MCZ33742EGR2 - System Basis Chip w/ HS-CAN Transceiver | NXP
N.º da peça: MCZ33742EGR2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.28 | $6,28 |
| 10 | $5.74 | $57,40 |
| 100 | $5.21 | $521,00 |
| 500 | $4.65 | $2.325,00 |
| 1.000 | $4.1 | $4.100,00 |
MCZ33742EGR2 Visão geral
A System Basis Chip is a class of automotive power-management IC that consolidates a 5V regulator, CAN/LIN physical layer, watchdog timer, and reset generation onto a single die. The MCZ33742EGR2 sits in the NXP SBC product family between simple transceivers and full microcontroller companion chips, reducing ECU bill-of-materials, PCB area, and quiescent current in body and chassis control modules.
Key features include a 5 V/9 V/12 V/15 V/18 V/24 V-tolerant CAN bus interface, 1 Mbps high-speed CAN 2.0b passive/active error framing, hardware SPI control of all functions, programmable watchdog with window mode, low quiescent current in Sleep mode for battery-direct ECUs, and integrated thermal shutdown plus load-dump protection up to 40 V. The chip targets 12 V automotive battery rails where cold-crank and load-dump transients stress conventional transceivers.
The 33742 architecture combines a CAN physical layer compliant with ISO 11898-2/5, an internal 5 V LDO/switch-mode preregulator front end selectable by variant, and an SPI register set mapped for diagnostics such as TX/RX error counters, thermal flags, and bus failure modes. The companion variant 33742S adds enhanced ESD on the bus pins, useful for off-board harness connections.
Typical automotive applications include body control modules (BCM), HVAC controllers, instrument clusters, seat and mirror modules, lighting ECUs, and gateway nodes that bridge CAN networks. The integrated SBC form factor replaces discrete 5 V regulators plus standalone CAN transceivers, freeing board space for wireless or sensor interfaces.
When designing with the MCZ33742EGR2, place a 100 nF decoupling capacitor within 5 mm of VBAT and a bulk capacitor (>=10 uF) on the regulated 5 V rail to handle CAN bus load transients. Configure the watchdog window via SPI before enabling CAN transmit to satisfy fail-safe startup timing.
This page consolidates distributor pricing, drop-in alternatives, and design notes not found in the Freescale/NXP datasheet, along with provenance-traced comparison parameters and AI-search-optimized FAQ answers for engineers evaluating SBC upgrades.
Alternativas drop-in para MCZ33742EGR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCZ33742EGR2 (mesmo formato e footprint) — diferindo em CAN Data Rate, Package, Packaging, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCZ33742EFR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCZ33742EG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCZ33742SEG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.35 / unidade
Ver ficha técnica →MCZ33742EGR2 Classificações máximas e características elétricas
| Product Type | System Basis Chip (SBC) with HS-CAN Transceiver |
| Manufacturer | Freescale / NXP Semiconductors |
| Supply Voltage (VBAT) | 5.5 V to 18 V |
| Corrente de alimentação | 42 mA (typical operating) |
| CAN Data Rate | 1 Mbps (High-Speed CAN 2.0b) |
| Supported Bus Voltages | 5 V / 9 V / 12 V / 15 V / 18 V / 24 V (12 V automotive nominal) |
| Low-Power Modes | Sleep / Standby / Stop |
| Control Interface | SPI |
| Integrated Functions | 5V regulator, CAN transceiver, watchdog, voltage monitoring, reset generator |
| Encapsulamento | 28-SOIC Wide Body (0.295 inch, 7.50 mm width) |
| Tipo de montagem | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Compliance / Standard | CAN 2.0b compliant; ISO 11898-2/5 physical layer |
| Status RoHS | Compliant (NXP product family standard) |
Configuração de pinos do MCZ33742EGR2
| Pino 1 | TXCAN — CAN transmit data input from MCU |
| Pino 2 | GND — Ground reference |
| Pino 3 | VCC — 5V regulated output for MCU |
| Pino 4 | MOSI — SPI Master-Out-Slave-In |
| Pino 5 | MISO — SPI Master-In-Slave-Out |
| Pino 6 | SCLK — SPI clock |
| Pino 7 | CS — SPI chip select (active low) |
| Pino 8 | INT — Interrupt output to MCU |
| Pino 9 | RST — Reset output to MCU |
| Pino 10 | WD — Watchdog input/output |
| Pino 11 | WAKE — Wake-up input |
| Pino 12 | CANL — CAN bus low line |
| Pino 13 | CANH — CAN bus high line |
| Pino 14 | SPLIT — CAN bus split termination |
| Pino 15 | VBAT — Battery supply input (5.5-18V) |
| Pino 16 | VSUP — Voltage supply reverse-protection |
| Pino 17 | NC — Not connected (per datasheet) |
| Pino 18 | NC — Not connected (per datasheet) |
| Pino 19 | NC — Not connected (per datasheet) |
| Pino 20 | GND — Ground reference |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
Aplicações típicas
MCZ33742EGR2 é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster ECU, Seat and Mirror Control Module, Automotive Lighting ECU, CAN Gateway / Network Bridge.
Automotive Body Control Module (BCM)
The MCZ33742EGR2 is well suited to body control modules where it integrates the 5 V microcontroller supply, the CAN bus physical layer, and the watchdog into a single 28-SOIC wide-body device. The 5.5 V to 18 V VBAT rating tolerates 12 V automotive cold-crank to load-dump transients; the 1 Mbps high-speed CAN bus interfaces directly with body networks. SPI registers expose watchdog window, fault flags, and sleep-mode control, allowing the BCM microcontroller to manage peripheral loads via standard SPI commands. Compared with discrete regulator plus CAN-transceiver designs, this SBC approach cuts PCB area roughly 50 percent and reduces BOM count by 3-5 components.
Recomendado
HVAC Control Module
HVAC control modules benefit from the MCZ33742EGR2's combination of regulated 5 V output, SPI-controlled diagnostic flags, and low-quiescent Sleep mode for parked-vehicle current. The chip's 1 Mbps CAN bus interfaces with the cabin network, while its integrated watchdog ensures the HVAC microcontroller resets cleanly on firmware lock-up. Sleep mode current is reduced to enable months-long parking without draining the battery, and the wide SOIC package provides thermal margin for continuous backlight relay driving. Using this SBC eliminates the need for separate CAN transceivers, voltage regulators, and external reset ICs.
Recomendado
Instrument Cluster ECU
Instrument clusters require stable 5 V rails for display drivers and reliable CAN communication to the vehicle network. The MCZ33742EGR2 supplies both functions from a 28-SOIC wide-body SBC, with thermal performance suited to continuous cluster operation under hood-temperature conditions. SPI-controlled low-power modes allow cluster wake-up on CAN activity or key-on edge, preserving battery life during long parking. The integrated watchdog timer also protects against firmware crashes that would otherwise blank the cluster display.
Recomendado
Seat and Mirror Control Module
Seat and mirror modules integrate motor drivers, position sensors, and CAN communication in compact body-side ECUs. The MCZ33742EGR2's small 28-SOIC wide footprint and integrated SBC functions allow these modules to be highly integrated while sharing vehicle-wide CAN messages. The 5 V regulator supports position-sensor and Hall-effect logic circuits, while 1 Mbps CAN transmits position changes back to the BCM. Sleep mode is essential since seat modules typically remain on the bus for key-off wake-up.
Recomendado
Automotive Lighting ECU
Lighting ECUs such as headlamp controllers and tail-light modules use the MCZ33742EGR2 to combine CAN network interface, microcontroller supply, and watchdog reset in one chip. The wide SOIC package tolerates the thermal load from nearby LED-driver stages. SPI commands enable fault reporting (lamp-out detection, short-circuit flags) back to the BCM over CAN. Compared with discrete implementations, the SBC approach reduces PCB area and simplifies ASIL-relevant firmware-boot sequencing.
Recomendado
CAN Gateway / Network Bridge
CAN gateway ECUs bridge between powertrain, body, and chassis CAN segments, often running two or more CAN buses plus optional LIN. The MCZ33742EGR2 supplies one of these networks with its integrated SBC, freeing the gateway microcontroller from discrete voltage regulators and CAN transceivers. At 1 Mbps the device keeps up with high-speed body and chassis buses. The SPI control interface allows the gateway firmware to monitor bus error counters and trigger fault-recovery actions when one segment degrades.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCZ33742EGR2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCZ33742EFR2 | MCZ33742EG | MCZ33742SEG |
|---|---|---|---|---|
| Package | 28-SOIC Wide | 28-SOIC Wide (same) | 28-SOIC Wide (same) | 28-SOIC Wide (same) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Supply Voltage (VBAT) | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V |
| Supply Current | 42 mA | 42 mA | 42 mA | 42 mA |
| CAN Data Rate | 1 Mbps | 1 Mbps | 1 Mbps | 1 Mbps |
| Low-Power Modes | Sleep / Standby / Stop | Sleep / Standby / Stop | Sleep / Standby / Stop | Sleep / Standby / Stop |
| Bus ESD Protection | Standard | Standard | Standard | Enhanced ESD on bus pins |
| Packaging Format | Tape & Reel (TR) | Tape & Reel (TR) | Tube | Tube |
Principais diferenciais
- Integrated SBC reduces PCB area vs. discrete implementations (vs Discrete 5V regulator + CAN transceiver + external watchdog)
- Enhanced ESD variant available in same footprint (vs MCZ33742EGR2 vs. MCZ33742SEG)
- Three low-power modes reduce parked-vehicle battery drain (vs Discrete CAN transceivers without deep-sleep modes)
Notas de projeto
Place a 100 nF decoupling capacitor within 5 mm of the VBAT pin and a bulk capacitor >=10 uF on the regulated 5 V output (VCC) rail. The 42 mA operating supply current combined with CAN bus load transients during dominant-bit switching can cause sub-microsecond dips on VCC unless bulk capacitance is sized correctly. For modules with motors or relays, add a 22 uF reservoir capacitor near the 5 V rail to absorb relay-coil inductance. Estimated: a 10 uF X7R 16V cap keeps ripple below 50 mVpp at typical CAN frame rates.
The 28-SOIC wide-body package provides adequate thermal dissipation for 12 V automotive battery operation at typical SBC power levels. Estimated: power dissipation during full CAN traffic is approximately 0.5 W (5V * 100 mA to MCU + 12V * 5 mA idle), well within the wide-SOIC thermal envelope. For modules in extreme-temperature underhood locations (>=105 C ambient), verify junction temperature against the manufacturer's thermal model. Always connect the copper pour on top and bottom layers under the chip to the GND pin to maximize heat spreading.
Do not exceed VBAT maximum transient ratings during load-dump events - automotive 12V systems can swing above 40V on load-dump. Add a TVS diode (e.g., SMBJ24CA) directly at the harness connector for protection. The CAN bus requires 120 ohm termination at each end of the bus segment; do not place termination inside the SBC ECU unless the design is a stub. Watchdog window mode must be configured via SPI during firmware init; failure to do so leaves the watchdog in the default off state and defeats fail-safe reset generation.
Route the CANH and CANL traces as a differential pair with 100 ohm differential impedance on a 4-layer or higher PCB. Keep the bus traces short, matched in length (<3mm difference), and isolated from switching-node traces by at least 3 mm. Place the CAN bus split-capacitor (SPLIT pin) symmetrically between CANH and CANL with a 10 nF X7R cap to GND. The GND pin and exposed pad must be soldered to a continuous ground pour for both thermal and EMC performance.
Informações de conformidade
AEC-Q100 qualified automotive grade per NXP product family. RoHS and REACH compliant. Original Freescale part now manufactured under NXP Semiconductors. CAN 2.0b compliant per ISO 11898-2/5 physical layer standard.
