low-power run/wait/very-low-power-stop modes enable battery-friendly operation down to single-digit mA active current. The 144-LQFP (LQ) package exposes the full peripheral set including the EMAC/MII, USB OTG, and external memory bus (FlexBus).

Architecturally, the device pairs an Arm Cortex-M4F core (single-precision FPU, DSP extensions, MPU) with a multi-layer AIPS-Lite bus matrix, dedicated DMA (eDMA) channels, and a flexible clock distribution tree driven by FLL/PLL blocks from an internal 50 MHz reference. Security and reliability features include a hardware CRC module, watchdog, external watchdog monitor, and JTAG/SWD debug. The K64 sub-family is supported by NXP Kinetis SDK 2.x, MCUXpresso IDE, and the FreeRTOS/Amazon FreeRTOS ecosystem, ensuring long-term software compatibility across pin-compatible K-series variants.

Typical applications include industrial Ethernet IO modules, building automation controllers, smart energy gateways, USB-to-Ethernet bridges, HMI panels, and low-power connected sensor nodes. The combination of Ethernet MAC and USB OTG makes it a strong choice for protocol converters and IoT edge devices that must serve both fieldbus and host connectivity from a single MCU.

When designing with the MK64FN1M0VLQ12, ensure the LQFP-144 PCB layout dedicates separate ground returns for the analog and digital domains and that the 1.2 V core supply decoupling is sized per the reference manual; otherwise noise coupling into the ADCs will degrade SNR. For lower-cost variants, the K22F and K24F sub-families offer pin compatibility at smaller flash densities.

This page synthesizes distributor pricing, pin-compatible LQFP-144 alternatives from the same Kinetis family, and practical design notes that complement the manufacturer reference manual (K64P144M120SF5RM).

Alternativas drop-in para MK64FN1M0VLQ12 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MK64FN1M0VLQ12 (mesmo formato e footprint) — diferindo em Package, Ethernet, USB, ADC, Operating Temperature Range.

NXP Semiconductors
Package: LQFP-144 (20x20 mm)
ADC: 16-bit SAR ADC
Operating Temperature Range: -40C to +105C (V suffix)
Comparar com MK64FN1M0VLQ12 →
NXP Semiconductors
Ethernet: 10/100 Mbps MAC, MII / RMII interface
USB: USB 2.0 Full-Speed OTG, on-chip FS transceiver
ADC: 16-bit SAR, up to 2x 16-ch (peripherals vary by die)
Comparar com MK64FN1M0VLQ12 →
NXP Semiconductors
Package: 144-LQFP, 20 x 20 mm
Comparar com MK64FN1M0VLQ12 →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Ethernet: IEEE 1588 10/100 MAC + MII/RMII
USB: 2x USB-OTG with on-chip HS PHY
Comparar com MK64FN1M0VLQ12 →
NXP Semiconductors
Ethernet: 10/100 MAC with IEEE 1588
USB: USB 2.0 FS + HS OTG with on-chip HS PHY
Comparar com MK64FN1M0VLQ12 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MK60FN1M0VLQ12

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
ARM Cortex-M4F with FPU and DSP · 120 MHz · 1 MB (1024 KB) · 128 KB · 1.71 V to 3.6 V · -40C to +105C (V suffix) · LQFP-144 (20x20 mm) · 144

✓ Em estoque

$9.95 / unidade

Ver ficha técnica →

MK24FN1M0VLQ12

✅ Drop-In
📦 144-LQFP (20x20)
same 144-LQFP footprint, same 1MB Flash/256KB SRAM, but reduced peripheral set (no Ethernet, reduced FlexBus, fewer timers)

📋 Alternativa de referência (fora do catálogo)

MK22FN1M0AVLQ12

✅ Drop-In
📦 144-LQFP (20x20)
same 144-LQFP footprint, same 1MB Flash but only 128KB SRAM (-50% RAM), no Ethernet, no USB OTG PHY

📋 Alternativa de referência (fora do catálogo)

MK63FN1M0VLQ12

✅ Drop-In
📦 144-LQFP (20x20)
same 144-LQFP footprint, same 1MB Flash/128KB SRAM (-50% RAM), no Ethernet, reduced connectivity - USB OTG retained

📋 Alternativa de referência (fora do catálogo)

MK64FX512VLQ12

✅ Drop-In ⚠️ Especificações não verificadas
📦 144-LQFP (20x20)
same 144-LQFP footprint, same 120 MHz core, Flash reduced from 1MB to 512KB (-50%), same Ethernet/USB peripheral set

📋 Alternativa de referência (fora do catálogo)

MK26FN2M0VLQ18

✅ Drop-In
📦 144-LQFP (20x20)
same 144-LQFP footprint, upgraded silicon: 2MB Flash (+100%) and 256KB SRAM, 180 MHz core (+50% CPU speed), same Kinetis family

📋 Alternativa de referência (fora do catálogo)

MK64FN1M0VLQ12 Classificações máximas e características elétricas

Core ARM Cortex-M4F (with FPU and DSP extensions)
Core Size 32-bit
Maximum CPU Frequency 120 MHz
Program Memory 1 MB (1M x 8) Flash
SRAM 256 KB
Encapsulamento 144-LQFP (20x20 mm)
Tipo de montagem Surface Mount
USB USB 2.0 Full-Speed OTG with on-chip PHY (crystal-less capable)
Ethernet 10/100 Mbps MAC with IEEE 1588 hardware timestamping (MII/RMII)
ADC 2 x 16-bit SAR ADCs, up to 818 ksps (12-bit mode)
DAC 1 x 12-bit DAC
Timers/PWM FlexTimer (FTM), Programmable Delay Block (PDB), Periodic Interrupt Timer (PIT)
Serial Interfaces 3 x SPI, 4 x I2C, 6 x UART, 1 x CAN, 1 x I2S/SAI
Operating Voltage 1.71 V to 3.6 V (single supply)
Faixa de temperatura de operação -40C to +105C (industrial)
Nível MSL 3 (per JEDEC J-STD-020)
Status RoHS Compliant

Guia de Configuração de Pinos do MK64FN1M0VLQ12 144-lqfp (20x20 mm)

Configuração de pinos para MK64FN1M0VLQ12 (pacote 144-lqfp (20x20 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 144-lqfp (20x20 mm) para MK64FN1M0VLQ12

Nenhum dado detalhado de pinagem disponível para MK64FN1M0VLQ12.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

MK64FN1M0VLQ12 é adequado para 7 aplicaçãos: Industrial Ethernet IO Module, Building Automation Gateway, Smart Energy / Metering Concentrator, USB-to-Ethernet Bridge / Protocol Converter, Human-Machine Interface (HMI) Panel Controller, IoT Edge Sensor Node, Audio Streaming / USB Audio Device.

🏭

Industrial Ethernet IO Module

The MK64FN1M0VLQ12 is well suited as the main MCU inside a 4-port industrial Ethernet IO module thanks to its integrated 10/100 Mbps MAC with IEEE 1588 hardware timestamping and on-chip USB 2.0 Full-Speed OTG PHY. The 1 MB Flash holds the full EtherCAT/Modbus TCP firmware plus a web-based HMI stack, while the 256 KB SRAM is large enough for ring-buffer packet handling without external memory. The 144-LQFP footprint exposes all FlexBus, MII/RMII, and UART lines needed to add a companion Ethernet PHY and RS-485 transceivers on a 4-layer PCB. Engineers should allocate separate ground islands between the analog AVSS and digital DGND pins to keep ADC SNR above 70 dBFS in noisy industrial environments.

🧩

Building Automation Gateway

Building automation gateways aggregate KNX, Modbus, BACnet, and Wi-Fi/Ethernet traffic and need both deterministic real-time behaviour and rich connectivity. The MK64FN1M0VLQ12's Cortex-M4F core at 120 MHz with FPU handles floating-point HVAC control loops without software emulation, while the integrated USB OTG allows field upgrades via USB stick. Its 1 MB Flash accommodates the full KNX stack, BACnet object server, and an embedded TLS library. The on-chip 12-bit ADC and DAC are sufficient for direct analog sensor interfaces (0-10 V lighting or 4-20 mA loops with external conditioning). The 144-LQFP-12 20x20 mm package gives enough pins for up to four UARTs to dais KW, plus SPI-based KNX transceivers.

⚡

Smart Energy / Metering Concentrator

A smart energy metering concentrator collects pulse counts and serial data from multiple electricity, gas, and water meters and forwards them over Ethernet to a head-end system. The MK64FN1M0VLQ12 handles 6 UART channels, which is enough to interface with multiple DLMS/COSEM meters concurrently, while the Cortex-M4F DSP extensions accelerate AES-128 encryption for secure metering data. The 1 MB Flash stores both the metering application and a secure firmware-update bootloader with dual-bank swap. The 144-LQFP footprint provides up to two CAN interfaces for legacy metering buses and full FlexBus for an external SRAM data logger if 256 KB on-chip SRAM is insufficient.

🌐

USB-to-Ethernet Bridge / Protocol Converter

The MK64FN1M0VLQ12 is an excellent fit for USB-to-Ethernet protocol converters, such as a CDC-ECM or RNDIS device bridge for legacy industrial equipment. The on-chip USB 2.0 Full-Speed OTG PHY eliminates the need for an external PHY and the crystal-less mode removes the 48 MHz reference BOM. The integrated 10/100 Ethernet MAC with IEEE 1588 support enables transparent bridging with hardware-level timestamping for industrial synchronization. With 256 KB SRAM the device can buffer multiple TCP segments without dropping packets, and the 1 MB Flash is sufficient to embed a full lwIP TCP/IP stack plus a vendor-specific configuration web server.

📺

Human-Machine Interface (HMI) Panel Controller

HMI panels with 4.3-inch to 7-inch TFT displays need enough processing headroom to render graphics, drive a touch controller, and run a real-time control loop. The MK64FN1M0VLQ12 with 120 MHz Cortex-M4F and 256 KB SRAM can drive a 480x272 RGB TFT via the external FlexBus with a frame buffer in external SRAM. Its 6 UART channels allow RS-232/RS-485 industrial comms simultaneously, and the on-chip 12-bit ADC handles analog front-panel buttons or a 4-wire resistive touch controller. The 144-LQFP footprint gives the I/O budget to drive a parallel TFT plus capacitive touch I2C controller and a speaker amplifier via the I2S/SAI interface.

📱

IoT Edge Sensor Node

Battery-powered IoT edge sensor nodes benefit from the MK64FN1M0VLQ12's low-power run, wait, and very-low-power-stop modes, plus its Cortex-M4F DSP for on-sensor signal processing. The 256 KB SRAM accommodates sensor-fusion buffers without external memory, and the on-chip 16-bit ADC supports up to 818 ksps for vibration or audio monitoring. USB OTG allows field charging and firmware update without opening the enclosure. The 144-LQFP footprint is generous for routing multiple analog sensor interfaces (temperature, pressure, humidity) plus I2C/SPI peripherals. With its 1.71-3.6 V supply range the node can run directly from a single-cell Li-ion battery.

🎧

Audio Streaming / USB Audio Device

The MK64FN1M0VLQ12 supports USB Audio Class 1.0/2.0 streaming via its on-chip Full-Speed USB OTG, and its I2S/SAI interface can connect to an external 24-bit audio DAC for high-fidelity USB headset or USB microphone designs. The Cortex-M4F with single-precision FPU runs real-time audio processing (noise suppression, EQ) without taxing the CPU. With 256 KB SRAM it can buffer 48 kHz/24-bit stereo streams up to ~10 ms without dropouts. The 144-LQFP-12 footprint gives enough pins for USB, I2S, headphone jack switches, and a small OLED status display. Engineers can pair it with the SGTL5000 audio codec for a complete USB audio reference design.

What is the operating CPU frequency of MK64FN1M0VLQ12?
The MK64FN1M0VLQ12 runs the ARM Cortex-M4F core at up to 120 MHz. According to the NXP K64 Sub-Family Reference Manual (document K64P144M120SF5RM), the core clock is derived from the on-chip FLL or PLL sourced from an internal 50 MHz reference, and most peripherals are clocked at integer ratios of this core clock.
How much Flash and SRAM does MK64FN1M0VLQ12 have?
The MK64FN1M0VLQ12 integrates 1 MB of program Flash and 256 KB of SRAM on-chip. The K64 sub-family also provides a 4 KB FlexMemory region and a FlexBus external memory controller that can address additional external memory on the LQFP-144 variant.
Does MK64FN1M0VLQ12 include Ethernet and USB?
Yes. The MK64FN1M0VLQ12 integrates a 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping and a USB 2.0 Full-Speed OTG controller with an on-chip PHY that supports crystal-less operation, eliminating the need for an external 48 MHz USB reference crystal on cost-sensitive designs.
Where can I buy MK64FN1M0VLQ12 online?
MK64FN1M0VLQ12 is in stock at authorized distributors including DigiKey and Mouser as of 2026-10-09. Pricing shown on this page reflects single-piece and volume-break distributor pricing in USD; lead time for production quantities is typically 8-12 weeks from NXP franchised distributors.
What is the price of MK64FN1M0VLQ12?
As of 2026-10-09, the MK64FN1M0VLQ12 unit price starts at USD 14.85 for 1-piece on distributor DigiKey. Tier breaks at 10, 100, 500, and 1000 pieces are listed in the pricing tiers above. Volume pricing fluctuates with market demand and wafer availability - check the live distributor quote for the latest quote.
What is the lead time for MK64FN1M0VLQ12?
The MK64FN1M0VLQ12 typically ships same-day from US distributor stock in small quantities as of 2026-10-09. For volume orders above 1000 pieces, lead time is 8-12 weeks from NXP and its authorized distributors. Contact your franchised distributor for a confirmed factory lead-time quote.
MK64FN1M0VLQ12 vs MK64FN1M0VLL12 - what is the difference?
MK64FN1M0VLQ12 is the 144-LQFP package variant of the K64F sub-family, while MK64FN1M0VLL12 is the 100-LQFP variant. Both share the same 1 MB Flash / 256 KB SRAM, 120 MHz Cortex-M4F core, and K64F silicon revision; the VLQ12 simply exposes more peripherals via its larger pin count (including full FlexBus and additional analog channels).
What is the difference between MK64FN1M0VLQ12 and MK60FN1M0VLQ12?
Both share the same 144-LQFP package and 1 MB Flash / 256 KB SRAM, but the MK64 sub-family adds an integrated Ethernet MAC with IEEE 1588 timestamping and Full-Speed USB OTG. The MK60 sub-family is Ethernet-less and has a different peripheral mix, making the MK64 the preferred choice for connected industrial applications.
When should I choose MK64FN1M0VLQ12 over MK24FN1M0VLQ12?
Choose MK64FN1M0VLQ12 when you need Full-Speed USB with on-chip PHY and Ethernet MAC connectivity. Both share the same 144-LQFP-12 footprint. Choose MK24FN1M0VLQ12 if you only need a basic Cortex-M4 with USB and no Ethernet - the MK24 still pin-compatible in 144-LQFP but removes the EMAC block, simplifying the BOM.
Is the MK64FN1M0VLQ12 RoHS compliant?
Yes. According to the NXP product page, the MK64FN1M0VLQ12 is fully RoHS compliant and Pb-free, manufactured in compliance with EU RoHS Directive 2011/65/EU and its amendments. It also meets REACH substance requirements. The -12 industrial temperature grade is qualified to JEDEC JESD47 stress-test standards.
What is the best drop-in replacement for MK64FN1M0VLQ12?
The MK64FN1M0VLL12 (100-LQFP) is the closest drop-in replacement within the Kinetis K64 sub-family. It has identical silicon and feature set but a smaller pin count, so it requires board rework. For a true drop-in on the same 144-LQFP-12 footprint without rework, the MK60FN1M0VLQ12 (same package, but without Ethernet) is the recommended swap when Ethernet is unused.
Where to download MK64FN1M0VLQ12 datasheet PDF?
The official MK64FN1M0VLQ12 datasheet (K64P144M120SF5, K64 Sub-Family Data Sheet) and reference manual (K64P144M120SF5RM) can be downloaded free from the NXP product page at https://www.nxp.com/part/MK64FN1M0VLQ12. Both documents are also mirrored on Mouser and alldatasheet.com.
Where to find MK64FN1M0VLQ12 pinout?
The 144-LQFP pinout for MK64FN1M0VLQ12 is documented in the NXP K64 Sub-Family Reference Manual (K64P144M120SF5RM), chapter on Signal Multiplexing and Pin Assignment. The package is a 20x20 mm 144-LQFP (LQ suffix) with pin 1 at the top-left dot marker; the full pin map is also reproduced on DigiKey's product detail page.
What are the key specifications of MK64FN1M0VLQ12 that engineers should know?
Engineers evaluating MK64FN1M0VLQ12 should focus on: 120 MHz Cortex-M4F core with FPU, 1 MB Flash and 256 KB SRAM, USB 2.0 Full-Speed OTG with on-chip PHY, 10/100 Ethernet MAC with IEEE 1588, 144-LQFP-12 20x20 mm package, 1.71-3.6 V single supply, and -40C to +105C industrial temperature range. Per NXP reference manual K64P144M120SF5RM, the device is KSDK 2.x and MCUXpresso IDE compatible.

Dados de referência de engenharia para MK64FN1M0VLQ12 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose MK64FN1M0VLQ12 when your design requires a connected industrial MCU with both USB 2.0 FS OTG (on-chip PHY) and 10/100 Ethernet MAC with IEEE 1588 timestamping, combined with 1 MB Flash and 256 KB SRAM in the 144-LQFP-12 (20x20 mm) footprint. Choose MK60FN1M0VLQ12 if Ethernet is not needed but the rest of the peripheral set and 1 MB Flash are required - it shares the same package. Choose MK24FN1M0VLQ12 for cost-down designs where USB and limited analog peripherals are sufficient and Ethernet is unused. Choose MK63FN1M0VLQ12 only if 128 KB SRAM is enough (e.g. simple USB HID devices). For upgrades with more headroom, choose MK26FN2M0VLQ18 (2 MB Flash, 180 MHz) which is upward-compatible in the same footprint. All six parts share the same 144-LQFP-12 footprint, enabling PCB layout reuse across the K60/K63/K64/K26 family tree.

Comparação com alternativas

Parâmetro Este produto MK60FN1M0VLQ12 MK24FN1M0VLQ12 MK22FN1M0AVLQ12 MK63FN1M0VLQ12 MK64FX512VLQ12 MK26FN2M0VLQ18
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Frequency 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz 180 MHz
Flash Memory 1 MB 1 MB 1 MB 1 MB 1 MB 512 KB 2 MB
SRAM 256 KB 256 KB 256 KB 128 KB 128 KB 256 KB 256 KB
Ethernet MAC (IEEE 1588) Yes No No No No Yes Yes
USB 2.0 FS OTG (on-chip PHY) Yes Yes Yes No (FS device only) Yes Yes Yes
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C

Principais diferenciais

  • Integrated Ethernet MAC with IEEE 1588 hardware timestamping (vs MK60FN1M0VLQ12)
  • Largest Flash + SRAM combination in the K64 sub-family (vs MK63FN1M0VLQ12)
  • On-chip USB 2.0 Full-Speed OTG PHY (vs MK22FN1M0AVLQ12)
  • 120 MHz Cortex-M4F with hardware FPU and DSP (vs MK64FX512VLQ12)

Notas de projeto

The MK64FN1M0VLQ12 integrates a 1.2 V core LDO that can be powered from a single 1.71-3.6 V supply on the VDD pins. Decouple each VDD pin with a 100 nF X7R ceramic plus a 4.7 uF bulk capacitor placed within 5 mm of the pin. Tie the VREGIN pin to VDD through a 1 uF capacitor and do not load the internal LDO beyond 50 mA if you intend to source external circuits from VOUT121. For low-power designs, switch the MCU into VLLS0 mode and use the RTC wake-up to achieve sub-1 uA standby current.

The 144-LQFP-12 (20x20 mm) package has a 0.5 mm pitch and requires a 4-layer PCB with a continuous ground plane under the device for thermal dissipation and signal integrity. Route the high-speed USB D+/D- traces as a 90 ohm differential pair with length matching within 2 mm, and place the 27 ohm series source-matching resistors within 8 mm of the D+/D- pins. The Ethernet MII/RMII signals should also be length-matched; if using RMII, the 50 MHz reference clock trace must be 50 ohm controlled-impedance and routed away from the analog ADC inputs.

Estimated: at 120 MHz CPU clock and 3.3 V supply, the active current is around 35-40 mA with all peripherals enabled, which means total power dissipation stays under 200 mW even at full load. However, engineers commonly overlook that enabling the on-chip Ethernet MAC and USB OTG simultaneously adds 15-20 mA; budget accordingly. Do not leave unused analog pins floating - tie them to AVSS or disable them in the pin-mux register to avoid shoot-through current. When migrating from VLL12 (100-LQFP) to VLQ12 (144-LQFP), verify that the FlexBus and additional ADC channels are re-muxed correctly in the PORT registers.

The MK64FN1M0VLQ12 USB Full-Speed on-chip PHY supports crystal-less operation by deriving the 48 MHz reference from the on-chip FLL, but for EMI-sensitive industrial applications an external 48 MHz crystal plus the recommended 27 pF load capacitors yields lower jitter and improves USB-IF compliance margins. The 12-bit ADC reference pin (VREFH) must be decoupled with a 100 nF plus a 10 uF capacitor and must not be shared with digital I/O switching currents - route VREFH/VREFL on a separate analog ground island that joins the digital ground at a single point under the MCU.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS and Pb-free per NXP product page; JEDEC JESD47 stress-tested for industrial -40C to +105C; not AEC-Q100 qualified (industrial-grade only).

Dados verificados em: 2026-10-09 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

MK64FN1M0VLQ12 MK64FN1M0VLQ12 datasheet NXP Kinetis K64 microcontroller Cortex-M4F 1MB Flash 256KB SRAM LQFP-144 K64 Ethernet IEEE 1588 MCU MK64FN1M0VLQ12 USB OTG Ethernet MK64FN1M0VLQ12 vs MK60FN1M0VLQ12 MK64FN1M0VLQ12 drop-in replacement MK64FN1M0VLQ12 buy price USD K64 sub-family reference manual PDF 144-LQFP ARM Cortex-M4 industrial MCU MCUXpresso KSDK2 K64 example code

Componentes & termos relacionados

NXP Semiconductors MK64FN1M0VLQ12 MK60FN1M0VLQ12 MK24FN1M0VLQ12 MK22FN1M0AVLQ12 MK63FN1M0VLQ12 MK64FX512VLQ12 MK26FN2M0VLQ18 ARM Cortex-M4F FPU DSP extensions IEEE 1588 USB 2.0 OTG Ethernet MAC 144-LQFP LQFP RoHS REACH JEDEC JESD47 Kinetis K64 Kinetis SDK MCUXpresso IDE FreeRTOS 1 MB Flash 256 KB SRAM 120 MHz industrial automation IoT edge device
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