MK22DX256VMC5 - 50MHz Cortex-M4 MCU, 256KB Flash | NXP
N.º da peça: MK22DX256VMC5 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $7.95 | $79,50 |
| 100 | $6.78 | $678,00 |
| 500 | $5.92 | $2.960,00 |
| 1.000 | $5.21 | $5.210,00 |
MK22DX256VMC5 Visão geral
What is a Cortex-M4 microcontroller? An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core designed for embedded applications that require deterministic real-time response, low power consumption, and rich digital signal processing capability via single-precision FPU and DSP instructions. Within the broader taxonomy, the MK22DX256VMC5 belongs to the Kinetis family of general-purpose MCUs, which itself sits under NXP's LPC/Kinetis portfolio of ARM-based microcontrollers for industrial and IoT use cases. The K22 sub-family specifically targets applications that need low-power operation, processing efficiency, and moderate memory density with integrated USB.
Key features include a 50 MHz Cortex-M4 core with single-precision FPU and DSP extensions, 256 KB Flash, 32 KB SRAM, full-speed USB 2.0 device/host/OTG controller, multiple low-power modes with sub-µA RTC operation, a 16-bit SAR ADC, 12-bit DAC, programmable delay block, multiple timers (FTM, PIT, LPTMR, RTC), and a wide operating voltage range of 1.71 V to 3.6 V. Peripherals include I2C, UART, SPI, I2S, and an on-chip 1 kHz LPO oscillator.
The MK22DX256VMC5 uses a Cortex-M4 core with a 3-stage pipeline, hardware multiply/divide, and a single-precision FPU. Flash is organized in a 256K x 8 array with 16-byte minimum erase sector, supporting in-application programming. The device integrates an 8-channel DMA controller for offloading CPU transfers and a memory protection unit for reliable RTOS operation.
Typical applications include USB HID peripherals, USB-to-UART bridges, low-power sensor hubs, fitness wearables, point-of-sale terminals, building automation controllers, and battery-powered industrial sensors. The integrated full-speed USB with on-chip transceiver simplifies USB device designs without an external PHY.
When designing with the MK22DX256VMC5, ensure proper decoupling on all VDD pins (typically 100 nF + bulk capacitors) and follow NXP's recommended 121-MAPBGA routing escape. The full-speed USB pins D+ and D require 33 ohm series termination and a 1.5 kohm pull-up on D+ for full-speed device operation. For low-power RTC retention, VBAT must be supplied when VDD is removed.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MK22DX256VMC5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK22DX256VMC5R
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK22DX256VMC7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK22DX128VMC5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK22DN512VMC5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK22FX512VMC5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK22DX256VMC5 Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 50 MHz |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Encapsulamento | 121-MAPBGA (8x8 mm) |
| Tensão de alimentação | 1.71 V to 3.6 V |
| I/O Voltage Rails | 1.8 V / 2.5 V / 3.3 V |
| USB Controller | USB 2.0 Full-Speed Device/Host/OTG with on-chip PHY |
| ADC | 16-bit SAR ADC |
| DAC | 12-bit DAC |
| Temperatura de operação | -40C to +105C |
| DMA Channels | 8 channels |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Nível MSL | 3 (168 hours) |
Guia de Configuração de Pinos do MK22DX256VMC5 121-mapbga (8x8 mm)
Configuração de pinos para MK22DX256VMC5 (pacote 121-mapbga (8x8 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MK22DX256VMC5.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MK22DX256VMC5 é adequado para 6 aplicaçãos: USB HID Peripheral Devices, USB-to-UART Bridge Module, Low-Power Industrial Sensor Hub, Building Automation Controller, Point-of-Sale Terminal, Fitness Wearable Data Logger.
USB HID Peripheral Devices
The MK22DX256VMC5 fits USB HID applications because it integrates a USB 2.0 Full-Speed controller with on-chip transceiver, 50 MHz Cortex-M4 processing headroom, and 256 KB Flash to hold USB stacks plus application logic. Placed as the only MCU on the PCB with a USB connector, 33 ohm series termination, and 1.5 kohm pull-up on D+, the part eliminates the need for an external PHY. Compared to discrete USB controllers plus an 8-bit MCU, this part reduces BOM and PCB area while delivering 32 KB SRAM for HID report buffers.
Recomendado
USB-to-UART Bridge Module
For USB-to-UART bridges, the MK22DX256VMC5 provides integrated USB device controller plus three UART modules in a single chip. The 50 MHz Cortex-M4 easily handles USB CDC-ACM enumeration at Full-Speed and UART baud rates up to 1 Mbaud. With 256 KB Flash, manufacturers can include vendor-specific command sets and in-field DFU bootloaders without external memory. Compared to FTDI-style discrete bridges, this MCU enables firmware-customizable behavior at lower cost in moderate volumes.
Recomendado
Low-Power Industrial Sensor Hub
The MK22DX256VMC5 fits low-power sensor hubs because of its multiple low-power modes including VLLS0/1/3 with sub-µA RTC retention and VBAT domain backup. The 16-bit SAR ADC, 12-bit DAC, and multiple I2C/SPI instances allow direct connection to environmental sensors. With 32 KB SRAM, the part buffers sensor data while the Cortex-M4 sleeps between acquisitions. The 1.71-3.6 V supply range supports both 3.3 V and 1.8 V sensor rails without level shifters.
Recomendado
Building Automation Controller
For building automation, the MK22DX256VMC5 offers USB for commissioning, multiple UARTs for Modbus or KNX gateways, and 256 KB Flash to host application logic, wireless stacks, and OTA bootloaders. The 50 MHz core executes real-time control loops while DMA offloads peripheral transfers. The -40C to +105C industrial temperature range and integrated RTC with calendar function support unattended operation in basements, mechanical rooms, and outdoor enclosures.
Recomendado
Point-of-Sale Terminal
The MK22DX256VMC5 fits point-of-sale (POS) terminals because of its USB device port for PC tethering, multiple UART/SPI peripherals for barcode scanners and printers, and the 16-bit ADC for battery monitoring. The 50 MHz Cortex-M4 with FPU accelerates payment protocol parsing and LCD refresh tasks. The 256 KB Flash holds USB stack, application UI, and security primitives, while 32 KB SRAM supports display framebuffers and transaction buffers.
Recomendado
Fitness Wearable Data Logger
The MK22DX256VMC5 suits fitness wearables because of its low-power modes, 16-bit ADC for biometric sensor reading, integrated RTC for time-stamping, and 32 KB SRAM for sample buffering during sleep. The 50 MHz Cortex-M4 with DSP extensions handles real-time heart-rate and step-count algorithms. With 256 KB Flash, firmware can include proprietary algorithms and BLE-over-UART passthrough protocols without external storage. The VBAT domain enables RTC retention during battery swaps.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MK22DX256VMC5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK22DX256VMC5R | MK22DX256VMC7 | MK22DX128VMC5 | MK22DN512VMC5 | MK22FX512VMC5 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 72 MHz | 50 MHz | 50 MHz | 120 MHz |
| Program Flash | 256 KB | 256 KB | 256 KB | 128 KB | 512 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 64 KB | 128 KB |
| USB Controller | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS/HS with on-chip PHY |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Core Architecture | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
Principais diferenciais
- Higher CPU speed grade option in same footprint (vs MK22DX256VMC7)
- Larger memory variant for richer firmware (vs MK22DN512VMC5)
- Pin-compatible cost-down variant (vs MK22DX128VMC5)
Notas de projeto
The MK22DX256VMC5 has multiple VDD pins (VDD, VDDIO, VDDA) that each require a 100 nF decoupling capacitor placed as close to the pin as possible, plus a 4.7 uF bulk capacitor near the MCU. A separate 1 uF decoupling cap is recommended for VDDA to isolate analog reference noise from the digital supply. The VBAT pin powers the RTC domain and requires its own decoupling when battery backup is used.
The 121-MAPBGA package uses 0.5 mm ball pitch, which demands 4-layer PCB design with microvia or via-in-pad escape for reliable assembly. Per NXP hardware design guide, route high-speed USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil. Place the 33 ohm series termination resistors within 4 mm of the USB connector pins.
Do not skip the 1.5 kohm pull-up resistor on the USB D+ line, or the host will not detect the device at full-speed. Ensure the NMI pin has a defined state at reset - leaving it floating may cause unintended interrupts. The MAPBGA package is MSL3, so assembly must occur within 168 hours of opening the dry-pack bag, or rebaking is required per JEDEC J-STD-033.
Informações de conformidade
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this part targets industrial and consumer applications, not automotive. MAPBGA package is MSL3 per JEDEC J-STD-033.