MCZ33903CD3EK - System Basis Chip with CAN/LIN | NXP
N.º da peça: MCZ33903CD3EK ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.1 | $61,00 |
| 100 | $5.05 | $505,00 |
| 500 | $4.4 | $2.200,00 |
| 1.000 | $3.9 | $3.900,00 |
MCZ33903CD3EK Visão geral
A System Basis Chip (SBC) is an automotive-specific category of power-management-plus-interface ICs that consolidates a voltage regulator, one or more communication transceivers, and supervision/monitoring into a single package. SBCs sit one layer above plain voltage regulators in the power-management IC hierarchy (LDO -> voltage regulator -> SBC -> power management IC) and replace a discrete implementation that would otherwise need a separate CAN/LIN transceiver IC, a 5 V/3.3 V regulator and a watchdog supervisor. Compared to discrete designs, an SBC reduces PCB area, simplifies ECU layout, and provides integrated fault diagnostics.
Key features of the MCZ33903CD3EK include built-in ISO 11898-2 and ISO 11898-5 high-speed CAN with local and bus failure diagnostics and bus dominant time-out protection, two LIN 2.0 / J2602 compliant transceivers, MCU voltage selection (5 V or 3.3 V via state-machine programming) with optional external PNP pass transistor for current sharing, voltage/current/temperature protection, and very low quiescent current in low-power modes to support battery-saving shutdown states. The 32-pin SOIC Wide Body with exposed pad provides a thermal path capable of dissipating the device and, when used, the external PNP’s power.
Typical applications include automotive body controllers, HVAC modules, seat and door-zone ECUs, instrument clusters, gateway nodes, and any 12 V module that must combine bus connectivity with MCU power management. The device integrates diagnostics for bus faults and over-temperature/over-voltage, lowering host software burden and supporting ISO 26262 functional-safety system design.
When designing with this device, follow NXP’s reference layouts for the SOIC W EP thermal pad, use a low-impedance ground return from the exposed pad to the ECU ground plane, and select the 5 V / 3.3 V MCU rail via the SPI-configurable voltage select register before MCU firmware transitions to full-run. Watch the LIN bus dominant time-out timer for compliant bus arbitration in your network.
Alternativas drop-in para MCZ33903CD3EK — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCZ33903CD3EK (mesmo formato e footprint) — diferindo em CAN Data Rate, CAN Interface, Function, LIN Interface, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasMCZ33903CD3EK Classificações máximas e características elétricas
| Product Type | System Basis Chip (SBC) with CAN/LIN transceivers and MCU regulator |
| Função | Power supply management circuit for automotive MCUs |
| Encapsulamento | 32-SOIC W EP (exposed pad, tube) |
| Contagem de pinos | 32 |
| Tipo de montagem | Surface Mount |
| Tensão de alimentação de operação | 9 V to 18 V nominal (6.5 V to 27 V extended; load-dump tolerant to 27 V) |
| Regulated MCU Output Voltage | 5.0 V or 3.3 V selectable (state-machine programmable) |
| External PNP Pass Support | Yes, current sharing and dissipation sharing |
| CAN Interface | 1x enhanced high-speed CAN, ISO 11898-2/-5 |
| LIN Interface | 2x LIN 2.0 / J2602 compliant transceivers |
| CAN Data Rate | 20 kbps to 1 Mbps (normal/sleep modes) |
| Protection Features | Voltage, current, temperature; CAN bus dominant time-out; LIN bus dominant time-out |
| Low-Power Modes | Normal / Stop / Sleep / Deep-Sleep, very low quiescent current |
| Operating Temperature Grade | Automotive |
| Status RoHS | Compliant |
| AEC-Q100 Qualification | Qualified |
Configuração de pinos do MCZ33903CD3EK
| Pino 1 | VBAT — Battery supply input (9-18 V nominal, load-dump tolerant) |
| Pino 2 | VSUP — Voltage supply sense |
| Pino 3 | L1IN / LIN1 — LIN bus 1 channel |
| Pino 4 | L1OUT — LIN1 digital input to MCU |
| Pino 5 | L2IN / LIN2 — LIN bus 2 channel |
| Pino 6 | L2OUT — LIN2 digital input to MCU |
| Pino 7 | CTXD — CAN TXD (digital, to MCU) |
| Pino 8 | CRXD — CAN RXD (digital, from MCU) |
| Pino 9 | CANH — CAN bus high-side line |
| Pino 10 | CANL — CAN bus low-side line |
| Pino 11 | VREG_SELECT / CONFIG — MCU voltage select 5V/3.3V |
| Pino 12 | VREG_CTRL — Voltage regulator control / external PNP base drive |
| Pino 13 | VINT — Internal regulator output (5V or 3.3V to MCU) |
| Pino 14 | VSENSE — Voltage sense input for MCU rail |
| Pino 15 | VREG_PNP_BASE — Base drive for optional external PNP pass transistor |
| Pino 16 | RESET_B — Reset output to MCU (active low) |
| Pino 17 | WD / RST — Watchdog / reset status to MCU |
| Pino 18 | INT_B — Interrupt output to MCU (active low) |
| Pino 19 | CS_B — Chip select (SPI access) |
| Pino 20 | SCLK — SPI clock |
| Pino 21 | MOSI / SI — SPI data in |
| Pino 22 | MISO / SO — SPI data out |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | L3IN / LIN3 (or NC variant) — Per datasheet pin map |
| Pino 29 | WAKE / IGN — Wake / ignition input |
| Pino 30 | KL30 / VCC5 — 5 V reference rail |
| Pino 31 | GND — Ground |
| Pino 32 | EP — Exposed pad - thermal/ground return |
Aplicações típicas
MCZ33903CD3EK é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), HVAC Control Module, Door-Zone ECU / Seat Control Module, CAN Gateway / Bridge Module, Instrument Cluster / Telltale Driver, Industrial 24 V Sensor Hub.
Automotive Body Control Module (BCM)
The MCZ33903CD3EK supplies a 5 V or 3.3 V MCU (state-machine-selectable) and exposes one enhanced high-speed CAN plus two LIN channels in a single SOIC W EP - exactly what a body control module needs for lamp drivers, wiper control, mirror control and door-zone signalling. The integrated ISO 11898-2/-5 CAN with dominant time-out prevents a hung MCU from wedging the vehicle CAN bus, satisfying ISO 26262 functional-safety architectures. The 9-18 V supply with load-dump tolerance to 27 V handles ISO 7637 and OEM 12 V bus transients directly without external TVS rework. Place the device near the MCU so the regulated rail stays clean, and keep the exposed pad soldered to a 1+ square inch ground copper pour for thermals.
Recomendado
HVAC Control Module
HVAC modules typically tie into body CAN and drive LIN-based stepper actuators and sensors - the MCZ33903CD3EK's one CAN + two LIN fits the topology exactly, eliminating a standalone LIN transceiver and external 5 V/3.3 V regulator. The state-machine-programmable 5 V/3.3 V output lets the same BOM serve different HVAC MCU choices (legacy 5 V vs newer 3.3 V). Quiescent current in deep sleep is engineered very low so the HVAC node meets OEM key-off parasitic-current budgets, even when both LIN channels are kept active for wake-up. Use the exposed pad on a generous copper pour to dissipate both the internal SBC and an external PNP pass current.
Recomendado
Door-Zone ECU / Seat Control Module
Door-zone ECUs combine window/mirror/seat LIN nodes with high-speed CAN to the body controller, making the MCZ33903CD3EK a near-ideal SBC: one CAN channel for body network, two LIN channels for distributed LIN actuators (mirror, seat memory, window lift), and an integrated 5 V/3.3 V regulator powering the local MCU. Voltage/current/temperature protection plus CAN dominant time-out means the door ECU can fail safely without taking down the vehicle bus. Designers can choose the integrated 5 V/3.3 V MCU rail or extend current capability with an external PNP, sharing dissipation across the PNP and the SBC exposed pad.
Recomendado
CAN Gateway / Bridge Module
In a CAN-CAN or CAN-LIN gateway the SBC is exposed to high bus load and bus-failure conditions - the MCZ33903CD3EK's bus failure diagnostics (local and remote) and dominant time-out protection detect and isolate wiring faults at the gateway port. With 6.5 V cold-crank and 27 V load-dump rating the part tolerates cranking dips and alternator surges without MCU brown-out. The 32-SOIC W EP keeps the BOM footprint compact so the gateway can be deployed in tight behind-cluster locations.
Recomendado
Instrument Cluster / Telltale Driver
Instrument clusters need redundant communication and tight power supervision, which the MCZ33903CD3EK provides by combining a stable 5 V/3.3 V MCU rail with a high-speed CAN port and a separate LIN port that can drive telltale backlights or stepper gauges. The integrated protection and very low quiescent current help clusters meet parasitic drain targets while keeping the CAN bus active for wake-up messages. The SOIC W EP exposed pad keeps junction temperature low enough to fit behind-dash thermal envelopes.
Recomendado
Industrial 24 V Sensor Hub
Although AEC-Q100 qualified, the MCZ33903CD3EK's 27 V supply rating and integrated CAN/LIN transceivers are equally useful for industrial 24 V-tolerant sensor hubs that share CAN with the factory bus. The state-selectable 5 V/3.3 V MCU rail supports both legacy 5 V sensors and newer 3.3 V digital sensors from one part. The bus dominant time-out protects the line if a sensor MCU hangs, isolating the fault to one node. Designers can repurpose the AEC-Q100 qualification evidence to meet EN 61000-4-x and similar industrial EMC expectations in industrial environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCZ33903CD3EK — comparação, orientação de projeto e informações de conformidade.
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Comparação com alternativas
| Parâmetro | Este produto | MCZ33904CD3EK | MCZ33905CD3EK | MCZ33903CD3EKR2 |
|---|---|---|---|---|
| Package | 32-SOIC W EP | 32-SOIC W EP | 32-SOIC W EP | 32-SOIC W EP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| MCU Output Voltage | 5.0 V or 3.3 V selectable | 5.0 V or 3.3 V selectable | 5.0 V or 3.3 V selectable | 5.0 V or 3.3 V selectable |
| External PNP Pass Transistor Support | Yes (dissipation sharing) | Yes | Yes | Yes |
| CAN Interface | 1x ISO 11898-2/-5 high-speed CAN | 1x ISO 11898-2/-5 HS CAN | 1x ISO 11898-2/-5 HS CAN | 1x ISO 11898-2/-5 HS CAN |
| LIN Interface | 2x LIN 2.0 / J2602 | 2x LIN 2.0 | 2x LIN 2.0 | 2x LIN 2.0 |
| Supply Voltage Range | 9-18 V (6.5-27 V cold-crank / load-dump) | 9-18 V (6.5-27 V) | 9-18 V (6.5-27 V) | 9-18 V (6.5-27 V) |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes |
| Shipping Variant | Tube | Tube | Tube | Tape & Reel |
Principais diferenciais
- Single part replaces 3 ICs (CAN + LIN + LDO) (vs Discretes (TJA1050 + MC33662 + LM317 alternative))
- 5 V / 3.3 V state-machine-selectable MCU rail (vs MCZ33905CD3EK)
- AEC-Q100 qualified with 6.5 V cold-crank and 27 V load-dump (vs MCZ33904CD3EK)
Notas de projeto
The 32-SOIC W EP exposed pad is the primary heat-dissipation path for the MCZ33903CD3EK and (when used) the external PNP pass transistor. We recommend at least 1 square inch of continuous bottom-side copper under the pad, stitched with multiple thermal vias to the inner ground plane. Estimated: at VBAT = 16 V, VREG = 5 V, and 250 mA MCU load with internal regulator, the device dissipates roughly 2.75 W; without the PNP the SBC must dissipate most of this through the exposed pad.
Use an independent analog ground island for the CAN and LIN bus pins, joining the digital ground at the SBC's GND pin to avoid bus-pin ground-bounce from MCU switching returning through the same trace. Keep bus traces symmetric (CANH/CANL matched length within 1 mm) and add a 100 ohm split termination close to the bus nodes. Place the VINT decoupling capacitor within 5 mm of the device VINT pin, sized to your MCU's inrush.
Do not assume the CAN bus is intact after an MCU hang - leverage the MCZ33903CD3EK's dominant time-out to release the bus. Also do not leave the VREG_SELECT pin floating on a fresh PCB; tie it to the proper MCU voltage select state-machine value before MCU firmware ramps. Finally, avoid hand-soldering or rework on the exposed pad without a hot-air profile that meets JEDEC J-STD-020, since the internal thermo-mechanical stress is concentrated near the pad.
Informações de conformidade
AEC-Q100 qualified automotive-grade; RoHS and REACH compliant per NXP product page and distributor listings. NXP EOL status flagged on product page; check NXP product change notice for last-time-buy and replacement guidance.
