NXP Semiconductors

MK10DN512ZAB10R - Kinetis K10 ARM Cortex-M4 MCU 512KB WLCSP | NXP

N.º da peça: MK10DN512ZAB10R ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
WLCSP Package 100 MHz Speed 512 KB (512K x 8) Memory
A partir de $5.73 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-20
Preços por volume
Qtd. Preço unitário Total
1 $8.95 $8,95
10 $8.06 $80,60
100 $7.16 $716,00
500 $6.44 $3.220,00
1.000 $5.73 $5.730,00
ℹ️ Todos os preços estão em USD

MK10DN512ZAB10R Visão geral

The NXP MK10DN512ZAB10R is a Kinetis K10 family mixed-signal ARM Cortex-M4 microcontroller with 512 KB of program flash, packaged in a WLCSP (Wafer-Level Chip-Scale Package) form factor aimed at space-constrained embedded designs. The part integrates an ARM Cortex-M4 core running at up to 100 MHz, providing deterministic 32-bit processing for real-time control loops. Mixed-signal integration on this K10 die includes a 16-bit ADC, 12-bit DAC, comparators, and a flexible timer/PWM unit set, enabling direct interface to analog sensors and motor-control stages without external signal-conditioning ICs.

A microcontroller (MCU) is a single-chip computer containing a processor core, non-volatile program memory, volatile data memory, and a fixed set of peripherals. Within the embedded hierarchy, an MCU sits below a microprocessor (MPU) because it integrates memory and peripherals on-die. Kinetis K-series MCUs target mixed-signal industrial applications, distinct from K-series L (low-power) and M (motor-control) derivatives. NXP Kinetis K10 sits in the value-line mixed-signal MCU segment, balancing analog integration, CPU performance, and low-power modes for portable instrumentation, factory automation, and consumer devices.

Key features highlighted in the manufacturer datasheet include 512 KB flash, 128 KB SRAM, a 100 MHz Cortex-M4 core, integrated USB 2.0 full-speed OTG controller, multiple serial peripherals (UART, SPI, I2C), and a 12-channel DMA. The 16-bit ADC supports up to 16 single-ended inputs with hardware averaging, and the 12-bit DAC enables precise analog output for setpoint generation. The WLCSP package eliminates the lead-frame, reducing PCB area to roughly the silicon die size and offering excellent electrical performance at high frequencies. Low-power Run, Wait, Stop, and VLLS modes allow the device to draw microamps in deep sleep, suitable for battery-powered sensors.

Typical applications include industrial sensor transmitters, portable medical instrumentation, USB peripherals, motor control for small BLDC/PMSM stages, and low-power IoT edge nodes where the mixed-signal front-end removes the need for separate ADC/DAC ICs. Designers typically choose the MK10DN512ZAB10R when PCB area is critical and on-board analog conversion is required. When sourcing, note that the trailing 'R' suffix denotes Tape and Reel packaging, while the 'AB10' segment encodes the 100 MHz speed grade and WLCSP package option.

Alternativas drop-in para MK10DN512ZAB10R — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MK10DN512ZAB10R (mesmo formato e footprint) — diferindo em Package, ADC, DAC, USB, Core Architecture.

NXP Semiconductors
Package: 80-LQFP (12x12 mm, pin-pitch 0.4 mm)
ADC: 16-bit SAR ADC, multi-channel
DAC: 12-bit DAC
Comparar com MK10DN512ZAB10R →
NXP Semiconductors
Package: 121-XFBGA (8x8 mm, 0.5 mm pitch)
ADC: 16-bit successive-approximation, configurable single-ended or differential
DAC: 12-bit
Comparar com MK10DN512ZAB10R →
NXP Semiconductors
Package: 144-LQFP
ADC: 16-bit ADC
Comparar com MK10DN512ZAB10R →
NXP Semiconductors
Package: 144-LQFP (20 mm x 20 mm)
ADC: 16-bit SAR ADC
DAC: 12-bit
Comparar com MK10DN512ZAB10R →
NXP Semiconductors
ADC: 16-bit, multiple channels
DAC: 12-bit
Core Architecture: ARM Cortex-M4 with FPU and DSP
Comparar com MK10DN512ZAB10R →
NXP Semiconductors
Package: 144-MAPBGA (13 x 13 mm)
Comparar com MK10DN512ZAB10R →
NXP Semiconductors
Package: 144-MAPBGA (13 x 13 mm)
Comparar com MK10DN512ZAB10R →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MK10DN512ZVLQ10

✅ Drop-In
📦 LQFP-144
same 512 KB flash + 100 MHz Cortex-M4 die; LQFP-144 package instead of WLCSP - pinout differs

📋 Alternativa de referência (fora do catálogo)

MK10DN512ZVMC10R

✅ Drop-In
📦 MAPBGA-144
same K10 die, 512 KB flash, 100 MHz; MAPBGA-144 package instead of WLCSP - different ball map

📋 Alternativa de referência (fora do catálogo)

MK22FN1M0AVLK12

✅ Drop-In
NXP Semiconductors
📦 LQFP-80
ARM Cortex-M4F with single-precision FPU · 120 MHz · 1 MB (1M x 8) · 128 KB · 1.71 V to 3.6 V · -40 C to +105 C · 80-LQFP (12x12 mm, pin-pitch 0.4 mm) · USB 2.0 Full-Speed Host/Device/OTG with on-chip transceiver

✓ Em estoque

$7.95 / unidade

Ver ficha técnica →

MK60DN512ZVLQ10

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
ARM Cortex-M4 with FPU and DSP · 100 MHz · 512 KB · 128 KB · 1.71 V to 3.6 V · -40 C to +105 C · 144-LQFP (20x20 mm) · 10/100 Mbps with IEEE 1588

✓ Em estoque

$9.3 / unidade

Ver ficha técnica →

MK24FN1M0VDC12

✅ Drop-In
NXP Semiconductors
📦 MAPBGA-144
ARM Cortex-M4F (32-bit) · 120 MHz · 1 MB (1M x 8) · 256 KB · 121-XFBGA (8x8 mm, 0.5 mm pitch) · Surface Mount · -40C to +105C (industrial) · Full-Speed USB 2.0 on-chip transceiver

✓ Em estoque

$9.75 / unidade

Ver ficha técnica →

MK10DN512ZAB10R Classificações máximas e características elétricas

Core Architecture ARM Cortex-M4
Core Bit Width 32-bit
Maximum CPU Frequency 100 MHz
Program Flash Memory 512 KB (512K x 8)
Encapsulamento WLCSP
ADC 16-bit integrated
DAC 12-bit integrated
USB USB 2.0 Full-Speed OTG
DMA Channels 12
Tipo de montagem Surface Mount
Status RoHS Compliant
Series Kinetis K10

Guia de Configuração de Pinos do MK10DN512ZAB10R wlcsp

Configuração de pinos para MK10DN512ZAB10R (pacote wlcsp). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote wlcsp para MK10DN512ZAB10R

Nenhum dado detalhado de pinagem disponível para MK10DN512ZAB10R.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

MK10DN512ZAB10R é adequado para 6 aplicaçãos: Industrial Sensor Transmitters, Portable Medical Instrumentation, USB Peripherals and HID Devices, Small Motor Control - BLDC / PMSM, Battery-Powered IoT Edge Nodes, Consumer HMI Touch Interfaces.

🏭

Industrial Sensor Transmitters

The MK10DN512ZAB10R's integrated 16-bit ADC, 12-bit DAC, and Cortex-M4 DSP extensions make it well-suited for industrial sensor transmitters. The MCU can digitize multi-channel analog sensor inputs with hardware averaging, apply digital filtering, then drive a 4-20 mA loop via the 12-bit DAC. The 100 MHz core sustains real-time linearization and RTD/cold-junction compensation without offloading to a separate DSP. Compared with a discrete ADC + 8-bit processor solution, the MK10DN512ZAB10W shrinks the BOM while keeping 512 KB flash for protocol stacks such as HART or IO-Link. The WLCSP footprint allows the entire transmitter to fit inside a standard DIN form-factor head, and low-power VLLS modes extend battery life in loop-powered 4-20 mA designs.

💊

Portable Medical Instrumentation

Portable medical devices such as pulse oximeters, glucose meters, and handheld ECG monitors benefit from the MK10DN512ZAB10R's mixed-signal integration and tiny WLCSP footprint. The 16-bit ADC captures bio-potential or photodiode signals directly, while the Cortex-M4 DSP extensions run real-time DSP filters (e.g., moving average, FFT) without external accelerators. The 512 KB flash holds both the application and an IEC 62304-grade firmware, while 128 KB SRAM is adequate for waveform buffering. Low-power Run and VLLS modes reduce average current below 50 uA between samples, supporting coin-cell or Li-ion battery operation. The integrated USB 2.0 FS OTG enables direct charging and data upload without a separate interface IC, lowering BOM cost for high-volume medical disposables.

🖥️

USB Peripherals and HID Devices

The MK10DN512ZAB10R's integrated USB 2.0 full-speed OTG controller with on-chip transceiver makes it ideal for USB peripherals such as HID controllers, data loggers, and diagnostic tools. The USB peripheral can be addressed without an external PHY, saving PCB area and BOM cost. The 512 KB flash accommodates the USB stack plus application code, while 128 KB SRAM supports USB endpoint buffering and protocol handling. The Cortex-M4 runs at 100 MHz, more than adequate for full-speed USB at 12 Mbps. The WLCSP package suits compact dongle designs, and low-power modes help meet USB suspend current requirements. Compared with using an external USB-serial bridge IC, the integrated USB reduces BOM by 1-2 USD per unit and simplifies FCC/CE compliance.

⚡

Small Motor Control - BLDC / PMSM

The MK10DN512ZAB10R's mixed-signal integration and Cortex-M4 DSP extensions make it a viable MCU for small brushless DC (BLDC) and permanent-magnet synchronous motor (PMSM) control stages such as fans, pumps, and small drones. The 16-bit ADC samples phase currents, while the on-chip eFlexPWM timer generates complementary PWM with dead-time insertion for the half-bridge gate drivers. The 100 MHz core executes FOC (field-oriented control) at rates up to 10 kHz with adequate headroom. The 12-bit DAC can drive an analog torque reference or signal a debug node. The 512 KB flash is sufficient to hold the FOC algorithm plus telemetry, while 128 KB SRAM handles Park/Clarke transform scratch buffers. For higher-current or higher-RPM motors, an external gate driver is required.

🧩

Battery-Powered IoT Edge Nodes

The MK10DN512ZAB10R's integrated peripherals and low-power modes make it a strong choice for battery-powered IoT edge nodes. The 16-bit ADC samples analog sensors, the DAC drives analog actuators, and the USB OTG provides direct Li-ion charging. The WLCSP package fits within 4x4 mm PCB area - ideal for coin-cell wearables. Low-power Run, Wait, Stop, and VLLS modes reduce quiescent current below 5 uA in deep sleep, extending battery life to 5+ years on a CR2032 for periodic sampling. The 512 KB flash accommodates application code, a secure bootloader, and an OTA update staging partition. Compared with a discrete analog-front-end + WiFi SoC, the MK10DN512ZAB10R eliminates one IC while keeping the BOM small and predictable.

📱

Consumer HMI Touch Interfaces

The MK10DN512ZAB10R's integrated peripherals support consumer HMI touch interfaces such as appliance control panels and small industrial HMIs. The 16-bit ADC reads resistive touch overlays, the 12-bit DAC drives an LED backlight brightness control, and the Cortex-M4 DSP runs the touch-sensing algorithm in real time. The 512 KB flash accommodates an LVGL-style graphics library and a USB stack for firmware updates. The WLCSP package fits inside a slim bezel, and the 100 MHz core renders simple graphics at 30+ fps. Low-power Wait mode lets the panel enter a screen-off state without losing touch wakeup capability. Compared with a separate touch controller IC, the integrated ADC reduces BOM while keeping latency low for finger-tracking gestures.

What is the MK10DN512ZAB10R?
The MK10DN512ZAB10R is an NXP Kinetis K10 mixed-signal microcontroller built around an ARM Cortex-M4 core running at up to 100 MHz, with 512 KB of on-chip flash and integrated 16-bit ADC plus 12-bit DAC. It ships in a WLCSP package per the manufacturer datasheet. The 'R' suffix indicates Tape & Reel packaging for high-volume SMT assembly.
What is the core architecture and clock speed of MK10DN512ZAB10R?
The MK10DN512ZAB10R uses a 32-bit ARM Cortex-M4 core capable of up to 100 MHz operation, as listed on distributor specifications pages including Mouser. The Cortex-M4 includes a single-precision FPU and DSP extensions, giving it deterministic interrupt latency suitable for motor-control and signal-processing loops in industrial applications.
How much flash memory does the MK10DN512ZAB10R have?
The MK10DN512ZAB10R integrates 512 KB (512K x 8) of program flash according to the NXP datasheet snippet and Octopart parametric listing. This is enough for application code plus a bootloader, OTA staging area, or USB stack on a Kinetis K10 device.
What package does MK10DN512ZAB10R use?
The MK10DN512ZAB10R ships in a Wafer-Level Chip-Scale Package (WLCSP), the most compact Kinetis K10 footprint available. According to the NXP datasheet, this package reduces PCB area to roughly the die size and offers excellent high-frequency electrical performance. The full pinout table for this WLCSP variant is documented in the K10P100M100SF2 reference manual.
Where can I buy MK10DN512ZAB10R online?
Authorized distributors listing the MK10DN512ZAB10R include Mouser, with secondary stock observed through IC-Components, Rochester Electronics, and Element HK as of 2026-10-20. Pricing on Mouser starts around $8.95 per unit for qty-1, dropping to roughly $5.73 at 1000-piece reels. Lead time is generally 8-12 weeks through authorized channels.
What is the price of MK10DN512ZAB10R as of 2026-10-20?
MK10DN512ZAB10R unit pricing as of 2026-10-20 starts at approximately $8.95 for single units on Mouser, scaling to $8.06 at qty 10, $7.16 at qty 100, $6.44 at qty 500, and $5.73 at qty 1000. Independent distributors such as IC-Components and ampheo may quote higher depending on lot date code and availability, particularly for fully-traceable stock.
What is the lead time for MK10DN512ZAB10R?
MK10DN512ZAB10R lead time as of 2026-10-20 is approximately 8-12 weeks when ordered through authorized distributors like Mouser, with no spot stock confirmed in the verified distributor listings. Independent brokers may advertise immediate shipping but carry date-code and traceability risk. For production orders, placing a 12-week PO ahead of demand is recommended.
Is MK10DN512ZAB10R in stock at authorized distributors?
As of 2026-10-20, Mouser lists the MK10DN512ZAB10R in stock with factory-fresh inventory, and Rochester Electronics offers active supply of this MCU. Octopart cross-references 11 distributors total. Demand is moderate; ordering through authorized channels at qty 1000 typically clears the same week.
MK10DN512ZAB10R vs MK10DN512VLQ10 - which is better for portable designs?
The MK10DN512ZAB10R ships in a WLCSP package while the MK10DN512VLQ10 ships in a 144-pin LQFP, making the WLCSP variant the better choice for portable, area-constrained designs. Both share the same 512 KB flash and 100 MHz Cortex-M4 core. For hand-solderable prototypes, choose the LQFP version; for production wearables, choose the WLCSP.
What is the difference between MK10DN512ZAB10R and MK60DN512ZVLQ10?
The MK10DN512ZAB10R is a Kinetis K10 mixed-signal MCU in a WLCSP package with 100 MHz Cortex-M4, while the MK60DN512ZVLQ10 is a Kinetis K60 connectivity MCU in a 144-pin LQFP with Ethernet and HS USB. The K60 offers higher-bandwidth peripherals but draws more power. Choose K10 for compact mixed-signal nodes, K60 for Ethernet-connected gateways.
When should I choose MK10DN512ZAB10R over MK22FN1M0AVLK12?
Choose the MK10DN512ZAB10R when you need an integrated 16-bit ADC and 12-bit DAC in the smallest possible footprint (WLCSP). The MK22FN1M0AVLK12 (Kinetis K22) instead offers 1 MB flash, 120 MHz operation, and USB HS in an 80-pin LQFP for higher-throughput designs. For battery-powered sensor nodes, the K10's mixed-signal integration is the deciding factor.
What is the best drop-in replacement for MK10DN512ZAB10R?
The closest drop-in replacement within the Kinetis K10 family is MK10DN512ZVLQ10, which uses the same die but a 144-pin LQFP package rather than WLCSP - so it requires PCB rework. For an exact-footprint WLCSP K10 alternative, no direct cross-manufacturer equivalent exists in the verified data; consider MK10DN512ZVMC10R as a same-family pin-compatible option where the package permits.
Where can I download the MK10DN512ZAB10R datasheet PDF?
The MK10DN512ZAB10R datasheet is published by NXP at https://www.nxp.com/docs/en/data-sheet/K10P100M100SF2.pdf, covering the K10P100M100SF2 sub-family. An NXP community thread confirms this is the correct document for the WLCSP variant. The reference manual K10P100M100SF2RM provides full pinout tables for the WLCSP option.
Where do I find the MK10DN512ZAB10R pinout for WLCSP?
The MK10DN512ZAB10R WLCSP pinout is found in the K10P100M100SF2 reference manual chapter on signal multiplexing, as confirmed by an NXP community discussion. Mouser and Octopart parametric listings do not include the full ball-map; engineers should consult the K10 family reference manual rather than relying on distributor images. Marking on the top surface identifies pin A1.
What cross-brand equivalent exists for MK10DN512ZAB10R?
The MK10DN512ZAB10R has no verified cross-brand drop-in equivalent in the WLCSP package as of 2026-10-20. Competitor Cortex-M4 MCUs such as STM32F407 or ATSAM4S exist in different packages and footprints; they would require PCB redesign. For drop-in, stay within the NXP Kinetis K10 WLCSP family or move to a same-footprint NXP K10 die variant.

Dados de referência de engenharia para MK10DN512ZAB10R — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MK10DN512ZAB10R when PCB area is the dominant constraint and on-chip analog integration (16-bit ADC, 12-bit DAC) is required - portable medical, IoT edge nodes, and consumer HMI touch panels are the strongest fits. For designs that need hand-solderable prototypes, pick the MK10DN512ZVLQ10 (LQFP-144) instead and accept the larger footprint. For Ethernet-connected gateways, step up to the MK60DN512ZVLQ10. For higher-throughput DSP work, move to the K22 family (MK22FN1M0AVLK12). The WLCSP package requires reflow-only assembly; if you need wave soldering or socket-based prototypes, this part is not appropriate.

Comparação com alternativas

Parâmetro Este produto MK10DN512ZVLQ10 MK10DN512ZVMC10R MK22FN1M0AVLK12 MK60DN512ZVLQ10 MK24FN1M0VDC12
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package WLCSP LQFP-144 - different footprint MAPBGA-144 - different footprint LQFP-80 - different footprint LQFP-144 - different footprint MAPBGA-144 - different footprint
Core ARM Cortex-M4 ARM Cortex-M4 ARM Cortex-M4 ARM Cortex-M4 ARM Cortex-M4 ARM Cortex-M4
Max CPU Frequency 100 MHz 100 MHz 100 MHz 120 MHz 100 MHz 120 MHz
Flash Memory 512 KB 512 KB 512 KB 1 MB 512 KB 1 MB
USB USB 2.0 Full-Speed OTG USB 2.0 Full-Speed OTG USB 2.0 Full-Speed OTG USB 2.0 High-Speed OTG USB 2.0 High-Speed OTG + Ethernet USB 2.0 Full-Speed OTG
Integrated ADC 16-bit 16-bit 16-bit 16-bit 16-bit 16-bit
Family Kinetis K10 Kinetis K10 Kinetis K10 Kinetis K22 Kinetis K60 Kinetis K24

Principais diferenciais

  • Smallest-footprint K10 variant - WLCSP (vs MK10DN512ZVLQ10)
  • Integrated mixed-signal front-end (vs MK22FN1M0AVLK12)
  • Lower-power variant within Kinetis K-series (vs MK60DN512ZVLQ10)

Notas de projeto

The MK10DN512ZAB10R WLCSP package has limited thermal mass compared to LQFP equivalents; in continuous high-CPU-load use cases the junction temperature can rise significantly. For applications with sustained 100 MHz operation, ensure the PCB has a small copper pour beneath the WLCSP thermal balls to dissipate heat. The K10P100M100SF2 datasheet specifies thermal characteristics in the WLCSP variant - consult the package thermal model before sealing the MCU inside an enclosed sensor head.

Place the 16 MHz external crystal within 5 mm of the XTAL pins, with a ground guard ring to reduce EMI. Decouple VDD/VSS pairs with a 100 nF X7R 0402 ceramic capacitor per supply pin, plus a bulk 4.7 uF tantalum or ceramic on the regulator rail. For WLCSP variants, place 0.1 uF decoupling directly under each supply ball on the opposite PCB side to minimize loop inductance. NXP application note AN4830 provides Kinetis hardware design guidance.

Do not confuse the K10 (mixed-signal), K20 (connectivity), K60 (Ethernet+HS USB), and K70 (LCD) families - they share the same ARM Cortex-M4 core but pinouts and peripherals differ. The 'AB10' suffix in MK10DN512ZAB10R encodes the 100 MHz speed grade and WLCSP package option; sourcing the wrong speed variant will fail timing-closure checks. Always verify the exact MPN against the NXP product selector before placing volume POs.

Use a low-dropout regulator with at least 100 mA headroom for the MK10DN512ZAB10R's peak current draw during ADC sampling and flash writes. The internal voltage regulator requires a 4.7 uF bulk capacitor on the internal regulator output pin. Enable the on-chip voltage regulator monitor in software to detect brown-out conditions during flash programming; this prevents partial writes that can brick the part in the field.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS compliance confirmed via Mouser product listing. Not AEC-Q100 qualified - the MK10DN512ZAB10R targets industrial/consumer; for automotive, evaluate the K10x AEC-Q100 variants. Halogen-free status not explicitly listed in verified data.

Dados verificados em: 2026-10-20 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

MK10DN512ZAB10R datasheet NXP Kinetis K10 WLCSP microcontroller MK10DN512ZAB10R price ARM Cortex-M4 100MHz 512KB flash MCU MK10DN512ZAB10R vs MK10DN512ZVLQ10 Kinetis K10 mixed signal MCU USB OTG MK10DN512ZAB10R pinout WLCSP K10P100M100SF2 reference manual buy MK10DN512ZAB10R online MK10DN512ZAB10R drop-in replacement 16-bit ADC integrated MCU Kinetis low power IoT edge node microcontroller

Componentes & termos relacionados

NXP Semiconductors MK10DN512ZAB10R MK10DN512ZVLQ10 MK10DN512ZVMC10R MK22FN1M0AVLK12 MK60DN512ZVLQ10 MK24FN1M0VDC12 ARM Cortex-M4 microcontroller MCU Kinetis K10 WLCSP LQFP-144 MAPBGA-144 USB 2.0 USB OTG 16-bit ADC 12-bit DAC DMA RoHS AEC-Q100 embedded systems industrial sensor transmitter portable medical device BLDC motor control
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